BE770346A - Procede et bain pour le depot de cuivre brillant - Google Patents

Procede et bain pour le depot de cuivre brillant

Info

Publication number
BE770346A
BE770346A BE770346A BE770346A BE770346A BE 770346 A BE770346 A BE 770346A BE 770346 A BE770346 A BE 770346A BE 770346 A BE770346 A BE 770346A BE 770346 A BE770346 A BE 770346A
Authority
BE
Belgium
Prior art keywords
bath
copper deposit
brilliant copper
brilliant
deposit
Prior art date
Application number
BE770346A
Other languages
English (en)
Inventor
O Kardos
D A Arcilesi
A J Tomson
S P Valayil
Original Assignee
M & T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M & T Chemicals Inc filed Critical M & T Chemicals Inc
Publication of BE770346A publication Critical patent/BE770346A/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
BE770346A 1970-07-28 1971-07-22 Procede et bain pour le depot de cuivre brillant BE770346A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5903470A 1970-07-28 1970-07-28

Publications (1)

Publication Number Publication Date
BE770346A true BE770346A (fr) 1971-12-01

Family

ID=22020395

Family Applications (1)

Application Number Title Priority Date Filing Date
BE770346A BE770346A (fr) 1970-07-28 1971-07-22 Procede et bain pour le depot de cuivre brillant

Country Status (7)

Country Link
US (1) US3682788A (fr)
AU (1) AU3040571A (fr)
BE (1) BE770346A (fr)
CA (1) CA1026702A (fr)
DE (1) DE2134757A1 (fr)
FR (1) FR2104809B3 (fr)
NL (1) NL7110413A (fr)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3804729A (en) * 1972-06-19 1974-04-16 M & T Chemicals Inc Electrolyte and process for electro-depositing copper
US3956120A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956079A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3966565A (en) * 1972-12-14 1976-06-29 M & T Chemicals Inc. Electrodeposition of copper
DE2360892A1 (de) * 1972-12-14 1974-06-20 M & T Chemicals Inc Waessriges saures galvanisches kupferbad
US3956084A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3940320A (en) * 1972-12-14 1976-02-24 M & T Chemicals Inc. Electrodeposition of copper
JPS544329B2 (fr) * 1973-03-20 1979-03-06
NL7415845A (nl) * 1973-12-26 1975-06-30 Upjohn Co Werkwijze voor het bevorderen van de productie van endogene prostaglandinen door zoogdieren, alsmede werkwijze ter bereiding van daarbij te gebruiken preparaten.
US4014760A (en) * 1974-11-21 1977-03-29 M & T Chemicals Inc. Electrodeposition of copper
US4036710A (en) * 1974-11-21 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
CA1070637A (fr) * 1975-09-22 1980-01-29 M And T Chemicals Inc. Methode d'electroplacage
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4374709A (en) * 1980-05-01 1983-02-22 Occidental Chemical Corporation Process for plating polymeric substrates
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
DE3462259D1 (de) * 1983-07-22 1987-03-05 Bayer Ag Substituted furazans
US4781801A (en) * 1987-02-03 1988-11-01 Mcgean-Rohco, Inc. Method of copper plating gravure rolls
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
ATE151474T1 (de) * 1990-05-30 1997-04-15 Gould Electronics Inc Elektroplattierte kupferfolie und deren herstellung unter verwendung elektrolytischer lösungen mit niedrigen konzentrationen von chlor ionen
DE69110208T2 (de) * 1990-08-03 1995-10-19 Rohco Inc Mcgean Kupferplattieren von Tiefdruckzylindern.
US6544399B1 (en) * 1999-01-11 2003-04-08 Applied Materials, Inc. Electrodeposition chemistry for filling apertures with reflective metal
US7074315B2 (en) * 2000-10-19 2006-07-11 Atotech Deutschland Gmbh Copper bath and methods of depositing a matt copper coating
DE10058896C1 (de) * 2000-10-19 2002-06-13 Atotech Deutschland Gmbh Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
WO2003012174A1 (fr) * 2001-07-27 2003-02-13 Pirelli Pneumatici S.P.A. Procede electrolytique permettant de deposer une couche de cuivre sur un fil d'acier
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US20040074775A1 (en) * 2002-10-21 2004-04-22 Herdman Roderick Dennis Pulse reverse electrolysis of acidic copper electroplating solutions
US6851200B2 (en) * 2003-03-14 2005-02-08 Hopkins Manufacturing Corporation Reflecting lighted level

Also Published As

Publication number Publication date
FR2104809B3 (fr) 1974-04-05
CA1026702A (fr) 1978-02-21
NL7110413A (fr) 1972-02-01
US3682788A (en) 1972-08-08
FR2104809A3 (fr) 1972-04-21
AU3040571A (en) 1973-01-04
DE2134757A1 (de) 1972-03-30

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