DE10393769B4 - Halbleiterbauelement mit Klemmen zum Verbinden mit externen Elementen - Google Patents

Halbleiterbauelement mit Klemmen zum Verbinden mit externen Elementen Download PDF

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Publication number
DE10393769B4
DE10393769B4 DE10393769T DE10393769T DE10393769B4 DE 10393769 B4 DE10393769 B4 DE 10393769B4 DE 10393769 T DE10393769 T DE 10393769T DE 10393769 T DE10393769 T DE 10393769T DE 10393769 B4 DE10393769 B4 DE 10393769B4
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Prior art keywords
semiconductor
contact
conductive
main
electrode
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Expired - Fee Related
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DE10393769T
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German (de)
English (en)
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DE10393769T5 (de
Inventor
Martin Standing
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Infineon Technologies Americas Corp
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International Rectifier Corp USA
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07637—Techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/881—Bump connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE10393769T 2002-11-22 2003-11-21 Halbleiterbauelement mit Klemmen zum Verbinden mit externen Elementen Expired - Fee Related DE10393769B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/303,523 US6841865B2 (en) 2002-11-22 2002-11-22 Semiconductor device having clips for connecting to external elements
US10/303,523 2002-11-22
PCT/US2003/037314 WO2004049435A1 (en) 2002-11-22 2003-11-21 Semiconductor device having clips for connecting to external elements

Publications (2)

Publication Number Publication Date
DE10393769T5 DE10393769T5 (de) 2006-02-09
DE10393769B4 true DE10393769B4 (de) 2012-09-27

Family

ID=32325025

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10393769T Expired - Fee Related DE10393769B4 (de) 2002-11-22 2003-11-21 Halbleiterbauelement mit Klemmen zum Verbinden mit externen Elementen

Country Status (7)

Country Link
US (1) US6841865B2 (https=)
JP (1) JP4327096B2 (https=)
CN (1) CN100421240C (https=)
AU (1) AU2003295783A1 (https=)
DE (1) DE10393769B4 (https=)
TW (1) TWI228317B (https=)
WO (1) WO2004049435A1 (https=)

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US6930397B2 (en) * 2001-03-28 2005-08-16 International Rectifier Corporation Surface mounted package with die bottom spaced from support board
CN100499053C (zh) * 2003-02-28 2009-06-10 西门子公司 用于具有遵循表面轮廓的电绝缘材料层的功率半导体的布线工艺
US7692316B2 (en) 2004-10-01 2010-04-06 International Rectifier Corporation Audio amplifier assembly
US20060145319A1 (en) * 2004-12-31 2006-07-06 Ming Sun Flip chip contact (FCC) power package
CN100435324C (zh) * 2004-12-20 2008-11-19 半导体元件工业有限责任公司 具有增强散热性的半导体封装结构
JP4917296B2 (ja) * 2005-10-28 2012-04-18 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
EP1946364A1 (en) * 2005-11-01 2008-07-23 Koninklijke Philips Electronics N.V. Methods of packaging a semiconductor die and package formed by the methods
DE102005061015B4 (de) * 2005-12-19 2008-03-13 Infineon Technologies Ag Verfahren zum Herstellen eines Halbleiterbauteils mit einem vertikalen Halbleiterbauelement
US20070215997A1 (en) * 2006-03-17 2007-09-20 Martin Standing Chip-scale package
US7663212B2 (en) * 2006-03-21 2010-02-16 Infineon Technologies Ag Electronic component having exposed surfaces
US7733659B2 (en) * 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
DE102007009521B4 (de) * 2007-02-27 2011-12-15 Infineon Technologies Ag Bauteil und Verfahren zu dessen Herstellung
US8222078B2 (en) * 2009-07-22 2012-07-17 Alpha And Omega Semiconductor Incorporated Chip scale surface mounted semiconductor device package and process of manufacture
CN201629397U (zh) * 2009-11-30 2010-11-10 鸿富锦精密工业（深圳）有限公司 集成电路组合
US20120175688A1 (en) * 2011-01-10 2012-07-12 International Rectifier Corporation Semiconductor Package with Reduced On-Resistance and Top Metal Spreading Resistance with Application to Power Transistor Packaging
US9536800B2 (en) 2013-12-07 2017-01-03 Fairchild Semiconductor Corporation Packaged semiconductor devices and methods of manufacturing
US10192846B2 (en) 2014-11-05 2019-01-29 Infineon Technologies Austria Ag Method of inserting an electronic component into a slot in a circuit board
US10553557B2 (en) * 2014-11-05 2020-02-04 Infineon Technologies Austria Ag Electronic component, system and method
US10064287B2 (en) 2014-11-05 2018-08-28 Infineon Technologies Austria Ag System and method of providing a semiconductor carrier and redistribution structure
US11521862B2 (en) * 2017-12-15 2022-12-06 Chih-Liang Hu Process for fabricating circuit components in matrix batches
DE102023135840A1 (de) * 2023-12-19 2025-06-26 Infineon Technologies Ag Halbleiterbauelement mit einem träger, einem halbleiterdie und einem c-förmigen clip, der zwischen ihnen verbunden ist

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63281451A (ja) * 1987-05-13 1988-11-17 Hitachi Ltd 半導体装置
JPH01161707A (ja) * 1987-12-17 1989-06-26 Nec Corp チップ部品
JPH0357251A (ja) * 1989-07-26 1991-03-12 Hitachi Ltd 半導体装置
JPH04159704A (ja) * 1990-10-23 1992-06-02 Nec Corp 電気二重層コンデンサ
WO1999065077A1 (en) * 1998-06-09 1999-12-16 Fairchild Semiconductor Corporation Low resistance package for semiconductor devices
EP0966038A2 (en) * 1998-06-15 1999-12-22 Ford Motor Company Bonding of semiconductor power devices
JP2000091475A (ja) * 1998-09-09 2000-03-31 Shindengen Electric Mfg Co Ltd 半導体装置
DE10003671A1 (de) * 1999-01-28 2000-08-10 Hitachi Ltd Halbleiter-Bauelement
JP2000243887A (ja) * 1999-02-23 2000-09-08 Sanyo Electric Co Ltd 半導体装置とその製造方法
JP2000277542A (ja) * 1999-03-25 2000-10-06 Sanyo Electric Co Ltd 半導体装置
US20010048116A1 (en) * 2000-04-04 2001-12-06 International Rectifier Corp. Chip scale surface mounted device and process of manufacture
JP2002076195A (ja) * 2000-09-04 2002-03-15 Sanyo Electric Co Ltd Ｍｏｓｆｅｔの実装構造およびその製造方法

Also Published As

Publication number Publication date
AU2003295783A1 (en) 2004-06-18
WO2004049435A1 (en) 2004-06-10
DE10393769T5 (de) 2006-02-09
US20040099940A1 (en) 2004-05-27
US6841865B2 (en) 2005-01-11
CN100421240C (zh) 2008-09-24
TWI228317B (en) 2005-02-21
CN1729568A (zh) 2006-02-01
TW200414533A (en) 2004-08-01
JP2006507688A (ja) 2006-03-02
JP4327096B2 (ja) 2009-09-09

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