DE102020125705A1 - Leistungs-Halbleitervorrichtung - Google Patents

Leistungs-Halbleitervorrichtung Download PDF

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Publication number
DE102020125705A1
DE102020125705A1 DE102020125705.8A DE102020125705A DE102020125705A1 DE 102020125705 A1 DE102020125705 A1 DE 102020125705A1 DE 102020125705 A DE102020125705 A DE 102020125705A DE 102020125705 A1 DE102020125705 A1 DE 102020125705A1
Authority
DE
Germany
Prior art keywords
power semiconductor
semiconductor device
external connection
lid
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102020125705.8A
Other languages
German (de)
English (en)
Inventor
Hidetoshi Ishibashi
Yoshitaka Kimura
Minoru EGUSA
Nobuhiro Asaji
Kazunari Teshigawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102020125705A1 publication Critical patent/DE102020125705A1/de
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/7064—Press fitting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
DE102020125705.8A 2019-10-30 2020-10-01 Leistungs-Halbleitervorrichtung Pending DE102020125705A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019197065A JP7224272B2 (ja) 2019-10-30 2019-10-30 パワー半導体装置
JP2019-197065 2019-10-30

Publications (1)

Publication Number Publication Date
DE102020125705A1 true DE102020125705A1 (de) 2021-05-06

Family

ID=75485442

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102020125705.8A Pending DE102020125705A1 (de) 2019-10-30 2020-10-01 Leistungs-Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US11742251B2 (https=)
JP (1) JP7224272B2 (https=)
CN (1) CN112750801B (https=)
DE (1) DE102020125705A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114361115B (zh) * 2021-12-31 2022-08-23 中山市木林森微电子有限公司 一种多芯片埋入式封装模块结构
JP2023110389A (ja) * 2022-01-28 2023-08-09 三菱電機株式会社 半導体装置、電力変換装置、および、半導体装置の製造方法
CN114823546A (zh) * 2022-03-26 2022-07-29 华为数字能源技术有限公司 功率模块及其制造方法、功率变换器和供电设备
KR102655235B1 (ko) * 2022-12-20 2024-04-08 주식회사 현대케피코 커넥터 매립형 하우징 앗세이 적용 제어기
EP4700827A1 (en) * 2024-08-19 2026-02-25 Infineon Technologies AG Power semiconductor module arrangement
CN119695016B (zh) * 2025-02-24 2025-07-18 深圳市万联芯科技有限公司 一种集成电路芯片的封装结构及其方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006025453B4 (de) * 2006-05-31 2009-12-24 Infineon Technologies Ag Halbleiterschaltungsanordnung
JP2009081325A (ja) * 2007-09-27 2009-04-16 Sanyo Electric Co Ltd 回路装置
KR101463074B1 (ko) * 2008-01-10 2014-11-21 페어차일드코리아반도체 주식회사 리드리스 패키지
JP5136513B2 (ja) 2009-05-15 2013-02-06 トヨタ自動車株式会社 半導体装置
JP5583433B2 (ja) 2010-03-05 2014-09-03 株式会社ケーヒン 半導体装置
EP2538761B1 (en) * 2011-06-20 2014-01-29 STMicroelectronics Srl Intelligent Power Module and related assembling method
JP5633496B2 (ja) * 2011-09-29 2014-12-03 三菱電機株式会社 半導体装置及びその製造方法
KR101443985B1 (ko) * 2012-12-14 2014-11-03 삼성전기주식회사 전력 모듈 패키지
JP6157584B2 (ja) 2013-02-26 2017-07-05 三菱電機株式会社 電力用半導体装置組み込み機器の製造方法および電力用半導体装置
JP6119313B2 (ja) 2013-03-08 2017-04-26 富士電機株式会社 半導体装置
JP6380244B2 (ja) 2015-06-15 2018-08-29 三菱電機株式会社 半導体装置、電力変換装置
JP6455364B2 (ja) 2015-08-28 2019-01-23 三菱電機株式会社 半導体装置、インテリジェントパワーモジュールおよび電力変換装置
JP6451569B2 (ja) * 2015-09-14 2019-01-16 株式会社デンソー 電子装置
EP3217774B1 (en) 2016-03-08 2018-06-13 ABB Schweiz AG Semiconductor module
JP6559093B2 (ja) * 2016-05-16 2019-08-14 三菱電機株式会社 半導体装置
JP6705394B2 (ja) 2017-02-16 2020-06-03 三菱電機株式会社 半導体モジュールおよびインバータ装置
JP6806024B2 (ja) 2017-10-03 2020-12-23 三菱電機株式会社 半導体装置
JP7099020B2 (ja) * 2018-04-10 2022-07-12 株式会社デンソー 圧入端子、及び圧入端子を含む電子装置

Also Published As

Publication number Publication date
JP7224272B2 (ja) 2023-02-17
JP2021072329A (ja) 2021-05-06
CN112750801A (zh) 2021-05-04
CN112750801B (zh) 2024-08-02
US11742251B2 (en) 2023-08-29
US20210134686A1 (en) 2021-05-06

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Free format text: PREVIOUS MAIN CLASS: H01L0025070000

Ipc: H10D0080200000