CN112750801B - 功率半导体装置 - Google Patents

功率半导体装置 Download PDF

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Publication number
CN112750801B
CN112750801B CN202011146157.7A CN202011146157A CN112750801B CN 112750801 B CN112750801 B CN 112750801B CN 202011146157 A CN202011146157 A CN 202011146157A CN 112750801 B CN112750801 B CN 112750801B
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CN
China
Prior art keywords
power semiconductor
semiconductor device
external connection
cover
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011146157.7A
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English (en)
Chinese (zh)
Other versions
CN112750801A (zh
Inventor
石桥秀俊
木村义孝
江草稔
浅地伸洋
勅使河原一成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
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Publication of CN112750801A publication Critical patent/CN112750801A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/7064—Press fitting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
CN202011146157.7A 2019-10-30 2020-10-23 功率半导体装置 Active CN112750801B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019197065A JP7224272B2 (ja) 2019-10-30 2019-10-30 パワー半導体装置
JP2019-197065 2019-10-30

Publications (2)

Publication Number Publication Date
CN112750801A CN112750801A (zh) 2021-05-04
CN112750801B true CN112750801B (zh) 2024-08-02

Family

ID=75485442

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011146157.7A Active CN112750801B (zh) 2019-10-30 2020-10-23 功率半导体装置

Country Status (4)

Country Link
US (1) US11742251B2 (https=)
JP (1) JP7224272B2 (https=)
CN (1) CN112750801B (https=)
DE (1) DE102020125705A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114361115B (zh) * 2021-12-31 2022-08-23 中山市木林森微电子有限公司 一种多芯片埋入式封装模块结构
JP2023110389A (ja) * 2022-01-28 2023-08-09 三菱電機株式会社 半導体装置、電力変換装置、および、半導体装置の製造方法
CN114823546A (zh) * 2022-03-26 2022-07-29 华为数字能源技术有限公司 功率模块及其制造方法、功率变换器和供电设备
KR102655235B1 (ko) * 2022-12-20 2024-04-08 주식회사 현대케피코 커넥터 매립형 하우징 앗세이 적용 제어기
EP4700827A1 (en) * 2024-08-19 2026-02-25 Infineon Technologies AG Power semiconductor module arrangement
CN119695016B (zh) * 2025-02-24 2025-07-18 深圳市万联芯科技有限公司 一种集成电路芯片的封装结构及其方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105074919A (zh) * 2013-02-26 2015-11-18 三菱电机株式会社 电力用半导体装置
CN106252292A (zh) * 2015-06-15 2016-12-21 三菱电机株式会社 压接端子、半导体装置、电力变换装置及压接端子的制造方法
CN106487252A (zh) * 2015-08-28 2017-03-08 三菱电机株式会社 半导体装置、智能功率模块及电力转换装置
CN109599372A (zh) * 2017-10-03 2019-04-09 三菱电机株式会社 半导体装置

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DE102006025453B4 (de) * 2006-05-31 2009-12-24 Infineon Technologies Ag Halbleiterschaltungsanordnung
JP2009081325A (ja) * 2007-09-27 2009-04-16 Sanyo Electric Co Ltd 回路装置
KR101463074B1 (ko) * 2008-01-10 2014-11-21 페어차일드코리아반도체 주식회사 리드리스 패키지
JP5136513B2 (ja) 2009-05-15 2013-02-06 トヨタ自動車株式会社 半導体装置
JP5583433B2 (ja) 2010-03-05 2014-09-03 株式会社ケーヒン 半導体装置
EP2538761B1 (en) * 2011-06-20 2014-01-29 STMicroelectronics Srl Intelligent Power Module and related assembling method
JP5633496B2 (ja) * 2011-09-29 2014-12-03 三菱電機株式会社 半導体装置及びその製造方法
KR101443985B1 (ko) * 2012-12-14 2014-11-03 삼성전기주식회사 전력 모듈 패키지
JP6119313B2 (ja) 2013-03-08 2017-04-26 富士電機株式会社 半導体装置
JP6451569B2 (ja) * 2015-09-14 2019-01-16 株式会社デンソー 電子装置
EP3217774B1 (en) 2016-03-08 2018-06-13 ABB Schweiz AG Semiconductor module
JP6559093B2 (ja) * 2016-05-16 2019-08-14 三菱電機株式会社 半導体装置
JP6705394B2 (ja) 2017-02-16 2020-06-03 三菱電機株式会社 半導体モジュールおよびインバータ装置
JP7099020B2 (ja) * 2018-04-10 2022-07-12 株式会社デンソー 圧入端子、及び圧入端子を含む電子装置

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CN105074919A (zh) * 2013-02-26 2015-11-18 三菱电机株式会社 电力用半导体装置
CN106252292A (zh) * 2015-06-15 2016-12-21 三菱电机株式会社 压接端子、半导体装置、电力变换装置及压接端子的制造方法
CN106487252A (zh) * 2015-08-28 2017-03-08 三菱电机株式会社 半导体装置、智能功率模块及电力转换装置
CN109599372A (zh) * 2017-10-03 2019-04-09 三菱电机株式会社 半导体装置

Also Published As

Publication number Publication date
DE102020125705A1 (de) 2021-05-06
JP7224272B2 (ja) 2023-02-17
JP2021072329A (ja) 2021-05-06
CN112750801A (zh) 2021-05-04
US11742251B2 (en) 2023-08-29
US20210134686A1 (en) 2021-05-06

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