DE102007061410A1 - Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel - Google Patents
Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel Download PDFInfo
- Publication number
- DE102007061410A1 DE102007061410A1 DE102007061410A DE102007061410A DE102007061410A1 DE 102007061410 A1 DE102007061410 A1 DE 102007061410A1 DE 102007061410 A DE102007061410 A DE 102007061410A DE 102007061410 A DE102007061410 A DE 102007061410A DE 102007061410 A1 DE102007061410 A1 DE 102007061410A1
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- wafers
- moving means
- suction
- transport path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G59/00—De-stacking of articles
- B65G59/02—De-stacking from the top of the stack
- B65G59/04—De-stacking from the top of the stack by suction or magnetic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G59/00—De-stacking of articles
- B65G59/02—De-stacking from the top of the stack
- B65G59/04—De-stacking from the top of the stack by suction or magnetic devices
- B65G59/045—De-stacking from the top of the stack by suction or magnetic devices with a stepwise upward movement of the stack
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3306—Horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007061410A DE102007061410A1 (de) | 2007-12-11 | 2007-12-11 | Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel |
| AU2008334890A AU2008334890A1 (en) | 2007-12-11 | 2008-12-11 | Method of, and apparatus for, separating wafers from a wafer stack |
| PCT/EP2008/010527 WO2009074317A1 (de) | 2007-12-11 | 2008-12-11 | Verfahren und vorrichtung zum vereinzeln von wafern von einem waferstapel |
| TW097148262A TW201001601A (en) | 2007-12-11 | 2008-12-11 | Method and device for separating wafers from a wafer stack |
| CN200880126572.7A CN102006976B (zh) | 2007-12-11 | 2008-12-11 | 用于将晶片从晶片堆分离的方法和设备 |
| JP2010537313A JP2011507242A (ja) | 2007-12-11 | 2008-12-11 | ウェハ・スタックからウェハを分離する方法と装置 |
| KR1020107015196A KR20100100957A (ko) | 2007-12-11 | 2008-12-11 | 웨이퍼 스택에서 웨이퍼를 분리하는 방법 및 장치 |
| EP08858959A EP2229265A1 (de) | 2007-12-11 | 2008-12-11 | Verfahren und vorrichtung zum vereinzeln von wafern von einem waferstapel |
| CA2707804A CA2707804A1 (en) | 2007-12-11 | 2008-12-11 | Method of, and apparatus for, separating wafers from a wafer stack |
| IL206256A IL206256A0 (en) | 2007-12-11 | 2010-06-08 | Method of, and apparatus for separating wafers from a wafer stack |
| US12/814,200 US20110008145A1 (en) | 2007-12-11 | 2010-06-11 | Method of, and apparatus for, separating wafers from a wafer stack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007061410A DE102007061410A1 (de) | 2007-12-11 | 2007-12-11 | Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102007061410A1 true DE102007061410A1 (de) | 2009-06-18 |
Family
ID=40514053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102007061410A Ceased DE102007061410A1 (de) | 2007-12-11 | 2007-12-11 | Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20110008145A1 (https=) |
| EP (1) | EP2229265A1 (https=) |
| JP (1) | JP2011507242A (https=) |
| KR (1) | KR20100100957A (https=) |
| CN (1) | CN102006976B (https=) |
| AU (1) | AU2008334890A1 (https=) |
| CA (1) | CA2707804A1 (https=) |
| DE (1) | DE102007061410A1 (https=) |
| IL (1) | IL206256A0 (https=) |
| TW (1) | TW201001601A (https=) |
| WO (1) | WO2009074317A1 (https=) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008060012A1 (de) | 2008-11-24 | 2010-05-27 | Gebr. Schmid Gmbh & Co. | Verfahren zum Drehen eines zersägten Waferblocks und Vorrichtung dafür |
| DE102008060014A1 (de) | 2008-11-24 | 2010-05-27 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Handhabung eines zersägten Waferblocks |
| WO2011032567A1 (de) * | 2009-09-15 | 2011-03-24 | Rena Gmbh | Vorrichtung und verfahren zum berührungslosen aufnehmen und halten sowie zum fördern von flachen gegenständen |
| WO2011063988A1 (de) * | 2009-11-30 | 2011-06-03 | Amb Apparate + Maschinenbau Gmbh | Vereinzelungsvorrichtung |
| DE202011102453U1 (de) | 2011-06-24 | 2011-08-29 | Schmid Technology Systems Gmbh | Vorrichtung zum Entnehmen von einzelnen Wafern von einem Stapel solcher Wafer aus einer Aufnahmevorrichtung |
| WO2011054510A3 (en) * | 2009-11-04 | 2011-10-13 | Solar Semi Engineering Limited | Wafer processing |
| DE102012221452A1 (de) | 2012-07-20 | 2014-01-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zum Separieren von Wafern |
| CN106180111A (zh) * | 2016-08-24 | 2016-12-07 | 高佳太阳能股份有限公司 | 一种硅片自动插片机的上料装置 |
| WO2021089735A1 (de) * | 2019-11-05 | 2021-05-14 | Asys Automatisierungssysteme Gmbh | Be- und entladeeinrichtung für ein substratmagazin, substratmagazinsystem |
| EP4345867A1 (en) * | 2022-09-26 | 2024-04-03 | SCREEN Holdings Co., Ltd. | Substrate treating apparatus |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5254114B2 (ja) * | 2009-04-07 | 2013-08-07 | 日鉄住金ファインテック株式会社 | ウエハ搬送方法およびウエハ搬送装置 |
| JP5368222B2 (ja) * | 2009-09-14 | 2013-12-18 | 日鉄住金ファインテック株式会社 | ウエハ搬送方法およびウエハ搬送装置 |
| KR101370578B1 (ko) * | 2009-07-24 | 2014-03-07 | 스미토모 긴조쿠 파인테크 가부시키가이샤 | 웨이퍼 반송방법 및 웨이퍼 반송장치 |
| JP2011061120A (ja) * | 2009-09-14 | 2011-03-24 | Sumitomo Metal Fine Technology Co Ltd | ウエハ搬送方法およびウエハ搬送装置 |
| JP2011029390A (ja) * | 2009-07-24 | 2011-02-10 | Sumitomo Metal Fine Technology Co Ltd | ウエハ搬送方法およびウエハ搬送装置 |
| JP5405947B2 (ja) * | 2009-09-04 | 2014-02-05 | 日本文化精工株式会社 | ウエハ搬送装置、および、ウエハ搬送方法 |
| JP5457113B2 (ja) * | 2009-09-14 | 2014-04-02 | 日鉄住金ファインテック株式会社 | ウエハ搬送方法およびウエハ搬送装置 |
| KR101152522B1 (ko) | 2009-10-30 | 2012-06-01 | 주식회사 케이씨텍 | 웨이퍼 이송을 위하여 유체의 흐름을 강화한 웨이퍼 분리 장치 |
| KR101162684B1 (ko) | 2009-11-09 | 2012-07-05 | 주식회사 케이씨텍 | 웨이퍼 분리장치 |
| JP5502503B2 (ja) * | 2010-01-21 | 2014-05-28 | 日鉄住金ファインテック株式会社 | ウエハ搬送装置およびウエハ搬送方法 |
| CN102883978B (zh) * | 2010-05-03 | 2015-05-06 | 爱诺华李赛克技术中心有限公司 | 用于输送板形元件的装置 |
| JP5965316B2 (ja) * | 2010-07-08 | 2016-08-03 | 株式会社渡辺商行 | ウエハ分離装置、ウエハ分離搬送装置、ウエハ分離方法、ウエハ分離搬送方法及び太陽電池用ウエハ分離搬送方法 |
| CN101950778A (zh) * | 2010-09-02 | 2011-01-19 | 董维来 | 太阳能硅片湿法自动分片方法 |
| DE102010045098A1 (de) * | 2010-09-13 | 2012-03-15 | Rena Gmbh | Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten |
| KR101102428B1 (ko) * | 2011-05-24 | 2012-01-05 | 주식회사 에이에스이 | 웨이퍼 분리 및 반출장치 |
| JP2013149703A (ja) * | 2012-01-18 | 2013-08-01 | Nippon Steel & Sumikin Fine Technology Co Ltd | ウエハ搬送装置 |
| JP5600692B2 (ja) * | 2012-01-18 | 2014-10-01 | 日鉄住金ファインテック株式会社 | ウエハ搬送装置 |
| JP5995089B2 (ja) * | 2012-05-31 | 2016-09-21 | パナソニックIpマネジメント株式会社 | シリコンウェハ剥離方法、およびシリコンウェハ剥離装置 |
| ITUD20120207A1 (it) * | 2012-12-03 | 2014-06-04 | Applied Materials Italia Srl | Apparecchiatura e metodo per trasportare un substrato |
| CN103199044B (zh) * | 2013-03-06 | 2015-06-24 | 北京自动化技术研究院 | 一种硅片传送装置 |
| CN104658954A (zh) * | 2015-02-13 | 2015-05-27 | 苏州博阳能源设备有限公司 | 一种硅片插片机 |
| CN105417168A (zh) * | 2015-12-31 | 2016-03-23 | 苏州博阳能源设备有限公司 | 一种用于硅片插片机的供料槽 |
| CN105460612A (zh) * | 2015-12-31 | 2016-04-06 | 苏州博阳能源设备有限公司 | 一种硅片分片机构 |
| CN108408402A (zh) * | 2018-04-04 | 2018-08-17 | 杭州利珀科技有限公司 | 太阳能电池片连续吸附系统和连续吸附方法 |
| CN110391149B (zh) * | 2018-04-19 | 2024-05-28 | 无锡市南亚科技有限公司 | 硅片分片及吸片送片装置以及硅片分片吸片送片的方法 |
| US10507991B2 (en) * | 2018-05-08 | 2019-12-17 | Applied Materials, Inc. | Vacuum conveyor substrate loading module |
| CN110451268A (zh) * | 2019-07-24 | 2019-11-15 | 广州复雅机械设备有限公司 | 全自动放盘机 |
| KR102751035B1 (ko) * | 2019-12-19 | 2025-01-07 | 삼성디스플레이 주식회사 | 박리 장치 및 그를 이용한 표시 장치의 제조 방법 |
| CN113651123A (zh) * | 2021-08-09 | 2021-11-16 | 张家港市超声电气有限公司 | 用于硅片的分片装置 |
| KR102528896B1 (ko) * | 2021-10-21 | 2023-05-08 | 주식회사 유성에프에이 | 기판 버퍼장치 |
| CN114476674A (zh) * | 2022-03-24 | 2022-05-13 | 深圳市蓝际工业技术有限公司 | 一种叶片上料设备及片状材料输送设备 |
| CN114733795A (zh) * | 2022-05-09 | 2022-07-12 | 苏州天准科技股份有限公司 | 碎料检测剔除装置、检测剔除方法和分选系统 |
| JP7806681B2 (ja) * | 2022-12-23 | 2026-01-27 | 株式会社Sumco | ウェーハ分離装置及び方法並びにシリコンウェーハの製造方法 |
| JP7624466B2 (ja) * | 2023-01-27 | 2025-01-30 | 株式会社Screenホールディングス | 基板処理システム |
| JP2025007099A (ja) * | 2023-06-30 | 2025-01-17 | 株式会社Screenホールディングス | 基板処理システム |
| CN116872368A (zh) * | 2023-07-21 | 2023-10-13 | 安徽省恒泰新材料有限公司 | 反式浇筑石膏板生产设备 |
| CN117068761B (zh) * | 2023-08-16 | 2025-01-10 | 龙口科诺尔玻璃科技有限公司 | 一种玻璃自动分片输送装置 |
| CN118162866A (zh) * | 2023-12-22 | 2024-06-11 | 江苏智仁景行新材料研究院有限公司 | 一种过滤模具组拆分装置及清理系统 |
| CN118553675B (zh) * | 2024-07-30 | 2024-09-27 | 西湖仪器(杭州)技术有限公司 | 一种应用于碳化硅晶片的剥离设备及其剥离方法 |
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-
2007
- 2007-12-11 DE DE102007061410A patent/DE102007061410A1/de not_active Ceased
-
2008
- 2008-12-11 JP JP2010537313A patent/JP2011507242A/ja active Pending
- 2008-12-11 WO PCT/EP2008/010527 patent/WO2009074317A1/de not_active Ceased
- 2008-12-11 KR KR1020107015196A patent/KR20100100957A/ko not_active Ceased
- 2008-12-11 CN CN200880126572.7A patent/CN102006976B/zh not_active Expired - Fee Related
- 2008-12-11 TW TW097148262A patent/TW201001601A/zh unknown
- 2008-12-11 EP EP08858959A patent/EP2229265A1/de not_active Withdrawn
- 2008-12-11 AU AU2008334890A patent/AU2008334890A1/en not_active Abandoned
- 2008-12-11 CA CA2707804A patent/CA2707804A1/en not_active Abandoned
-
2010
- 2010-06-08 IL IL206256A patent/IL206256A0/en unknown
- 2010-06-11 US US12/814,200 patent/US20110008145A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE6925828U (de) * | 1969-06-30 | 1972-08-17 | Hwm Weh Maschf Hermann | Vorrichtung zum kontinuierlichen erfassen, transportieren, stapeln und/oder entstapeln von plattenfoermigem foedergut mit einem oder mehreren saugkoepfen; |
| DE4100526A1 (de) * | 1991-01-10 | 1992-07-16 | Wacker Chemitronic | Vorrichtung und verfahren zum automatischen vereinzeln von gestapelten scheiben |
| DE102006011870A1 (de) * | 2006-03-15 | 2007-09-20 | Insotech Ohg | Vereinzelungsvorrichtung und Verfahren zur stückweisen Bereitstellung plattenförmiger Gegenstände |
| DE102006014136A1 (de) * | 2006-03-28 | 2007-10-11 | Rena Sondermaschinen Gmbh | Maschinenteil zum Ablösen und Einlagern von scheibenförmigen Substraten oder Teilen |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008060012A1 (de) | 2008-11-24 | 2010-05-27 | Gebr. Schmid Gmbh & Co. | Verfahren zum Drehen eines zersägten Waferblocks und Vorrichtung dafür |
| DE102008060014A1 (de) | 2008-11-24 | 2010-05-27 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Handhabung eines zersägten Waferblocks |
| WO2011032567A1 (de) * | 2009-09-15 | 2011-03-24 | Rena Gmbh | Vorrichtung und verfahren zum berührungslosen aufnehmen und halten sowie zum fördern von flachen gegenständen |
| WO2011054510A3 (en) * | 2009-11-04 | 2011-10-13 | Solar Semi Engineering Limited | Wafer processing |
| WO2011063988A1 (de) * | 2009-11-30 | 2011-06-03 | Amb Apparate + Maschinenbau Gmbh | Vereinzelungsvorrichtung |
| DE202011102453U1 (de) | 2011-06-24 | 2011-08-29 | Schmid Technology Systems Gmbh | Vorrichtung zum Entnehmen von einzelnen Wafern von einem Stapel solcher Wafer aus einer Aufnahmevorrichtung |
| DE102012221452A1 (de) | 2012-07-20 | 2014-01-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zum Separieren von Wafern |
| WO2014012879A1 (de) | 2012-07-20 | 2014-01-23 | Xenon Automatisierungstechnik Gmbh | Vorrichtung zum separieren von wafern |
| CN106180111A (zh) * | 2016-08-24 | 2016-12-07 | 高佳太阳能股份有限公司 | 一种硅片自动插片机的上料装置 |
| WO2021089735A1 (de) * | 2019-11-05 | 2021-05-14 | Asys Automatisierungssysteme Gmbh | Be- und entladeeinrichtung für ein substratmagazin, substratmagazinsystem |
| EP4345867A1 (en) * | 2022-09-26 | 2024-04-03 | SCREEN Holdings Co., Ltd. | Substrate treating apparatus |
| US12598947B2 (en) | 2022-09-26 | 2026-04-07 | SCREEN Holdings Co., Ltd. | Substrate treating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201001601A (en) | 2010-01-01 |
| WO2009074317A1 (de) | 2009-06-18 |
| US20110008145A1 (en) | 2011-01-13 |
| KR20100100957A (ko) | 2010-09-15 |
| IL206256A0 (en) | 2010-12-30 |
| EP2229265A1 (de) | 2010-09-22 |
| JP2011507242A (ja) | 2011-03-03 |
| AU2008334890A1 (en) | 2009-06-18 |
| CN102006976A (zh) | 2011-04-06 |
| CA2707804A1 (en) | 2009-06-18 |
| CN102006976B (zh) | 2017-05-31 |
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