DE10132092A1 - Leiterbahnstrukturen und Verfahren zu ihrer Herstellung - Google Patents

Leiterbahnstrukturen und Verfahren zu ihrer Herstellung

Info

Publication number
DE10132092A1
DE10132092A1 DE10132092A DE10132092A DE10132092A1 DE 10132092 A1 DE10132092 A1 DE 10132092A1 DE 10132092 A DE10132092 A DE 10132092A DE 10132092 A DE10132092 A DE 10132092A DE 10132092 A1 DE10132092 A1 DE 10132092A1
Authority
DE
Germany
Prior art keywords
carrier material
following
metal
electromagnetic radiation
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10132092A
Other languages
German (de)
English (en)
Inventor
Gerhard Naundorf
Horst Wisbrock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LPKF Laser and Electronics AG
Original Assignee
LPKF Laser and Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7690377&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE10132092(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to DE10132092A priority Critical patent/DE10132092A1/de
Application filed by LPKF Laser and Electronics AG filed Critical LPKF Laser and Electronics AG
Priority to EP01130189A priority patent/EP1274288B1/de
Priority to DE50105542.8T priority patent/DE50105542C5/de
Priority to AT01130189T priority patent/ATE290766T1/de
Priority to PT01130189T priority patent/PT1274288E/pt
Priority to DK01130189T priority patent/DK1274288T3/da
Priority to ES01130189T priority patent/ES2238380T3/es
Priority to JP2003511603A priority patent/JP3881338B2/ja
Priority to AU2002319088A priority patent/AU2002319088A1/en
Priority to PCT/DE2002/002219 priority patent/WO2003005784A2/de
Priority to CNB028126092A priority patent/CN1326435C/zh
Priority to KR1020037016717A priority patent/KR100716486B1/ko
Publication of DE10132092A1 publication Critical patent/DE10132092A1/de
Priority to US10/751,111 priority patent/US7060421B2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/204—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
DE10132092A 2001-07-05 2001-07-05 Leiterbahnstrukturen und Verfahren zu ihrer Herstellung Withdrawn DE10132092A1 (de)

Priority Applications (13)

Application Number Priority Date Filing Date Title
DE10132092A DE10132092A1 (de) 2001-07-05 2001-07-05 Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
EP01130189A EP1274288B1 (de) 2001-07-05 2001-12-19 Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
DE50105542.8T DE50105542C5 (de) 2001-07-05 2001-12-19 Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
AT01130189T ATE290766T1 (de) 2001-07-05 2001-12-19 Leiterbahnstrukturen und verfahren zu ihrer herstellung
PT01130189T PT1274288E (pt) 2001-07-05 2001-12-19 Estruturas de pistas condutoras e processo se fabrico das mesmas
DK01130189T DK1274288T3 (da) 2001-07-05 2001-12-19 Lederbanestrukturer samt fremgangsmåde til deres fremstilling
ES01130189T ES2238380T3 (es) 2001-07-05 2001-12-19 Estructuras de pistas conductoras y procedimiento para su fabricacion.
JP2003511603A JP3881338B2 (ja) 2001-07-05 2002-06-19 コンダクタートラック構造物およびその製造方法
KR1020037016717A KR100716486B1 (ko) 2001-07-05 2002-06-19 도체 트랙 구조물 및 그 구조물의 제조 방법
AU2002319088A AU2002319088A1 (en) 2001-07-05 2002-06-19 Conductor track structures and method for the production thereof
PCT/DE2002/002219 WO2003005784A2 (de) 2001-07-05 2002-06-19 Leiterbahnstrukturen und verfahren zu ihrer herstellung
CNB028126092A CN1326435C (zh) 2001-07-05 2002-06-19 导体轨道结构的制造方法
US10/751,111 US7060421B2 (en) 2001-07-05 2004-01-05 Conductor track structures and method for production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10132092A DE10132092A1 (de) 2001-07-05 2001-07-05 Leiterbahnstrukturen und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
DE10132092A1 true DE10132092A1 (de) 2003-01-23

Family

ID=7690377

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10132092A Withdrawn DE10132092A1 (de) 2001-07-05 2001-07-05 Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
DE50105542.8T Expired - Lifetime DE50105542C5 (de) 2001-07-05 2001-12-19 Leiterbahnstrukturen und Verfahren zu ihrer Herstellung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE50105542.8T Expired - Lifetime DE50105542C5 (de) 2001-07-05 2001-12-19 Leiterbahnstrukturen und Verfahren zu ihrer Herstellung

Country Status (9)

Country Link
US (1) US7060421B2 (zh-TW)
EP (1) EP1274288B1 (zh-TW)
KR (1) KR100716486B1 (zh-TW)
AT (1) ATE290766T1 (zh-TW)
AU (1) AU2002319088A1 (zh-TW)
DE (2) DE10132092A1 (zh-TW)
DK (1) DK1274288T3 (zh-TW)
ES (1) ES2238380T3 (zh-TW)
PT (1) PT1274288E (zh-TW)

Cited By (18)

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DE102004017440A1 (de) * 2004-04-08 2005-11-03 Enthone Inc., West Haven Verfahren zur Behandlung von laserstrukturierten Kunststoffoberflächen
DE102004052301A1 (de) * 2004-10-27 2006-05-11 Jens Freye Verfahren zur Herstellung von Leiterbahnstrukturen
DE102004052300A1 (de) * 2004-10-27 2006-05-11 Jens Freye Verfahren zur Herstellung von Leiterbahnstrukturen
DE102004052303A1 (de) * 2004-10-27 2006-05-11 Jens Freye Verfahren zur Herstellung von Funktionselementstrukturen
EP1898682A2 (de) 2006-09-05 2008-03-12 Harting Mitronics AG Metallisierte Kunststoffoberfläche sowie Verfahren zum Bearbeiten und Metallisieren von Kunststoffoberflächen
DE102006053982B4 (de) * 2006-11-10 2009-10-29 Infineon Technologies Ag Dreidimensionale Trägerstruktur für elektrische oder optoelektronische Bauteile mit einer elektromagnetischen Schirmungsstruktur, elektronische oder optoelektronische Baugruppe mit einer dreidimensionalen Trägerstruktur, Verfahren zur Herstellung einer dreidimensionalen Trägerstruktur für elektrische oder optoelektronische Bauteile mit einer elektromagnetischen Schirmungsstruktur
US8258624B2 (en) 2007-08-10 2012-09-04 Intel Mobile Communications GmbH Method for fabricating a semiconductor and semiconductor package
US8323802B2 (en) 2004-10-20 2012-12-04 E I Du Pont De Nemours And Company Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto
DE102011055117A1 (de) 2011-11-08 2013-05-08 Harting Kgaa Verfahren und Lösung zur Metallisierung von Polymeroberflächen
US8449949B2 (en) 2007-07-09 2013-05-28 E. I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
WO2013079059A1 (de) 2011-11-28 2013-06-06 Harting Kgaa Isolierkörper eines steckverbinders
DE102011056261A1 (de) 2011-12-12 2013-06-13 Harting Ag Federkontakt
DE102013100016A1 (de) * 2013-01-02 2014-07-03 Lpkf Laser & Electronics Ag Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einem nichtleitenden Trägermaterial sowie ein hierzu bestimmtes Additiv und Trägermaterial
DE102014114986A1 (de) * 2014-10-15 2016-04-21 Lpkf Laser & Electronics Ag Verfahren zur Herstellung einer elektrisch leitfähigen Struktur sowie ein mit diesem Verfahren hergestelltes Trägermaterial
DE102014114987A1 (de) * 2014-10-15 2016-04-21 Lpkf Laser & Electronics Ag Verfahren zur Herstellung einer elektrisch leitfähigen Struktur sowie ein mit diesem Verfahren hergestelltes Trägermaterial
WO2017178186A1 (de) 2016-04-14 2017-10-19 Endress+Hauser Gmbh+Co. Kg Verfahren zur positionierung von leiterplatten und leiterplattenanordnung
WO2021115518A1 (de) 2019-12-11 2021-06-17 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zur herstellung einer elektrisch leitfähigen struktur
WO2021228298A1 (de) 2020-05-12 2021-11-18 Lpkf Laser & Electronics Aktiengesellschaft Verbundstruktur mit zumindest einer elektronischen komponente sowie ein verfahren zur herstellung einer solchen verbundstruktur

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DE10344512A1 (de) 2003-09-24 2005-04-28 Mitsubishi Polyester Film Gmbh Einschichtige, orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester zur Herstellung selektiv metallisierter Folien
DE10344511A1 (de) 2003-09-24 2005-04-28 Mitsubishi Polyester Film Gmbh Orientierte, mittels elektromagnetischer Strahlung strukturierbare und mit Aminosilan beschichtete Folie aus thermoplastischem Polyester zur Herstellung selektiv metallisierter Folien
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CN102088131A (zh) * 2009-12-03 2011-06-08 深圳富泰宏精密工业有限公司 电子装置壳体及其制作方法
KR20130064824A (ko) * 2009-12-17 2013-06-18 비와이디 컴퍼니 리미티드 표면 금속화 방법, 플라스틱 제품 제조 방법 및 이로부터 제조된 플라스틱 제품
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CN102071421B (zh) * 2010-01-15 2012-01-04 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
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EP1898682A2 (de) 2006-09-05 2008-03-12 Harting Mitronics AG Metallisierte Kunststoffoberfläche sowie Verfahren zum Bearbeiten und Metallisieren von Kunststoffoberflächen
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US7060421B2 (en) 2006-06-13
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EP1274288B1 (de) 2005-03-09
AU2002319088A1 (en) 2003-01-21
US20040241422A1 (en) 2004-12-02
KR100716486B1 (ko) 2007-05-10
DE50105542D1 (de) 2005-04-14
PT1274288E (pt) 2005-06-30
ATE290766T1 (de) 2005-03-15

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