CN205893421U - 卡盘组件和用于晶片电镀系统中的卡盘组件 - Google Patents

卡盘组件和用于晶片电镀系统中的卡盘组件 Download PDF

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CN205893421U
CN205893421U CN201620726839.8U CN201620726839U CN205893421U CN 205893421 U CN205893421 U CN 205893421U CN 201620726839 U CN201620726839 U CN 201620726839U CN 205893421 U CN205893421 U CN 205893421U
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兰迪·A·哈里斯
迈克尔·温德姆
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Abstract

本公开内容提供了卡盘组件。本公开内容提供了用于晶片电镀系统中的卡盘组件。晶片被放置到电镀系统内的卡盘组件中。所述卡盘组件包括背板组件，所述背板组件可与环接合。轮毂可提供在所述背板组件的一侧上，用以将所述卡盘组件附接到用于电镀晶片的处理器的转子。晶片板可提供在所述背板组件的另外一侧上。所述环具有接触指，所述接触指电连接到环形母线，并且其中所述环形母线在所述环被接合到所述背板组件时，通过所述背板组件电连接到所述处理器中的电源。位于所述环上的晶片密封件覆盖在所述接触指上。卡盘密封件可围绕周边提供。电触点和密封件的维护由所述处理器远程执行。

Description

卡盘组件和用于晶片电镀系统中的卡盘组件
相关申请
本申请要求于2015年7月9日提交的并且目前待决的美国临时专利申请号62/190,603的优先权，并且所述优先权申请以引用的方式结合在此。
技术领域
本公开内容涉及卡盘组件，更具体地，涉及用于晶片电镀系统中的卡盘组件。
背景技术
微电子器件一般形成在半导体晶片或其它类型的基板或工件上。在典型的制造工艺中，一个或多个金属薄层形成在晶片上，以便生产微电子器件和/或提供在器件之间的导线。
金属层一般通过在电镀处理器中进行电化学镀层来涂覆到晶片。一种典型的电镀处理器包括：用于保存电解液或电镀液的容器；在容器内、与电镀液接触的一个或多个阳极；以及具有带有多个电接触指(electrical contact finger)的接触环的头部，所述多个电接触指触碰晶片。工件的前表面浸入在电镀液中，并且电场致使电镀液中的金属离子电镀到晶片上，以形成金属层。一般来说，多个电镀处理器连同其它类型的处理器一起提供在罩壳(enclosure)内，以便形成电镀系统。
位于接触环上的电触点需要经常维护，以便清洁和/或去电镀层。所谓的干触点电镀处理器使用密封件来避免电镀液接触触点。密封件也需要经常清洁。对维护触点和密封件的需要降低了电镀处理器的产量或使用效率，因为电镀处理器在清洁过程中是空闲的。新的处理系统通过使用接触环来处理晶片克服了这个缺点，所述接触环被构建到与晶片一起移动通过电镀系统的卡盘组件中并且所述接触环并非是处理器的一部分。因此，接触环的维护可以在系统的另一位置中执行，从而使处理器可继续电镀操作。然而，卡盘组件必须精确地与处理器对准，并且还必须以机械和电方式牢固接合晶片。因此，需要改进设计。
实用新型内容
一种包括背板的卡盘组件，所述背板可与环接合。轮毂(hub)可提供在所述背板的一侧上，用以将所述卡盘组件附接到用于电镀晶片的处理器的转子。晶片板可提供在所述背板的另外一侧上。所述环具有接触指，所述接触指电连接到环形母线，并且其中所述环形母线在所述环被接合到所述背板时，通过所述背板电连接到所述处理器中的电源。
位于所述环上的晶片密封件覆盖在所述接触指上。卡盘密封件可绕环周边提供，用以在所述环被接合到所述背板时，抵靠所述背板进行密封。所述轮毂可以具有电触点，所述电触点电连接到所述环形母线。
一种卡盘组件，所述卡盘组件包括：
背板组件，所述背板组件具有底板；
位于所述底板的第一侧上的轮毂和位于所述底板的第二侧上的晶片板；
环，所述环可与所述背板组件接合；
所述环包括多个接触指，所述多个接触指电连接到环形母线，并且其中所述环形母线在所述环被接合到所述背板时，电连接到所述底板；
位于所述环上的晶片密封件，所述晶片密封件覆盖在所述接触指上，其中所述晶片密封件具有插入区段和接触区段，并且其中所述晶片密封件具有触点定位凹槽，其中所述接触指中的一个或多个的一部分延伸到所述触点定位凹槽中。
所述的卡盘组件进一步包括位于所述轮毂中的一个或多个电触点，所述一个或多个电触点电连接到所述环形母线。
所述的卡盘组件进一步包括位于所述环上的多个间隔开的定心销，其中每一个定心销延伸穿过所述底板中的间隙孔。
所述的卡盘组件进一步包括密封件保持器，所述密封件保持器被附接到所述环形母线，并且其中所述晶片密封件和所述卡盘密封件通过所述密封件保持器固定到所述环形母线上。
所述的卡盘组件进一步包括沿所述环形母线的内径间隔开的多个晶片导件。
所述的卡盘组件进一步包括绕所述环周边的卡盘密封件，用以在所述环被接合到所述背板时，抵靠所述背板进行密封。
所述的卡盘组件进一步包括位于所述晶片板中的至少一个真空通道和围绕所述至少一个真空通道的晶片提取密封件。
所述的卡盘组件进一步包括位于所述环形母线中的凹口中的一个或多个环形磁铁，和将所述凹口密封的磁铁密封件。
所述的卡盘组件进一步包括位于所述底板上的背板母线，其中所述背板母线具有内环，所述内环电连接到所述轮毂中的所述电触点。
所述的卡盘组件的所述背板母线进一步包括外环，所述外环电连接到所述内环以及电连接到位于所述底板上的多个间隔开的卡盘触点。
所述的卡盘组件的所述多个接触指被提供在至少一个接触指节段上，所述至少一个接触指节段具有向下折叠部或突出部，所述向下折叠部或突出部插入到所述触点定位凹槽中，以便将所述晶片密封件的内径与所述电接触指的内部尖端对准。
一种用于晶片电镀系统中的卡盘组件，所述卡盘组件包括：
背板组件，所述背板组件具有轮毂和晶片板；
环，所述环包括多个接触指，所述多个接触指电连接到环形母线，并且其中所述环形母线在所述环被接合到所述背板组件时，电连接到所述背板组件；
位于所述环上的晶片密封件，所述晶片密封件覆盖在所述接触指上；
位于所述轮毂中的一个或多个电触点，所述一或多个电触点电连接到所述环形母线；以及
卡盘密封件，所述卡盘密封件围绕所述环的周边，用以在所述环被接合到所述背板组件时，抵靠所述背板组件进行密封。
所述的卡盘组件进一步包括多个在所述环周边上间隔开的定心销，其中每一个定心销延伸穿过所述背板组件中的间隙孔。
所述的卡盘组件进一步包括：密封件保持器，所述密封件保持器被附接到所述环形母线；卡盘密封件，所述卡盘密封件围绕所述环的周边，用以在所述环被接合到所述背板组件时，抵靠所述背板组件进行密封，并且其中所述晶片密封件和所述卡盘密封件通过所述密封件保持器固定到所述环形母线上。
一种用于晶片电镀系统中的卡盘组件，所述卡盘组件包括：
背板组件和与所述背板组件接合的环；
所述环包括多个接触指，所述多个接触指电连接到环形母线，并且其中所述环形母线在所述环被接合到所述背板组件时，电连接到所述背板组件；
位于所述环上的晶片密封件，所述晶片密封件覆盖在所述接触指上，所述晶片密封件具有连接到接触区段的插入区段，并且其中所述晶片密封件具有触点定位凹槽，其中所述接触指中的一个或多个的一部分延伸到所述触点定位凹槽中。
附图说明
图1是保持晶片的卡盘组件的顶透视图。
图2是图1的卡盘组件的底透视图。
图3是图1的卡盘组件的顶透视分解图。
图4是图1的卡盘组件的顶透视截面图。
图5是图1的卡盘组件中的元件的放大的细节图。
图6是从图4的视图旋转的卡盘组件的顶透视截面图。
图7是图2所示环的放大的细节图。
图8是图6所示元件的放大的细节图。
图9是图3所示卡盘组件的底透视图。
图10是图7所示环的底透视图。
图11是图10所示环中的元件的放大的细节图。
图12是替代卡盘组件设计的顶透视截面图。
图13是图12所示元件的放大的细节图。
图14是机器人将卡盘组件移交到处理器的示意图示。
具体实施方式
参照图1-3和图14，卡盘组件20在用于电镀半导体基板或晶片25的电镀系统220中使用。卡盘组件20包括环24和背板组件22。
转至图7和图8，环24包括晶片密封件92、电接触指98、环形母线90、密封件保持器102、卡盘密封件112、在环24的周边上间隔开的定心销108和晶片导件114。晶片密封件92提供使电镀液避免接触电接触指98的屏障。出于将材料均匀地电镀到晶片25上的目的，电接触指98均匀物理接触到晶片25上。电接触指98可使用连续冲模工艺来制成笔直条或节段，这种连续冲模工艺提供极精确的尺寸公差，如国际专利公开案WO2013/081823中所述。为了电镀300mm直径晶片，环24可以在4-8个节段上具有例如720个电接触指98。如图11所示，晶片密封件92可以具有插入区段94和接触区段95，所述接触区段大体上垂直于插入区段94，其中插入区段94夹紧在环形母线90与密封件保持器102之间，并且其中接触区段95覆盖在电接触指98上。
电接触指98可借助于触点定位凹槽100精确地相对于晶片密封件92的内径93(内径93为晶片密封件92的触碰晶片25的部分)定位。接触节段或条96的后缘可以具有插入触点定位凹槽100中的向下折叠部或突出部。这精密地控制晶片密封件92的内径93与电接触指98的尖端之间的尺寸公差，从而允许晶片25的大面积暴露于电镀液下，由此对于每个晶片25提供更多晶粒(die)。触点定位凹槽100可以定位在接触区段95中、位于接触区段95的外周边，在此，接触区段95连接到插入区段94或与所述插入区段94交叉。
接触节段或条96可通过将它们组装到晶片密封件92中的触点定位凹槽100中来形成为弯曲弧形，如图10所示。接着，通过图7中示出的紧固件106将接触节段96夹紧或固定到环24中的固定位置中，从而将晶片密封件92附接到环形母线90。
仍然参照图7和图8，环形母线90提供在背板组件22与电接触指98之间的电接触。环形母线90具有用于晶片密封件92的定位和安装孔、用于环形磁铁116的凹口和用于安装晶片导件114的狭槽。晶片导件114可为柔性金属弹簧。定心销108也附接到环形母线90。为了将环24与处理器202的转子206对准，并且具体地是将晶片密封件92的内径93与转子206对准，位于环24上的定心销108(如图9所示)穿过背板组件22中的间隙孔130并接合到图14中示出的位于转子206中的对准孔208之中。
定心销108确保晶片密封件92与处理器202的自旋轴是同心的。位于环形母线90上的晶片导件114相对于晶片密封件92的内径93来校准，并且还操作成使得晶片25相对于晶片密封件92定位在中心。这提供了在晶片25的尺寸公差内的良好晶片定位可重复性。
密封件保持器102提供使电镀液避免接触环24的导电元件(即环形母线90和电接触指98)的屏障。密封件保持器102抵靠晶片密封件92的外径密封，并还在卡盘组件20位于闭合位置(如图1所示)时抵靠卡盘密封件112密封。如图11所示，密封件保持器102具有半径103，所述半径通向成角度的表面105，以使卡盘组件20顺滑地进入到容器210中的电镀液之中。
如图7、图8和图11所示，卡盘密封件112被附接到环24的外径。卡盘密封件112在电镀工艺以及清洗工艺中，在环24与背板组件22之间提供耐液体的界面。卡盘密封件112的管形形状减少了电镀液的滞留。
转至图6和图8，环24包含环形磁铁116，所述环形磁铁吸引背板组件22中的背板磁铁80，以便在背板组件22与环24之间提供夹紧力。环形磁铁116定位在围绕环形母线90间隔开的凹口中。每个环形磁铁116通过压到磁铁密封件或O形环118上的磁铁板120密封在凹口内。
如图6所示，背板组件22具有底板26，所述底板包含背板磁铁80。背板磁铁80利用夹紧在底部环56下方的O形环密封。轮毂30和背板母线64被附接到底板26。从处理器202到电接触指98的电力路径通过穿过轮毂30中的电触点31、通向背板母线64并随后穿过卡盘触点40以到达环形母线90形成。
轮毂30包含耐磨衬套34，以便允许机器人200在过度磨损或颗粒生成的情况下接合并升降卡盘组件20。位于底板26上的环定位销38(如图3所示)确保环24正确地取向到背板组件22。当然，背板母线64和环形母线90可用其它形式的电导体(如金属丝)替换。
如图4、图5和图6所示，背板组件22可以包括支撑在底板26上的晶片板44，所述底板具有通过大体上平坦的腹板区段(web section)65连接到外缘60的中心支柱58。晶片板44支撑在底板26上，并且抵靠所述底板密封。如图4所示，晶片板44可以具有从晶片提取密封件52径向向外延伸的法兰46。真空端口62可选地向上延伸穿过中心支柱58并且通向晶片板44上的真空通道76。真空气孔74完全延伸穿过晶片板44。背板母线64可以具有电连接到轮毂30中的电触点31的内环、电连接到卡盘触点40的外环和连接内环与外环的辐条。
晶片提取密封件52对晶片25的背侧表面提供密封。真空可从在电镀系统220中的真空源或连接到所述电镀系统的真空源来供应到真空端口62以及晶片板44中的真空通道76。真空传感器205测量在晶片25的背侧与晶片板44之间的空间中的压力。所感测到的压力可以用于确认卡盘组件20中的晶片25的存在。
真空还可以在卡盘组件打开序列中的不同步骤处施加，以便监测卡盘组件20中的晶片状态。在初始真空测量结果P1超过后续测量结果P2(在系统控制计算机207指示晶片已向上提升而脱离晶片提取密封件52后进行测量)达预定值时，就告知系统控制计算机207晶片25未被成功提取。如果差值是低于预定值，那么就通知系统控制计算机207晶片25已成功地被提取。晶片板44中的真空气孔74在真空关闭后快速均衡压力。这防止了晶片粘到晶片板44。真空可以在卡盘组件打开后打开，如图4和图6所示，并且真空可被施加并利用先前的真空值来复查以便确认存在预定偏差。这确保了电镀系统220正确操作。真空气孔74还趋向于限制施加到晶片25的真空的量，以便降低过量真空对晶片造成损害的风险。
当卡盘组件20闭合时，晶片板44向晶片25的背侧提供足够的接合力以使电接触指98和晶片密封件92接合晶片25。在图4-6的设计中，晶片板44经过加工或以其它方式来由塑料制成，并且法兰46提供对接触和密封而言所必需的弹簧刚度。这种设计对厚度变化有限的晶片来说是有效的。在晶片厚度发生较大变化时，法兰46可以提供过多或过少的力来实现电接触指98和晶片密封件的正确操作。
图12和图13示出具有向晶片25的背侧提供预加载力的弹簧154的替代背板150。弹簧154可为连接到附接于底板26的弹簧轮毂152的弹性条，其中晶片板44支撑在弹簧154上。背板150使薄晶片或厚晶片具有足够的力(但不过多)以与晶片密封件92和电接触指98接合。图12和图13的设计还可用于更高温度处理，因为即使在大范围的温度下，弹簧154的弹簧常数基本不受影响。
卡盘组件20可以在如国际专利公布号WO2014/179234中所描述的处理系统中操作。然而，卡盘组件20克服了与此类处理系统关联的各种工程挑战。如以上所论述，卡盘组件20的闭合移动使晶片25相对于晶片密封件92以及相对于电接触指98对准或定位在中心。使环24保持抵靠背板组件22的磁铁提供足够的力保持晶片25，并提供力以在晶片上的导电层(如晶种层)与电接触指98之间实现良好密封压力和电接触。在一些实施方式中，可将晶片密封件和/或卡盘密封件省去。
在使用中，晶片25通过处理系统的晶片装载/卸载模块中的装载/卸载机器人放置到背板组件22的晶片板44上。在装载/卸载过程中，环24从背板组件22上移除或与所述背板组件分开，或者环24通过位于装载/卸载模块中的向上延伸穿过背板组件22的周边中的环分离间隙孔128的环分离销与背板间隔开。在任一情况下，由背板组件22和环24形成的卡盘组件20实际处于图3、图4和图6中示出的打开位置。环分离销(如果使用的话)接合到环24中的环分离销凹口132中。环分离销使环24抵抗将环24吸引到背板组件22的磁力来远离背板组件22。
在装载后，环分离销回缩，并且环24通过磁吸引力来移动成与背板接合以提供现装载的具有有要电镀的晶片25的闭合卡盘组件20，如图1、图2和图14所示。电接触指98和晶片密封件92按压在晶片25上。
参照图14，卡盘组件20通过机器人200从装载/卸载模块移动到处理器202。卡盘组件20通过接合在转子上的接头(fitting)的轮毂30来附接到处理器202的转子206，如国际专利公布号WO2014/179234中所述。电流路径通过至轮毂30中的电触点31、背板母线64、卡盘触点40、环形母线90和至触碰到晶片的电接触指98的接头从处理器202(通常是从处理器中的阴极)提供到晶片25。如图3所示，卡盘触点40形成背板组件22与环形母线90之间的电连接。
处理器202的处理器头204将卡盘组件20中保持的晶片25移动到处理器202的容器210中的电解液浴之中，并使电流穿过电解液以将金属膜电镀到晶片25上。在电镀完成后，上述步骤顺序会反过来。装载/卸载模块中的升降销可以向上延伸穿过背板中的升降销间隙孔126，以便允许机器人拾取已电镀的晶片，并且已电镀的晶片25从电镀系统220中移除用于进一步处理。随后，可将背板组件22和环24共同或分开地清洁，并且环24可以在电镀系统220内或外的清洁/去电镀层模块中去电镀层，同时处理器202使用另一卡盘组件20电镀后续晶片。
晶片表示硅晶片或其它半导体材料的晶片，或者用于制造微电子、微机电或微光学器件的其它类型的基板或工件。母线表示包括金属板或金属条以及接线或编织物的电导体。所描述的系统可适合于与150、200、300或450mm直径晶片一起使用。

Claims (15)

1.一种卡盘组件，其特征在于，所述卡盘组件包括：
背板组件，所述背板组件具有底板；
位于所述底板的第一侧上的轮毂和位于所述底板的第二侧上的晶片板；
环，所述环可与所述背板组件接合；
所述环包括多个接触指，所述多个接触指电连接到环形母线，并且其中所述环形母线在所述环被接合到所述背板时，电连接到所述底板；
位于所述环上的晶片密封件，所述晶片密封件覆盖在所述接触指上，其中所述晶片密封件具有插入区段和接触区段，并且其中所述晶片密封件具有触点定位凹槽，其中所述接触指中的一个或多个的一部分延伸到所述触点定位凹槽中。
2.根据权利要求1所述的卡盘组件，其特征在于，进一步包括位于所述轮毂中的一个或多个电触点，所述一个或多个电触点电连接到所述环形母线。
3.根据权利要求1所述的卡盘组件，其特征在于，进一步包括位于所述环上的多个间隔开的定心销，其中每一个定心销延伸穿过所述底板中的间隙孔。
4.根据权利要求1所述的卡盘组件，其特征在于，进一步包括密封件保持器，所述密封件保持器被附接到所述环形母线，并且其中所述晶片密封件和所述卡盘密封件通过所述密封件保持器固定到所述环形母线上。
5.根据权利要求4所述的卡盘组件，其特征在于，进一步包括沿所述环形母线的内径间隔开的多个晶片导件。
6.根据权利要求1所述的卡盘组件，其特征在于，进一步包括绕所述环周边的卡盘密封件，用以在所述环被接合到所述背板时，抵靠所述背板进行密封。
7.根据权利要求1所述的卡盘组件，其特征在于，进一步包括位于所述晶片板中的至少一个真空通道和围绕所述至少一个真空通道的晶片提取密封件。
8.根据权利要求1所述的卡盘组件，其特征在于，进一步包括位于所述环形母线中的凹口中的一个或多个环形磁铁，和将所述凹口密封的磁铁密封件。
9.根据权利要求2所述的卡盘组件，其特征在于，进一步包括位于所述底板上的背板母线，其中所述背板母线具有内环，所述内环电连接到所述轮毂中的所述电触点。
10.根据权利要求9所述的卡盘组件，其特征在于，所述背板母线进一步包括外环，所述外环电连接到所述内环以及电连接到位于所述底板上的多个间隔开的卡盘触点。
11.根据权利要求10所述的卡盘组件，其特征在于，所述多个接触指被提供在至少一个接触指节段上，所述至少一个接触指节段具有向下折叠部或突出部，所述向下折叠部或突出部插入到所述触点定位凹槽中，以便将所述晶片密封件的内径与所述电接触指的内部尖端对准。
12.一种用于晶片电镀系统中的卡盘组件，其特征在于，所述卡盘组件包括：
背板组件，所述背板组件具有轮毂和晶片板；
环，所述环包括多个接触指，所述多个接触指电连接到环形母线，并且其中所述环形母线在所述环被接合到所述背板组件时，电连接到所述背板组件；
位于所述环上的晶片密封件，所述晶片密封件覆盖在所述接触指上；
位于所述轮毂中的一个或多个电触点，所述一或多个电触点电连接到所述环形母线；以及
卡盘密封件，所述卡盘密封件围绕所述环的周边，用以在所述环被接合到所述背板组件时，抵靠所述背板组件进行密封。
13.根据权利要求12所述的卡盘组件，其特征在于，进一步包括多个在所述环周边上间隔开的定心销，其中每一个定心销延伸穿过所述背板组件中的间隙孔。
14.根据权利要求12所述的卡盘组件，其特征在于，进一步包括：密封件保持器，所述密封件保持器被附接到所述环形母线；卡盘密封件，所述卡盘密封件围绕所述环的周边，用以在所述环被接合到所述背板组件时，抵靠所述背板组件进行密封，并且其中所述晶片密封件和所述卡盘密封件通过所述密封件保持器固定到所述环形母线上。
15.一种用于晶片电镀系统中的卡盘组件，其特征在于，所述卡盘组件包括：
背板组件和与所述背板组件接合的环；
所述环包括多个接触指，所述多个接触指电连接到环形母线，并且其中所述环形母线在所述环被接合到所述背板组件时，电连接到所述背板组件；
位于所述环上的晶片密封件，所述晶片密封件覆盖在所述接触指上，所述晶片密封件具有连接到接触区段的插入区段，并且其中所述晶片密封件具有触点定位凹槽，其中所述接触指中的一个或多个的一部分延伸到所述触点定位凹槽中。
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TW201710569A (zh) 2017-03-16
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KR20180021389A (ko) 2018-03-02
KR102200286B1 (ko) 2021-01-07
US20170009367A1 (en) 2017-01-12
TWI686513B (zh) 2020-03-01
CN106337198A (zh) 2017-01-18

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