TWI686513B - 晶圓電鍍夾頭組件 - Google Patents

晶圓電鍍夾頭組件 Download PDF

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TWI686513B
TWI686513B TW105121596A TW105121596A TWI686513B TW I686513 B TWI686513 B TW I686513B TW 105121596 A TW105121596 A TW 105121596A TW 105121596 A TW105121596 A TW 105121596A TW I686513 B TWI686513 B TW I686513B
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哈理斯蘭迪Ａ
溫德哈姆麥克
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美商應用材料股份有限公司
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Abstract

晶圓被放置到電鍍系統內的夾頭組件中。所述夾頭組件包括背板組件，所述背板組件可與環接合。輪轂可提供在所述背板組件的一側上，用以將所述夾頭組件附接到用於電鍍晶圓的處理器的轉子。晶圓板可提供在所述背板組件的另外一側上。所述環具有接觸指，所述接觸指電連接到環形母線，並且其中所述環形母線在所述環被接合到所述背板組件時，通過所述背板組件電連接到所述處理器中的電源。位於所述環上的晶圓密封件覆蓋在所述接觸指上。夾頭密封件可圍繞周邊提供。電觸點和密封件的維護由所述處理器遠端執行。

Description

晶圓電鍍夾頭組件
本申請主張於2015年7月9日提交的並且目前待決的美國臨時專利申請號62/190,603的優先權，並且所述優先權申請以引用的方式結合在此。
本發明係關於晶圓電鍍夾頭組件。
微電子器件一般形成在半導體晶圓或其它類型的基板或工件上。在典型的製造製程中，一個或多個金屬薄層形成在晶圓上，以便生產微電子器件和/或提供在器件之間的導線。
金屬層一般通過在電鍍處理器中進行電化學鍍層來塗覆到晶圓。一種典型的電鍍處理器包括：用於保存電解液或電鍍液的容器；在容器內、與電鍍液接觸的一個或多個陽極；以及具有帶有多個電接觸指(electrical contact finger)的接觸環的頭部，所述多個電接觸指觸碰晶圓。工件的前表面浸入在電鍍液中，並且電場致使電鍍液中的金屬離子電鍍到晶圓上，以形成金屬層。一般來說，多個電鍍處理器連同其它類型的處理器一起提供在罩殼(enclosure)內，以便形成電鍍系統。
位於接觸環上的電觸點需要經常維護，以便清潔和/或去電鍍層。所謂的幹觸點電鍍處理器使用密封件來避免電鍍液接觸觸點。密封件也需要經常清潔。對維護觸點和密封件的需要降低了電鍍處理器的產量或使用效率，因為電鍍處理器在清潔過程中是空閒的。新的處理系統通過使用接觸環來處理晶圓克服了這個缺點，所述接觸環被構建到與晶圓一起移動通過電鍍系統的夾頭組件中並且所述接觸環並非是處理器的一部分。因此，接觸環的維護可以在系統的另一位置中執行，從而使處理器可繼續電鍍操作。然而，夾頭組件必須精確地與處理器對準，並且還必須以機械和電方式牢固接合晶圓。因此，需要改進設計。
一種包括背板的夾頭組件，所述背板可與環接合。輪轂(hub)可提供在所述背板的一側上，用以將所述夾頭組件附接到用於電鍍晶圓的處理器的轉子。晶圓板可提供在所述背板的另外一側上。所述環具有接觸指，所述接觸指電連接到環形母線，並且其中所述環形母線在所述環被接合到所述背板時，通過所述背板電連接到所述處理器中的電源。
位於所述環上的晶圓密封件覆蓋在所述接觸指上。夾頭密封件可繞環周邊提供，用以在所述環被接合到所述背板時，抵靠所述背板進行密封。所述輪轂可以具有電觸點，所述電觸點電連接到所述環形母線。
20:夾頭組件
22:背板組件
24:環
25:晶圓
26:底板
30:輪轂
31:電觸點
34:耐磨襯套
38:環定位銷
40:夾頭觸點
44:晶圓板
46:凸緣
52:晶圓提取密封件
56:底部環
58:中心支柱
60:外緣
62:真空埠
64:背板母線
65:卷材區段
74:真空氣孔
76:真空通道
80:背板磁鐵
90:環形母線
92:晶圓密封件
93:內徑
94:插入區段
95:接觸區段
96:接觸節段
98:電接觸指
100:觸點定位凹槽
102:密封件保持器
103:半徑
105:表面
106:緊固件
108:定心銷
112:夾頭密封件
114:晶圓導件
116:環形磁鐵
118:O形環
120:磁鐵板材
126:升降銷間隙孔
128:環分離間隙孔
130:間隙孔
132:環分離銷凹口
150:背板
152:彈簧輪轂
154:彈簧
200:機器人
202:處理器
204:處理器頭
205:真空感測器
206:轉子
207:系統控制電腦
208:對準孔
210:容器
220:電鍍系統
圖1是保持晶圓的夾頭組件的頂透視圖。
圖2是圖1的夾頭組件的底透視圖。
圖3是圖1的夾頭組件的頂透視分解圖。
圖4是圖1的夾頭組件的頂透視截面圖。
圖5是圖1的夾頭組件中的元件的放大的細節圖。
圖6是從圖4的視圖旋轉的夾頭組件的頂透視截面圖。
圖7是圖2所示環的放大的細節圖。
圖8是圖6所示元件的放大的細節圖。
圖9是圖3所示夾頭組件的底透視圖。
圖10是圖7所示環的底透視圖。
圖11是圖10所示環中的元件的放大的細節圖。
圖12是替代夾頭組件設計的頂透視截面圖。
圖13是圖12所示元件的放大的細節圖。
圖14是機器人將夾頭組件交遞到處理器的示意圖示。
參照圖1-3和圖14，夾頭組件20在用於電鍍半導體基板或晶圓25的電鍍系統220中使用。夾頭組件20包括環24和背板組件22。
轉至圖7和圖8，環24包括晶圓密封件92、電接觸指98、環形母線90、密封件保持器102、夾頭密封件112、在環24的周邊上間隔開的定心銷108和晶圓導件114。晶圓密封件92提供使電鍍液避免接觸電接觸指98的屏障。出於將材料均勻地電鍍到晶圓25上的目的，電接觸指98均勻物理接觸到晶圓25上。電接觸指98可使用連續沖模製程來製成筆直條或節段，這種連續沖模製程提供極精確的尺寸公差，如國際專利公開案WO2013/081823中所述。為了電鍍300mm直徑晶圓，環24可以在4-8個節段上具有例如720個電接觸指98。如圖11所示，晶圓密封件92可以具有插入區段94和接觸區段95，所述接觸區段大體上垂直于插入區段94，其中插入區段94夾緊在環形母線90與密封件保持器102之間，並且其中接觸區段95覆蓋在電接觸指98上。
電接觸指98可借助於觸點定位凹槽100精確地相對於晶圓密封件92的內徑93(內徑93為晶圓密封件92的觸碰晶圓25的部分)定位。接觸節段或條96的後緣可以具有插入觸點定位凹槽100中的向下折疊部或突出部。這精密地控制晶圓密封件92的內徑93與電接觸指98的尖端之間的尺寸公差，從而允許晶圓25的大面積暴露於電鍍液下，由此對於每個晶圓25提供更多晶粒(die)。觸點定位凹槽100可以定位在接觸區段95中、 位於接觸區段95的外周邊，在此，接觸區段95連接到插入區段94或與所述插入區段94交叉。
接觸節段或條96可通過將它們組裝到晶圓密封件92中的觸點定位凹槽100中來形成為彎曲弧形，如圖10所示。接著，通過圖7中示出的緊固件106將接觸節段96夾緊或固定到環24中的固定位置中，從而將晶圓密封件92附接到環形母線90。
仍然參照圖7和圖8，環形母線90提供在背板組件22與電接觸指98之間的電連接。環形母線90具有用於晶圓密封件92的定位和安裝孔、用於環形磁鐵116的凹口和用於安裝晶圓導件114的狹槽。晶圓導件114可為柔性金屬彈簧。定心銷108也附接到環形母線90。為了將環24與處理器202的轉子206對準，並且具體地是將晶圓密封件92的內徑93與轉子206對準，位於環24上的定心銷108(如圖9所示)穿過背板組件22中的間隙孔130並接合到圖14中示出的位於轉子206中的對準孔208之中。
定心銷108確保晶圓密封件92與處理器202的自旋軸是同心的。位於環形母線90上的晶圓導件114相對於晶圓密封件92的內徑93來校準，並且還操作成使得晶圓25相對於晶圓密封件92定位在中心。這提供了在晶圓25的尺寸公差內的良好晶圓定位可重複性。
密封件保持器102提供使電鍍液避免接觸環24的導電元件(即環形母線90和電接觸指98)的屏障。 密封件保持器102抵靠晶圓密封件92的外徑密封，並還在夾頭組件20位於閉合位置(如圖1所示)時抵靠夾頭密封件112密封。如圖11所示，密封件保持器102具有半徑103，所述半徑通向成角度的表面105，以使夾頭組件20順滑地進入到容器210中的電鍍液之中。
如圖7、圖8和圖11所示，夾頭密封件112被附接到環24的外徑。夾頭密封件112在電鍍製程以及清洗製程中，在環24與背板組件22之間提供耐液體的介面。夾頭密封件112的管形形狀減少了電鍍液的滯留。
轉至圖6和圖8，環24包含環形磁鐵116，所述環形磁鐵吸引背板組件22中的背板磁鐵80，以便在背板組件22與環24之間提供夾緊力。環形磁鐵116定位在圍繞環形母線90間隔開的凹口中。每個環形磁鐵116通過壓到磁鐵密封件或O形環118上的磁鐵板材120密封在凹口內。
如圖6所示，背板組件22具有底板26，所述底板包含背板磁鐵80。背板磁鐵80利用夾緊在底部環56下方的O形環密封。輪轂30和背板母線64被附接到底板26。從處理器202到電接觸指98的電力路徑通過穿過輪轂30中的電觸點31、通向背板母線64並隨後穿過夾頭觸點40以到達環形母線90形成。
輪轂30包含耐磨襯套34，以便允許機器人200在過度磨損或顆粒生成的情況下接合並升降夾頭組件20。位於底板26上的環定位銷38(如圖3所示)確保 環24正確地取向到背板組件22。當然，背板母線64和環形母線90可用其它形式的電導體(如金屬絲)替換。
如圖4、圖5和圖6所示，背板組件22可以包括支撐在底板26上的晶圓板44，所述底板具有通過大體上平坦的卷材區段(web section)65連接到外緣60的中心支柱58。晶圓板44支撐在底板26上，並且抵靠所述底板密封。如圖4所示，晶圓板44可以具有從晶圓提取密封件52徑向向外延伸的凸緣46。真空埠62可選地向上延伸穿過中心支柱58並且通向晶圓板44上的真空通道76。真空氣孔74完全延伸穿過晶圓板44。背板母線64可以具有電連接到輪轂30中的電觸點31的內環、電連接到夾頭觸點40的外環和連接內環與外環的輻條。
晶圓提取密封件52對晶圓25的背側表面提供密封。真空可從在電鍍系統220中的真空源或連接到所述電鍍系統的真空源來供應到真空埠62以及晶圓板44中的真空通道76。真空感測器205測量在晶圓25的背側與晶圓板44之間的空間中的壓力。所感測到的壓力可以用於確認夾頭組件20中的晶圓25的存在。
真空還可以在夾頭組件打開序列中的不同步驟處施加，以便監測夾頭組件20中的晶圓狀態。在初始真空測量結果P1超過後續測量結果P2(在系統控制電腦207指示晶圓已向上提升而脫離晶圓提取密封件52後進行測量)達預定值時，就告知系統控制電腦207晶圓25 未被成功提取。如果差值是低於預定值，那麼就通知系統控制電腦207晶圓25已成功地被提取。晶圓板44中的真空氣孔74在真空關閉後快速均衡壓力。這防止了晶圓粘到晶圓板44。真空可以在夾頭組件打開後打開，如圖4和圖6所示，並且真空可被施加並利用先前的真空值來複查以便確認存在預定偏差。這確保了電鍍系統220正確操作。真空氣孔74還趨向於限制施加到晶圓25的真空的量，以便降低過量真空對晶圓造成損害的風險。
當夾頭組件20閉合時，晶圓板44向晶圓25的背側提供足夠的接合力以使電接觸指98和晶圓密封件92接合晶圓25。在圖4-6的設計中，晶圓板44經過加工或以其它方式來由塑膠製成，並且凸緣46提供對接觸和密封而言所必需的彈簧剛度。這種設計對厚度變化有限的晶圓來說是有效的。在晶圓厚度發生較大變化時，凸緣46可以提供過多或過少的力來實現電接觸指98和晶圓密封件的正確操作。
圖12和圖13示出具有向晶圓25的背側提供預載入力的彈簧154的替代背板150。彈簧154可為連接到附接於底板26的彈簧輪轂152的彈性條，其中晶圓板44支撐在彈簧154上。背板150使薄晶圓或厚晶圓具有足夠的力(但不過多)以與晶圓密封件92和電接觸指98接合。圖12和圖13的設計還可用于更高溫度處理，因為即使在大範圍的溫度下，彈簧154的彈簧常數基本不受影響。
夾頭組件20可以在如國際專利公佈號WO2014/179234中所描述的處理系統中操作。然而，夾頭組件20克服了與此類處理系統關聯的各種工程挑戰。如以上所論述，夾頭組件20的閉合移動使晶圓25相對於晶圓密封件92以及相對於電接觸指98對準或定位在中心。使環24保持抵靠背板組件22的磁鐵提供足夠的力保持晶圓25，並提供力以在晶圓上的導電層(如晶種層)與電接觸指98之間實現良好密封壓力和電接觸。在一些實施方式中，可將晶圓密封件和/或夾頭密封件省去。
在使用中，晶圓25通過處理系統的晶圓裝載/卸載模組中的裝載/卸載機器人放置到背板組件22的晶圓板44上。在裝載/卸載過程中，環24從背板組件22上移除或與所述背板組件分開，或者環24通過位於裝載/卸載模組中的向上延伸穿過背板組件22的周邊中的環分離間隙孔128的環分離銷與背板間隔開。在任一情況下，由背板組件22和環24形成的夾頭組件20實際處於圖3、圖4和圖6中示出的打開位置。環分離銷(如果使用的話)接合到環24中的環分離銷凹口132中。環分離銷使環24抵抗將環24吸引到背板組件22的磁力來遠離背板組件22。
在裝載後，環分離銷回縮，並且環24通過磁吸引力來移動成與背板接合以提供現裝載的具有有要電 鍍的晶圓25的閉合夾頭組件20，如圖1、圖2和圖14所示。電接觸指98和晶圓密封件92按壓在晶圓25上。
參照圖14，夾頭組件20通過機器人200從裝載/卸載模組移動到處理器202。夾頭組件20通過接合在轉子上的接頭(fitting)的輪轂30來附接到處理器202的轉子206，如國際專利公佈號WO2014/179234中所述。電流路徑通過至輪轂30中的電觸點31、背板母線64、夾頭觸點40、環形母線90和至觸碰到晶圓的電接觸指98的接頭從處理器202(通常是從處理器中的陰極)提供到晶圓25。如圖3所示，夾頭觸點40形成背板組件22與環形母線90之間的電連接。
處理器202的處理器頭204將夾頭組件20中保持的晶圓25移動到處理器202的容器210中的電解液浴之中，並使電流穿過電解液以將金屬膜電鍍到晶圓25上。在電鍍完成後，上述步驟順序會反過來。裝載/卸載模組中的升降銷可以向上延伸穿過背板中的升降銷間隙孔126，以便允許機器人拾取已電鍍的晶圓，並且已電鍍的晶圓25從電鍍系統220中移除用於進一步處理。隨後，可將背板組件22和環24共同或分開地清潔，並且環24可以在電鍍系統220內或外的清潔/去電鍍層模組中去電鍍層，同時處理器202使用另一夾頭組件20電鍍後續晶圓。
晶圓表示矽晶圓或其它半導體材料的晶圓，或者用於製造微電子、微機電或微光學器件的其它類型 的基板或工件。母線表示包括金屬板材或金屬條以及接線或編織物的電導體。所描述的系統可適合於與150、200、300或450mm直徑晶圓一起使用。
20:夾頭組件
22:背板組件
24:環
26:底板
30:輪轂
34:耐磨襯套
40:夾頭觸點
44:晶圓板
46:凸緣
52:晶圓提取密封件
56:底部環
58:中心支柱
60:外緣
62:真空埠
64:背板母線
65:卷材區段
98:電接觸指
102:密封件保持器
108:定心銷
112:夾頭密封件

Claims (16)

  1. 一種夾頭組件，該夾頭組件包括：一背板組件，該背板組件具有一底板；位於該底板的一第一側上的一輪轂和位於該底板的一第二側上的一晶圓板，該輪轂係適於由一機器人接合，該輪轂包括一盤，該盤具有從該盤的一中心區域到該盤的一邊緣徑向向外地延伸的一狹槽；一環，該環可與該背板組件接合；該環包括多個接觸指，該等多個接觸指電連接到一環形母線，並且其中該環形母線在該環被接合到該背板組件時，電連接到該底板；以及位於該環上的一晶圓密封件，該晶圓密封件覆蓋在該等接觸指上，其中該晶圓密封件具有一插入區段和一接觸區段，並且其中該晶圓密封件具有一觸點定位凹槽，其中該接觸指中的一個或多個的一部分延伸到該觸點定位凹槽中。
  2. 如請求項1所述的夾頭組件，進一步包括位於該輪轂中的一個或多個電觸點，該一個或多個電觸點電連接到該環形母線。
  3. 如請求項1所述的夾頭組件，進一步包括位於該環上的多個間隔開的定心銷，其中每一個定心銷延伸穿過該底板中的一間隙孔。
  4. 如請求項1所述的夾頭組件，進一步包括一密封件保持器，該密封件保持器被附接到該環形母線，並且其中該晶圓密封件和一夾頭密封件通過該密封件保持器固定到該環形母線上。
  5. 如請求項4所述的夾頭組件，進一步包括沿該環形母線的一內徑間隔開的多個晶圓導件。
  6. 如請求項1所述的夾頭組件，進一步包括繞該環周邊的一夾頭密封件，用以在該環被接合到該背板組件時，抵靠該背板組件進行密封。
  7. 如請求項1所述的夾頭組件，進一步包括位於該晶圓板中的至少一個真空通道和圍繞該至少一個真空通道的一晶圓提取密封件。
  8. 如請求項1所述的夾頭組件，進一步包括位於該環形母線中的凹口中的一個或多個環形磁鐵，和將該凹口密封的一磁鐵密封件。
  9. 如請求項2所述的夾頭組件，進一步包括位於該底板上的一背板母線，其中該背板母線具有一內環，該內環電連接到該輪轂中的該電觸點。
  10. 如請求項9所述的夾頭組件，其特徵在於，該背板母線進一步包括一外環，該外環電連接到該內環以及電連接到位於該底板上的多個間隔開的夾頭觸點。
  11. 如請求項10所述的夾頭組件，其特徵在於，該多個接觸指被提供在至少一個接觸指節段上，該至少一個接觸指節段具有一向下折疊部或突出部，該向下折疊部或突出部插入到該觸點定位凹槽中，以便將該晶圓密封件的一內徑與該電接觸指的內部尖端對準。
  12. 一種用於一晶圓電鍍系統中的夾頭組件，該夾頭組件包括：一背板組件，該背板組件具有一輪轂和一晶圓板，該輪轂係適於由一機器人接合，該輪轂包括一盤，該盤具有從該盤的一中心區域到該盤的一邊緣徑向向外地延伸的一狹槽；一環，該環包括多個接觸指，該多個接觸指電連接到一環形母線，並且其中該環形母線在該環被接合到該背板組件時，電連接到該背板組件；位於該環上的一晶圓密封件，該晶圓密封件覆蓋在該等接觸指上；位於該輪轂中的一個或多個電觸點，該一或多個電觸點電連接到該環形母線；以及一夾頭密封件，該夾頭密封件圍繞該環的一周邊，用以在該環被接合到該背板組件時，抵靠該背板組件進行密封。
  13. 如請求項12所述的夾頭組件，進一步包括多個在該環周邊上間隔開的定心銷，其中每一個定心銷延伸穿過該背板組件中的一間隙孔。
  14. 如請求項12所述的夾頭組件，進一步包括：一密封件保持器，該密封件保持器被附接到該環形母線；一夾頭密封件，該夾頭密封件圍繞該環的一周邊，用以在該環被接合到該背板組件時，抵靠該背板組件進行密封，並且其中該晶圓密封件和該夾頭密封件通過該密封件保持器固定到該環形母線上。
  15. 一種用於一晶圓電鍍系統中的夾頭組件，該夾頭組件包括：一背板組件和與該背板組件接合的一環，該背板組件具有一輪轂，該輪轂係適於由一機器人接合，該輪轂包括一盤，該盤具有從該盤的一中心區域到該盤的一邊緣徑向向外地延伸的一狹槽；該環包括多個接觸指，該多個接觸指電連接到一環形母線，並且其中該環形母線在該環被接合到該背板組件時，電連接到該背板組件；以及位於該環上的一晶圓密封件，該晶圓密封件覆蓋在該等接觸指上，該晶圓密封件具有連接到一接觸區段的一插入區段，並且其中該晶圓密封件具有一觸點定位凹槽，其中該等接觸指中的一個或多個的一部分延 伸到該觸點定位凹槽中。
  16. 一種夾頭組件，該夾頭組件包括：一背板組件，該背板組件具有一底板；位於該底板的一第一側上的一輪轂和位於該底板的一第二側上的一晶圓板；一環，該環可與該背板組件接合；該環包括多個接觸指，該等多個接觸指電連接到一環形母線，並且其中該環形母線在該環被接合到該背板組件時，電連接到該底板；位於該環上的一晶圓密封件，該晶圓密封件覆蓋在該等接觸指上，其中該晶圓密封件具有一插入區段和一接觸區段，並且其中該晶圓密封件具有一觸點定位凹槽，其中該接觸指中的一個或多個的一部分延伸到該觸點定位凹槽中；一密封件保持器，該密封件保持器被附接到該環形母線，並且其中該晶圓密封件和一夾頭密封件通過該密封件保持器固定到該環形母線上；以及沿該環形母線的一內徑間隔開的多個晶圓導件。
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US10174437B2 (en) 2019-01-08
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CN106337198A (zh) 2017-01-18
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US20170009367A1 (en) 2017-01-12
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