CN1954224A - 利用探针再测试数据分析提高晶片测试的生产率 - Google Patents
利用探针再测试数据分析提高晶片测试的生产率 Download PDFInfo
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- CN1954224A CN1954224A CNA2005800155459A CN200580015545A CN1954224A CN 1954224 A CN1954224 A CN 1954224A CN A2005800155459 A CNA2005800155459 A CN A2005800155459A CN 200580015545 A CN200580015545 A CN 200580015545A CN 1954224 A CN1954224 A CN 1954224A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Thin Film Transistor (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US10/709,729 | 2004-05-25 | ||
US10/709,729 US7253650B2 (en) | 2004-05-25 | 2004-05-25 | Increase productivity at wafer test using probe retest data analysis |
Publications (2)
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CN1954224A true CN1954224A (zh) | 2007-04-25 |
CN100587507C CN100587507C (zh) | 2010-02-03 |
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CN200580015545A Expired - Fee Related CN100587507C (zh) | 2004-05-25 | 2005-05-25 | 测试制造后的集成电路器件的方法和系统 |
Country Status (6)
Country | Link |
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US (5) | US7253650B2 (zh) |
EP (1) | EP1769257B1 (zh) |
JP (1) | JP4866843B2 (zh) |
KR (1) | KR100998388B1 (zh) |
CN (1) | CN100587507C (zh) |
WO (1) | WO2005116671A2 (zh) |
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CN104614656A (zh) * | 2013-11-05 | 2015-05-13 | 京元电子股份有限公司 | 半导体芯片重测系统及其重测方法 |
CN109444703A (zh) * | 2018-10-15 | 2019-03-08 | 上海华虹宏力半导体制造有限公司 | 超级结器件的测试方法 |
CN109765479A (zh) * | 2019-01-28 | 2019-05-17 | 合肥京东方视讯科技有限公司 | 一种电路板缺件检测装置和方法 |
CN110031746A (zh) * | 2019-04-19 | 2019-07-19 | 中国南方电网有限责任公司 | 芯片测试远程监控方法、装置、计算机设备和存储介质 |
CN110160918A (zh) * | 2018-02-12 | 2019-08-23 | 黄彦凯 | 晶圆再验的方法 |
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US7547947B2 (en) * | 2005-11-15 | 2009-06-16 | International Business Machines Corporation | SRAM cell |
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2004
- 2004-05-25 US US10/709,729 patent/US7253650B2/en not_active Expired - Fee Related
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2005
- 2005-05-25 EP EP05778492.8A patent/EP1769257B1/en not_active Not-in-force
- 2005-05-25 KR KR1020067022487A patent/KR100998388B1/ko not_active IP Right Cessation
- 2005-05-25 WO PCT/US2005/019267 patent/WO2005116671A2/en active Application Filing
- 2005-05-25 CN CN200580015545A patent/CN100587507C/zh not_active Expired - Fee Related
- 2005-05-25 JP JP2007515536A patent/JP4866843B2/ja not_active Expired - Fee Related
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2007
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- 2007-08-15 US US11/838,934 patent/US20070284669A1/en not_active Abandoned
- 2007-08-29 US US11/846,544 patent/US7763531B2/en not_active Expired - Fee Related
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104614656A (zh) * | 2013-11-05 | 2015-05-13 | 京元电子股份有限公司 | 半导体芯片重测系统及其重测方法 |
CN110160918A (zh) * | 2018-02-12 | 2019-08-23 | 黄彦凯 | 晶圆再验的方法 |
CN109444703A (zh) * | 2018-10-15 | 2019-03-08 | 上海华虹宏力半导体制造有限公司 | 超级结器件的测试方法 |
CN109765479A (zh) * | 2019-01-28 | 2019-05-17 | 合肥京东方视讯科技有限公司 | 一种电路板缺件检测装置和方法 |
CN110031746A (zh) * | 2019-04-19 | 2019-07-19 | 中国南方电网有限责任公司 | 芯片测试远程监控方法、装置、计算机设备和存储介质 |
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EP1769257A4 (en) | 2012-08-08 |
US20070284669A1 (en) | 2007-12-13 |
WO2005116671A2 (en) | 2005-12-08 |
US7253650B2 (en) | 2007-08-07 |
EP1769257B1 (en) | 2013-12-11 |
EP1769257A2 (en) | 2007-04-04 |
WO2005116671A3 (en) | 2006-10-26 |
CN100587507C (zh) | 2010-02-03 |
KR100998388B1 (ko) | 2010-12-03 |
JP4866843B2 (ja) | 2012-02-01 |
US20080270057A1 (en) | 2008-10-30 |
US7463047B2 (en) | 2008-12-09 |
KR20070017167A (ko) | 2007-02-08 |
US20050267706A1 (en) | 2005-12-01 |
US7573284B2 (en) | 2009-08-11 |
US7763531B2 (en) | 2010-07-27 |
US20070288190A1 (en) | 2007-12-13 |
JP2008500737A (ja) | 2008-01-10 |
US20070292996A1 (en) | 2007-12-20 |
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