CN1881810A - 多模式高频电路 - Google Patents
多模式高频电路 Download PDFInfo
- Publication number
- CN1881810A CN1881810A CNA2006100850213A CN200610085021A CN1881810A CN 1881810 A CN1881810 A CN 1881810A CN A2006100850213 A CNA2006100850213 A CN A2006100850213A CN 200610085021 A CN200610085021 A CN 200610085021A CN 1881810 A CN1881810 A CN 1881810A
- Authority
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- China
- Prior art keywords
- circuit
- mentioned
- frequency
- communication mode
- receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004891 communication Methods 0.000 claims abstract description 60
- 230000005540 biological transmission Effects 0.000 claims abstract description 23
- 239000004020 conductor Substances 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 53
- 238000012545 processing Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims 1
- 230000010363 phase shift Effects 0.000 description 31
- 230000009471 action Effects 0.000 description 22
- 230000000694 effects Effects 0.000 description 16
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- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 230000003534 oscillatory effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
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- 239000002241 glass-ceramic Substances 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
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- 238000009958 sewing Methods 0.000 description 2
- QVWYCTGTGHDWFQ-AWEZNQCLSA-N (2s)-2-[[4-[2-chloroethyl(2-methylsulfonyloxyethyl)amino]benzoyl]amino]pentanedioic acid Chemical compound CS(=O)(=O)OCCN(CCCl)C1=CC=C(C(=O)N[C@@H](CCC(O)=O)C(O)=O)C=C1 QVWYCTGTGHDWFQ-AWEZNQCLSA-N 0.000 description 1
- AAHNBILIYONQLX-UHFFFAOYSA-N 6-fluoro-3-[4-[3-methoxy-4-(4-methylimidazol-1-yl)phenyl]triazol-1-yl]-1-(2,2,2-trifluoroethyl)-4,5-dihydro-3h-1-benzazepin-2-one Chemical group COC1=CC(C=2N=NN(C=2)C2C(N(CC(F)(F)F)C3=CC=CC(F)=C3CC2)=O)=CC=C1N1C=NC(C)=C1 AAHNBILIYONQLX-UHFFFAOYSA-N 0.000 description 1
- 101100449736 Candida albicans (strain SC5314 / ATCC MYA-2876) ZCF23 gene Proteins 0.000 description 1
- 101150016162 GSM1 gene Proteins 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
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- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Transceivers (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP165098/2005 | 2005-06-06 | ||
JP2005165098A JP4521602B2 (ja) | 2005-06-06 | 2005-06-06 | マルチモード高周波回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1881810A true CN1881810A (zh) | 2006-12-20 |
CN1881810B CN1881810B (zh) | 2010-08-18 |
Family
ID=37494776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100850213A Expired - Fee Related CN1881810B (zh) | 2005-06-06 | 2006-05-30 | 多模式高频电路 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8391821B2 (zh) |
JP (1) | JP4521602B2 (zh) |
CN (1) | CN1881810B (zh) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101771424A (zh) * | 2009-01-05 | 2010-07-07 | 启碁科技股份有限公司 | 用于一无线信号收发器的射频电路及相关无线信号收发器 |
CN101902241A (zh) * | 2009-05-26 | 2010-12-01 | 株式会社村田制作所 | 高频开关模块 |
CN102110033A (zh) * | 2009-12-28 | 2011-06-29 | 株式会社日立制作所 | Lsi、铁道用失效保护lsi、电子装置、铁道用电子装置 |
CN103635020A (zh) * | 2012-08-21 | 2014-03-12 | 太阳诱电株式会社 | 高频电路模块 |
CN103635021A (zh) * | 2012-08-21 | 2014-03-12 | 太阳诱电株式会社 | 高频电路模块 |
CN107113019A (zh) * | 2014-12-25 | 2017-08-29 | 株式会社村田制作所 | 高频模块 |
CN107113018A (zh) * | 2014-12-25 | 2017-08-29 | 株式会社村田制作所 | 高频模块 |
CN108233974A (zh) * | 2016-12-14 | 2018-06-29 | 株式会社村田制作所 | 收发模块 |
CN108233976A (zh) * | 2016-12-21 | 2018-06-29 | 株式会社村田制作所 | 高频模块 |
CN108886378A (zh) * | 2016-03-31 | 2018-11-23 | 株式会社村田制作所 | 前置电路和高频模块 |
CN109743072A (zh) * | 2018-12-26 | 2019-05-10 | 深圳市万普拉斯科技有限公司 | 一种移动终端信号收发装置及其控制方法 |
CN109792260A (zh) * | 2016-09-30 | 2019-05-21 | 株式会社村田制作所 | 高频模块以及通信装置 |
CN110710118A (zh) * | 2017-06-02 | 2020-01-17 | 株式会社村田制作所 | 高频模块以及通信装置 |
CN111865337A (zh) * | 2019-04-03 | 2020-10-30 | 株式会社村田制作所 | 高频模块和通信装置 |
Families Citing this family (40)
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EP1555864A1 (en) * | 2004-01-14 | 2005-07-20 | Thomson Licensing S.A. | RF circuit with stacked printed circuit boards |
US7383024B2 (en) * | 2005-09-30 | 2008-06-03 | Avago Technologies Wireless Ip Pte Ltd | Multi-band handset architecture |
TWI355840B (en) * | 2006-12-07 | 2012-01-01 | Wistron Neweb Corp | Communication device capable of simultaneously ope |
JP2008219174A (ja) * | 2007-02-28 | 2008-09-18 | Matsushita Electric Ind Co Ltd | 携帯端末装置 |
US9723709B2 (en) * | 2007-10-22 | 2017-08-01 | Todd Steigerwald | Method for assigning control channels |
US7729724B2 (en) * | 2007-11-19 | 2010-06-01 | Broadcom Corporation | RF front-end and applications thereof |
US8279913B2 (en) * | 2008-03-19 | 2012-10-02 | Intel Mobile Communications GmbH | Configurable transceiver |
TWI388144B (zh) * | 2008-12-23 | 2013-03-01 | Wistron Neweb Corp | 用於一無線訊號收發器之射頻電路及其相關無線訊號收發器 |
WO2010137405A1 (ja) * | 2009-05-27 | 2010-12-02 | 株式会社村田製作所 | 高周波モジュール |
KR101565995B1 (ko) * | 2009-07-16 | 2015-11-05 | 삼성전자주식회사 | 듀얼-입력 듀얼-출력의 필터를 이용한 멀티-대역의 라디오 주파수 신호 송수신 시스템 |
US9319214B2 (en) | 2009-10-07 | 2016-04-19 | Rf Micro Devices, Inc. | Multi-mode power amplifier architecture |
US8369250B1 (en) * | 2009-10-07 | 2013-02-05 | Rf Micro Devices, Inc. | Multi-mode split band duplexer architecture |
US8768267B2 (en) * | 2010-02-03 | 2014-07-01 | Hollinworth Fund, L.L.C. | Switchless band separation for transceivers |
CN101882941A (zh) * | 2010-07-07 | 2010-11-10 | 中兴通讯股份有限公司 | 一种全球移动通讯系统四频收发的装置及设备 |
CN103125078B (zh) * | 2010-09-29 | 2015-02-11 | 株式会社村田制作所 | 高频模块 |
JP5660450B2 (ja) * | 2010-12-28 | 2015-01-28 | 日立金属株式会社 | 回路基板およびそれを用いた通信装置 |
CN102123466B (zh) * | 2011-01-18 | 2014-01-08 | 华为技术有限公司 | 多模终端减少频段干扰方法、多模终端及网络设备 |
WO2012118874A2 (en) * | 2011-03-03 | 2012-09-07 | Thomson Licensing | Apparatus and method for processing a radio frequency signal |
CN103490793B (zh) * | 2012-06-12 | 2015-08-19 | 太阳诱电株式会社 | 高频电路模块 |
JP5143972B1 (ja) | 2012-08-16 | 2013-02-13 | 太陽誘電株式会社 | 高周波回路モジュール |
US9295157B2 (en) | 2012-07-13 | 2016-03-22 | Skyworks Solutions, Inc. | Racetrack design in radio frequency shielding applications |
JP5342704B1 (ja) * | 2012-11-12 | 2013-11-13 | 太陽誘電株式会社 | 高周波回路モジュール |
US9788466B2 (en) * | 2013-04-16 | 2017-10-10 | Skyworks Solutions, Inc. | Apparatus and methods related to ground paths implemented with surface mount devices |
WO2015008557A1 (ja) | 2013-07-16 | 2015-01-22 | 株式会社村田製作所 | フロントエンド回路 |
JP5456935B1 (ja) * | 2013-10-30 | 2014-04-02 | 太陽誘電株式会社 | 回路モジュール |
JP5949753B2 (ja) * | 2013-12-27 | 2016-07-13 | 株式会社村田製作所 | フロントエンド回路 |
KR102428141B1 (ko) * | 2014-02-25 | 2022-08-02 | 스카이워크스 솔루션즈, 인코포레이티드 | 향상된 무선-주파수 모듈들에 관한 시스템들, 디바이스들 및 방법들 |
JP6409873B2 (ja) | 2014-07-15 | 2018-10-24 | 株式会社村田製作所 | 高周波モジュール |
US10447458B2 (en) * | 2014-08-13 | 2019-10-15 | Skyworks Solutions, Inc. | Radio-frequency front-end architecture for carrier aggregation of cellular bands |
JP6376291B2 (ja) | 2015-06-03 | 2018-08-22 | 株式会社村田製作所 | 高周波フロントエンド回路 |
KR102624466B1 (ko) * | 2017-01-12 | 2024-01-15 | 삼성전자주식회사 | 다중 대역 안테나를 구비한 전자 장치 및 다중 대역 안테나를 구비한 전자 장치에서 스위칭 방법 |
CN107332573B (zh) * | 2017-07-25 | 2021-04-13 | Oppo广东移动通信有限公司 | 一种射频电路、天线装置及电子设备 |
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US10659086B2 (en) * | 2018-06-13 | 2020-05-19 | Qorvo Us, Inc. | Multi-mode radio frequency circuit |
KR102584103B1 (ko) * | 2019-08-28 | 2023-10-04 | 가부시키가이샤 무라타 세이사쿠쇼 | 고주파 모듈 및 통신 장치 |
JP2021190772A (ja) * | 2020-05-27 | 2021-12-13 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
US11764822B2 (en) | 2020-08-06 | 2023-09-19 | Analog Devices, Inc. | Radio transceiver control interface |
CN116097570A (zh) * | 2020-08-13 | 2023-05-09 | 株式会社村田制作所 | 高频模块 |
CN116210157A (zh) * | 2020-08-13 | 2023-06-02 | 株式会社村田制作所 | 高频模块 |
KR20220037191A (ko) * | 2020-09-17 | 2022-03-24 | 삼성전자주식회사 | 적층 구조의 다이플렉서를 갖는 전자 장치 |
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JP2001244416A (ja) * | 2000-02-29 | 2001-09-07 | Hitachi Ltd | 信号処理用半導体集積回路 |
JP2001267952A (ja) * | 2000-03-22 | 2001-09-28 | Matsushita Electric Ind Co Ltd | 無線端末装置 |
US6780696B1 (en) * | 2000-09-12 | 2004-08-24 | Alien Technology Corporation | Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs |
WO2002078201A2 (de) | 2001-03-22 | 2002-10-03 | Siemens Aktiengesellschaft | Abschirmung für hochfrequenz-sende-/empfangseinrichtungen von elektronischen geräten, insbesondere von geräten zur drahtlosen telekommunikation |
JP3851184B2 (ja) | 2002-02-25 | 2006-11-29 | Tdk株式会社 | フロントエンドモジュール |
JP3752232B2 (ja) | 2002-03-27 | 2006-03-08 | Tdk株式会社 | フロントエンドモジュール |
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JP3514453B1 (ja) * | 2003-01-16 | 2004-03-31 | 日本特殊陶業株式会社 | 高周波部品 |
US20040240420A1 (en) | 2003-02-14 | 2004-12-02 | Tdk Corporation | Front end module and high-frequency functional module |
US7263072B2 (en) | 2003-04-16 | 2007-08-28 | Kyocera Wireless Corp. | System and method for selecting a communication band |
JP4418250B2 (ja) | 2004-02-05 | 2010-02-17 | 株式会社ルネサステクノロジ | 高周波回路モジュール |
-
2005
- 2005-06-06 JP JP2005165098A patent/JP4521602B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-30 CN CN2006100850213A patent/CN1881810B/zh not_active Expired - Fee Related
- 2006-06-01 US US11/444,398 patent/US8391821B2/en not_active Expired - Fee Related
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101771424B (zh) * | 2009-01-05 | 2013-03-27 | 启碁科技股份有限公司 | 用于一无线信号收发器的射频电路及相关无线信号收发器 |
CN101771424A (zh) * | 2009-01-05 | 2010-07-07 | 启碁科技股份有限公司 | 用于一无线信号收发器的射频电路及相关无线信号收发器 |
CN106209155A (zh) * | 2009-05-26 | 2016-12-07 | 株式会社村田制作所 | 高频开关模块 |
CN101902241A (zh) * | 2009-05-26 | 2010-12-01 | 株式会社村田制作所 | 高频开关模块 |
CN102110033A (zh) * | 2009-12-28 | 2011-06-29 | 株式会社日立制作所 | Lsi、铁道用失效保护lsi、电子装置、铁道用电子装置 |
CN103635021B (zh) * | 2012-08-21 | 2016-09-07 | 太阳诱电株式会社 | 高频电路模块 |
CN103635021A (zh) * | 2012-08-21 | 2014-03-12 | 太阳诱电株式会社 | 高频电路模块 |
CN103635020B (zh) * | 2012-08-21 | 2016-10-05 | 太阳诱电株式会社 | 高频电路模块 |
CN103635020A (zh) * | 2012-08-21 | 2014-03-12 | 太阳诱电株式会社 | 高频电路模块 |
CN107113019A (zh) * | 2014-12-25 | 2017-08-29 | 株式会社村田制作所 | 高频模块 |
CN107113018A (zh) * | 2014-12-25 | 2017-08-29 | 株式会社村田制作所 | 高频模块 |
CN107113019B (zh) * | 2014-12-25 | 2019-06-21 | 株式会社村田制作所 | 高频模块 |
CN107113018B (zh) * | 2014-12-25 | 2019-10-18 | 株式会社村田制作所 | 高频模块 |
CN108886378B (zh) * | 2016-03-31 | 2020-10-09 | 株式会社村田制作所 | 前置电路和高频模块 |
CN108886378A (zh) * | 2016-03-31 | 2018-11-23 | 株式会社村田制作所 | 前置电路和高频模块 |
CN109792260B (zh) * | 2016-09-30 | 2020-11-13 | 株式会社村田制作所 | 高频模块以及通信装置 |
CN109792260A (zh) * | 2016-09-30 | 2019-05-21 | 株式会社村田制作所 | 高频模块以及通信装置 |
CN108233974A (zh) * | 2016-12-14 | 2018-06-29 | 株式会社村田制作所 | 收发模块 |
CN108233976A (zh) * | 2016-12-21 | 2018-06-29 | 株式会社村田制作所 | 高频模块 |
US11283584B2 (en) | 2016-12-21 | 2022-03-22 | Murata Manufacturing Co., Ltd. | High frequency module |
CN110710118A (zh) * | 2017-06-02 | 2020-01-17 | 株式会社村田制作所 | 高频模块以及通信装置 |
CN110710118B (zh) * | 2017-06-02 | 2021-08-20 | 株式会社村田制作所 | 高频模块以及通信装置 |
CN109743072A (zh) * | 2018-12-26 | 2019-05-10 | 深圳市万普拉斯科技有限公司 | 一种移动终端信号收发装置及其控制方法 |
CN111865337A (zh) * | 2019-04-03 | 2020-10-30 | 株式会社村田制作所 | 高频模块和通信装置 |
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US8391821B2 (en) | 2013-03-05 |
JP4521602B2 (ja) | 2010-08-11 |
JP2006340257A (ja) | 2006-12-14 |
US20060276158A1 (en) | 2006-12-07 |
CN1881810B (zh) | 2010-08-18 |
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