CN1881591A - 铁电存储器件及其制造方法 - Google Patents
铁电存储器件及其制造方法 Download PDFInfo
- Publication number
- CN1881591A CN1881591A CNA2006100877610A CN200610087761A CN1881591A CN 1881591 A CN1881591 A CN 1881591A CN A2006100877610 A CNA2006100877610 A CN A2006100877610A CN 200610087761 A CN200610087761 A CN 200610087761A CN 1881591 A CN1881591 A CN 1881591A
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- Prior art keywords
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- hydrogen barrier
- barrier film
- film
- dielectric film
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- Granted
Links
- 238000000034 method Methods 0.000 title claims description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 239000001257 hydrogen Substances 0.000 claims abstract description 163
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 163
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 162
- 239000003990 capacitor Substances 0.000 claims abstract description 55
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 230000004888 barrier function Effects 0.000 claims description 144
- 208000005189 Embolism Diseases 0.000 claims description 71
- 239000000758 substrate Substances 0.000 claims description 13
- 238000002360 preparation method Methods 0.000 claims description 2
- 229910017083 AlN Inorganic materials 0.000 claims 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 230000005621 ferroelectricity Effects 0.000 abstract 3
- 230000005611 electricity Effects 0.000 abstract 1
- 210000004027 cell Anatomy 0.000 description 67
- 239000010410 layer Substances 0.000 description 65
- 230000015572 biosynthetic process Effects 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 238000009792 diffusion process Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000007789 sealing Methods 0.000 description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 8
- 229910052721 tungsten Inorganic materials 0.000 description 8
- 239000010937 tungsten Substances 0.000 description 8
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229910010037 TiAlN Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 210000000352 storage cell Anatomy 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007850 degeneration Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
- H01L21/76834—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers formation of thin insulating films on the sidewalls or on top of conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/7687—Thin films associated with contacts of capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
- H01L28/57—Capacitors with a dielectric comprising a perovskite structure material comprising a barrier layer to prevent diffusion of hydrogen or oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/65—Electrodes comprising a noble metal or a noble metal oxide, e.g. platinum (Pt), ruthenium (Ru), ruthenium dioxide (RuO2), iridium (Ir), iridium dioxide (IrO2)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/75—Electrodes comprising two or more layers, e.g. comprising a barrier layer and a metal layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/40—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the peripheral circuit region
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005158586 | 2005-05-31 | ||
JP2005158586A JP4756915B2 (ja) | 2005-05-31 | 2005-05-31 | 強誘電体メモリ装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1881591A true CN1881591A (zh) | 2006-12-20 |
CN100580931C CN100580931C (zh) | 2010-01-13 |
Family
ID=37462256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610087761A Expired - Fee Related CN100580931C (zh) | 2005-05-31 | 2006-05-30 | 铁电存储器件及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7576377B2 (zh) |
JP (1) | JP4756915B2 (zh) |
KR (1) | KR101194616B1 (zh) |
CN (1) | CN100580931C (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112447745A (zh) * | 2019-08-28 | 2021-03-05 | 铠侠股份有限公司 | 半导体存储装置 |
CN112542460A (zh) * | 2019-09-20 | 2021-03-23 | 无锡拍字节科技有限公司 | 具有减少的边缘缺陷的铁电存储器件及其制造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5035336B2 (ja) * | 2007-03-20 | 2012-09-26 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
US8395196B2 (en) * | 2010-11-16 | 2013-03-12 | International Business Machines Corporation | Hydrogen barrier liner for ferro-electric random access memory (FRAM) chip |
US9111944B2 (en) * | 2013-09-09 | 2015-08-18 | Cypress Semiconductor Corporation | Method of fabricating a ferroelectric capacitor |
US10109350B2 (en) * | 2016-07-29 | 2018-10-23 | AP Memory Corp., USA | Ferroelectric memory device |
US10622070B2 (en) | 2016-07-29 | 2020-04-14 | AP Memory Corp, USA | Ferroelectric memory device |
EP3507804A4 (en) | 2016-08-31 | 2020-07-15 | Micron Technology, INC. | FERROELECTRIC STORAGE CELLS |
EP3507805A4 (en) | 2016-08-31 | 2020-06-03 | Micron Technology, Inc. | DEVICES AND METHOD WITH FERROELECTRIC MEMORY AND FOR OPERATING FERROELECTRIC MEMORY |
US10867675B2 (en) | 2017-07-13 | 2020-12-15 | Micron Technology, Inc. | Apparatuses and methods for memory including ferroelectric memory cells and dielectric memory cells |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3542704B2 (ja) * | 1997-10-24 | 2004-07-14 | シャープ株式会社 | 半導体メモリ素子 |
JP3098474B2 (ja) | 1997-10-31 | 2000-10-16 | 日本電気株式会社 | 半導体装置の製造方法 |
US6509601B1 (en) * | 1998-07-31 | 2003-01-21 | Samsung Electronics Co., Ltd. | Semiconductor memory device having capacitor protection layer and method for manufacturing the same |
US6249014B1 (en) * | 1998-10-01 | 2001-06-19 | Ramtron International Corporation | Hydrogen barrier encapsulation techniques for the control of hydrogen induced degradation of ferroelectric capacitors in conjunction with multilevel metal processing for non-volatile integrated circuit memory devices |
EP0996160A1 (en) * | 1998-10-12 | 2000-04-26 | STMicroelectronics S.r.l. | Contact structure for a semiconductor device |
US6611014B1 (en) * | 1999-05-14 | 2003-08-26 | Kabushiki Kaisha Toshiba | Semiconductor device having ferroelectric capacitor and hydrogen barrier film and manufacturing method thereof |
JP2001044375A (ja) * | 1999-07-29 | 2001-02-16 | Fujitsu Ltd | 半導体装置およびその製造方法 |
US6534809B2 (en) * | 1999-12-22 | 2003-03-18 | Agilent Technologies, Inc. | Hardmask designs for dry etching FeRAM capacitor stacks |
DE10000005C1 (de) * | 2000-01-03 | 2001-09-13 | Infineon Technologies Ag | Verfahren zur Herstellung eines ferroelektrischen Halbleiterspeichers |
JP2001250922A (ja) | 2000-03-08 | 2001-09-14 | Nec Corp | 半導体装置及びその製造方法 |
JP3644887B2 (ja) * | 2000-04-11 | 2005-05-11 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
JP2001358311A (ja) * | 2000-06-12 | 2001-12-26 | Nec Corp | 半導体装置およびその製造方法 |
KR100396879B1 (ko) * | 2000-08-11 | 2003-09-02 | 삼성전자주식회사 | 동일 물질로 이루어진 이중막을 포함하는 다중막으로캡슐화된 캐패시터를 구비한 반도체 메모리 소자 및 그의제조 방법 |
JP4025829B2 (ja) * | 2000-09-18 | 2007-12-26 | 富士通株式会社 | 半導体装置及びその製造方法 |
JP3768102B2 (ja) * | 2001-01-05 | 2006-04-19 | 松下電器産業株式会社 | 半導体記憶装置及びその製造方法 |
KR100395766B1 (ko) * | 2001-02-12 | 2003-08-25 | 삼성전자주식회사 | 강유전체 기억 소자 및 그 형성 방법 |
JP2002252336A (ja) | 2001-02-26 | 2002-09-06 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
US6617626B2 (en) * | 2001-02-28 | 2003-09-09 | Fujitsu Limited | Ferroelectric semiconductor memory device and a fabrication process thereof |
KR100420117B1 (ko) * | 2001-03-12 | 2004-03-02 | 삼성전자주식회사 | 수소 확산방지막을 포함하는 반도체 장치 및 그 제조 방법 |
JP3643091B2 (ja) * | 2001-06-25 | 2005-04-27 | 松下電器産業株式会社 | 半導体記憶装置及びその製造方法 |
US6734477B2 (en) * | 2001-08-08 | 2004-05-11 | Agilent Technologies, Inc. | Fabricating an embedded ferroelectric memory cell |
JP2003068987A (ja) | 2001-08-28 | 2003-03-07 | Matsushita Electric Ind Co Ltd | 半導体記憶装置およびその製造方法 |
JP4280006B2 (ja) | 2001-08-28 | 2009-06-17 | パナソニック株式会社 | 半導体装置 |
JP3962296B2 (ja) * | 2001-09-27 | 2007-08-22 | 松下電器産業株式会社 | 強誘電体メモリ装置及びその製造方法 |
US6828161B2 (en) * | 2001-12-31 | 2004-12-07 | Texas Instruments Incorporated | Method of forming an FeRAM having a multi-layer hard mask and patterning thereof |
US20030143853A1 (en) * | 2002-01-31 | 2003-07-31 | Celii Francis G. | FeRAM capacitor stack etch |
JP3967143B2 (ja) * | 2002-01-31 | 2007-08-29 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
JP2004079675A (ja) * | 2002-08-13 | 2004-03-11 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP3621087B1 (ja) * | 2002-11-13 | 2005-02-16 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
JP2004303995A (ja) * | 2003-03-31 | 2004-10-28 | Seiko Epson Corp | 半導体装置の構造およびその製造方法 |
JP2004311470A (ja) * | 2003-04-01 | 2004-11-04 | Seiko Epson Corp | 半導体装置の構造およびその製造方法 |
US6984857B2 (en) * | 2003-07-16 | 2006-01-10 | Texas Instruments Incorporated | Hydrogen barrier for protecting ferroelectric capacitors in a semiconductor device and methods for fabricating the same |
CN100452404C (zh) * | 2004-02-19 | 2009-01-14 | 富士通微电子株式会社 | 半导体装置的制造方法 |
US6982448B2 (en) * | 2004-03-18 | 2006-01-03 | Texas Instruments Incorporated | Ferroelectric capacitor hydrogen barriers and methods for fabricating the same |
JP4800627B2 (ja) * | 2004-03-24 | 2011-10-26 | セイコーエプソン株式会社 | 強誘電体メモリ素子 |
JP2006019571A (ja) * | 2004-07-02 | 2006-01-19 | Toshiba Corp | 半導体記憶装置及びその製造方法 |
JP4371005B2 (ja) * | 2004-08-12 | 2009-11-25 | セイコーエプソン株式会社 | 半導体装置の製造方法及び半導体装置 |
JP4042730B2 (ja) * | 2004-09-02 | 2008-02-06 | セイコーエプソン株式会社 | 強誘電体メモリおよびその製造方法 |
US20060073613A1 (en) * | 2004-09-29 | 2006-04-06 | Sanjeev Aggarwal | Ferroelectric memory cells and methods for fabricating ferroelectric memory cells and ferroelectric capacitors thereof |
US7180141B2 (en) * | 2004-12-03 | 2007-02-20 | Texas Instruments Incorporated | Ferroelectric capacitor with parallel resistance for ferroelectric memory |
JP4713286B2 (ja) * | 2004-12-03 | 2011-06-29 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
JP4422644B2 (ja) * | 2005-03-30 | 2010-02-24 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2006310497A (ja) * | 2005-04-27 | 2006-11-09 | Oki Electric Ind Co Ltd | 半導体記憶装置及びその製造方法 |
JP2006310444A (ja) * | 2005-04-27 | 2006-11-09 | Oki Electric Ind Co Ltd | 半導体記憶装置及びその製造方法 |
-
2005
- 2005-05-31 JP JP2005158586A patent/JP4756915B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-26 US US11/441,195 patent/US7576377B2/en not_active Expired - Fee Related
- 2006-05-30 CN CN200610087761A patent/CN100580931C/zh not_active Expired - Fee Related
- 2006-05-30 KR KR1020060048935A patent/KR101194616B1/ko not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112447745A (zh) * | 2019-08-28 | 2021-03-05 | 铠侠股份有限公司 | 半导体存储装置 |
CN112542460A (zh) * | 2019-09-20 | 2021-03-23 | 无锡拍字节科技有限公司 | 具有减少的边缘缺陷的铁电存储器件及其制造方法 |
WO2021051751A1 (en) * | 2019-09-20 | 2021-03-25 | Wuxi Petabyte Technologies Co., Ltd. | Ferroelectric memory devices with reduced edge defects and methods for forming the same |
US11839087B2 (en) | 2019-09-20 | 2023-12-05 | Wuxi Petabyte Technologies Co., Ltd. | Ferroelectric memory devices with reduced edge defects and methods for forming the same |
CN112542460B (zh) * | 2019-09-20 | 2024-05-14 | 无锡舜铭存储科技有限公司 | 具有减少的边缘缺陷的铁电存储器件及其制造方法 |
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US20060267057A1 (en) | 2006-11-30 |
KR101194616B1 (ko) | 2012-10-29 |
JP4756915B2 (ja) | 2011-08-24 |
KR20060125555A (ko) | 2006-12-06 |
US7576377B2 (en) | 2009-08-18 |
JP2006339194A (ja) | 2006-12-14 |
CN100580931C (zh) | 2010-01-13 |
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