CN1822759A - 用于电子设备的散热装置和散热方法 - Google Patents

用于电子设备的散热装置和散热方法 Download PDF

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Publication number
CN1822759A
CN1822759A CNA200610008332XA CN200610008332A CN1822759A CN 1822759 A CN1822759 A CN 1822759A CN A200610008332X A CNA200610008332X A CN A200610008332XA CN 200610008332 A CN200610008332 A CN 200610008332A CN 1822759 A CN1822759 A CN 1822759A
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CN
China
Prior art keywords
heat dissipation
circuit board
plates
plate
electronic equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CNA200610008332XA
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English (en)
Chinese (zh)
Inventor
鹤房秀夫
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Toshiba Corp
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Toshiba Corp
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Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of CN1822759A publication Critical patent/CN1822759A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Aerials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNA200610008332XA 2005-02-18 2006-02-17 用于电子设备的散热装置和散热方法 Pending CN1822759A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005042344 2005-02-18
JP2005042344A JP2006229046A (ja) 2005-02-18 2005-02-18 電子機器の放熱装置及び放熱方法

Publications (1)

Publication Number Publication Date
CN1822759A true CN1822759A (zh) 2006-08-23

Family

ID=36912460

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200610008332XA Pending CN1822759A (zh) 2005-02-18 2006-02-17 用于电子设备的散热装置和散热方法

Country Status (3)

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US (1) US20060187643A1 (enExample)
JP (1) JP2006229046A (enExample)
CN (1) CN1822759A (enExample)

Cited By (13)

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US7894183B2 (en) 2008-04-25 2011-02-22 Shenzhen Mindray Bio-Medical Electronics Co., Ltd. Shielded and insulated heat removing system
CN102159054A (zh) * 2010-02-12 2011-08-17 乾坤科技股份有限公司 电子封装结构
US8181921B2 (en) 2008-03-24 2012-05-22 Shenzhen Mindray Bio-Medical Electronics Co., Ltd. Platform telescoping mechanism
CN103348782A (zh) * 2011-02-14 2013-10-09 华为技术有限公司 含各向异性导热散热器的设备及其制作方法
CN103415187A (zh) * 2013-07-30 2013-11-27 昆山维金五金制品有限公司 散热结构
CN104378954A (zh) * 2014-10-13 2015-02-25 上海仪电数字技术有限公司 电子器件的散热器
CN103348782B (zh) * 2011-02-14 2016-11-30 华为技术有限公司 含各向异性导热散热器的设备及其制作方法
CN106922101A (zh) * 2015-12-24 2017-07-04 宏达国际电子股份有限公司 电子装置
CN104604353B (zh) * 2012-09-07 2017-07-14 Lg伊诺特有限公司 热辐射构件、热辐射电路板和散热装置封装
CN107580449A (zh) * 2017-09-21 2018-01-12 广东欧珀移动通信有限公司 屏蔽罩、散热组件及电子设备
CN107734947A (zh) * 2016-08-10 2018-02-23 莱尔德电子材料（上海）有限公司 电磁屏蔽罩及电子设备
CN109309410A (zh) * 2017-07-27 2019-02-05 Tdk株式会社 线圈单元及使用其的供电装置、受电装置及无线电力传输系统
CN111133843A (zh) * 2017-09-21 2020-05-08 亚马逊技术股份有限公司 带有散热器的印刷电路板

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JP4445409B2 (ja) * 2005-02-23 2010-04-07 株式会社東芝 電子機器の放熱装置
US7532474B2 (en) * 2006-02-21 2009-05-12 3Com Corporation Apparatus for dissipating heat from electronic components in an enclosed housing
WO2008114381A1 (ja) * 2007-03-19 2008-09-25 Fujitsu Limited ヒートシンク及び電子装置及び電子装置の製造方法
JP2008270518A (ja) * 2007-04-20 2008-11-06 Nec Saitama Ltd ノイズシールドケースおよび電子部品のシールド構造
JP2009229510A (ja) * 2008-03-19 2009-10-08 Hitachi Displays Ltd 液晶表示装置
JP4473923B2 (ja) * 2008-10-22 2010-06-02 株式会社東芝 電子機器
JP5402200B2 (ja) * 2009-04-20 2014-01-29 株式会社リコー 熱移動機構及び情報機器
KR200448519Y1 (ko) * 2009-04-28 2010-04-21 남동진 돌출형 ⅰｃ 패키지용 방열판
TW201118543A (en) * 2009-11-26 2011-06-01 Hon Hai Prec Ind Co Ltd Electronic device and heat dissipation module thereof
US8902588B2 (en) 2009-12-09 2014-12-02 Thomson Licensing Set-top box having microperforations
KR20130029044A (ko) 2010-02-25 2013-03-21 톰슨 라이센싱 퀵 릴리스 스냅들이 은닉된 소형 다층 방사성 냉각 케이스
EP2572562B1 (en) 2010-05-19 2018-05-09 Thomson Licensing Set-top box having dissipating thermal loads
CN102036470B (zh) * 2010-12-05 2012-11-21 新高电子材料（中山）有限公司 低热阻高散热金属基电路板
EP2684375B8 (en) 2011-03-09 2017-12-13 Thomson Licensing Set top box or server having snap-in heat sink and smart card reader
KR20140041701A (ko) 2011-07-14 2014-04-04 톰슨 라이센싱 히트 싱크를 유지하기 위한 홀드다운 고정구를 갖는 스마트 카드 리더와 스냅인 히트 싱크를 구비한 셋톱박스
EP2783557B1 (en) * 2011-11-21 2020-03-18 InterDigital CE Patent Holdings Hold down for retaining a heat sink
WO2014039173A1 (en) * 2012-09-07 2014-03-13 Thomson Licensing Set top box having heat sink pressure applying means
KR20140121525A (ko) * 2013-04-05 2014-10-16 삼성전자주식회사 디스플레이 장치
KR102148201B1 (ko) * 2013-05-06 2020-08-26 삼성전자주식회사 제어장치
DE102015202142A1 (de) * 2015-02-06 2016-08-11 Mahle International Gmbh Elektrische Einrichtung
JP6477373B2 (ja) * 2015-09-11 2019-03-06 株式会社オートネットワーク技術研究所 回路構成体および電気接続箱
WO2017105616A1 (en) * 2015-12-18 2017-06-22 Continental Automotive Systems, Inc Sliding thermal shield
FR3049160B1 (fr) * 2016-03-15 2018-04-13 Aptiv Technologies Limited Dispositif electronique et methode d'assemblage d'un tel dispositif
JP6389211B2 (ja) * 2016-07-15 2018-09-12 本田技研工業株式会社 電子装置用保護カバー
JP6281622B1 (ja) * 2016-10-24 2018-02-21 日本電気株式会社 冷却装置、搭載方法、冷却構造
WO2019030809A1 (ja) * 2017-08-08 2019-02-14 Ｎｅｃプラットフォームズ株式会社 放熱構造体
US11032944B2 (en) * 2017-09-29 2021-06-08 Intel Corporation Crushable heat sink for electronic devices
JP2020057701A (ja) * 2018-10-02 2020-04-09 シャープ株式会社 電子機器
JP6768876B1 (ja) * 2019-04-25 2020-10-14 レノボ・シンガポール・プライベート・リミテッド 電子機器
JP2021190495A (ja) * 2020-05-27 2021-12-13 日立Astemo株式会社 電子制御装置
WO2022132244A1 (en) * 2020-12-15 2022-06-23 Arris Enterprises Llc Multisided heat spreader
JP2022159921A (ja) * 2021-04-05 2022-10-18 アルプスアルパイン株式会社 電子機器

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US2245069A (en) * 1940-11-20 1941-06-10 Vulcan Radiator Co Heat transfer unit
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
US5224538A (en) * 1991-11-01 1993-07-06 Jacoby John H Dimpled heat transfer surface and method of making same
CA2129336C (en) * 1992-02-28 1998-05-05 Christopher A. Soule Self-locking heat sinks for surface mount devices
US6742573B2 (en) * 1999-08-18 2004-06-01 The Furukawa Electric Co., Ltd. Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
JP4438164B2 (ja) * 2000-03-01 2010-03-24 ソニー株式会社 シールドケース
US6545871B1 (en) * 2000-10-27 2003-04-08 Thomson Licensing, S.A. Apparatus for providing heat dissipation for a circuit element
US6445583B1 (en) * 2001-01-26 2002-09-03 Laird Technologies, Inc. Snap in heat sink shielding lid
US6673998B1 (en) * 2003-01-02 2004-01-06 Accton Technology Corporation Electromagnetic shielding device with heat-dissipating capability
JP4498163B2 (ja) * 2005-02-08 2010-07-07 株式会社東芝 電子機器の放熱装置
JP2006222388A (ja) * 2005-02-14 2006-08-24 Toshiba Corp 電子機器の放熱装置及び放熱方法
JP4445409B2 (ja) * 2005-02-23 2010-04-07 株式会社東芝 電子機器の放熱装置
JP2007012941A (ja) * 2005-06-30 2007-01-18 Toshiba Corp 電子機器、およびこの電子機器に組み込まれたヒートシンク

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8181921B2 (en) 2008-03-24 2012-05-22 Shenzhen Mindray Bio-Medical Electronics Co., Ltd. Platform telescoping mechanism
US7894183B2 (en) 2008-04-25 2011-02-22 Shenzhen Mindray Bio-Medical Electronics Co., Ltd. Shielded and insulated heat removing system
CN102159054A (zh) * 2010-02-12 2011-08-17 乾坤科技股份有限公司 电子封装结构
CN103348782A (zh) * 2011-02-14 2013-10-09 华为技术有限公司 含各向异性导热散热器的设备及其制作方法
CN103348782B (zh) * 2011-02-14 2016-11-30 华为技术有限公司 含各向异性导热散热器的设备及其制作方法
CN104604353B (zh) * 2012-09-07 2017-07-14 Lg伊诺特有限公司 热辐射构件、热辐射电路板和散热装置封装
US10028371B2 (en) 2012-09-07 2018-07-17 Lg Innotek Co., Ltd. Heat radiation member, heat radiation circuit board, and heat emission device package
CN103415187A (zh) * 2013-07-30 2013-11-27 昆山维金五金制品有限公司 散热结构
CN104378954A (zh) * 2014-10-13 2015-02-25 上海仪电数字技术有限公司 电子器件的散热器
CN106922101A (zh) * 2015-12-24 2017-07-04 宏达国际电子股份有限公司 电子装置
CN106922101B (zh) * 2015-12-24 2018-12-21 宏达国际电子股份有限公司 电子装置
CN107734947A (zh) * 2016-08-10 2018-02-23 莱尔德电子材料（上海）有限公司 电磁屏蔽罩及电子设备
CN107734947B (zh) * 2016-08-10 2024-05-31 莱尔德电子材料（上海）有限公司 电磁屏蔽罩及电子设备
CN109309410A (zh) * 2017-07-27 2019-02-05 Tdk株式会社 线圈单元及使用其的供电装置、受电装置及无线电力传输系统
CN109309410B (zh) * 2017-07-27 2022-04-12 Tdk株式会社 线圈单元及使用其的供电装置、受电装置及无线电力传输系统
CN107580449A (zh) * 2017-09-21 2018-01-12 广东欧珀移动通信有限公司 屏蔽罩、散热组件及电子设备
CN111133843A (zh) * 2017-09-21 2020-05-08 亚马逊技术股份有限公司 带有散热器的印刷电路板
CN111133843B (zh) * 2017-09-21 2024-04-12 亚马逊技术股份有限公司 带有散热器的印刷电路板

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Publication number Publication date
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US20060187643A1 (en) 2006-08-24

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