CN1809512B - 脆性基板分断系统与脆性基板分断方法 - Google Patents

脆性基板分断系统与脆性基板分断方法 Download PDF

Info

Publication number
CN1809512B
CN1809512B CN2004800174224A CN200480017422A CN1809512B CN 1809512 B CN1809512 B CN 1809512B CN 2004800174224 A CN2004800174224 A CN 2004800174224A CN 200480017422 A CN200480017422 A CN 200480017422A CN 1809512 B CN1809512 B CN 1809512B
Authority
CN
China
Prior art keywords
substrate
holding
brittle
breaking
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2004800174224A
Other languages
English (en)
Chinese (zh)
Other versions
CN1809512A (zh
Inventor
音田健司
井上修一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN1809512A publication Critical patent/CN1809512A/zh
Application granted granted Critical
Publication of CN1809512B publication Critical patent/CN1809512B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Liquid Crystal (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
CN2004800174224A 2003-04-28 2004-04-27 脆性基板分断系统与脆性基板分断方法 Expired - Fee Related CN1809512B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003124501 2003-04-28
JP124501/2003 2003-04-28
PCT/JP2004/006103 WO2004096721A1 (ja) 2003-04-28 2004-04-27 脆性基板分断システムおよび脆性基板分断方法

Publications (2)

Publication Number Publication Date
CN1809512A CN1809512A (zh) 2006-07-26
CN1809512B true CN1809512B (zh) 2012-11-21

Family

ID=33410166

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2004800174224A Expired - Fee Related CN1809512B (zh) 2003-04-28 2004-04-27 脆性基板分断系统与脆性基板分断方法

Country Status (7)

Country Link
US (1) US20070051769A1 (enExample)
EP (1) EP1630140A4 (enExample)
JP (1) JP4637018B2 (enExample)
KR (1) KR101164491B1 (enExample)
CN (1) CN1809512B (enExample)
TW (1) TW200505805A (enExample)
WO (1) WO2004096721A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730447B (zh) * 2018-10-22 2021-06-11 日商坂東機工股份有限公司 玻璃板之折斷機械

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1647534B1 (de) * 2004-10-15 2018-12-19 Bystronic Maschinen AG Vorrichtung und Verfahren zum Brechen von Glasscheiben
KR101096733B1 (ko) * 2004-12-27 2011-12-21 엘지디스플레이 주식회사 기판의 절단장치 및 이를 이용한 기판의 절단방법
KR100907462B1 (ko) 2005-05-30 2009-07-13 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판 절단장치 및 절단방법
TWI325352B (en) 2005-09-12 2010-06-01 Foxsemicon Integrated Tech Inc Laser cutting apparatus and method
JP4890462B2 (ja) * 2005-10-28 2012-03-07 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブライン形成方法およびスクライブライン形成装置
TW200911442A (en) * 2007-09-11 2009-03-16 Nat Applied Res Laboratories Machining method and apparatus for brittle material
KR100890764B1 (ko) * 2008-01-25 2009-03-26 삼성코닝정밀유리 주식회사 가공 테이블 일체형 유리 기판 브레이킹 장치
JP2010229005A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP2011088382A (ja) * 2009-10-23 2011-05-06 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置およびブレイク方法
JP4996703B2 (ja) * 2010-02-09 2012-08-08 三星ダイヤモンド工業株式会社 基板分断装置
JP5249979B2 (ja) * 2010-03-18 2013-07-31 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法およびこれに用いるレーザ加工装置
CN102059458A (zh) * 2010-12-28 2011-05-18 惠州市正峰激光设备有限公司 卷状胶膜激光切割机
CN102219366B (zh) * 2011-04-12 2012-12-19 深圳市晶向科技有限公司 异型玻璃切割机的自动对位系统及自动对位方法
JP5348212B2 (ja) * 2011-09-02 2013-11-20 三星ダイヤモンド工業株式会社 分断装置
KR101968792B1 (ko) * 2011-11-16 2019-04-12 니폰 덴키 가라스 가부시키가이샤 판유리 할단장치, 판유리 할단방법, 판유리 제작방법 및 판유리 할단시스템
JP5276736B2 (ja) * 2012-04-16 2013-08-28 三星ダイヤモンド工業株式会社 ブレイク方法
KR102048921B1 (ko) * 2012-06-20 2019-11-27 삼성디스플레이 주식회사 셀 절단 장치 및 셀 절단 방법
KR101412399B1 (ko) * 2012-08-30 2014-06-25 현대제철 주식회사 용접선 정렬용 안착 유닛 및 이를 갖는 용접 장치
JP6191122B2 (ja) * 2012-10-30 2017-09-06 三星ダイヤモンド工業株式会社 積層セラミックス基板の分断方法
US9126857B2 (en) 2012-11-15 2015-09-08 Corning Incorporated Separation apparatuses for separating sheets of brittle material and methods for separating sheets of brittle material
JP6014490B2 (ja) * 2012-12-27 2016-10-25 三星ダイヤモンド工業株式会社 分断方法、及び分断装置
JP6163341B2 (ja) * 2013-04-02 2017-07-12 三星ダイヤモンド工業株式会社 ブレイク装置
JP6140012B2 (ja) * 2013-07-08 2017-05-31 三星ダイヤモンド工業株式会社 貼り合わせ基板のブレイク方法
TWI588002B (zh) * 2013-10-29 2017-06-21 三星國際機械股份有限公司 用於脆性基板之分裂夾具及切割方法
CN103896483B (zh) * 2014-03-27 2016-08-17 深圳市华星光电技术有限公司 一种玻璃基板切割设备及切割方法
JP6421472B2 (ja) * 2014-06-24 2018-11-14 三星ダイヤモンド工業株式会社 脆性基板の分断方法および表示パネルの製造方法
JP2016040079A (ja) * 2014-08-12 2016-03-24 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法及び分断装置
KR101659454B1 (ko) * 2014-08-21 2016-09-23 한국미쯔보시다이아몬드공업(주) 기판 브레이크 장치
KR102310157B1 (ko) * 2015-03-16 2021-10-12 주식회사 탑 엔지니어링 스크라이빙 장치
ITUB20152791A1 (it) * 2015-08-03 2017-02-03 Bottero Spa Macchina da taglio per il taglio di una lastra di vetro
CN105710980B (zh) * 2016-01-17 2017-08-22 长春理工大学 激光原位辅助机械刻划硬脆材料的装置及方法
JP7066701B2 (ja) * 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
CN106977089B (zh) * 2017-05-05 2019-11-08 东旭科技集团有限公司 玻璃压断装置、玻璃压断方法和玻璃切割系统
KR102668788B1 (ko) * 2019-01-08 2024-05-24 코닝 인코포레이티드 유리 라미네이트 물품 및 그의 제조 방법
CN113146746B (zh) * 2021-05-14 2023-04-28 赤峰元泰铸件有限公司 一种自动化数控苯板切割机
KR102474254B1 (ko) * 2022-07-14 2022-12-06 최호림 판유리 절단장치 및 그를 위한 판유리 절단기구

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1341262A (en) * 1914-02-04 1920-05-25 Libbey Owens Sheet Glass Co Glass drawing and cutting mechanism
FR1380755A (fr) * 1963-10-25 1964-12-04 Saint Gobain Procédé et dispositif pour la découpe du verre
US3532260A (en) * 1968-05-22 1970-10-06 Ford Motor Co Method of cutting glass employing vibratory energy
US4005808A (en) * 1974-01-30 1977-02-01 The Fletcher-Terry Company Plastic cutting method
FR2304581A2 (fr) * 1975-03-19 1976-10-15 Saint Gobain Procede et dispositif pour decouper le verre
JPS5342333B2 (enExample) 1975-03-18 1978-11-10
JPS5276317A (en) 1975-12-22 1977-06-27 Nippon Sheet Glass Co Ltd Method of curved cutting of flat glass
JPS5585430A (en) * 1978-12-18 1980-06-27 Seikosha Co Ltd Automatically cutting apparatus
JPS60112634A (ja) * 1983-11-22 1985-06-19 Bandou Kiko Kk ガラス切断機
US5785225A (en) * 1991-12-06 1998-07-28 Loomis Industries, Inc. Frangible semiconductor wafer dicing apparatus which employs scribing and breaking
JP3209448B2 (ja) * 1992-04-08 2001-09-17 河口湖精密株式会社 ガラス基板の分断方法及びガラス基板の分断装置
JPH11116260A (ja) * 1997-10-08 1999-04-27 Mitsuboshi Diamond Kogyo Kk ガラス加工装置
JP2000063137A (ja) * 1998-08-10 2000-02-29 Toyota Motor Corp ガラス板切断方法及びその装置
JP3813369B2 (ja) * 1999-01-05 2006-08-23 古河電気工業株式会社 光ファイバ切断器
JP3534033B2 (ja) * 2000-02-29 2004-06-07 日産自動車株式会社 積層式金属ベルト用リングとその製造方法
JP2002037638A (ja) * 2000-07-26 2002-02-06 Display Technologies Inc ガラス基板の切断装置及びその方法
JP3787489B2 (ja) * 2000-10-02 2006-06-21 三星ダイヤモンド工業株式会社 脆性基板のブレイク方法及び装置
WO2002057192A1 (en) * 2001-01-17 2002-07-25 Mitsuboshi Diamond Industrial Co., Ltd. Separator and separating system
TW515781B (en) * 2001-07-27 2003-01-01 Hannstar Display Corp Method for dividing fragile material and laminated glass
JP2003286044A (ja) * 2002-03-27 2003-10-07 Sharp Corp 基板分断装置および基板分断方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730447B (zh) * 2018-10-22 2021-06-11 日商坂東機工股份有限公司 玻璃板之折斷機械
US11591251B2 (en) 2018-10-22 2023-02-28 Bando Kiko Co., Ltd. Glass plate bend-breaking machine

Also Published As

Publication number Publication date
JPWO2004096721A1 (ja) 2006-07-13
KR101164491B1 (ko) 2012-07-18
US20070051769A1 (en) 2007-03-08
JP4637018B2 (ja) 2011-02-23
CN1809512A (zh) 2006-07-26
WO2004096721A1 (ja) 2004-11-11
TWI343907B (enExample) 2011-06-21
EP1630140A4 (en) 2006-10-25
KR20060006826A (ko) 2006-01-19
EP1630140A1 (en) 2006-03-01
TW200505805A (en) 2005-02-16

Similar Documents

Publication Publication Date Title
CN1809512B (zh) 脆性基板分断系统与脆性基板分断方法
CN101296787B (zh) 脆性材料基板的划线形成方法及划线形成装置
TWI454330B (zh) A method for processing a brittle material substrate and a laser processing apparatus for use in the method
CN101068666B (zh) 脆性材料基板的划线方法和划线装置以及脆性材料基板的切断系统
TWI434812B (zh) Breaking device and breaking method
TWI405732B (zh) A substrate cutting system, a substrate manufacturing apparatus, a substrate scribing method, and a substrate segmentation method
JP5022602B2 (ja) カッターホイールおよびこれを用いた脆性材料基板のスクライブ方法および分断方法
TWI658015B (zh) 在撓性薄玻璃中切割多個半徑的方法和設備與以其製造之玻璃基板
EP1666221A1 (en) Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method
CN101489746B (zh) 切割装置
CN102596523B (zh) 脆性材料基板的断裂方法
KR20080076711A (ko) 접합 유리판의 분리 방법 및 장치
KR101010310B1 (ko) 스크라이빙 장치, 그리고 이를 이용한 기판 절단 장치 및방법
JP2012076425A (ja) 脆性材料基板の分断装置
KR101134655B1 (ko) 기판 커팅 장치
CN112885746A (zh) 一种裂片装置
CN107686232A (zh) 玻璃基板的时间差切割方法
KR101236805B1 (ko) 기판 커팅 장치 및 기판 커팅 방법
CN112895183B (zh) 一种裂片装置
CN111231134B (zh) 划片方法
JP2017001191A (ja) 貼り合わせ基板の分断装置
JP2007022848A (ja) スクライブ装置及びそれを用いた基板の切断方法
CN101695854A (zh) 划线设备和方法
TW201424968A (zh) 分斷方法及分斷裝置
JP2017001190A (ja) 貼り合わせ基板の分断装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121121

CF01 Termination of patent right due to non-payment of annual fee