Classifications

• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B33/00—Severing cooled glass
  • C03B33/09—Severing cooled glass by thermal shock
  • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
  • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
  • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
  • B23K26/042—Automatically aligning the laser beam
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28D—WORKING STONE OR STONE-LIKE MATERIALS
  • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B33/00—Severing cooled glass
  • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
  • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
  • C03B33/027—Scoring tool holders; Driving mechanisms therefor
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B33/00—Severing cooled glass
  • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
  • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
  • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B33/00—Severing cooled glass
  • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
  • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
  • C03B33/033—Apparatus for opening score lines in glass sheets
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B33/00—Severing cooled glass
  • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
• • G—PHYSICS
  • G02—OPTICS
  • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
  • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
  • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
  • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
  • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
  • G02F1/1333—Constructional arrangements; Manufacturing methods
  • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T225/00—Severing by tearing or breaking
  • Y10T225/10—Methods
  • Y10T225/12—With preliminary weakening

Definitions

• the present invention forms a scribe line on a brittle substrate
• Substrate dividing system for dividing a brittle substrate by breaking along the
• Display devices include flat display panels (eg, liquid crystal panels, plasma display panels, organic EL display panels).
• Flat display panels are manufactured by bonding two brittle substrates (eg, two glass substrates). When manufacturing a display panel, it is necessary to divide the brittle substrate into a predetermined size. In general, a brittle substrate is divided by forming a scribe line on the brittle substrate (scribing step) and then breaking the brittle substrate along the formed scribing line (breaking step).
• WO 02 / 057172A1 discloses a dividing device in which a pair of dividing heads are disposed facing each other at the top and bottom.
• Each of the pair of dividing heads includes a cutter wheel for forming a scribe line on the glass substrate, and a roller rolling on the glass substrate in parallel with the scribe line formed by the cut wheel. including.
• This dividing device cuts the bonded substrate manufactured by bonding a pair of glass substrates.
• the dividing device disclosed in this publication is provided at the top and bottom while pressing on both sides of the scribing line, after simultaneously forming a scribing line on each glass substrate constituting the bonded substrate by the cutter wheel of each dividing head.
• Each division Roll the roller to apply shear stress (bending moment) to the scribe line of each glass substrate.
• shear stress bending moment
• the bending moment which acts to expand the vertical crack extending immediately below (directly above) the scratch line formed on each glass substrate in the thickness direction of the glass substrate is If sufficient shear force does not act on the scribe line and the vertical cracks that form the scribe line formed on each glass substrate are shallow, the glass substrates may not be divided reliably. is there.
• the divided side ridge portion hangs down because the divided side edge portion is not held, and the division processing is performed by the side ridge portion that hangs down. Unnecessary force may be applied to the inside glass substrate, and the substrate may be cut diagonally to the scribe line.
• the divided side edge portion comes into contact with the end surface which is the divided portion of the glass substrate, there is a possibility that the end surface portion may be chipped or broken.
• the present invention has been made in view of such problems, and a brittle substrate cutting system capable of efficiently breaking a brittle substrate without causing a crack or the like of the brittle substrate. It is an object of the present invention to provide a brittle substrate cutting method. Disclosure of the invention
• the brittle substrate cutting system comprises: a scribing device including scribing line forming means for forming a scribing line on a first surface of the brittle substrate; and a breaking device for breaking the brittle substrate along the scribing line.
• the breaking apparatus moves a pressing force on a second surface of the brittle substrate opposite to the first surface of the brittle substrate while holding the first surface of the brittle substrate along the scribe line.
• a pressure control means is provided to achieve the above object.
• the brittle substrate cutting system of the present invention in a state in which the first surface of the brittle substrate is held
• the pressing on the second surface of the brittle substrate opposite to the first surface of the brittle substrate can be moved along the scribe line formed on the first surface of the brittle substrate.
• the pressing force is applied to the second surface of the brittle substrate facing the first surface of the brittle substrate while the pressing force is moved along the scribe line formed on the first surface of the brittle substrate. Therefore, a bending moment can be applied to the brittle substrate to extend the vertical crack extending from the scribe line in the thickness direction of the substrate with certainty, and the brittle substrate can be broken.
• the breaking apparatus further comprises: pressing means for pressing the second surface of the brittle substrate; and first holding means for holding the first surface of the brittle substrate, the first pressing control means comprising The pressing means may be controlled such that the pressing means moves along the scribe line in a state where the first holding means and the pressing means are opposed to each other via the brittle substrate.
• the first holding means holds the first surface of the brittle substrate
• the pressing means presses the second surface of the brittle substrate, forming the first surface of the brittle substrate
• the pressing means can be moved along the scribe line. Therefore, a pressing force can be applied along the scribe line to the second surface of the brittle substrate opposite to the first surface of the brittle substrate on which the scribe line is formed.
• a bending moment can be applied to the brittle substrate such that the vertical crack extending from the scribe line can be surely extended in the thickness direction of the substrate, and the brittle substrate can be divided.
• the first pressing control unit may control the pressing unit such that the pressing unit rolls along the scribing line.
• the first pressing control means controls the pressing means so that the pressing means rolls along the scribing line
• the first control means can easily move the pressing means along the scribing line.
• the pressing means may be a roller. Since the pressing means is a roller, the first pressing control means can easily roll the pressing means along the scribing line.
• the pressing means may be a conveyor. '
• the first pressing control means can easily roll the pressing means along the scribing line.
• the pressing means may be a bearing.
• the first pressing control means can easily roll the pressing means along the scribing line.
• a groove may be formed on the second surface of the brittle substrate such that the pressing means is not in contact with a line facing the scribe line.
• the pressing means presses the both sides of the line on the second surface of the brittle substrate so that the pressing means does not contact the line on the second surface of the brittle substrate facing the scribe line. can do. Therefore, it is possible to prevent the occurrence of chipping of the divided section during parting processing.
• the breaking apparatus is configured such that the first holding means moves along the scribing line in a state where the first holding means and the pressing means are opposed to each other via the brittle substrate. It may further comprise first holding control means for controlling the holding means.
• the first pressing control means moves the pressing means along the scribe line, and the first holding control means is along the scribe line.
• the brittle substrate is divided in order from one end face of the brittle substrate to the other end face. Therefore, the brittle substrate can be divided without forming a plurality of dividing start points. As a result, it is possible to form an uneven cross section on the brittle substrate.
• the first holding means may extend along the scribe line.
• the first holding means may be controlled to roll.
• the first holding control means can easily move the first holding means along the scribe line.
• the first holding means may be a roller.
• the first holding control means can easily roll the first holding means along the scribing line.
• the first holding means may be a conveyor.
• the first holding control means can easily roll the first holding means along the scribing line.
• the first holding means may be a bearing.
• the first holding control means can easily roll the first holding means along the scribing line.
• a groove may be formed in the scribe line such that the first holding means is not in contact with the scribe line.
• the first holding means can hold the both sides of the scribe line so that the first holding means does not contact when the brittle substrate is cut along. Therefore, it is possible to prevent the occurrence of chipping of the divided section during parting processing.
• the width of the groove formed in the first holding means may be wider than the width of the pressing means.
• the pressing means further includes a second holding means for holding the brittle substrate and moving in a first direction along the scribing line, and a third holding means for holding the brittle substrate from the pressing means in the first direction.
• the second holding means In a state in which the second holding means holds the brittle substrate, the second holding means is arranged along the scribe line along the one surface.
• the second holding means is controlled to move, and the third holding means is moved along the scribing line along the scribing line, with the third holding means holding the brittle substrate.
• the apparatus may further include second holding control means for controlling the third holding means to move.
• the holding means can be moved along the scribe line in a state where the holding means holds the undivided area of the area where the scribe line is formed, the area where the pressing means is pressing is It can prevent unnecessary force from being applied. As a result, it is possible to prevent chipping of the partial cross section formed on the brittle substrate.
• the second holding control means is configured to: at a predetermined speed, the first holding means and the second holding means. The second holding means is controlled to move, and the second holding control means controls the third holding means so that the third holding means and the pressing means move at the predetermined speed. May be
• the second holding means and the third holding means can reliably hold the brittle substrate. it can.
• the pressing means is moved in a first direction along the scribe line, and a fourth holding means and a fifth holding means for holding the brittle substrate are further moved from the pressing means in a direction opposite to the first direction. You may have.
• the first holding means can be moved along the scribe line in a state in which the fourth holding means and the fifth holding means hold the divided area in the area where the scribe line is formed, It is possible to prevent an unnecessary force from being applied to the area where the pressing means is pressing. As a result, it is possible to prevent the partial cross section formed on the brittle substrate from being chipped off.
• the scribing line forming means comprises: a laser beam irradiating means for irradiating a laser beam to the first surface of the brittle substrate; and the laser beam irradiating means of the first surface of the brittle substrate.
• a cooling means may be provided for cooling the vicinity of the portion irradiated with the laser beam by the single beam irradiation means.
• the first surface of the brittle substrate is irradiated with a laser beam, and the vicinity of the area irradiated with the laser beam is cooled to form a scribe line in which a vertical crack is generated. Therefore, stress distortion does not remain at the edge of the cross section.
• a chipping occurs in the cross section formed on the brittle substrate. Can be prevented.
• the cooling means may be a cooling nozzle, and the cooling nozzle may cool the vicinity of the portion irradiated with the laser beam by spraying a refrigerant onto the first surface of the brittle substrate.
• the coolant is sprayed to the first surface of the brittle substrate by the cooling nozzle, a predetermined region of the brittle substrate can be reliably cooled without contact.
• the laser beam receiving unit may be configured to receive at least one of the laser beam irradiated by the laser beam irradiating means and the refrigerant blown by the cooling nozzle.
• the diffusion of at least one of the laser beam and the refrigerant can be prevented, the safety of the brittle substrate cutting system can be enhanced.
• the laser beam / refrigerant receiving portion may be configured to be movable independently of the pressing means.
• the brittle substrate on which the scribing line is formed can be divided by making the pressing means follow the scribing forming means. Further, since the second surface of the brittle substrate can be pressed by the pressing means while forming the scribe line on the first surface of the brittle substrate, the scribing step and the breaking step can be carried out almost simultaneously. Therefore, the division process time can be shortened.
• the cooling nozzle may be configured to be movable along the scribing line. Yes.
• cooling nozzle can be moved along the scribing line, scribing conditions can be set according to the material of the brittle substrate.
• the scribing line forming means may further include a cutting force cutter mechanism for forming a kerf at the start position of the scree brine formation on the first surface of the brittle substrate.
• the cutting power cutter mechanism may be configured to be movable integrally with the laser beam irradiation means and the cooling means.
• the scribe line can be accurately formed along the scribe line formation planned line.
• the scribe line forming means may be a force cutter.
• scribe lines can be stably formed.
• the force cutter may be a disk-shaped force wheel tip, and a blade may be formed on an outer peripheral edge of the force wheel tip.
• the speed for forming the scribing line (the scribing speed) can be increased.
• a plurality of recesses may be formed at predetermined intervals in the blade edge ridge line portion of the blade portion.
• a plurality of concave portions are formed at predetermined intervals in the blade edge ridge portion, and portions other than the formed plurality of concave portions become a plurality of convex portions.
• the plurality of projections can form a vertical crack extending to about 90% of the thickness of the brittle substrate due to impact impact on the first surface of the brittle substrate. As a result, the break process Can reliably separate brittle substrates.
• the cutter may be configured to be movable independently of the pressing means.
• the brittle substrate on which the scribing line is formed can be divided by causing the pressing means to follow the force cutter.
• the second surface of the brittle substrate can be pressed by the pressing means while forming the scribe line on the first surface of the brittle substrate, the scribing step and the breaking step can be carried out almost simultaneously. Therefore, the division process time can be shortened.
• the first pressing control unit may control the pressing unit such that the pressing unit moves along the scribing line.
• the pressing means can be moved along the scribe line formed on one side. Therefore, the scribing step and the breaking step of the brittle substrate can be performed almost simultaneously. As a result, the time for dividing the brittle substrate can be shortened.
• the scribing apparatus includes scribing line forming means for forming the scribing line on the first surface while holding the first surface of the brittle substrate, and the scribing apparatus is characterized in that the fragility facing the first surface is reduced. It may further comprise pressing means for pressing the second surface of the substrate.
• the scribing line forming means holds the first surface of the brittle substrate, and the pressing means presses the second surface of the brittle substrate to form the first surface.
• the pressing means can be moved along the scribing line. Therefore, a pressing force can be applied along the scribe line to the second surface of the brittle substrate opposite to the first surface of the brittle substrate where the scribe line is formed.
• the vertical cracks extending from the scribe line are surely extended in the thickness direction of the substrate. Bending moment can be applied to the brittle substrate, and the brittle substrate can be divided.
• the scribing line forming means can hold the first surface of the brittle substrate and the pressing means can press the second surface of the brittle substrate, a scribing line can be formed. And the break process can be performed almost simultaneously. As a result, the time for dividing the brittle substrate can be shortened.
• the brittle substrate is a bonded substrate obtained by bonding a substrate
• the scribing device is a first scribe line forming means for forming a first scribe line on a first surface of the bonded substrate, and the bonded substrate.
• a second scribe line forming means for forming a second scribe line on a second surface of the bonded substrate facing the first surface of the bonded substrate, and the breaking apparatus is configured to:
• a second bonded substrate is broken along a first scribe line formed on the first surface of the bonded substrate, and a second formed on the second surface of the bonded substrate by the second scribing line forming means.
• the first self-bonding substrate is broken along the scribe line, and the first pressing control means holds the first surface of the first substrate.
• the pressure on the second surface of the bonded substrate opposite to the first surface of the bonded substrate in a state may be moved along the scribe line was.
• the pressure to the second surface of the bonded substrate facing the first surface of the bonded substrate while holding the first surface of the bonded substrate is the second bonded substrate. It can move along the scribe line formed on one side. As described above, while the pressing force is moved along the scribe line formed on the first surface of the bonded substrate, the pressing force is applied to the second surface of the bonded substrate facing the first surface of the bonded substrate. Therefore, a bending moment can be applied to the brittle substrate such that the vertical grid extending from the scribe line can be extended in the thickness direction of the substrate with certainty, and the bonded substrate can be divided.
• the breaking apparatus comprises: a first bonded substrate pressing means for pressing a first surface of the bonded substrate; a second bonded substrate pressing means for pressing a second surface of the bonded substrate; and the bonded substrate.
• the second bonded substrate pressing means is moved such that the second bonded substrate pressing means moves along the first scribe line while the bonded substrate pressing means is opposed to the bonded substrate via the bonded substrate.
• a first pressing means control means for controlling the step, the second bonded substrate holding means, and the first bonded substrate pressing means facing each other with the bonded substrate interposed therebetween; And a second pressing means control means pressing means for controlling the first bonded substrate pressing means such that along connection moved to the second scribe line may be e Bei.
• the holding means holds the first surface of the bonded substrate, and the pressing means presses the second surface of the bonded substrate, the scribing formed on the first surface
• the pressing means can be moved along the line.
• another holding means holds the second surface of the bonded substrate, and another pressing means presses the first surface of the bonded substrate, along the scribe line formed on the second surface.
• Another pressing means can be moved.
• the first pressing means control means controls the second bonded substrate pressing means so that the second bonded substrate pressing means rolls along the first scribing line, and the second pressing means control means
• the first bonded substrate pressing unit may be controlled such that the first bonded substrate pressing unit rolls along the second scan line.
• the control means can easily move the pressing means along the scribing line.
• Another control means can easily move the other pressing means along the other scribe line.
• the first bonded substrate pressing means and the second bonded substrate pressing means may be rollers.
• the control means and the further controlling means can easily roll the pressing means and the further pressing means along the scribing line.
• the pressing means may be a conveyor.
• the control means and the further controlling means can easily roll the pressing means and the further pressing means along the scribing line.
• the pressing means may be bearing.
• the control means and the further controlling means can easily roll the pressing means and the further pressing means along the scribing line.
• the second bonded substrate pressing means is not in contact with the line facing the first scribe line on the second surface of the bonded substrate.
• a groove portion is formed, and the pressing means for the first bonded substrate includes: pressing the first bonded substrate on a line facing the second scribe line on the first surface of the bonded substrate.
• a second groove may be formed such that the means are non-contacting.
• the pressing means can press both sides of the line so that the pressing means does not contact the line of the surface of the bonded substrate facing the spline. Therefore, it is possible to prevent the occurrence of chipping of the divided section during parting processing.
• the breaking apparatus comprises: the first bonded substrate holding means and the second bonded substrate
• the first bonded substrate holding unit is controlled such that the first bonded substrate holding unit moves along the first scribe line in a state in which the first pressing unit is opposed to the substrate pressing unit via the bonded substrate.
• First holding means control means, the second bonded substrate holding means, and the first bonded substrate pressing means are opposed to each other via the bonded substrate, the second bonded substrate holding
• the apparatus may further comprise second holding means control means for controlling the second bonded substrate holding means so that the means moves along the second spline.
• the bonded substrate can be cut without forming a plurality of dividing start points. As a result, it is possible to form an uneven cross section on the bonded substrate.
• the first holding means control means controls the first bonded substrate holding means so that the first bonded substrate holding means rolls along the first scribing line, and the second holding means control means
• the second bonded substrate holding unit may be controlled such that the second bonded substrate holding unit rolls along the second scan line.
• the control means can easily move the holding means along the scribe line, and another control means can easily move the other holding means along the other scribe line.
• the first bonded substrate holding means and the second bonded substrate holding means may have a gap.
• the control means and the further control means can easily roll the holding means and the further holding means along the scribing line.
• the first bonded substrate holding means and the second bonded substrate holding means may be conveyors.
• the control means and the further controlling means can easily roll the holding means and the further holding means along the scribing line.
• the first bonded substrate holding means and the second bonded substrate holding means may be bare. .
• control means and the further control means can easily roll the holding means and the further holding means along the scribing line.
• a third groove portion is formed on the first scribe line such that the first bonded substrate holding unit is not in contact with the first bonded substrate holding unit.
• a fourth groove may be formed on the second scribe line such that the second bonded substrate holding means is not in contact with the second scribe line.
• the holding means When dividing the bonded substrate along the scribe line, the holding means can hold both sides of the scribe line so that the holding means does not contact the scribe line. Therefore, it is possible to prevent the occurrence of chipping of the divided section during divided kaoh.
• the width of the third groove portion formed in the first bonded substrate holding means is wider than the width of the second bonded substrate holding means, and the third groove portion formed in the second bonded substrate holding means is The width of the four groove portions may be wider than the width of the first bonded substrate pressing means.
• a part of the pressing means enters the groove of the holding means, and the bonded substrate is easily bent, so that the bonded substrate can be reliably cut along the scribe line.
• the first bonded substrate pressing unit and the second bonded substrate pressing unit move in a first direction along the first scribe line and the second scribe line, and hold the brittle substrate.
• (3) The first bonding substrate holding means and the fourth bonding substrate holding means are further provided in the first direction from the first bonding substrate pressing means and the second bonding substrate pressing means, and the breaking device is characterized by: 3) The third bonding is performed in a state where the bonding substrate holding means holds the bonded substrate.
• the third substrate holding means is controlled so that the second substrate holding means moves on the first surface along the scribe line, and the fourth substrate holding means holds the first substrate.
• the method may further include third pressing means control means for controlling the fourth bonded substrate holding means so that the fourth bonded substrate holding means moves on the two surfaces along the scan line.
• the holding means can be moved along the scribe line in the state where the holding means holds the undivided area of the area where the scribe line is formed, the pressing means is not necessary for the area being pressed. It is possible to prevent the application of As a result, it is possible to prevent the partial cross section formed in the bonded substrate from being chipped off.
• the third holding unit control unit is configured to:
• the third bonded substrate holding means is controlled such that the first bonded substrate holding unit and the first bonded substrate pressing unit move at a predetermined speed
• the third holding unit control unit is configured to: (4)
• the fourth bonded substrate holding unit may be controlled such that the bonded substrate holding unit, the second bonded substrate holding unit, and the second bonded substrate pressing unit move at the predetermined speed.
• the holding means can reliably hold the bonded substrate.
• the first bonded substrate pressing means moves in a first direction along the second scribe line
• the second bonded substrate pressing means moves in a first direction along the first scribe line.
• the fifth bonded substrate holding the bonded substrate holding means and the sixth bonded substrate holding device are opposite to the first direction from the first bonded substrate pressing device and the second bonded substrate pressing device You may be prepared to
• the holding means holds the divided area, unnecessary force can be prevented from being applied to the area being pressed by the pressing means. Ru. As a result, it is possible to prevent the partial cross section formed in the bonded substrate from being chipped off.
• the first scribe line forming device is a first bonded substrate of the first bonded substrate. In a state in which the first scribe line is formed on the surface, and in a state in which the second bonded substrate holding means and the first bonded substrate pressing means are opposed to each other through the bonded substrate.
• the first pressing unit control unit may be configured to press the second bonded substrate. Controlling the second bonding substrate pressing means so as to move along the first scribing line, wherein the second pressing means control means is configured such that the first bonding board pressing means is the second
• the first bonding Align substrate pressing means may be controlled to move along a scribe line.
• the scribing step and the breaking step of the bonded substrate can be performed almost simultaneously. As a result, it is possible to shorten the dividing process time of the bonded substrate.
• the brittle substrate cutting method of the present invention comprises the steps of: (a) forming a scribe line on the first surface of the brittle substrate; and (b) breaking the fragile substrate along the scribe line,
• the step (b) comprises: (b-1) pressing the second surface of the brittle substrate facing the first surface of the brittle substrate while holding the first surface of the brittle substrate against the scribe line Move along the road, to achieve the above objective.
• the step (b) is performed by a breaking device for breaking the brittle substrate along the scribing line, the breaking device pressing the second surface of the brittle substrate, and the pressing means.
• a first holding means for holding the first surface, and in the step (b-1), the first holding means and the pressing means are opposed to each other via the brittle substrate;
• the method may include the step of moving the pressing means along the scribing line.
• the step (b-1) may include the step of: controlling the pressing means such that the pressing means rolls along the scribing line.
• the pressing means may be a roller.
• the pressing means may be a conveyor.
• the pressing means may be a bearing.
• a groove may be formed on the second surface of the brittle substrate such that the pressing means is not in contact with the line facing the scribe line.
• the first holding means is moved along the scribe line in a state where the first holding means and the pressing means are opposed to each other via the brittle substrate.
• the method may further include the step of controlling the first holding means to do so.
• the step (b-2) may include the step of controlling the first holding means such that the first holding means rolls along the scribe line.
• the first holding means may be a roller.
• the first holding means may be a conveyor.
• the first holding means may be a bearing.
• a groove may be formed in the scribe line such that the first holding means is not in contact.
• the width of the groove formed in the first holding means may be wider than the width of the pressing means.
• the pressing means further includes a second holding means for holding the brittle substrate and a third holding means for holding the brittle substrate in the first direction along the scribing line, and the step ( b) (b-3) in a state where the second holding means holds the brittle substrate, the second holding means moves along the scribe line along the scribing line; Controlling the holding means, and the third holding means The method may further include the step of controlling the third holding means such that the third holding means moves on the two surfaces along the scribe line while holding the brittle substrate.
• the first holding means and the second holding means are predetermined. Controlling the second holding means to move at a speed, and controlling the third holding means so that the third holding means and the pressing means move at the predetermined speed. Good.
• the pressing means is moved in a first direction along the scribe line, and a fourth holding means and a fifth holding means for holding the brittle substrate are further moved from the pressing means in a direction opposite to the first direction. May be equipped.
• the step (a) includes the steps of: (a-1) irradiating the first surface of the brittle substrate with a laser beam; (a-2) the laser beam irradiating means of the first surface of the brittle substrate Cooling the vicinity of the portion irradiated with the laser beam.
• the step (a-2) is performed by a cooling unit, the cooling unit is a cooling nozzle, and the cooling nozzle is irradiated with the laser beam by spraying a refrigerant onto the first surface of the brittle substrate. The vicinity of the cut part may be cooled.
• the step (a-1) is executed by a laser beam irradiating means, and includes a step of receiving at least one of a laser beam irradiated to the laser beam irradiating means and a refrigerant blown by the cooling nozzle.
• the step of receiving at least one of the laser beam irradiated to the laser beam irradiation means and the refrigerant sprayed by the cooling nozzle is performed by a laser beam / refrigerant receiver, and the laser beam / refrigerant receiver is It may be configured to be movable independently of the pressing means.
• the cooling nozzle may be configured to be movable along the scribe line.
• the step (a) may further include the step of forming a kerf at the start position of the scribe line formation on the first surface of the brittle substrate.
• the step of forming the incision may be performed by a cutting cutter mechanism, and the cutting cutter mechanism may be configured to be movable integrally with the laser beam irradiation unit and the cooling unit.
• the step (a) may be performed by scribing line forming means, and the scribing line forming means may be a force cutter.
• the force cutter may be a disk-shaped force cutter wheel tip, and a blade may be formed on an outer peripheral edge of the force reel wheel tip.
• a plurality of recesses may be formed at predetermined intervals in the blade edge ridge line portion of the blade portion.
• the cutter may be configured to be movable independently of the pressing means.
• the step (b-1) may control the pressing means such that the pressing means moves along the scribe line.
• the step (a) further includes the step of forming the scribe line on the first surface while holding the first surface of the brittle substrate, and the step (b) faces the first surface.
• the method may further include the step of pressing the second surface of the brittle substrate.
• the brittle substrate is a bonded substrate obtained by bonding a substrate
• the scribing device is a first scribe line forming means for forming a first scribe line on a first surface of the bonded substrate, and the bonded substrate.
• a second scribe line forming means for forming a second scribe line on the second surface of the bonded substrate facing the first surface of the bonded substrate, and the step (b-1) comprises: And breaking the bonded substrate along the first scribe line formed on the first surface of the bonded substrate, thereby forming the second scribe line forming means.
• the step (b) is performed by a breaking device for breaking the brittle substrate along the scribing line, and the breaking device is configured to press a first bonded substrate pressing means for pressing a first surface of the bonded substrate.
• the step (b-1) includes the step of controlling the second bonded substrate pressing unit so that the second bonded substrate pressing unit rolls along the first scan line; And controlling the first bonded substrate pressing unit so that the bonded substrate pressing unit rolls along the second scribe line.
• the first bonded substrate pressing means and the second bonded substrate pressing means may be rollers.
• the pressing means may be a conveyor.
• the pressing means may be bearing.
• the second bonded substrate pressing means is not in contact with the line facing the first scribe line on the second surface of the bonded substrate.
• a groove portion is formed, and the pressing means for the first bonded substrate includes: pressing the first bonded substrate on a line facing the second scribe line on the first surface of the bonded substrate.
• a second groove may be formed such that the means are non-contacting.
• step (b) the first bonding is performed in a state where the first bonded substrate holding means and the second bonded substrate pressing means are opposed to each other via the bonded substrate.
• the step (b-2) controls the first bonded substrate holding unit so that the first bonded substrate holding unit rolls along the first spline line, and the second bonded substrate holding unit And controlling the second bonded substrate holding means so that it rolls along the second scribe line.
• the first bonded substrate holding means and the second bonded substrate holding means may be rollers.
• the first bonded substrate holding means and the second bonded substrate holding means may be conveyors.
• the first bonded substrate holding means and the second bonded substrate holding means may be bearings.
• the first bonded substrate holding unit may include the first scribing line and the first scribing line.
• a third groove portion is formed such that the bonded substrate holding means is not in contact with the second bonded substrate holding means, and the first bonded substrate holding means is not in contact with the second scribe line in the second bonded substrate holding means.
• the fourth groove may be formed to be
• the width of the third groove portion formed in the first bonded substrate holding means is wider than the width of the second bonded substrate holding means, and the fourth formed in the second bonded substrate holding means
• the width of the groove may be wider than the width of the first bonded substrate pressing means. .
• the first bonded substrate pressing unit and the second bonded substrate pressing unit move in a first direction along the first scribe line and the second scribe line, and hold the brittle substrate.
• the first bonding substrate holding means and the fourth bonding substrate holding means are further provided in the first direction from the first bonding substrate pressing means and the second bonding substrate pressing means, and the step (b) is (B-3) With the third bonded substrate holding means holding the bonded substrate, the third bonded substrate holding means moves along the scribing line along the scribing line.
• a fourth bonding step of controlling the substrate holding means may further comprise to move along connexion the 2 Menjo to.
• the step (b-3) includes the third bonded substrate holding means. And controlling the third bonded substrate holding unit such that the first bonded substrate holding unit and the first bonded substrate pressing unit move at a predetermined speed, and the fourth bonded substrate holding unit and the fourth bonded substrate holding unit.
• a step of controlling the fourth bonded substrate holding unit may be included so that the bonded substrate holding unit and the second bonded substrate pressing unit move at the predetermined speed.
• the first bonded substrate pressing means is a first method along the two scribe lines. Moving toward the first bonded substrate holding means for moving the second bonded substrate pressing unit along the first scribe line in the first direction, and holding the bonded substrate.
• the substrate holding means may be further provided in the direction opposite to the first direction from the first bonded substrate pressing means and the second bonded substrate pressing means.
• the first scribe line forming device is a first bonded substrate of the first bonded substrate.
• the second bonded substrate pressing unit is moved along the first scribe line while the second scribline forming unit forms the second scribe line on the second surface of the bonded substrate. Controlling the second bonding substrate pressing means, and moving the first bonding substrate pressing means along the second scribing line. The step of controlling the plate pressing means may be included.
• FIG. 1 is a perspective view showing a schematic configuration of a dividing apparatus 100 according to Embodiment 1 of the present invention.
• FIG. 2 is a front view showing the configuration of scribing unit 40 and breaking unit 30.
• FIG. 3 is a front view showing the configuration of the pressing mechanism.
• FIG. 4 is a cross-sectional view of a substrate holding roller.
• FIG. 5 is a cross-sectional view of the pressing mechanism.
• FIG. 5A is a perspective view of a pressing conveyor mechanism 32 ′, which is another example of the pressing roller mechanism 32.
• FIG. 7 is a diagram showing a state in which the plaque unit 30 and the scribe unit 40 are in a pair ⁇ ].
• FIG. 8 shows a state in which the flat side edges on both sides in the width direction of the substrate holding roller 45 a whose outer peripheral surface is recessed in a V-shape press-contact both sides of the scribe line formed on the glass substrate 90.
• FIG. 9 is a view showing another example of the dividing device 100. As shown in FIG.
• FIG. 10 is a schematic configuration view showing a break unit 30 and a scribe unit 40 according to a second embodiment of the present invention.
• the pressing roller 32a is sequentially pressed on both sides of the scribing line of the glass substrate 90 held by the substrate holding roller 45a, and the glass substrate 90 is divided along the scribing line. It is a figure which shows being done.
• FIG. 12 is a perspective view of a dividing device according to a third embodiment of the present invention.
• FIG. 13 is a front view showing a configuration of break units 30 and scribers 40 included in the dividing device according to Embodiment 3 of the present invention.
• the optical axis of the laser beam irradiation optical system 43 coincides with the cut, and the central part of the sliding direction of the laser beam ⁇ cooling water receiver 35 is the optical axis of the laser beam irradiation optical system 43. It is a figure which shows the state which corresponded.
• FIG. 15 is a front view showing a configuration of a break unit 30 and a scribe unit 40 provided in the dividing device according to Embodiment 4 of the present invention.
• FIG. 16 is a view showing a state in which the pressure roller 32a and the substrate holding roller 45a are opposed to each other with the glass substrate 90 interposed therebetween.
• FIG. 17 shows a break unit 3 provided in the dividing device according to the fifth embodiment of the present invention.
• FIG. 10 is a front view showing a configuration of 0 and scribe unit 40.
• FIG. 18 is a schematic configuration diagram of a dividing device according to a seventh embodiment.
• FIG. 19 is a diagram for explaining the operation of the dividing device according to the seventh embodiment.
• FIG. 20 is a flow chart showing a procedure for dividing a substrate according to an embodiment of the present invention.
• FIG. 21 is a front view showing a configuration of a break unit 30 and a scribe unit 40 provided in a dividing device according to an eighth embodiment of the present invention.
• FIG. 1 is a perspective view showing a schematic configuration of a dividing apparatus 100 according to Embodiment 1 of the present invention.
• the dividing device 100 is used, for example, to divide the glass substrate 90 into a predetermined size.
• the glass substrate 90 is a brittle material substrate used for a liquid crystal display panel.
• the dividing device 100 includes a base 18 and a pair of substrate support mechanisms 20 provided on the base 18.
• the glass substrates 90 to be divided are placed horizontally on the pair of substrate supporting mechanisms 20.
• a glass substrate 90 is supported between the pair of substrate support mechanisms 20 in an installed state.
• the dividing device 100 further includes a support table 21 and a plurality of transfer ports 22.
• the pair of substrate support mechanisms 20 includes a support table 21 disposed horizontally on a base 18 and a plurality of transport rollers 22 disposed rotatably on the upper portion of the support table 21. ing.
• a plurality of suction holes are formed in at least one of the pair of support tables 21.
• Suction means eg, vacuum pump, suction motor: illustrated . Suction the glass substrate 90 through the plurality of suction holes.
• the glass substrate 90 is adsorbed to the support tape 21 and the glass substrate 90 is fixed to at least one of the pair of support tables 21.
• the plurality of transport rollers 22 are arranged in a plurality of rows (two rows in FIG. 1). Each of the plurality of rows is parallel to one another. Each of the transport rollers in each row is disposed at a predetermined interval.
• the plurality of transport rollers 22 are raised and lowered by raising and lowering means (not shown). By elevating the plurality of conveyance rollers 22, the upper portions of the plurality of conveyance port rollers 22 can be protruded above the upper surface of the support table 21. When the upper portions of the plurality of transport rollers 22 project upward from the upper surface of the support table 21, the rotation of the plurality of transport rollers 22 causes the support table 21 of one of the substrate support mechanisms 20 to move away from the other.
• the glass substrate 90 can be conveyed horizontally to the support table 21 of the substrate support mechanism 20 of FIG. By lowering the plurality of transfer ports 22, the upper portion of the plurality of transfer ports 22 can be made lower than the upper surface of the support table 21.
• the dividing device 100 further includes a breaking unit 30, a scribing unit 40, an upper guide 12, a lower guide rail 13, a pair of columns 11 and a slider 14.
• the break unit 30 and the scribe unit 40 are used to divide the glass substrate 90, and are provided between a pair of substrate support mechanisms 20. Breaking unit 30 and scribing unit 40 are slidably attached to upper guide rail 12 and lower guide rail 13. The configurations of the break unit 30 and the scribe unit 40 will be described later in detail with reference to the drawings.
• the upper guide rail 12 and the lower guide rail 13 are disposed along the X direction orthogonal to the transport direction of the glass substrate 90 transported by the pair of substrate supporting mechanisms 20.
• Each end of the upper guide rail 12 is horizontally installed between the upper portions of a pair of columns 11 vertically provided on the base 18.
• the lower guide rail 1 Each end of 3 is horizontally installed between the lower portions of the pair of columns 11.
• the break unit 30 and the scribe unit 40 are configured to slide along the upper guide rail 12 and the lower guide rail 13 respectively by, for example, a linear motion mechanism.
• Each of the pair of columns 11 is provided on the upper surface of the base 18.
• Each of the pair of columns 11 is configured to be slidable in a direction orthogonal to the longitudinal direction of the upper guide rail 12 and the lower guide rail 13 by the slider 14.
• Each of the pair of columns 11 is integrally formed with the upper guide rail 12 and the lower guide rail 13. By sliding each of the pair of columns 11 supported by the slider 14, the upper guide rail 12 and the lower guide rail 13 slide in pairs.
• the dividing device 100 further includes a linear interpolation driving unit.
• the linear interpolation drive is provided below the longitudinally central portion of the lower guide rail 13 disposed between the lower portions of each of the pair of columns 11.
• the linear interpolation drive has a pole screw 15 along the Y direction orthogonal to the longitudinal direction of the lower guide rail 13.
• the pole screw 15 is rotated forward and reverse by the motor 16.
• a pole nut (not shown) is attached to the pole screw 15 at the longitudinal center of the lower guide rail 13 and is screwed to the hole screw 15.
• the pole screw 15 is rotated by the motor 16
• a force along the transport direction of the glass substrate 90 is applied to the lower guide rail 13.
• the pair of columns 11 slidably supported by the slider 14 is slid in the Y direction orthogonal to the longitudinal direction of the upper guide rails 12 and the lower guide rails 13.
• the dividing device 100 further includes a pair of positioning cameras 17.
• a pair of positioning cameras 17 are provided in the vicinity of the upper guide rail 12 at appropriate intervals in the longitudinal direction of the upper guide rail 12.
• a pair of positioning cameras 17 are provided on the glass substrate 90 when positioning the glass substrate 90. Take an image of the mark.
• FIG. 2 is a front view showing the configuration of scribing unit 40 and breaking unit 30. ⁇
• the scribing unit 40 includes a unit body 41, a cooling mechanism 42 for spraying the refrigerant upward, and a laser beam irradiation optical system 43 for irradiating the laser beam upward.
• the unit body 4 1 is slidably attached to the lower guide rail 13.
• a cooling mechanism 42 is provided substantially at the center of the unit main body 41, and a laser beam irradiation optical system 43 is provided on one side of the cooling mechanism 42.
• the laser beam irradiation optical system 43 irradiates a laser beam to the glass substrate 90 supported in a mounted state by the pair of substrate support mechanisms 20.
• a cutting mechanism for cutting 4 4 is provided on the side opposite to the cooling mechanism 4 2 with respect to the laser beam irradiation optical system 4 3.
• the cooling mechanism 42 sprays a refrigerant (for example, a coolant) in the vicinity of the portion irradiated with the laser beam to cool the portion irradiated with the laser beam.
• the cooling mechanism 42 has a nozzle portion 42a for blowing the refrigerant upward and an air cylinder 42b.
• the air cylinder 4 2 b is configured such that the nozzle portion 4 2 a is positioned between the injection position where the nozzle portion 4 2 a is close to the glass substrate 90 for injecting the refrigerant and the lower standby position away from the glass substrate 90. Go up and down.
• the coolant is not limited to the coolant as long as it can cool the portion irradiated with the laser beam.
• the refrigerant includes, for example, at least one of gas and liquid.
• the gas is, for example, compressed air, helium or argon.
• the liquid is, for example, water or liquid helium.
• the refrigerant is, for example, a combination of these gases and liquids.
• the glass substrate 90 is irradiated with a laser beam, and the vicinity of the portion irradiated with the laser beam By cooling the side, a vertical crack is formed to form a scribe line. Therefore, stress distortion does not remain at the edge of the cross section. As a result, when the fragmented brittle substrate is transported to an apparatus other than the dividing device 100 for the process after the glass substrate 90 is divided, the portion formed on the glass substrate 90 can be obtained. It is possible to prevent chipping of the cross section.
• the cutting knife mechanism 44 for cutting forms a cut which is a trigger for forming a vertical crack along the line to be scribed in the glass substrate 90 at the scribing start position of the glass substrate 90.
• the cutting cutter mechanism 44 includes a blade portion 4 4 a, a bracket 4 4 b, and an air cylinder 4 4 c for raising and lowering the blade portion 4 4 a.
• the blade portion 4 4 a is disposed along the sliding direction of the scribing unit 40.
• the blade portion 4 4 a is attached to the upper end portion of the bracket 4 4 b with the cutting edge directed upward.
• the blade portion 4 4 a is lifted and lowered by a lifting air cylinder 4 4 c provided on the unit body 4 1.
• the scribing unit 40 includes a substrate holding roller mechanism 45, a substrate holding roller mechanism 45, and a cooling mechanism on the side opposite to the laser beam irradiation optical system 43 with respect to the cooling mechanism 42.
• First auxiliary roller mechanism 4 6 provided between 2 and 4 and second auxiliary roller mechanism 4 provided on the opposite side of the first auxiliary roller mechanism 4 6 with respect to the substrate holding opening mechanism 4 5
• a mechanism 47 is provided.
• the substrate holding roller mechanism 45 and the second assisting roller mechanism 47 are attached to the unit body 41.
• the substrate holding roller mechanism 45 includes a roller holder, a substrate holding roller 45 a and a head portion 45 b.
• the substrate holding roller mechanism 45 has, for example, the same configuration as a pressure roller mechanism 32 described later.
• the substrate holding roller 4 5 a is rotatably attached to the roller holder.
• the axial direction of the substrate holding roller 4 5 a is the sliding direction of the scribing unit 40 (X Direction) is orthogonal to the Y direction.
• the configuration of the substrate holding roller 45 a will be described later in detail with reference to the drawing.
• the head section 45 b is freely driven up and down by a motor (not shown). ⁇
• the first auxiliary roller mechanism 46 includes a first auxiliary roller 4 6 a and an air cylinder 4 6 b for lifting and lowering.
• the first auxiliary roller 4 6 a is rotatably attached to the upper end of a lifting air cylinder 4 6 b attached to the unit body 4 1.
• the axial center direction of the first auxiliary roller 46 a is a Y3 direction orthogonal to the sliding direction (X direction) of the scribing unit 40.
• the second auxiliary roller mechanism 4 7 includes a second auxiliary roller 4 7 a and an air cylinder 4 7 b for raising and lowering.
• the second auxiliary roller 4 7 a is rotatably attached to the upper end of the air cylinder 4 7 b for raising and lowering.
• the axial direction of the second auxiliary port 4 7 a is the Y direction orthogonal to the slide direction (X direction) of the slide unit 40.
• the second auxiliary roller 4 7 a is disposed close to the substrate holding opening 45 5 a.
• the first auxiliary roller 4 6 a is spaced apart from the substrate holding roller 4 5 a at a distance wider than the distance between the substrate holding roller 4 5 a and the second auxiliary roller 4 7 a.
• the break unit 30 is provided on the upper guide rail 12.
• the break unit 30 includes a break main body 31, a pressing roller mechanism 32, a pressing side first auxiliary roller mechanism 33, and a pressing side second auxiliary roller mechanism 34.
• the break main body 31 is configured to be slidable with respect to the upper guide rail 12.
• the pressure roller mechanism 32, the pressure side first auxiliary roller mechanism 3 3 and the pressure side second auxiliary roller mechanism 34 are attached to the breaking unit main body 31.
• the pressing side first auxiliary roller mechanism 33 is provided on the side of the pressing roller mechanism 32.
• the pressing side second auxiliary roller mechanism 34 is provided on the side of the pressing roller mechanism 32 opposite to the pressing side first auxiliary roller mechanism 33.
• the pressing side first auxiliary opening mechanism 3 3 is disposed at a position facing the second auxiliary roller mechanism 4 7, and the pressing side second auxiliary roller mechanism 3 4 faces the first auxiliary roller mechanism 4 6 Placed in position.
• the configuration of the pressure roller mechanism 32 will be described later in detail with reference to the drawings.
• the pressing side first auxiliary roller mechanism 33 includes a pressing side first auxiliary roller 3 3 a and an air cylinder 3 3 b.
• the pressing side first auxiliary roller 3 3 a is rotatably attached to the lower end of the air cylinder 3 3.
• the pressure side first auxiliary roller 3 3 a faces the second auxiliary roller 4 7 a when breaking the glass substrate 90.
• the pressing side second auxiliary roller mechanism 34 includes a pressing side second auxiliary port 34a and an air cylinder 34b.
• the pressing side second auxiliary roller 3 4 a is rotatably attached to the lower end portion of the air cylinder 3 4.
• the pressing side second auxiliary roller 3 4 a faces the first auxiliary roller 4 6 a.
• Break unit 30 further includes a laser beam and cooling water receiver 35.
• the laser beam ⁇ cooling water receiver 35 is irradiated from the laser beam irradiation optical system 43 on the side opposite to the pressure roller mechanism 32 on the pressing side first auxiliary roller mechanism 33 It receives cooling water jetted from the laser beam and the cooling mechanism 42.
• the break unit 30 is slidably attached to the upper guide rail 12 and the scribing unit 40 is slidably attached to the lower guide rail 13.
• the configuration of the dividing device 100 is not limited to this.
• the break unit 30 may be slidably attached to the lower guide rail 13 and the scribing unit 40 may be slidably attached to the upper guide rail 12.
• the first holding means holds the first surface of the brittle substrate (glass substrate 90) and the pressing means (pressing mechanism)
• the pressing means can be moved along the scribe line formed on the first surface of the brittle substrate while pressing the second surface of the brittle substrate. Therefore, A pressing force can be applied to the second surface of the brittle substrate opposite to the first surface of the brittle substrate on which the scribe line is formed, along the scribing line. As a result, a bending moment can be applied to the brittle substrate to ensure that the vertical cracks extending from the scrly brine extend in the thickness direction of the substrate, and the brittle substrate can be divided.
• FIG. 3 is a front view showing the configuration of the pressing mechanism.
• FIG. 3 (a) is a front view showing the configuration of the pressure roller mechanism 32.
• the pressure roller mechanism 32 has a pressure roller 32a, an air cylinder 32b, a head portion 32d, a slide block 32e, a roller holder 32f, and a support shaft 32g And the bearing 3 2 h and the stopper 3 2 k.
• the slide block 32 e is rotatably attached to the head portion 32 d.
• the slide block 32 e is biased by an air cylinder 32 b provided in the head portion 32 d.
• a roller holder 32f is attached to the slide block 32e rotatably by a bearing 32h around a vertical axis.
• the roller holder 32f protrudes below the slide block 32e.
• a support shaft 32g is provided in a horizontal state.
• the pressure roller 32a is rotatably provided on the support shaft 32g. When breaking the glass substrate 90, the pressure roller 32a faces the substrate holding roller 45a.
• the stopper 3 2 k is provided on the head portion 3 2 d. The stopper 32 k detects the height of the head portion 32 d when the pressing roller 32 a contacts the glass substrate 90.
• the minute current is the stopper 32 2 k and the slide block.
• the stopper 32 2 k detects a change from the state in which the slide block 32 e is in contact with the stopper 3 2 k to the separated state.
• the stopper 1 3 2 k also functions as a stopper for the rotational movement of the slide block 3 2 e.
• the controller 32 calculates the position of the head portion 32 (1 in the ⁇ direction.
• the motor drives the motor to move the head 32 d up and down For example, when the pressure roller 32 a contacts the glass substrate 90, the direction perpendicular to the glass substrate surface of the head 32 d (Z The position (zero point position) of (direction) is determined, and the amount (distance) of pushing the pressure roller 32a against the glass substrate 90 is set based on the zero point position.
• the configuration of the substrate holding roller mechanism 45 is, for example, the same as that of the pressing roller mechanism 32 except that it is turned upside down.
• the pressing means for example, the pressing roller mechanism 3 2
• the pressing means can be easily moved along the scribing line.
• the pressing means is a roller
• the pressing means can be easily rolled along the scribing line.
• FIG. 3 (b) shows a pressing conveyor mechanism 32 ′ which is another example of the pressing roller mechanism 32.
• the pressing conveyor mechanism 32 is a pressing conveyor 32a, an air cylinder 32b, a head 322, a slide block 32e, a conveyor holder 32f ', and two supports Includes shaft 32 g, bearing 32 h, and stopper 32 k.
• the configuration of the pressure conveyor mechanism 32 is such that the pressure conveyor 32a, is substituted for the pressure roller 32a, and the conveyor holder 32f 'is included instead of the roller holder 32f.
• the structure of the roller mechanism 32 is the same as ⁇ 3 ⁇ 4.
• FIG. 3 (b) the same components as those shown in FIG. 3 (a) are denoted by the same reference numerals, and the description thereof is omitted.
• the pressing means is a conveyor, the pressing means can be easily rolled along the scribing line.
• Fig. 3 (c) shows another example of the pressure roller mechanism 32: a pressure bearing mechanism 3 2 '' is shown.
• the pressure bearing mechanism 32 is a pair of pressure bearings 32 X, an air cylinder 32 b, a head portion 32 d, a slide block 32 e, a holder 32 f,, and a support shaft 3 It contains 2 g, ', a bearing 32 h and a stopper 32 k.
• the configuration of the pressure bearing mechanism 32 ' is different from the pressure roller 32a except that the pressing means 32a' is included, and the holder 32f 'is included instead of the roller holder 32f.
• the configuration is the same as that of the pressure roller mechanism 32.
• FIG. 3 (c) the same components as those shown in FIG. 3 (a) are denoted by the same reference numerals, and the description thereof is omitted.
• the pressing means is a bearing, the pressing means can be easily rolled along the scribing line.
• FIG. 4 is a cross-sectional view of the holding mechanism.
• FIG. 4 (a) is a cross-sectional view of the substrate holding roller 45a.
• the outer peripheral surface of the substrate holding roller 45 a is formed in a V shape in which the central portion in the width direction is recessed except for the side edges on both sides in the width direction, and the side ridges on both sides are flat. It has become.
• the width direction dimension of the substrate holding roller 45 a is about 8 to 24 mm, and the substrate holding roller 45 a is about 4 to 12 mm from the scribing line on both sides of the scribing line across the scribing line. Hold away parts.
• the substrate holding roller 45 a is rotatably mounted on a support shaft disposed in a direction perpendicular to the sliding direction of the scribe unit 40 by a pair of bearings 45 d.
• the inner ring portion of each of the pair of bearings 45 d protrudes outward from each end face of the substrate holding roller 45 a.
• the substrate holding roller 45 a is made of polyacetal, polyurethane rubber (rubber hardness H s 20 ° to 90 °), or the like.
• Figure 4 (b) is a cross-sectional view of the first auxiliary port 46a.
• the outer peripheral surface of the first auxiliary roller 46a is flat.
• the first auxiliary roller 46a is rotatably mounted on a support shaft disposed in the direction perpendicular to the sliding direction (X direction) of the scribing unit 40 by the pair of bearings 46d. .
• the widthwise dimension of the first auxiliary roller 46a is substantially the same as the widthwise dimension of the substrate holding roller 45a.
• the inner ring portion of the pair of bearings 46 d protrudes outward from each end face of the first auxiliary roller 46 a. As a result, the support shaft can be easily attached to and detached from the roller holder.
• the second auxiliary roller 4 7 a, the pressing side first auxiliary roller 3 3 a, and the pressing side second auxiliary roller 3 4 a also have the same configuration as that of the first auxiliary roller 4 6 a, for example.
• the first holding means (holding mechanism) and the pressing means (pressing mechanism) facing each other via the brittle substrate, the first holding means is moved (rolled) to form one end face of the brittle substrate
• the brittle substrate is divided in order from the end face to the other end face. Therefore, the brittle substrate can be divided without forming a plurality of dividing start points. As a result, it is possible to form an uneven cross section on the brittle substrate.
• the first holding means is a roller, a conveyor, or a bearing, it can be easily rolled along the scribing line.
• FIG. 5 is a cross-sectional view of the pressing mechanism.
• FIG. 5 (a) is a cross-sectional view of the pressing roller 32a.
• the central portion in the width direction of the outer peripheral surface of the pressing roller 32 a protrudes in an arc shape.
• a groove 45 g having a U-shaped cross section is formed at the center in the width direction of the outer peripheral surface.
• the widthwise dimension of the groove portion 45 g is about 2 to 6 mm.
• the outer peripheral surface of the pressing roller 32a presses a portion which is about 1 to 3 mm away from the scan line.
• the groove portion 45 on the surface where the scribing line is not formed in the pressing roller 32a and the pressing roller 32a is not in contact with the line opposed to the scribing line. g is formed.
• the pressure roller 3 2 a has one bearing 3 2 x by the break unit Support shaft arranged in the direction (Y direction) orthogonal to the 30 sliding directions (X direction) 3
• the widthwise dimensions of the pressing roller 32a are the substrate holding roller 45a and the respective auxiliary rollers 46a, 47a,
• the inner ring portion of the bearing 32X also protrudes outward from each end face of the substrate holding roller 45a. Therefore, the support shaft 32 g can be easily attached to and detached from the roller holder 32 f (see FIG. 3).
• the pressing roller 32a is made of polyacetal, polyurethane rubber (rubber hardness Hs 20 ° to 90 °), or the like.
• the pressing roller 32 a faces the substrate holding roller 45 a.
• the center line in the width direction of the pressing roller 32a and the center line in the width direction of the substrate holding roller 45a coincide with each other.
• the pressing roller 32a and the substrate holding roller push the brittle substrate so that the regions on both sides of the scribe line formed on the brittle substrate are separated from each other. For this reason, the vertical cracks generated when forming the scribe line can be easily extended in the thickness direction of the brittle substrate.
• FIG. 5 (b) is a cross-sectional view of a pressing conveyor 32 a ′ which is another example of the pressing roller mechanism 32.
• the outer peripheral surface of the pressing conveyor 32 a ′ is flat, which corresponds to the compander shown in FIG. 5A (b).
• a pair of bearings 32 X are supported in the conveyor holder by two support shafts 32 g '(see Fig. 3 (b)).
• the pressing conveyor 32 a ′ is provided so as to be able to move circumferentially along the slide direction (X direction) of the break unit 30.
• FIG. 5C is a cross-sectional view of a pressure bearing mechanism 3 2 ′ ′ which is another example of the pressure roller mechanism 32.
• the pressure bearing mechanism 32 'includes a support shaft 32g,' and a pressing means 32a '.
• the support shaft 32g '' has elasticity.
• the support shaft 32 g ′ includes, for example, at least one of resin, plastic and rubber.
• the outer diameter of both side portions of the support shaft 32g ' is shorter than the outer diameter of the central portion of the support shaft 32g''.
• the pressing means 3 2 a includes two pressing bearings 3 2 X. Each of the two pressure bearings 3 2 X is press-inserted into each of the two side portions of the support shaft 3 2 g ′ ′.
• the support shaft 3 2 g '' has inertia.
• the pressing bearing mechanism 32 ' can also be used as a first holding means (holding mechanism).
• the pressure bearing mechanism 3 2 ′ ′ is used as the first holding means (holding mechanism)
• the two pressure bearings 3 2 X function as two holding bearings 3 2 X.
• the distance between the pair of holding bearings 32 X is wider than the pressing means, the brittle substrate can be separated more easily. This is because the pressing means sinks into the holding means and the pressing portion bends.
• FIG. 5 A shows the holding conveyor 4 5 a '.
• Holding conveyor 4 5 a ′ functions as a conveyor as a first holding means (holding mechanism).
• the holding conveyor 4 5 a ′ is provided so as to be able to move in a circular direction along the sliding direction (X direction) of the scribing unit 40.
• a groove 45 g ′ is formed in the scribing line so that the holding conveyor 45 a ′ does not contact.
• the holding conveyer 45 a ′ can push the areas on both sides so that the areas on both sides of the scribe line formed on the brittle substrate are separated from each other. As a result, the vertical cracks formed at the time of scribing line formation can be easily extended in the thickness direction of the brittle substrate.
• FIG. 5A (b) shows another example of the pressure roller mechanism 32.
• a pressure conveyor mechanism 3 2 It is a perspective view of a '.
• the outer periphery of the pressing conveyor mechanism 32 a ′ is flat.
• the pressing conveyor mechanism 32 a can also be used as a holding conveyor 45 a,. ⁇
• FIG. 5A (c) is a perspective view of a pressing conveyor mechanism 32 a ′ which is another example of the pressing roller mechanism 32.
• the pressing conveyor mechanism 32 a ′ is provided so as to be capable of circumferentially moving along the sliding direction (X direction) of the scribing unit 40.
• the pressing conveyor mechanism 32a ' has a groove 45 g' 'formed on the surface on which the scribing line is not formed and in which the pressing conveyor mechanism 32a' is not in contact with the line opposed to the spline. ing.
• the pressing conveyor mechanism 32 a ′ can push the areas on both sides so that the areas on both sides of the scribe line formed on the brittle substrate are separated from each other. As a result, the vertical cracks formed at the time of scribing line formation can be easily extended in the thickness direction of the brittle substrate.
• the first holding means In the case where the groove 45 g ′ of the groove is wider than the pressing means, the brittle substrate can be separated more easily. This is because the pressing means sinks into the first holding means and the pressing portion bends.
• FIG. 9 is a perspective view showing a schematic configuration of another example of the dividing device 100.
• FIG. 9 is a perspective view showing a schematic configuration of another example of the dividing device 100.
• the dividing device 30 is slidably attached to the lower guide rail 13, and the scribing unit 40 is slidably attached to the upper guide rail 12.
• the first surface of the brittle substrate (the glass substrate 90) is held and the first surface of the brittle substrate is opposed.
• the pressure on the two surfaces can be moved along the spline formed on the first surface of the brittle substrate.
• the pressing force can be applied to the second surface of the brittle substrate opposed to the first surface of the brittle substrate while moving the pressing force along the formed scribe line, the vertical crack extended from the scribe line is ensured
• the scribing line can reliably divide the formed glass substrate 90 along the scribing line.
• the glass substrate 90 can be divided continuously to the formation of scribe lines, the working efficiency is improved.
• FIG. 20 shows a procedure for dividing a substrate according to an embodiment of the present invention.
• the procedure for dividing the glass substrate 90 by the dividing device 100 includes a scribing step and a breaking step.
• the initial setting process is performed as needed.
• Step 5 01 The initial setting process is performed.
• the initial setting step is a step of setting an initial state of the substrate cutting apparatus 100 before starting the scribing step.
• step 520 the process proceeds to step 520.
• Step 520 A scribing step is performed.
• the scribing step is a step of forming a scribing line on the glass substrate 90. Details of the scribing process will be described later.
• step 500 When the scribing process is completed, the process proceeds to step 500.
• Step 500 A break process is performed. Break process, scriber This is a step of breaking the glass substrate 90 having the in-formed along the scribe line. Details of the breaking process will be described later.
• step 501 The initial setting step (step 501) and the scribing step (step 502) according to the embodiment of the present invention will be described below.
• the glass substrate 90 is transported onto the support table 21 included in one of the pair of substrate support mechanisms 20.
• the plurality of transfer rollers 22 are raised, and the glass substrate 90 is supported by the plurality of transfer ports 22. By rotating the plurality of transfer rollers 22, the glass substrate 90 is moved toward the other support table 21 of the pair of substrate support mechanisms 20.
• the glass substrate 90 is transported so as to be bridged between the pair of substrate support mechanisms 20.
• the position of the predetermined dividing line of the glass substrate 90 is positioned in the vicinity of the scribing line formed by the scribing unit 40 between the pair of substrate supporting mechanisms 20, the plurality of transfer ports 1 2 2 Falls.
• the plurality of suction holes formed in the pair of substrate support mechanisms 20 sucks the glass substrate 90, and the glass substrate 90 is fixed to the pair of support tables 21.
• the break unit 30 is slid from the standby position on one end (+ X side) of the upper guide rail 12 to the side edge on the X side of the glass substrate 90, and the pressure port 3 2a faces the scribing start position of the glass substrate 90 (see FIG. 2). Also, the end of the lower guide rail 1 3 (one X side) waits at the end of the lower guide rail 1 3 It is slid from the position to the scribing start position at the side edge of the ⁇ X side of the glass substrate 90.
• the cutting mechanism for cutting 44 is positioned to the side of the scribing start position of the glass substrate 90.
• the pressing roller 32a is lowered by a lifting motor (not shown) included in the pressing roller mechanism and pressed against the upper surface of the glass substrate 90, and the cutting cutter mechanism 44 is for lifting. Raised by air cylinder 4 4 b.
• the break unit 30 and the scribing unit 40 synchronously scribe in order to form a cut at the scribing start position of the glass substrate 90 by the blade portion 4 4 a included in the cutting cutter mechanism 4 4. It is slid in the direction (+ X direction) for a predetermined distance. As a result, a cut is formed at the scribing start position of the glass substrate 90 held by the pressing roller 32a by the blade portion 4 4a of the cutting mechanism 4 4..
• the break unit 30 is slid by a predetermined distance in the scribing direction (+ X direction), and the central portion of the sliding direction of the laser beam ⁇ cooling water receiving portion 35 is the optical system of the laser beam irradiation optical system 4 3 Aligned to the axis.
• the nozzle portion 4 2 a of the cooling mechanism 4 2 is moved to the upper position where the cooling water is sprayed by an elevating air cylinder 4 2 b.
• Fig. 6 the central part of the sliding direction of the laser beam and cooling water receiving part 35 coincides with the optical axis of the laser beam irradiation optical system 43, and the nozzle part 4 2a of the cooling mechanism 4 2 is raised and lowered. It is shown that it has been moved to the upper position of the coolant spray position by the air cylinder 42 b.
• the breaking unit 30 and the scribing unit 40 are synchronously slid in the scribing direction (+ X direction), and the cooling water from the nozzle portion 4 2 a
• the laser beam is emitted upward from the laser beam irradiation optical system 43 and sprayed upward.
• the laser beam is irradiated along the planned dividing line (planned line) of the glass substrate 90, and the vicinity of the part irradiated with the laser beam is cooled by the cooling water. Therefore, vertical cracks are continuously formed along the planned dividing position of the glass substrate 90 continuously from the cut provided at the scribing start position of the glass substrate 90.
• the linear interpolation drive unit is driven. That is, in order to correspond to the inclination of the glass substrate 90, while sliding the break unit 30 and slide unit 40, the upper guide in the direction (Y direction) orthogonal to the slide direction (+ X direction) The rails 12 and the lower guide rails 13 are slid, and the laser beam is irradiated along the dividing lines of the glass substrate 90.
• break break 30 and scribing unit 40 are slid from one side edge of glass substrate 90 to the other side edge, the glass substrate 90 continues along the dividing line (planned scribing line) of glass substrate 90. Vertical cracks are formed, and scribe lines are formed from one side edge of the glass substrate 90 to the other side edge. .
• step 501 The initial setting step (step 501) and the scribing step (step 502) according to the embodiment of the present invention have been described above.
• the breaking step is performed, for example, on the glass substrate 90 in which the scribing line is formed by the scribing step.
• step 500 The details of the breaking step (step 500) according to the embodiment of the present invention will be described below.
• the laser irradiation optical system Once the scribe line is formed on the glass substrate 90, the laser irradiation optical system
• the upper break unit 30 is slid in the direction (one X direction) opposite to the scribing direction; the pressing roller 32a faces the X-side end of the formed scribe line Be done. Further, the lower scribing unit 40 is slid so that the substrate holding roller 45 a is opposed to the X-side end of the scribing line.
• FIG. 7 shows a state in which the play product 30 and the scribe product 40 are facing each other.
• the first auxiliary roller 46a is raised by the elevating air cylinder 46b
• the second auxiliary roller 47a is raised by the elevating air cylinder 47b.
• the second auxiliary roller 4 7 a abuts on the lower surface of the glass substrate 90.
• the substrate holding roller 45a is raised by a motor (not shown) that raises and lowers the head portion 45b.
• the substrate holding roller 45 a contacts the lower surface of the glass substrate 90 at a predetermined pressure.
• the pressing side first auxiliary roller 33a is in contact with the upper surface portion of the glass substrate 90 facing the position where the pressing side first auxiliary roller 33a is lowered and the second auxiliary roller 47a is in contact.
• the pressing roller 32a is lowered by a motor (not shown) for moving the head portion 32d up and down, and the pressing roller 32a is opposed to the substrate holding roller 45a of the glass substrate 90.
• the upper surface portion is pressure-welded with a predetermined pressure.
• the pressing side second auxiliary roller 34a moves close to the end face of the glass substrate 90 on the-X side and then descends, and a glass substrate corresponding to the position where the first auxiliary roller 46a contacts. Touch the top surface of 0.
• FIG. 8 shows a scribing line formed on the glass substrate 90 with flat side edges on both sides in the width direction of the pressing roller 32a whose outer peripheral surface is recessed in a V shape and the substrate holding roller 45a. The state which pressure-welded both sides is shown.
• the central portion faces the scribe line S formed on the glass substrate 90.
• the groove 45 g formed in the substrate holding roller 45 a is formed such that the substrate holding port 45 a is not in contact with the scribing line S.
• the groove portion formed in the pressing roller 32a is formed such that the pressing roller 32a is not in contact with the line facing the scribe line S.
• the widthwise dimension of the pressure port 32a is smaller than the widthwise dimension of the substrate holding roller 45a (for example, the widthwise dimension of the pressure roller 32a is equal to the widthwise direction of the substrate holding roller 45a Since the dimension is about 1 Z 2), the upper surface of the glass substrate 90 close to the scribe line S, not the lower surface portion of the glass substrate 90 held at the side edges on both sides of the substrate holding roller 45 a.
• the pressure roller 3 2 a is in pressure contact with the portion.
• the pressure roller 32a is set to reach a lower position of, for example, 0.3 mm or more from the upper surface of the glass substrate 90.
• the glass substrate 90 is bent so as to protrude downward around the scribe line S, and the vertical crack of the end portion on the X side of the scribe line S formed on the lower surface of the glass substrate 90 is It extends in the thickness direction of the substrate and reaches the upper surface of the glass substrate 90. As a result, the glass substrate 90 is broken.
• a groove is formed on the second surface of the glass substrate 90 on the second surface of the glass substrate 90 so that the pressure roller 32a is not in contact with the pressure roller 32a. If the glass substrate 90 is divided along the scribe line, the pressure roller 32 may be pressed so that the pressure roller 32a does not contact the line on the second surface of the brittle substrate facing the scribe line. a can press both sides of the line on the second surface of the glass substrate 90. Therefore, it is possible to prevent the occurrence of chipping of the separated section during parting processing.
• a groove is formed in the scribing line so that the substrate holding roller 4 5 a is not in contact with the scribing line, so the glass substrate 90 is divided along the scribing line.
• the board holding roller 45a does not contact the scribing line, the board holding roller 45a holds both sides of the scribing line. It is possible. Therefore, it is possible to prevent the occurrence of chipping of the divided section during parting processing.
• the width of the groove formed in the substrate holding roller 45a is wider than the width of the pressure roller 32a, a part of the pressure roller 32a is in the groove of the substrate holding roller 45a. Since the glass substrate 90 easily intrudes and bends, the glass substrate 90 can be reliably cut along the scribing line.
• the pressure roller 32a is slightly raised. As a result, the pressing of the pressing roller 32a against the glass substrate 90 is slightly reduced. In this case, the pressure roller 32a is set to reach a lower position within 0.3 mm from the upper surface of the glass substrate 90.
• break unit 30 and scribe unit 40 are synchronously slid in the scribe direction (+ X side).
• the pressure roller 32a is pressed against both sides of the scribe line S held by the substrate holding roller 45a, and the substrate holding roller 45a and the pressure roller 32a are respectively glass substrates
• the lower surface and the upper surface of 90 are rolled, and the glass substrate 90 is broken along the scribe line S continuously from the position of the end on the X side of the scribe line S.
• the pressing side first auxiliary roller 3 3 a and the second auxiliary roller 4 7 a positioned forward of the pressing roller 32 a in the sliding direction are for pressing and holding the area in front of the scribe line to be divided from above and below
• the pressing side first auxiliary roller 3 3 a and the second auxiliary roller 4 7 a positioned forward of the pressing roller 32 a in the sliding direction are for pressing and holding the area in front of the scribe line to be divided from above and below
• the glass substrate 90 divided along the scribe line S during the breakage of the glass substrate 90 is a first auxiliary roller 46a disposed at a predetermined distance from the substrate holding roller 45a.
• Chipping of the broken glass substrate 90 is prevented, and unnecessary force does not act on the pre-deposited portion, so chipping or cracking that causes defects in the product after the glass substrate 90 is broken. There is no fear of occurrence of etc.
• the breaking unit 30 and the scribing unit 40 are slid respectively, and moved to the standby position at the end of the upper guide rail 12 and the lower guide rail 13.
• step 500 The details of the breaking step (step 500) according to the embodiment of the present invention have been described above.
• the dividing method of the present invention it is possible to reliably divide the glass substrate 90 on which the scribe line is formed along the scribe line. Moreover, since the glass substrate 90 can be divided continuously to the formation of the scribe line, the working efficiency is improved. Furthermore, when dividing the glass substrate 90, there is no possibility that an unnecessary force will act on the undivided scribline S, and the divided glass substrate 90 is not bent. There is no risk of chipping on the edge of the glass substrate that has been cut.
• FIG. 10 is a schematic configuration view showing a break unit 30 and a scribe unit 40 according to a second embodiment of the present invention.
• the laser beam irradiation optical system 43 and the cooling mechanism 42 provided in the first embodiment of the present invention are not disposed in the scribing unit 40.
• a scribing cutter mechanism 4 8 is provided.
• a cutter wheel tip 4 8 a is rotatably provided at an upper end portion of a cutter head 4 8 b attached to the scribing unit main body 41 so as to be able to move up and down.
• the outer peripheral ridge of the wheel-shaped cutter disclosed in Japanese Patent Laid-Open Publication No. Hei 9_1 8 8 5 3 4 4 is provided with a recess at a predetermined interval.
• An arrangement is preferably used, but may be a conventional cutter wheel tip.
• vibration associated with peripheral expansion and contraction of the vibrating actuator is applied to the cutter pressed against the surface of the brittle material substrate to cycle the pressing force (load) applied to the cutter. It may be changed in such a way that the brittle material substrate is impacted by impact. As an example, it is disclosed in Japanese Patent No. 29 5 4 5 6 6 and will not be described in detail here.
• Head 4 8 b to cutter is summer as raised and lowered by a ball screw mechanism having a motor evening 4 8 m.
• the scribing line forming means is a force cutter
• the scribing line can be stably formed because the range of selection of the conditions for forming the scribing line is wide.
• a cutter is a disc-shaped cutter wheel tip and a blade portion is formed on the outer peripheral edge of the katsu-Yu wheel tip
• the cutter wheel tip is pressed and rolled on a brittle substrate. Since the scribe line can be formed, the speed (scribe formation speed) for forming the scribe line can be increased.
• portions other than the formed plurality of recesses become a plurality of protrusions.
• Form scribe line since the plurality of projections apply impact to the first surface of the brittle substrate, they can form vertical cracks extending to about 90% of the thickness of the brittle substrate. As a result, the brittle substrate can be reliably divided by going through the breaking process.
• the brittle substrate on which the brine is formed is divided by making the pressing means follow the cutter when forming the scan line. Can. Further, since the second surface of the brittle substrate can be pressed by the pressing means while forming the scribe line on the first surface of the brittle substrate, the scribing step and the breaking step can be carried out almost simultaneously. Therefore, the division process time can be shortened.
• the first auxiliary roller mechanism 46 is provided in the scribing unit main body 41 adjacent to the scribing cutter mechanism 48 in the same manner as the scribing unit 40 of the dividing device according to the first embodiment. Adjacent to the auxiliary roller mechanism 46, a substrate holding roller mechanism 45 and a second auxiliary roller mechanism 47 are provided. In the cutting device according to the embodiment of the present invention, the substrate holding roller mechanism 45 is raised and lowered by a pole screw mechanism having a distance of 45 m. The other configuration is essentially the same as the configuration of the scribe unit 40 described above.
• the break unit 30 includes the pressure roller mechanism 32, the pressure side first auxiliary roller mechanism 33, and the pressure side mechanism 3 in the break unit main body 31.
• An auxiliary roller mechanism 34 is provided, and the pressing roller mechanism 32 is moved up and down by a pole screw mechanism having a motor 32 m. It is similar.
• the scribe line formation start position (glass substrate 9 Position the cutter wheel tip 4 8 a at the side edge of 0 on the + X side and press it against the cutter 1 wheel tip 4 8 a Position roller 3 2 a.
• Slide Pleek Unit 30 and Scribe Unit 40 synchronously in the scribing direction (one X direction), and cut the cutter wheel chip 4 8 a along the planned dividing line (planned scribing line) on the glass substrate 90. Press and roll. Thereby, a scribe line is formed along the line to be divided (line to be scribed).
• the break unit 3 0 and the scribe unit 40 are synchronously slid in the direction (+ X direction) opposite to the scribing direction by the cutter wheel tip 4 8 a.
• the pressing roller 32a is sequentially pressed on both sides of the scribing line of the glass substrate 90 held by the substrate holding roller 45a, and the glass substrate 90 is divided along the scribing line. Indicates that it will be done. 'With the second auxiliary roller mechanism 4 7 holding the glass substrate 90, the second auxiliary aperture mechanism 4 7 moves on the surface along the scribe line, and the pressing side first auxiliary aperture — While the roller mechanism 33 is holding the glass substrate 90, the pressing side first auxiliary roller mechanism 33 moves on the surface along the scribing line
• the holding means can be moved along the scribe line in the state where the holding means holds the undivided area of the area where the scribe line is formed, the pressing means is not necessary for the area being pressed. It is possible to prevent the application of As a result, it is possible to prevent the partial cross section formed on the glass substrate 90 from being chipped off. Since the substrate holding roller mechanism 45, the second auxiliary roller mechanism 47, the first auxiliary roller mechanism 46 and the pressing means are moved at the same speed, the second auxiliary roller mechanism 47 and the first auxiliary roller mechanism 46 can securely hold the glass substrate 90.
• the first auxiliary roller mechanism 46 moves on the surface along the scribe line while the first auxiliary roller mechanism 46 holds the divided area of the area where the scribe line is formed, and The first holding means can be moved along the scribing line while the pressure side second auxiliary roller mechanism 34 holds the glass substrate 90. This can prevent the application of an unnecessary force to the area being pressed by the substrate holding roller mechanism 45. As a result, it is possible to prevent the partial cross section formed on the brittle substrate from being chipped off. ⁇
• FIG. 12 is a perspective view of a dividing device according to a third embodiment of the present invention.
• FIG. 13 is a front view showing a configuration of a break unit 30 and a scribe unit 40 included in the dividing device according to Embodiment 3 of the present invention.
• the break-down unit 30 included in the dividing device according to the third embodiment of the present invention includes a first upper unit 30a and a second upper unit 30b.
• the first upper unit 30a includes the pressing roller mechanism 32 of the breaking unit 30 according to the first embodiment, the pressing side first auxiliary opening roller mechanism 33, and the pressing side second auxiliary roller mechanism 34.
• the second upper unit 30 b includes a laser pipe and a cooling water receiver 35. Since the laser beam / cooling water receiver 35 can prevent the diffusion of at least one of the laser beam and the refrigerant, the safety of the dividing device 100 can be enhanced.
• the first upper unit 3. 0 a and the second upper unit 3 0 b are independently slid along the upper guide rail 12 by the linear motor mechanism.
• the scribe unit 40 included in the dividing device according to the third embodiment of the present invention includes a first lower unit 4 0 a and a second lower unit 4 0 b.
• the first lower unit 40a integrally includes the first auxiliary roller mechanism 46 of the scribing unit 40 according to the first embodiment, the substrate holding roller mechanism 45, and the second auxiliary roller mechanism 47.
• the second lower unit 40b integrally includes a cutting knife mechanism 44 of the scribe unit 40 according to the first embodiment, a laser beam irradiation optical system 43, and a cooling mechanism 42.
• the first lower unit 40a and the second lower unit 40b are independently slid along the lower guide rail 13 by the linear motor mechanism.
• breaking unit 30 of the dividing device according to the third embodiment of the present invention breaking unit 30 of the dividing device according to the third embodiment of the present invention.
• an apparatus According to the knit 40, an apparatus according to the processing conditions of various brittle material substrates Operation (scribe operation and break operation) can be selected.
• the other configuration is the same as that of the first embodiment.
• the first upper unit 30a and the second lower unit 4O b are respectively It is slid from the standby position, moves on the side edge of the glass substrate 90 on the ⁇ X side, and the pressing roller 32a is directed to the end of the glass substrate 90, and a cutting force setting mechanism 4 is positioned to the side of the scribing line formation start position on the end portion on the X side of the glass substrate 90.
• the pressure roller mechanism 32 descends, and the pressure roller 32a contacts the upper surface of the glass substrate 90 at a predetermined pressure.
• the cutter mechanism for cutting 4 4 is lifted by the lifting and lowering air cylinder 4 4 c.
• the first upper unit 30a and the second lower unit 40 are used to form a cut in the scribing line formation start position of the glass substrate 90 by the blade portion 4 4a of the cutting knife mechanism 4 4.
• the second lower unit 40 b is slid, and the laser beam irradiation optical system 4
• the second lower unit 40 b is positioned so that the optical axis of 3 coincides with the incision.
• the first upper part 30a is slid to the standby position
• the second upper part 30b is slid from the standby position
• the central portion in the sliding direction of the laser beam ⁇ cooling water receiving part 35 is The laser beam irradiation optical system 43 is aligned with the optical axis.
• the cooling nozzle is configured to be movable along the scribing line, the cooling nozzle can be moved along the scribing line, so that a brittle substrate can be obtained.
• the scribing conditions can be set according to the material of
• the cutting cutter mechanism By the cutting cutter mechanism, it is possible to reliably form a cut at the start position of the scribe line formation on the glass substrate 90.
• the cutting mechanism is configured to be movable integrally with the laser beam irradiation means and the cooling means, the incision formed at the scribing line formation start position, the laser beam irradiation area, and the cooling area are aligned in a straight line. Since the lines can be arranged, the scribe lines can be formed precisely along the planned scribe line formation lines.
• Fig. 13 shows that the optical axis of the laser beam irradiation optical system 43 coincides with the cut, and the central part of the sliding direction of the laser beam ⁇ cooling water receiver 35 is the optical axis of the laser beam irradiation optical system 43. Indicates a match.
• the second upper unit 30b and the second lower unit 40b are synchronously moved in the scribing direction (+ X direction), and the scribing line is formed by the laser beam irradiation and the cooling water injection. Be done.
• the first upper unit 30b and the second lower unit 40b are slid to the standby position on the side of the scribing start position, and the first upper unit 30a and the first lower unit 30b are slid.
• the unit 40a is slid in the same direction, and at the scribing start position, the pressure port 32a is pressed against both sides of the scribing line, and the substrate holding roller 45a is on the lower surface of the glass substrate 90. It is pressed.
• only the second upper unit 30a and the first lower unit 40a are synchronously slid in the same direction (+ X direction) as the scribing direction, as shown in FIG.
• the glass substrate 90 is pressed by the pressure roller 32a of the first upper unit 30a and the substrate holding roller 45a of the lower first unit 40a. , Break along the scribe line.
• FIG. 15 shows a break unit 3 provided in the dividing device according to the fourth embodiment of the present invention.
• FIG. 10 is a front view showing the configuration of 0 and scribe unit 40.
• the scribing unit 40 of the dividing device according to the fourth embodiment includes a first lower unit 4 0 a and a second lower unit 4 0 b.
• the first lower unit 40a includes the first auxiliary roller mechanism 46, the substrate holding roller mechanism 45 and the second auxiliary roller mechanism 47 of the scribing unit 40 according to the second embodiment.
• the second lower unit 40b includes a scribing hook mechanism 48 separated from the first lower unit 40a.
• the first lower unit 40a and the second lower unit 40b can respectively slide independently along the lower guide rail 13 by linear mechanisms.
• the dividing device of the fourth embodiment of the present invention it is possible to select the operation of the device (the scribing operation and the breaking operation) meeting the processing conditions of various brittle material substrates.
• the other configuration is the same as that of the second embodiment.
• the second lower unit 40b when the scribe line is formed on the glass substrate 90, first, the second lower unit 40b is at an end of one of the lower guide rails 13 (on the ⁇ X side). From the standby position, it is slid to the scribe line formation start position of the side edge of the + X side of the glass substrate 90, and the force scribing wheel tip 4 8a of the scribing cutter 4 8 a is the scribe line formation start position Face the Fragment 30 is similarly slid to position the pressure roller 32a of breakbreak 30 so as to face cutter wheel tip 48a (see FIG. 15).
• slide break unit 30 and scribe unit 40 synchronously in the scribing direction (_ X direction), and press the pressure roller and cutter wheel tip 4 8 a along the line to be divided (line to be scribed). Press and roll the upper and lower surfaces of the glass substrate respectively. As a result, scribe lines are formed on the glass substrate 90 along the lines to be divided (lines to be scribed).
• the second lower unit 40 b is scanned in the same direction (one X direction) as the scribing direction. It is ridden and positioned at the standby position on the side of the glass substrate 90.
• FIG. 16 shows a state in which the pressure roller 32a and the substrate holding roller 45a are opposed to each other with the glass substrate 90 interposed therebetween.
• the pressure roller 32a and the substrate holding roller 45a are brought into contact with the glass substrate 90, and the pressure side first auxiliary roller 33a and the second auxiliary roller 4 7a are respectively glass substrate 90.
• the first auxiliary roller 4 6a is raised.
• the break unit 30 and the first lower unit 40 a are synchronously synchronized in the direction opposite to the scribing direction by the cutter wheel tip 4 8 a (+ X direction).
• the pressure side second auxiliary roller 3 4 a is moved to the vicinity of the end face portion on the ⁇ X side of the glass substrate 90, and then descends to contact the glass substrate 90.
• the break unit 30 and the first lower unit 40 a are held by the substrate holding roller 45 a by being slid over the entire area of the scribe line.
• the pressure roller 3 2 a is sequentially pressed on both sides of the scribe line of the glass substrate 90 to be in rolling contact, and the glass substrate 90 is divided along the scribe line.
• FIG. 17 is a front view showing a configuration of a break unit 30 and a scribe unit 40 provided in the dividing device according to the fifth embodiment of the present invention.
• the nozzle portion 4 2 a of the cooling mechanism 4 2 of the scribe ring 40 according to the first embodiment is configured to be slidable in the slide direction of the scribe ring 40 (FIG. 17). See).
• the other configuration is the same as the disconnecting device of the first embodiment.
• the pressing roller 32a of the breaking unit 30 when forming the scribe line, is pressed against the upper surface of the glass substrate 90 (see FIG. 17). Therefore, the portion where the glass substrate 90 scribe line is formed is bent downward.
• the nozzle portion 4 2 a of the scribing unit 40 is slid so that the cooling water is ejected following the portion bent by the pressure of the pressure roller 3 2 a.
• the cooling water is sprayed to the vicinity of the portion irradiated with the laser beam, the portion to which the cooling water is sprayed is bent downward, whereby the glass substrate is irradiated by the irradiation of the laser beam and the spraying of the cooling water.
• the vertical cracks formed from the lower surface of the lower surface extend upward to reach the vicinity of the upper surface of the glass substrate 90.
• the glass substrate 90 is divided. .
• the glass substrate is subjected to the breaking step using the roller of the present application. 0 is definitely cut off.
• the pressing roller 3 2 a of the breaking unit 30 is used as the glass substrate 90.
• the pressing roller 3 2 a of the breaking unit 30 is used as the glass substrate 90.
• the pressure roller 3 2 a or the pressure roller 3 2 a provided on the break 30 when forming the scribe line by the irradiation of the laser beam and the spraying of the cooling water, the pressure roller 3 2 a or the pressure roller 3 2 a provided on the break 30.
• the pressure side auxiliary roller 3 3 a may be brought into pressure contact with the glass substrate 90 to bend the glass substrate downward.
• FIG. 18 is a schematic configuration diagram of a dividing device according to a seventh embodiment.
• the dividing device of the seventh embodiment is used when dividing a bonded glass substrate 91 in which a pair of glass substrates 90 are bonded.
• the dividing device includes: an upper guide rail 12; a first upper part: a knit 51; a second upper unit 52; a third upper unit 53; a lower guide rail 13; The lower unit 61, the second lower unit 62, and the third lower unit 63 are included.
• the first upper unit 51, the second upper unit 52, and the third upper unit 53 are attached to the upper guide rail 12 so that they can slide independently.
• the first lower unit 61, the second lower unit 62 and the third lower unit 63 are attached to the lower guide rails 13 so that they can slide independently.
• the first upper unit 51 includes a pressure roller mechanism 51a, a first auxiliary roller mechanism 51b, a support plate roller mechanism 51c, and a second auxiliary roller mechanism 51d.
• the pressure roller mechanism 5 1 a is configured in the same manner as the pressure roller mechanism 32 of the first upper unit 3 0 a of the third embodiment
• the first auxiliary roller mechanism 51 b is the first of the third embodiment of the third embodiment. It is configured in the same manner as the pressing side first auxiliary roller mechanism 33 of the upper unit 3 0 a.
• the substrate holding roller mechanism 51 c is provided between the pressing roller mechanism 51 a and the first auxiliary opening mechanism 51 b.
• the substrate holding roller mechanism 51 c is configured in the same manner as the substrate holding roller mechanism 45 of the third embodiment.
• a second auxiliary roller mechanism 51 d is provided on the side opposite to the substrate holding port-roller mechanism 51 c with respect to the pressing roller mechanism 51 a.
• the second auxiliary roller mechanism 51 d is configured in the same manner as the first auxiliary roller mechanism 51 b.
• the second upper unit 52 has a configuration in which the vertical direction of the second lower unit 40 b of the third embodiment is reversed. Cooling mechanism 52b, Laser beam irradiation optics 52c and A cutter mechanism 52 d for cutting is provided in this order from the side of the first upper unit 51.
• the third upper unit 5 ⁇ 3 has a laser beam ⁇ cooling water receiving portion 5 3 a.
• the first lower unit 61 has a configuration in which the vertical direction and the left and right direction of the first upper unit 51 are reversed.
• the second auxiliary roller mechanism 61 d, the pressing roller mechanism 61 a, the substrate holding roller mechanism 61 c, and the first auxiliary roller mechanism 61 are provided in this order from the first auxiliary roller mechanism 51 b side. There is.
• the second lower unit 62 is configured in the same manner as the second lower unit 40 b of the third embodiment.
• a cooling mechanism 62 b, a laser beam irradiation optical system 62 c, and a cutting mechanism for cutting 62 d are provided in this order from the side of the first lower unit 61.
• the third lower unit 63 has an inverted configuration of the third upper unit 53 in the vertical direction.
• the third lower unit 63 has a laser beam and a coolant receiving portion 63 a.
• FIG. 19 is a diagram for explaining the operation of the dividing device according to the seventh embodiment.
• a scribe line is formed on the lower glass substrate of the bonded substrate stack. For that purpose, slide the third lower unit 6 3 to the standby position on the side of the end of the scribing direction (see Fig. 19 (a)), and then the second lower unit 62 and the third upper unit 66. A scribe line is formed on the lower glass substrate by using the step 5-3.
• the formation method of this scree brine is the same as the formation method of the scribe line of the glass substrate 90 of the third embodiment.
• the first auxiliary roller mechanism 51 b is the second auxiliary roller mechanism 61 d
• the substrate holding roller mechanism 51 c is the pressing roller mechanism 61 a
• the pressing roller mechanism 51 a is the substrate holding roller mechanism 6
• the second auxiliary roller mechanism 51 d is opposed to the first auxiliary roller mechanism 61 b at 1 c and is brought into contact with the bonded substrate stack respectively.
• the first upper bundle 51 and the first lower bundle 61 are slid along the scribing line in synchronization with the scribing direction.
• both sides of the scribe line formed on the upper glass substrate of the bonded glass substrate 91 are pressed by the pressing roller mechanism 61 a via the lower glass substrate.
• the upper glass substrate is divided along the scribe line, and both sides of the scribe line formed on the lower glass substrate are pressed by the pressing roller mechanism 51a via the upper glass substrate.
• the lower glass substrate is cut along the scribe line.
• pasting is performed by the second auxiliary roller mechanism 5 I d and the first auxiliary roller mechanism 61 b at the front portion in the scribing direction rather than the scribing position.
• the substrate is pinched. Therefore, when breaking the scribe line of each of the upper glass substrate and the lower glass substrate, unnecessary force does not act on each portion of the bonded substrate to be broken, so that the occurrence of chipping and cracking can be prevented. .
• the upper glass substrate and the lower glass substrate which have been divided are: Since it is held by the roller mechanism 51 b and the second auxiliary roller mechanism 61 d, bending of the bonded substrate can be prevented.
• the bonded substrate can be efficiently divided.
• the pressure to the second surface of the bonded substrate opposite to the first surface of the bonded substrate is bonded. It can move along a scribe line formed on one side. As described above, while the pressing force is moved along the scribe line formed on the first surface of the bonded substrate, the pressing force is applied to the second surface of the bonded substrate facing the first surface of the bonded substrate. Can be generated when forming the scrubbing on the first surface of the bonded substrate, and the bending moment is brittle so as to extend the vertical cracks extending from the surface of the first surface in the thickness direction of the substrate. It can be made to act on the substrate, and the bonded substrate can be divided.
• 21 is a front view showing a configuration of a breaking unit 30 and a scribing unit 40 provided in a dividing device according to an eighth embodiment of the present invention.
• the configuration of the dividing device according to the eighth embodiment is the same as the configuration according to the fourth embodiment except that two break units 30 are used.
• the pressing roller and the cutter wheel chip 4 8 a are respectively arranged on the upper surface and the lower surface of the glass substrate along the planned dividing line (line to be scribed). Press the contact roll. As a result, scribe lines are formed on the glass substrate 90 along the lines to be divided (planned lines).
• the first lower unit 40a is slid below the pressing roller 32a of the breaking unit 30 located at the end position of the scribe line, and the pressing roller 32a and the substrate holding roller 4 5 a and are opposed via a glass substrate 90 Ru.
• the pressure roller 32a and the substrate holding port 45a are brought into contact with the glass substrate, and the pressure side first auxiliary roller 33a and the second auxiliary roller 4 7a are brought into contact with the glass substrate 90 respectively.
• the pressing side second auxiliary roller and the first auxiliary roller 4 6 a respectively contact the glass substrate 90.
• the break unit 30 and the first lower unit 40 a slide in synchronization with each other in the same direction (+ X direction) as the direction of the scrap by the wheel tip 4 8 a.
• the scribing line forming means forms a scribing line on the scribing line forming surface of the brittle substrate.
• the pressing means moves along the scribe line. Therefore, the scribing step and the breaking step of the brittle substrate can be performed almost simultaneously. As a result, the time for dividing the brittle substrate can be shortened.
• the glass substrate when forming a scribe line on a glass substrate, the glass substrate may be vibrated so that the vertical cracks constituting the scribe line can be easily extended.
• a pressing side first auxiliary roller mechanism 33, a pressing side second auxiliary port mechanism 34, a first auxiliary roller mechanism 46, 51 b, 61 b and a second auxiliary roller mechanism 47, 51 c and 61 d can be omitted appropriately depending on the thickness and dimensions of the glass substrate 90 to be broken.
• the pressing on the second surface of the brittle substrate facing the first surface of the brittle substrate while holding the first surface of the brittle substrate can move along the scribe line formed on one side.
• a pressing force can be applied to the second surface of the brittle substrate facing the first surface of the brittle substrate. Therefore, a bending moment can be applied to the brittle substrate such that the vertical crack extending from the scribing line can be extended in the thickness direction of the substrate with certainty, and the brittle substrate can be divided.
• the brittle substrate or the bonded substrate can be cut accurately while holding the substrate with six- or eight-ring rollers with certainty.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Organic Chemistry (AREA)
• Materials Engineering (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Toxicology (AREA)
• Health & Medical Sciences (AREA)
• Thermal Sciences (AREA)
• Mechanical Engineering (AREA)
• Plasma & Fusion (AREA)
• Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
• Processing Of Stones Or Stones Resemblance Materials (AREA)
• Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
• Liquid Crystal (AREA)
• Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

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• 2004
  • 2004-04-27 US US10/554,855 patent/US20070051769A1/en not_active Abandoned
  • 2004-04-27 CN CN2004800174224A patent/CN1809512B/zh not_active Expired - Fee Related
  • 2004-04-27 JP JP2005505922A patent/JP4637018B2/ja not_active Expired - Fee Related
  • 2004-04-27 WO PCT/JP2004/006103 patent/WO2004096721A1/ja not_active Ceased
  • 2004-04-27 EP EP04729768A patent/EP1630140A4/en not_active Withdrawn
  • 2004-04-27 KR KR1020057020458A patent/KR101164491B1/ko not_active Expired - Fee Related
  • 2004-04-28 TW TW093111820A patent/TW200505805A/zh not_active IP Right Cessation

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