TWI343907B - - Google Patents

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Publication number
TWI343907B
TWI343907B TW93111820A TW93111820A TWI343907B TW I343907 B TWI343907 B TW I343907B TW 93111820 A TW93111820 A TW 93111820A TW 93111820 A TW93111820 A TW 93111820A TW I343907 B TWI343907 B TW I343907B
Authority
TW
Taiwan
Prior art keywords
substrate
pressing
scribe line
holding
roller
Prior art date
Application number
TW93111820A
Other languages
English (en)
Chinese (zh)
Other versions
TW200505805A (en
Original Assignee
Mitsuboshi Diamond Ind Co Ltdl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltdl filed Critical Mitsuboshi Diamond Ind Co Ltdl
Publication of TW200505805A publication Critical patent/TW200505805A/zh
Application granted granted Critical
Publication of TWI343907B publication Critical patent/TWI343907B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Liquid Crystal (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW093111820A 2003-04-28 2004-04-28 Brittle board dividing system and brittle board dividing method TW200505805A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003124501 2003-04-28

Publications (2)

Publication Number Publication Date
TW200505805A TW200505805A (en) 2005-02-16
TWI343907B true TWI343907B (enExample) 2011-06-21

Family

ID=33410166

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111820A TW200505805A (en) 2003-04-28 2004-04-28 Brittle board dividing system and brittle board dividing method

Country Status (7)

Country Link
US (1) US20070051769A1 (enExample)
EP (1) EP1630140A4 (enExample)
JP (1) JP4637018B2 (enExample)
KR (1) KR101164491B1 (enExample)
CN (1) CN1809512B (enExample)
TW (1) TW200505805A (enExample)
WO (1) WO2004096721A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI588002B (zh) * 2013-10-29 2017-06-21 三星國際機械股份有限公司 用於脆性基板之分裂夾具及切割方法
TWI602670B (zh) * 2012-12-27 2017-10-21 三星鑽石工業股份有限公司 Breaking method and breaking device

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1647534B1 (de) * 2004-10-15 2018-12-19 Bystronic Maschinen AG Vorrichtung und Verfahren zum Brechen von Glasscheiben
KR101096733B1 (ko) * 2004-12-27 2011-12-21 엘지디스플레이 주식회사 기판의 절단장치 및 이를 이용한 기판의 절단방법
KR100907462B1 (ko) 2005-05-30 2009-07-13 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판 절단장치 및 절단방법
TWI325352B (en) 2005-09-12 2010-06-01 Foxsemicon Integrated Tech Inc Laser cutting apparatus and method
JP4890462B2 (ja) * 2005-10-28 2012-03-07 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブライン形成方法およびスクライブライン形成装置
TW200911442A (en) * 2007-09-11 2009-03-16 Nat Applied Res Laboratories Machining method and apparatus for brittle material
KR100890764B1 (ko) * 2008-01-25 2009-03-26 삼성코닝정밀유리 주식회사 가공 테이블 일체형 유리 기판 브레이킹 장치
JP2010229005A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP2011088382A (ja) * 2009-10-23 2011-05-06 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置およびブレイク方法
JP4996703B2 (ja) * 2010-02-09 2012-08-08 三星ダイヤモンド工業株式会社 基板分断装置
JP5249979B2 (ja) * 2010-03-18 2013-07-31 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法およびこれに用いるレーザ加工装置
CN102059458A (zh) * 2010-12-28 2011-05-18 惠州市正峰激光设备有限公司 卷状胶膜激光切割机
CN102219366B (zh) * 2011-04-12 2012-12-19 深圳市晶向科技有限公司 异型玻璃切割机的自动对位系统及自动对位方法
JP5348212B2 (ja) * 2011-09-02 2013-11-20 三星ダイヤモンド工業株式会社 分断装置
KR101968792B1 (ko) * 2011-11-16 2019-04-12 니폰 덴키 가라스 가부시키가이샤 판유리 할단장치, 판유리 할단방법, 판유리 제작방법 및 판유리 할단시스템
JP5276736B2 (ja) * 2012-04-16 2013-08-28 三星ダイヤモンド工業株式会社 ブレイク方法
KR102048921B1 (ko) * 2012-06-20 2019-11-27 삼성디스플레이 주식회사 셀 절단 장치 및 셀 절단 방법
KR101412399B1 (ko) * 2012-08-30 2014-06-25 현대제철 주식회사 용접선 정렬용 안착 유닛 및 이를 갖는 용접 장치
JP6191122B2 (ja) * 2012-10-30 2017-09-06 三星ダイヤモンド工業株式会社 積層セラミックス基板の分断方法
US9126857B2 (en) 2012-11-15 2015-09-08 Corning Incorporated Separation apparatuses for separating sheets of brittle material and methods for separating sheets of brittle material
JP6163341B2 (ja) * 2013-04-02 2017-07-12 三星ダイヤモンド工業株式会社 ブレイク装置
JP6140012B2 (ja) * 2013-07-08 2017-05-31 三星ダイヤモンド工業株式会社 貼り合わせ基板のブレイク方法
CN103896483B (zh) * 2014-03-27 2016-08-17 深圳市华星光电技术有限公司 一种玻璃基板切割设备及切割方法
JP6421472B2 (ja) * 2014-06-24 2018-11-14 三星ダイヤモンド工業株式会社 脆性基板の分断方法および表示パネルの製造方法
JP2016040079A (ja) * 2014-08-12 2016-03-24 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法及び分断装置
KR101659454B1 (ko) * 2014-08-21 2016-09-23 한국미쯔보시다이아몬드공업(주) 기판 브레이크 장치
KR102310157B1 (ko) * 2015-03-16 2021-10-12 주식회사 탑 엔지니어링 스크라이빙 장치
ITUB20152791A1 (it) * 2015-08-03 2017-02-03 Bottero Spa Macchina da taglio per il taglio di una lastra di vetro
CN105710980B (zh) * 2016-01-17 2017-08-22 长春理工大学 激光原位辅助机械刻划硬脆材料的装置及方法
JP7066701B2 (ja) * 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
CN106977089B (zh) * 2017-05-05 2019-11-08 东旭科技集团有限公司 玻璃压断装置、玻璃压断方法和玻璃切割系统
JP2020066539A (ja) 2018-10-22 2020-04-30 坂東機工株式会社 ガラス板の折割機械
KR102668788B1 (ko) * 2019-01-08 2024-05-24 코닝 인코포레이티드 유리 라미네이트 물품 및 그의 제조 방법
CN113146746B (zh) * 2021-05-14 2023-04-28 赤峰元泰铸件有限公司 一种自动化数控苯板切割机
KR102474254B1 (ko) * 2022-07-14 2022-12-06 최호림 판유리 절단장치 및 그를 위한 판유리 절단기구

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI602670B (zh) * 2012-12-27 2017-10-21 三星鑽石工業股份有限公司 Breaking method and breaking device
TWI588002B (zh) * 2013-10-29 2017-06-21 三星國際機械股份有限公司 用於脆性基板之分裂夾具及切割方法

Also Published As

Publication number Publication date
JPWO2004096721A1 (ja) 2006-07-13
KR101164491B1 (ko) 2012-07-18
US20070051769A1 (en) 2007-03-08
JP4637018B2 (ja) 2011-02-23
CN1809512A (zh) 2006-07-26
WO2004096721A1 (ja) 2004-11-11
CN1809512B (zh) 2012-11-21
EP1630140A4 (en) 2006-10-25
KR20060006826A (ko) 2006-01-19
EP1630140A1 (en) 2006-03-01
TW200505805A (en) 2005-02-16

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