CN1705080A - 半导体器件 - Google Patents
半导体器件 Download PDFInfo
- Publication number
- CN1705080A CN1705080A CNA2005100746959A CN200510074695A CN1705080A CN 1705080 A CN1705080 A CN 1705080A CN A2005100746959 A CNA2005100746959 A CN A2005100746959A CN 200510074695 A CN200510074695 A CN 200510074695A CN 1705080 A CN1705080 A CN 1705080A
- Authority
- CN
- China
- Prior art keywords
- capacitor
- insulating barrier
- contact plug
- memory block
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
- H10B12/0335—Making a connection between the transistor and the capacitor, e.g. plug
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/315—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004162337 | 2004-05-31 | ||
JP2004162337A JP4492940B2 (ja) | 2004-05-31 | 2004-05-31 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1705080A true CN1705080A (zh) | 2005-12-07 |
CN100378908C CN100378908C (zh) | 2008-04-02 |
Family
ID=35425025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100746959A Expired - Fee Related CN100378908C (zh) | 2004-05-31 | 2005-05-30 | 半导体器件 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7199420B2 (zh) |
JP (1) | JP4492940B2 (zh) |
CN (1) | CN100378908C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104037176A (zh) * | 2013-03-06 | 2014-09-10 | 南亚科技股份有限公司 | 接触结构以及采用所述接触结构的半导体存储元件 |
WO2021056985A1 (zh) * | 2019-09-27 | 2021-04-01 | 福建省晋华集成电路有限公司 | 电接触结构、掩模板组合、接触插塞制作方法及半导体器件 |
WO2022041928A1 (zh) * | 2020-08-27 | 2022-03-03 | 长鑫存储技术有限公司 | 半导体结构的形成方法及半导体结构 |
CN114446884A (zh) * | 2020-11-02 | 2022-05-06 | 长鑫存储技术有限公司 | 半导体结构及其形成方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4543383B2 (ja) * | 2005-02-16 | 2010-09-15 | エルピーダメモリ株式会社 | 半導体記憶装置 |
KR100791339B1 (ko) | 2006-08-25 | 2008-01-03 | 삼성전자주식회사 | 평탄화 저항 패턴을 포함하는 복합칩 반도체 소자 및 그제조 방법 |
US20090102015A1 (en) * | 2007-10-17 | 2009-04-23 | Ulrich Klostermann | Integrated Circuit, Memory Cell Array, Memory Cell, Memory Module, Method of Operating an Integrated Circuit, and Method of Manufacturing an Integrated Circuit |
US7859890B2 (en) * | 2008-08-28 | 2010-12-28 | Qimonda Ag | Memory device with multiple capacitor types |
JP2010219139A (ja) * | 2009-03-13 | 2010-09-30 | Elpida Memory Inc | 半導体装置及びその製造方法 |
JP2011049250A (ja) * | 2009-08-25 | 2011-03-10 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
KR101615650B1 (ko) * | 2009-11-19 | 2016-04-26 | 삼성전자주식회사 | 반도체 소자 및 그 형성방법 |
JP5591016B2 (ja) * | 2010-08-09 | 2014-09-17 | ルネサスエレクトロニクス株式会社 | 半導体装置、及び半導体装置の製造方法 |
US8796855B2 (en) | 2012-01-13 | 2014-08-05 | Freescale Semiconductor, Inc. | Semiconductor devices with nonconductive vias |
US20130228837A1 (en) * | 2012-03-01 | 2013-09-05 | Elpida Memory, Inc. | Semiconductor device |
KR102435524B1 (ko) | 2015-10-21 | 2022-08-23 | 삼성전자주식회사 | 반도체 메모리 장치 |
CN108389906B (zh) * | 2017-02-03 | 2023-01-10 | 联华电子股份有限公司 | 高压金属氧化物半导体晶体管元件 |
JP2021034649A (ja) * | 2019-08-28 | 2021-03-01 | キオクシア株式会社 | 半導体記憶装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999062116A1 (fr) * | 1998-05-25 | 1999-12-02 | Hitachi, Ltd. | Dispositif a semi-conducteurs et procede de fabrication |
DE19926106C1 (de) * | 1999-06-08 | 2001-02-01 | Siemens Ag | Halbleiterspeicherbauelement mit Speicherzellen, Logikbereichen und Füllstrukturen |
JP3274664B2 (ja) | 1999-08-30 | 2002-04-15 | エヌイーシーマイクロシステム株式会社 | 半導体装置 |
JP4651169B2 (ja) * | 2000-08-31 | 2011-03-16 | 富士通株式会社 | 半導体装置及びその製造方法 |
US6462368B2 (en) * | 2000-10-31 | 2002-10-08 | Hitachi, Ltd. | Ferroelectric capacitor with a self-aligned diffusion barrier |
JP3871618B2 (ja) | 2001-07-19 | 2007-01-24 | 松下電器産業株式会社 | 半導体記憶装置及びその製造方法 |
-
2004
- 2004-05-31 JP JP2004162337A patent/JP4492940B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-30 CN CNB2005100746959A patent/CN100378908C/zh not_active Expired - Fee Related
- 2005-05-31 US US11/140,181 patent/US7199420B2/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104037176A (zh) * | 2013-03-06 | 2014-09-10 | 南亚科技股份有限公司 | 接触结构以及采用所述接触结构的半导体存储元件 |
CN104037176B (zh) * | 2013-03-06 | 2017-06-09 | 南亚科技股份有限公司 | 接触结构以及采用所述接触结构的半导体存储元件 |
WO2021056985A1 (zh) * | 2019-09-27 | 2021-04-01 | 福建省晋华集成电路有限公司 | 电接触结构、掩模板组合、接触插塞制作方法及半导体器件 |
WO2022041928A1 (zh) * | 2020-08-27 | 2022-03-03 | 长鑫存储技术有限公司 | 半导体结构的形成方法及半导体结构 |
CN114446884A (zh) * | 2020-11-02 | 2022-05-06 | 长鑫存储技术有限公司 | 半导体结构及其形成方法 |
CN114446884B (zh) * | 2020-11-02 | 2024-05-21 | 长鑫存储技术有限公司 | 半导体结构及其形成方法 |
Also Published As
Publication number | Publication date |
---|---|
US7199420B2 (en) | 2007-04-03 |
CN100378908C (zh) | 2008-04-02 |
JP4492940B2 (ja) | 2010-06-30 |
JP2005347334A (ja) | 2005-12-15 |
US20050265100A1 (en) | 2005-12-01 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: RENESAS ELECTRONICS CORPORATION Free format text: FORMER NAME: NEC CORP. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Patentee after: Renesas Electronics Corporation Address before: Kanagawa Patentee before: NEC Corp. |
|
CP02 | Change in the address of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: Renesas Electronics Corporation Address before: Kanagawa Patentee before: Renesas Electronics Corporation |
|
CP02 | Change in the address of a patent holder | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080402 Termination date: 20190530 |
|
CF01 | Termination of patent right due to non-payment of annual fee |