CN1697190A - 光学器件及其制造方法 - Google Patents
光学器件及其制造方法 Download PDFInfo
- Publication number
- CN1697190A CN1697190A CNA2005100712384A CN200510071238A CN1697190A CN 1697190 A CN1697190 A CN 1697190A CN A2005100712384 A CNA2005100712384 A CN A2005100712384A CN 200510071238 A CN200510071238 A CN 200510071238A CN 1697190 A CN1697190 A CN 1697190A
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Links
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- 238000004519 manufacturing process Methods 0.000 claims description 33
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- 238000003384 imaging method Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 8
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- 239000004065 semiconductor Substances 0.000 claims description 3
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- 239000002184 metal Substances 0.000 description 13
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- 239000012212 insulator Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 2
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- HOWHQWFXSLOJEF-MGZLOUMQSA-N systemin Chemical compound NCCCC[C@H](N)C(=O)N[C@@H](CCSC)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CC(O)=O)C(=O)OC(=O)[C@@H]1CCCN1C(=O)[C@H]1N(C(=O)[C@H](CC(O)=O)NC(=O)[C@H](CCCN=C(N)N)NC(=O)[C@H](CCCCN)NC(=O)[C@H](CO)NC(=O)[C@H]2N(CCC2)C(=O)[C@H]2N(CCC2)C(=O)[C@H](CCCCN)NC(=O)[C@H](CO)NC(=O)[C@H](CCC(N)=O)NC(=O)[C@@H](NC(=O)[C@H](C)N)C(C)C)CCC1 HOWHQWFXSLOJEF-MGZLOUMQSA-N 0.000 description 1
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Images
Classifications
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J36/00—Parts, details or accessories of cooking-vessels
- A47J36/02—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay
- A47J36/027—Cooking- or baking-vessels specially adapted for use in microwave ovens; Accessories therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004144523A JP4606063B2 (ja) | 2004-05-14 | 2004-05-14 | 光学デバイスおよびその製造方法 |
JP2004144523 | 2004-05-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1697190A true CN1697190A (zh) | 2005-11-16 |
CN100459138C CN100459138C (zh) | 2009-02-04 |
Family
ID=35308608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100712384A Expired - Fee Related CN100459138C (zh) | 2004-05-14 | 2005-05-13 | 光学器件及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7436053B2 (zh) |
JP (1) | JP4606063B2 (zh) |
KR (1) | KR100665786B1 (zh) |
CN (1) | CN100459138C (zh) |
TW (1) | TWI278992B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8664750B2 (en) | 2008-11-17 | 2014-03-04 | Advanpack Solutions Pte. Ltd. | Semiconductor substrate, package and device |
CN104094405A (zh) * | 2012-02-07 | 2014-10-08 | 株式会社尼康 | 拍摄单元及拍摄装置 |
US9059050B2 (en) | 2008-11-17 | 2015-06-16 | Advanpack Solutions Pte. Ltd. | Manufacturing methods of semiconductor substrate, package and device |
CN108352388A (zh) * | 2015-11-05 | 2018-07-31 | 索尼半导体解决方案公司 | 半导体装置、半导体装置制造方法和电子设备 |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6297548B1 (en) | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Stackable ceramic FBGA for high thermal applications |
JP4686134B2 (ja) * | 2004-04-26 | 2011-05-18 | パナソニック株式会社 | 光学デバイスおよびその製造方法 |
US7368695B2 (en) * | 2004-05-03 | 2008-05-06 | Tessera, Inc. | Image sensor package and fabrication method |
CN100561282C (zh) * | 2005-09-09 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | 数码相机模组 |
JP4828261B2 (ja) * | 2006-03-07 | 2011-11-30 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
TW200737506A (en) | 2006-03-07 | 2007-10-01 | Sanyo Electric Co | Semiconductor device and manufacturing method of the same |
JP2008016630A (ja) * | 2006-07-06 | 2008-01-24 | Matsushita Electric Ind Co Ltd | プリント配線板およびその製造方法 |
JP4451864B2 (ja) * | 2006-07-11 | 2010-04-14 | 浜松ホトニクス株式会社 | 配線基板及び固体撮像装置 |
TWI367557B (en) | 2006-08-11 | 2012-07-01 | Sanyo Electric Co | Semiconductor device and manufaturing method thereof |
JP5218058B2 (ja) | 2006-09-15 | 2013-06-26 | 富士通セミコンダクター株式会社 | 半導体装置およびその製造方法 |
JP5010247B2 (ja) | 2006-11-20 | 2012-08-29 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置及びその製造方法 |
US20080131998A1 (en) * | 2006-12-01 | 2008-06-05 | Hem Takiar | Method of fabricating a film-on-wire bond semiconductor device |
US20080128879A1 (en) * | 2006-12-01 | 2008-06-05 | Hem Takiar | Film-on-wire bond semiconductor device |
SG149709A1 (en) * | 2007-07-12 | 2009-02-27 | Micron Technology Inc | Microelectronic imagers and methods of manufacturing such microelectronic imagers |
GB2451077A (en) * | 2007-07-17 | 2009-01-21 | Zetex Semiconductors Plc | Semiconductor chip package |
US8125619B2 (en) | 2007-07-25 | 2012-02-28 | Eminent Electronic Technology Corp. | Integrated ambient light sensor and distance sensor |
SG142321A1 (en) * | 2008-04-24 | 2009-11-26 | Micron Technology Inc | Pre-encapsulated cavity interposer |
US8043894B2 (en) * | 2008-08-26 | 2011-10-25 | Stats Chippac Ltd. | Integrated circuit package system with redistribution layer |
WO2010047807A1 (en) * | 2008-10-22 | 2010-04-29 | Tom Chang | Light detection circuit for ambient light and proximity sensor |
JP5378781B2 (ja) * | 2008-12-26 | 2013-12-25 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
WO2010085487A1 (en) * | 2009-01-20 | 2010-07-29 | Tom Chang | Light-proximity-inertial sensor combination |
WO2011072364A1 (en) * | 2009-12-14 | 2011-06-23 | Nortel Networks Limited | Integrated transmit and receive modules for a coherent optical transmission system |
JP5461356B2 (ja) * | 2010-09-30 | 2014-04-02 | 京セラSlcテクノロジー株式会社 | 配線基板 |
WO2013028616A2 (en) * | 2011-08-19 | 2013-02-28 | Imi Usa, Inc. | Flip-chip bonded imager die |
TWM521008U (zh) * | 2016-01-27 | 2016-05-01 | Lite On Technology Corp | 車燈裝置及其發光模組 |
US9899290B2 (en) * | 2016-03-23 | 2018-02-20 | Nxp Usa, Inc. | Methods for manufacturing a packaged device with an extended structure for forming an opening in the encapsulant |
US10763290B2 (en) * | 2017-02-22 | 2020-09-01 | Elwha Llc | Lidar scanning system |
KR102610614B1 (ko) * | 2021-08-26 | 2023-12-07 | 주식회사 아이에이네트웍스 | 허메틱 실링 패키지 모듈 및 그 제조 방법 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60257546A (ja) * | 1984-06-04 | 1985-12-19 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
US4766095A (en) * | 1985-01-04 | 1988-08-23 | Oki Electric Industry Co., Ltd. | Method of manufacturing eprom device |
US4874722A (en) * | 1987-04-16 | 1989-10-17 | Texas Instruments Incorporated | Process of packaging a semiconductor device with reduced stress forces |
US5264393A (en) * | 1988-11-25 | 1993-11-23 | Fuji Photo Film Co., Ltd. | Solid state image pickup device and method of manufacturing the same |
JPH0590549A (ja) * | 1991-09-27 | 1993-04-09 | Sanyo Electric Co Ltd | 固体撮像素子及びその製造方法 |
JPH06203403A (ja) * | 1992-10-22 | 1994-07-22 | Matsushita Electron Corp | 半導体レーザ装置および光ピックアップ装置 |
US5748658A (en) * | 1993-10-22 | 1998-05-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser device and optical pickup head |
EP0790652B1 (en) * | 1995-08-02 | 2007-02-21 | Matsushita Electric Industrial Co., Ltd. | Solid-state image pickup device and its manufacture |
JP3443406B2 (ja) * | 1997-02-10 | 2003-09-02 | 松下電器産業株式会社 | 樹脂封止型半導体装置 |
US6583444B2 (en) * | 1997-02-18 | 2003-06-24 | Tessera, Inc. | Semiconductor packages having light-sensitive chips |
JP4372241B2 (ja) | 1998-08-05 | 2009-11-25 | パナソニック株式会社 | 固体撮像装置の製造方法 |
US6130448A (en) * | 1998-08-21 | 2000-10-10 | Gentex Corporation | Optical sensor package and method of making same |
US6147389A (en) * | 1999-06-04 | 2000-11-14 | Silicon Film Technologies, Inc. | Image sensor package with image plane reference |
US6489178B2 (en) * | 2000-01-26 | 2002-12-03 | Texas Instruments Incorporated | Method of fabricating a molded package for micromechanical devices |
US6384473B1 (en) * | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
JP2001358997A (ja) * | 2000-06-12 | 2001-12-26 | Mitsubishi Electric Corp | 半導体装置 |
TW454309B (en) | 2000-07-17 | 2001-09-11 | Orient Semiconductor Elect Ltd | Package structure of CCD image-capturing chip |
JP3540281B2 (ja) | 2001-02-02 | 2004-07-07 | シャープ株式会社 | 撮像装置 |
JP4359072B2 (ja) * | 2002-05-07 | 2009-11-04 | 三井化学株式会社 | 固体撮像素子装着用パッケージ |
JP3980933B2 (ja) * | 2002-05-23 | 2007-09-26 | ローム株式会社 | イメージセンサモジュールの製造方法 |
US7150569B2 (en) * | 2003-02-24 | 2006-12-19 | Nor Spark Plug Co., Ltd. | Optical device mounted substrate assembly |
DE10318501A1 (de) * | 2003-04-24 | 2005-01-05 | Robert Bosch Gmbh | Chipaufbau in einem Premold-Gehäuse |
-
2004
- 2004-05-14 JP JP2004144523A patent/JP4606063B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-11 US US11/102,736 patent/US7436053B2/en not_active Expired - Fee Related
- 2005-04-18 KR KR1020050031923A patent/KR100665786B1/ko not_active IP Right Cessation
- 2005-05-13 TW TW094115671A patent/TWI278992B/zh not_active IP Right Cessation
- 2005-05-13 CN CNB2005100712384A patent/CN100459138C/zh not_active Expired - Fee Related
-
2008
- 2008-08-14 US US12/191,639 patent/US7563644B2/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8664750B2 (en) | 2008-11-17 | 2014-03-04 | Advanpack Solutions Pte. Ltd. | Semiconductor substrate, package and device |
US9059050B2 (en) | 2008-11-17 | 2015-06-16 | Advanpack Solutions Pte. Ltd. | Manufacturing methods of semiconductor substrate, package and device |
CN102144291B (zh) * | 2008-11-17 | 2015-11-25 | 先进封装技术私人有限公司 | 半导体基板、封装与装置 |
CN105161427A (zh) * | 2008-11-17 | 2015-12-16 | 先进封装技术私人有限公司 | 半导体基板、半导体封装与半导体装置的制造方法 |
CN105161427B (zh) * | 2008-11-17 | 2019-12-06 | 先进封装技术私人有限公司 | 半导体基板、半导体封装与半导体装置的制造方法 |
CN104094405A (zh) * | 2012-02-07 | 2014-10-08 | 株式会社尼康 | 拍摄单元及拍摄装置 |
CN108352388A (zh) * | 2015-11-05 | 2018-07-31 | 索尼半导体解决方案公司 | 半导体装置、半导体装置制造方法和电子设备 |
US11527453B2 (en) | 2015-11-05 | 2022-12-13 | Sony Semiconductor Solutions Corporation | Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus |
Also Published As
Publication number | Publication date |
---|---|
TW200537685A (en) | 2005-11-16 |
TWI278992B (en) | 2007-04-11 |
US7563644B2 (en) | 2009-07-21 |
CN100459138C (zh) | 2009-02-04 |
JP4606063B2 (ja) | 2011-01-05 |
US20050253211A1 (en) | 2005-11-17 |
KR100665786B1 (ko) | 2007-01-09 |
US20080304790A1 (en) | 2008-12-11 |
JP2005327893A (ja) | 2005-11-24 |
US7436053B2 (en) | 2008-10-14 |
KR20060047180A (ko) | 2006-05-18 |
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Owner name: KELAIBO INNOVATION CO., LTD. Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. Effective date: 20141125 |
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Effective date of registration: 20141125 Address after: American California Patentee after: Craib Innovations Ltd Address before: Osaka Japan Patentee before: Matsushita Electric Industrial Co., Ltd. |
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