CN1551260A - 超低电感多层陶瓷电容器 - Google Patents
超低电感多层陶瓷电容器 Download PDFInfo
- Publication number
- CN1551260A CN1551260A CNA2004100310216A CN200410031021A CN1551260A CN 1551260 A CN1551260 A CN 1551260A CN A2004100310216 A CNA2004100310216 A CN A2004100310216A CN 200410031021 A CN200410031021 A CN 200410031021A CN 1551260 A CN1551260 A CN 1551260A
- Authority
- CN
- China
- Prior art keywords
- capacitor
- terminal
- outside terminal
- battery lead
- lead plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003985 ceramic capacitor Substances 0.000 title description 7
- 239000003990 capacitor Substances 0.000 claims abstract description 280
- 239000003989 dielectric material Substances 0.000 claims description 12
- 230000003071 parasitic effect Effects 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 20
- 230000008901 benefit Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- CLODVDBWNVQLGO-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC=CC(Cl)=C1C1=C(Cl)C(Cl)=CC(Cl)=C1Cl CLODVDBWNVQLGO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Dc-Dc Converters (AREA)
- Filters And Equalizers (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46887603P | 2003-05-06 | 2003-05-06 | |
US46838003P | 2003-05-06 | 2003-05-06 | |
US60/468,380 | 2003-05-06 | ||
US60/468,876 | 2003-05-06 | ||
US46947503P | 2003-05-08 | 2003-05-08 | |
US60/469,475 | 2003-05-08 | ||
US10/694,306 | 2003-10-27 | ||
US10/694,306 US6950300B2 (en) | 2003-05-06 | 2003-10-27 | Ultra low inductance multi layer ceramic capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1551260A true CN1551260A (zh) | 2004-12-01 |
CN1551260B CN1551260B (zh) | 2010-05-12 |
Family
ID=33102453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004100310216A Expired - Lifetime CN1551260B (zh) | 2003-05-06 | 2004-04-07 | 超低电感多层陶瓷电容器 |
Country Status (5)
Country | Link |
---|---|
US (3) | US6950300B2 (zh) |
EP (1) | EP1480236B1 (zh) |
JP (2) | JP4045258B2 (zh) |
CN (1) | CN1551260B (zh) |
TW (1) | TWI338903B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100397632C (zh) * | 2004-12-09 | 2008-06-25 | 国际商业机器公司 | 组合式散热去耦电容器阵列和印刷电路板组件 |
CN101479849B (zh) * | 2006-06-30 | 2012-08-08 | 英特尔公司 | 低电感电容器、装配其的方法和包含其的系统 |
CN103796426A (zh) * | 2012-10-30 | 2014-05-14 | 联想(北京)有限公司 | 应用片式多层电容器的电路模块和电子设备 |
Families Citing this family (62)
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US6950300B2 (en) * | 2003-05-06 | 2005-09-27 | Marvell World Trade Ltd. | Ultra low inductance multi layer ceramic capacitor |
US6885544B2 (en) * | 2003-09-24 | 2005-04-26 | Intel Corporation | Vertical capacitor apparatus, systems, and methods |
US7068490B2 (en) * | 2004-04-16 | 2006-06-27 | Kemet Electronics Corporation | Thermal dissipating capacitor and electrical component comprising same |
US6917510B1 (en) * | 2004-10-27 | 2005-07-12 | Kemet Corporation | Extended terminal ceramic SMD |
US7136274B2 (en) * | 2004-10-28 | 2006-11-14 | Motorola, Inc. | Embedded multilayer printed circuit |
US7554172B2 (en) * | 2005-04-07 | 2009-06-30 | Tai-Her Yang | Multi-directional multiplexing radius convergence electrode |
JP2007096272A (ja) * | 2005-09-02 | 2007-04-12 | Sanyo Electric Co Ltd | 電気素子および電気回路 |
US7697262B2 (en) * | 2005-10-31 | 2010-04-13 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
US7414857B2 (en) | 2005-10-31 | 2008-08-19 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
CN101346787B (zh) | 2005-12-26 | 2011-07-20 | 三洋电机株式会社 | 电路装置 |
US7292429B2 (en) * | 2006-01-18 | 2007-11-06 | Kemet Electronics Corporation | Low inductance capacitor |
WO2007115255A2 (en) * | 2006-03-31 | 2007-10-11 | University Of Florida Research Foundation, Inc. | Integrated power passives |
JP5023069B2 (ja) * | 2006-10-06 | 2012-09-12 | 三洋電機株式会社 | 電気素子 |
DE102006054086A1 (de) * | 2006-11-16 | 2008-05-29 | Epcos Ag | Vielschicht-Kondensator |
US7961453B2 (en) * | 2007-01-09 | 2011-06-14 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor |
US20080174931A1 (en) * | 2007-01-18 | 2008-07-24 | Skamser Daniel J | Vertical electrode layer design to minimize flex cracks in capacitors |
US7920370B2 (en) * | 2007-02-05 | 2011-04-05 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor |
US8493744B2 (en) * | 2007-04-03 | 2013-07-23 | Tdk Corporation | Surface mount devices with minimum lead inductance and methods of manufacturing the same |
US8238116B2 (en) | 2007-04-13 | 2012-08-07 | Avx Corporation | Land grid feedthrough low ESL technology |
US7633739B2 (en) * | 2007-05-24 | 2009-12-15 | Daniel Devoe | Stacked multilayer capacitor |
US8289675B2 (en) | 2007-05-24 | 2012-10-16 | Daniel Devoe | Stacked multilayer capacitor |
KR100905879B1 (ko) * | 2007-09-28 | 2009-07-03 | 삼성전기주식회사 | 적층형 캐패시터 |
US20090147440A1 (en) * | 2007-12-11 | 2009-06-11 | Avx Corporation | Low inductance, high rating capacitor devices |
US8446705B2 (en) * | 2008-08-18 | 2013-05-21 | Avx Corporation | Ultra broadband capacitor |
US8094429B2 (en) * | 2009-06-22 | 2012-01-10 | Industrial Technology Research Institute | Multilayer capacitors and methods for making the same |
CN102056404B (zh) * | 2010-11-15 | 2013-01-23 | 浪潮电子信息产业股份有限公司 | 一种中和过孔容性的方法 |
KR101536678B1 (ko) * | 2011-04-07 | 2015-07-14 | 가부시키가이샤 무라타 세이사쿠쇼 | 전자부품 |
KR101558023B1 (ko) * | 2011-08-26 | 2015-10-07 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR101548774B1 (ko) * | 2011-08-26 | 2015-08-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
US9564275B2 (en) | 2012-03-09 | 2017-02-07 | The Paper Battery Co. | Supercapacitor structures |
DE102012104033A1 (de) * | 2012-05-08 | 2013-11-14 | Epcos Ag | Keramischer Vielschichtkondensator |
JP5853976B2 (ja) * | 2012-06-12 | 2016-02-09 | 株式会社村田製作所 | 積層コンデンサ |
KR101452058B1 (ko) * | 2012-12-06 | 2014-10-22 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
JP6136916B2 (ja) * | 2013-03-15 | 2017-05-31 | 株式会社村田製作所 | 積層コンデンサ |
WO2014145451A1 (en) | 2013-03-15 | 2014-09-18 | The Paper Battery Company, Inc. | Energy storage structures and fabrication methods thereof |
KR101565643B1 (ko) * | 2013-04-30 | 2015-11-03 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 실장 기판 |
US20150021082A1 (en) | 2013-07-17 | 2015-01-22 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same |
KR20140038872A (ko) * | 2013-07-17 | 2014-03-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR20140038876A (ko) | 2013-08-13 | 2014-03-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
US9653212B2 (en) | 2013-08-13 | 2017-05-16 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board for mounting thereof |
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US20150114704A1 (en) | 2013-10-31 | 2015-04-30 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same |
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2003
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-
2004
- 2004-04-07 CN CN2004100310216A patent/CN1551260B/zh not_active Expired - Lifetime
- 2004-04-20 TW TW093110964A patent/TWI338903B/zh not_active IP Right Cessation
- 2004-04-28 JP JP2004134183A patent/JP4045258B2/ja not_active Expired - Lifetime
- 2004-04-28 EP EP04010108.1A patent/EP1480236B1/en not_active Expired - Lifetime
-
2005
- 2005-07-19 US US11/184,208 patent/US7230816B2/en not_active Expired - Lifetime
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2007
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100397632C (zh) * | 2004-12-09 | 2008-06-25 | 国际商业机器公司 | 组合式散热去耦电容器阵列和印刷电路板组件 |
CN101479849B (zh) * | 2006-06-30 | 2012-08-08 | 英特尔公司 | 低电感电容器、装配其的方法和包含其的系统 |
CN102723198A (zh) * | 2006-06-30 | 2012-10-10 | 英特尔公司 | 低电感电容器、装配其的方法和包含其的系统 |
CN102723198B (zh) * | 2006-06-30 | 2016-01-13 | 英特尔公司 | 低电感电容器、装配其的方法和包含其的系统 |
CN103796426A (zh) * | 2012-10-30 | 2014-05-14 | 联想(北京)有限公司 | 应用片式多层电容器的电路模块和电子设备 |
Also Published As
Publication number | Publication date |
---|---|
EP1480236B1 (en) | 2016-06-08 |
EP1480236A2 (en) | 2004-11-24 |
US6950300B2 (en) | 2005-09-27 |
JP4045258B2 (ja) | 2008-02-13 |
US20050258511A1 (en) | 2005-11-24 |
US20040223290A1 (en) | 2004-11-11 |
EP1480236A3 (en) | 2004-12-01 |
JP2004336041A (ja) | 2004-11-25 |
US7701695B2 (en) | 2010-04-20 |
US7230816B2 (en) | 2007-06-12 |
CN1551260B (zh) | 2010-05-12 |
US20080049377A1 (en) | 2008-02-28 |
JP4498397B2 (ja) | 2010-07-07 |
TWI338903B (en) | 2011-03-11 |
TW200504773A (en) | 2005-02-01 |
JP2008022017A (ja) | 2008-01-31 |
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