CN1533687A - 制造具有三维半导体芯片阵列安装面的电路板的方法和设备 - Google Patents
制造具有三维半导体芯片阵列安装面的电路板的方法和设备 Download PDFInfo
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Abstract
揭示了一种用于制造三维阵列半导体芯片的方法和设备。该方法采用同一芯片载体自动表面安装半导体芯片的多步骤的制造工艺,以获得三维阵列的芯片。该方法包括同时在多个芯片载体上沉积焊料,在印刷电路板上放置具有芯片的芯片载体,以及随后通过单次回流烘箱对具有三维阵列的芯片和芯片载体的板处理,从而完成单次回流处理,以永久连接所有的元件。该设备包括独特的芯片载体的脱班和印刷固定支架,以组合方式工作来定位芯片载体,以适用于一次性在多个芯片载体上沉积焊料,并随后定位,以适用于其它电路板。
Description
相关申请
申请人按照根据35 USC§119(e),请求本发明享有以2001年3月14日申请的美国临时专利序列号60/275,843“制造具有三维半导体芯片阵列安装面的电路板的方法和设备”的优先权。
技术领域
本发明涉及半导体制造处理工艺,更具体的说,涉及在印刷电路板上以三维阵列制造半导体芯片的方法和系统。
发明背景
半导体芯片一般是连接在印刷电路板上,并依次将芯片与该电路板上一起工作所包括的其它芯片进行互连。以往,芯片是以简单的两维阵列散落在整个印刷电路板上的一个较大的平面上的。近年来,计算机工业趋向于更加密集封装的印刷电路板。其中,就希望能增加较大随机存取存储器的需求,更快的计算机的需求,更紧凑的计算的需求,以及通过在印刷电路板上增加电路密度来降低印刷电路板的成本。在19世纪80年代中期和后期,整个工业就从通过在印刷电路板上的孔来附加计算机芯片的技术转移到了采用表面安装技术来附加计算机芯片的技术。随着表面安装技术的不断进步,常规的印刷电路板上的通孔已经被印刷电路板上的导体安装焊盘所取代。这就允许多层电路板的互连线路的复杂网路可以在板的层间运行。因此,允许在印刷电路板上增加芯片的密度,通过减小板上个芯片之间的传输信号的距离,这不仅减小了电路板的尺寸,而且还提高计算机的工作速度。
表面安装技术的发展进一步引发了各种结构的印刷电路板上的芯片的定位实现,以增加电路板的芯片密度,并从而减小在芯片之间的距离,以加快整个系统的工作速度。一般来说,常规结构是采用相互间的叠片来增加密度的。芯片的相互叠片特别适用于在电路中具有冗余的存储器芯片。直到现在,为了将芯片能相互叠片,以增加电路板的芯片密度并获得三维的阵列,计算机商家不得不将芯片发给擅长于以叠片方式永久结合芯片技术的第三方制造厂家。芯片的叠片一般是由将其焊接在一起所组成的。因此,这会产生各种问题,包括不得不依赖于其它制造工厂所固有的时间延迟以及由于将芯片直接焊接在一起所造成的对芯片的潜在危害。
最新的发展,特别是本发明所申请的这些发展已经产生了适用于以三维阵列将芯片叠片在印刷电路板上的新的和更加有效的方法。在本申请所拥有的共同所附专利申请中详细讨论了这些发展,它们是:1999年4月4日申请的美国专利申请序列号09/285,354“具有三维阵列集成电路封装的电路板组件”,和2000年3月3日申请的美国专利申请序列号09/524,324“具有三维阵列载体安装的集成电路封装的电子模块”。这两个申请都作为参考结合于本文并成为本文的一部分,正如本文最后所阐明的那样。所参考的这两个申请讨论了独特的电子模块,其作用是提供在电路板上设置芯片的平台并且连接电路板上的接触焊盘,该焊盘与电路板下的平台共享焊盘。随后将第二个芯片与平台的上部相连接,以获得叠片的三维阵列,正如在上述所参考的专利申请中所详细讨论的那样。图1中的21A和21B说明了在上述两个参考申请中所讨论和权利要求的两种不同类型的芯片载体。21A说明了采用印刷电路板形式所制成的芯片载体,而21B则说明以模块封装形式所制成的芯片载体。
然而,为了能最大化在上述两个所提及的共同所附的申请中讨论的电子芯片载体模块的优点,就需要自动和优化它们安装的制造处理工艺和设备。另外,这些制造处理工艺和设备也应该由计算机或电路板制造厂家自己使用,而不需要使用来自第三方制造厂家的服务。
发明内容
本发明的一个目的是提供了效率和成本有效的制造处理工艺和设备,其中采用了新的发展以允许在印刷电路板上以三维阵列的方式放置芯片。本发明的另一目的是提供了能够采用现有方法的设备和方法以及用于在印刷电路板组件中的半导体制造机器。
通过提供适用于组装具有三维阵列半导体芯片的普通电路板,就能够获得上述以及其它的目的,该方法包括以下步骤:a)验证多个芯片载体上电触点的适当对准的装配工艺;b)制备所述芯片载体的芯片接收面,以接收芯片和无源元件;c)制备适用于芯片装配工艺的电路板;d)将芯片的第一层和无源元件组装在所述的电路板上,并且所述的芯片和无源元件定位在与预先选定的预先确定的电触点相接触的位置上;e)将所述的芯片载体定位在芯片的所述第一层上,使得所述的芯片载体与所述电路板上的预先选定的电触点相接触;f)将半导体芯片与无源元件放置于各个所述的芯片载体;以及,g)将所述的芯片,无源元件和芯片载体以永久的方式与电路板互连。
在本发明的另一方面,提供了适用于采用三维阵列半导体芯片来组装电路板的系统,它包括:a)多个附加在电路板上的芯片载体,其中的间隔适用于芯片可直接定位在各个芯片载体之下的电路板上以及适用于将芯片定位在芯片载体的上面,从而在电路板上创建三维阵列的芯片;b)在电路板的装配过程中用于保持和移动多个芯片载体的载体架,该载体架具有一个腔室的矩阵,该腔室的结构类似于至少在载体架的上面具有开口的腔室,所形成的各个腔室用于在电路板组装工序中能保持芯片载体,该芯片载体定位在载体架的各个腔室中,与芯片载体上面的芯片接收面相接触,该接收面面对着载体架的上面,从而在电路板的组装工序中使得芯片载体的上面成为可存取的;以及,c)在电路板组装工序中移动和定位载体架的机器,使得由载体架所保持的多个芯片载体能在电路板组装工序中接收芯片且容易从载体架上存取和取出,以及定位在采用定位在各个芯片载体上的芯片直接定位在电路板上的芯片上的电路板上。
本发明的还有一个方面,提供了在半导体制造工艺过程中用于定位和安全以及单独保持芯片模块的设备,该设备包括:a)用于保持芯片模块的载体架,该载体架具有腔室的两维矩阵,该腔室在载体架的第一和第二相对并行一面是开口的;当载体架的第一面向上时,该腔室在相邻的载体架第二面上的开口处的基础上,在腔室内部的边缘允许腔室可保持与腔室相同的直径来固定芯片模块;b)具有两维矩阵凸起部分的印刷固定支架,该两维矩阵的凸起部分与载体架的腔室矩阵相匹配,以便于凸起部分的尺寸可以使其能够一对一适合于载体架第二面的载体架腔室的基础上;以及,c)在腔室被芯片模块所填满时以及当印刷固定支架在载体架第二面上于载体架结合在一起时,凸起部分会抬高在腔室内的芯片模块,使其工作定位便于能从载体架的第一面进行工作。
附图的简述
通过以下结合附图的讨论,将对本发明有更好的理解,附图包括:
图1描述了两种不同形式的电子芯片承载模块;
图2是载体架的抬高的透视图,该载体架在本发明的制造过程中保持承载电子芯片的模块;
图2A是图2中描述的载体架沿着线I-I的剖面图;
图3是本发明用于芯片承载模块模板印刷步骤中的印刷固定支架的抬高投影视图;
图3A是图3所示印刷固定支架沿线I-I的剖面图;
图4是本发明的印刷固定支架的仰视图;
图5是本发明制造处理工艺中所使用模板印刷的俯视图;
图6是本发明一个制造阶段中载体架和印刷固定支架结合一起的侧视图;
图6A是图6的剖面图,在载体架一个腔室的III处插入抬高部分,以支撑芯片载体;
图7是本发明的模板印刷步骤的视图;
图8是本发明的电路板组装步骤的视图;以及
图9是在本发明单次回流处理工序中所使用的烘箱的侧视图。
较佳实施例的详细描述
本发明较佳实施例的方法使用了芯片载体在印刷电路板上自动表面安装的三个制造处理步骤,其中芯片载体类似于在图1中的21A和21B所说明的以及在上述两个共同附加的申请中所说明的,这两个共同附加的申请已经作为参考而与本文相结合。第一步骤涉及同时在大量的芯片载体21上进行模板印刷(焊料的沉积)。第二步骤涉及将芯片载体移动到装配的位置,在该位置上,将芯片载体放置在已经直接安装在电路板上的芯片和无源元件上的电路板上。芯片与相应的无源器件一起再放置在芯片载体上。在第三和最后的步骤中,粘附着元件的电路板通过单次回流处理工艺,以完成与电路板和芯片载体上的各种元件焊点的永久互连。
本发明的较佳实施例使用了两种新型的器件,有助于大量芯片载体的同时移动和模板印刷。在制造的处理工艺中,芯片载体21是由芯片载体架23来保持着,正如图2所说明的那样。正如实施例所说明的载体架23具有总共54个腔室25,各个腔室都保持着一个芯片的载体21。在图2中,仅仅只有25A,25B和25C具有芯片载体21。载体架23中的各个腔室25在载体架的上部23A和底部23B都是开口的。各个芯片载体的尺寸近似为载体架23上的各个腔室25的相同尺寸,除了芯片载体21四个角的凸起部分或边缘部分22。具有该尺寸的各个芯片载体,使之在芯片载体定位于腔室25内时,其边缘部分22可突出腔室,并且保持在载体架的上表面23A,正如图2中的25A,25B和25C所示范的那样。于是,在芯片放置于腔室时,可以防止各个芯片落在腔室25中。
在较佳实施例中的各个腔室25有四个邻接点27,环绕着上部外边缘,正如图2所说明的那样。将该邻接点设计成能够保持着芯片载体21并在定位在腔室27内时能够保护芯片载体。邻接点27能够具有保护作用是因为在定位于腔室25内时芯片载体21处于低于周围邻接点27上部的凹陷部分。载体架可以采用各种材料来制成,包括耐用的塑料,铝或任何其它适用的材料。图2A是载体架沿着线I-I的剖面图,它清楚地表明了腔室25开口的上部23A和底部23B。在制造过程中,邻接点27可保护各个芯片载体的上部,同时芯片载体是在载体架23的腔室内。芯片载体21的上部受到保护,使得在载体上部沉积了焊料之后,正如以下所要讨论的,载体架可以在没有以上所述在芯片载体上焊料的烦恼的情况下叠片和移动。
第二个新的器件是印刷固定支架31,正如在图3的投影分解图所示。该印刷固定支架31具有系列凸出的类似于块的区域33。类似于块的区域33是以9乘6的矩阵与载体架23上的9乘6的腔室25相匹配。设计凸出区域的矩阵,使其尺寸适合于在载体架23上所对应腔室25的底部。印刷固定支架31使向内凹的,且各个凸出类似块的区域33具有上部开口35,它向印刷固定支架31下凹内部开口。图4提供了印刷固定支架31的底部视图。也可以通过印刷固定支架31的底部平板41圆形开口39看到一些上部开口35。图3A是印刷固定支架31沿着图3线II-II的剖面图。在图3A中,可以看下凹的内部36。底部平板41确保了可移动凹轴(未显示)。该轴的凹陷部分通向印刷固定支架31的下凹内部36。印刷固定支架31可以采用浇铸铝或任何其它多种适用的材料制成。
印刷固定支架31可设计成能适用于套住载体架23的底部,并且能凸出和确保芯片支架21在凸版的腔室25中。当印刷固定支架31与载体架23结合时(图6),上部的开口35是淹没在位于腔室25中的芯片载体的底部,并且在印刷固定支架31出现了密封的间隔36,以在模板印刷过程中建立能保持芯片载体的稍低真空,这将在下文中进行更详细的讨论。图6A是图6所示具有插入支撑芯片载体21的凸起部分33的腔室沿着线III的剖面图。从该图中可以看到,定位在腔室25中的所凸出区域33具有一个被芯片载体21的底部29所淹没的上部开口35。
图5提供了在模板印刷工艺中所使用的网板47的顶视图。网板47是用于在芯片载体21定位在载体架23的腔室25内时在其连接焊盘46上(图1和图2)沉积焊料的样板,并且芯片载体21可由印刷固定支架31来确保固定着。正如以下所显示的,网板47放置在载体架23上,此时,载体架23上放满了芯片载体21,并且网板47的孔49的行矩阵与在载体架23的各个腔室25中的芯片载体上部的焊盘46匹配。网板47通常是采用不锈钢薄片或者一些其它适用的材料制成。
本发明的较佳实施例使用了网板工艺的自动模板印刷。正如在图6中所说明的,利用印刷固定支架31在下面定位而放满芯片载体21的载体架23可以定位在工作座51上。同样,正如以上所提到的那样,当印刷固定支架与载体架结合成一体时,该拖出的芯片载体21就会部分露出载体架23的腔室25的上部。再接着参考图7,具有结合成一体的印刷固定支架31和载体架23的工作座可放置在网板47的下面。该网板47可采用具有特殊双向摄像机辅助的合适定位设备来放置(未显示),其中,摄像机可在工艺中插入在网板47和载体架23之间,这在该领域中是众所周知的。通过隔断在网板47和载体架23上的基准点,可以将摄像机排列在网板和载体架上。一旦机器确保正确的对准之后,就由工作座51向网板47顶升印刷固定支架31和载体架23,直至定位在载体架23上与网板27所相邻的芯片载体21的上部。工作座51具有一个启动部件来提升和降低整体结构。这时,焊料沉积机器59可以降低至网板47的上面并通过网板47上的矩阵孔49的阵列来沉积焊料。据真空49暴露了芯片载体21的连接焊盘46,使得机器59能够准确地在连接焊盘上沉积焊料。一旦完成之后,该机器59就提升,脱离网板47并且向上取出网板47。由于芯片载体是由在印刷固定之间的凸出区域33和各个芯片载体21的底部之间所建立的真空状态牢靠的保持着(见图6A),因此,没有任何芯片载体21会粘在网板47上并且载体架23可以取出或者降低。
一旦已经完成网板工序,则载体架23就与印刷固定支架31向脱离,并且载体架23和模板印刷印好的芯片载体21一起移至下一步骤,如图8所说明的电路板组装工序。在电路板组装工序的较佳实施例中,使用了标准的拾取和放置机器60。当组装的工艺中,门形构架61具有各种拾取和放置的喷嘴63,它首先将半导体计算机芯片73放置在包含各种无源器件的电路板65上。在图8中的芯片是从槽67中取出的,或者是从采用工业标准方式的其它带上取出的。同样,无源器件,例如,电阻器,电容器,等等,都是从采用工业标准方式的盘69上取出的。一旦电路板65采用第一层芯片和无源器件的组装之后,门形构架61就开始从载体架23取出的芯片载体21的放置。一旦在电路板65上放置好所有的芯片载体21之后,就在包含合适无源器件的芯片载体21上放置芯片。图9说明了具有第一层芯片73,无源器件75,芯片载体21和第二层芯片77的完成后的电路板65。在放置过程中,放置在电路板65上的各个芯片,芯片载体和无源器件都即刻呈现在摄像中以便于检测。在其表面出现缺陷的这类器件全都丢弃。
第三和最后的步骤是单次回流工艺,在该工艺中,具有粘附着元器件的电路板65通过烘箱87,通过原先放置在电路板和芯片载体上的焊料,使得元器件可以永久地粘附在电路板上。图9说明了进入烘箱87的电路板65。采用单次回流工艺避免了对电路板和黏附在电路板上的元器件施加不适当的应力,因为在进入烘箱87之前电路板65已经放置的所有元器件。在较佳实施例中,使用了标准的回流烘箱。正如业内都知道的,单次回流烘箱会引起焊料熔融,从而将放置在电路板上的各种元器件焊在包括芯片载体的电路板上。放置在各个芯片载体上的元器件自然会同时焊在该芯片载体上。本发明的一个优点是允许所有的元器件、芯片、芯片载体和无源器件在一个步骤中定位在印刷电路板上。一旦放置好元器件的电路板通过烘箱之后,就会是在电路板上所保持元器件的焊料熔融,并使之永久焊在板上。这就避免了需要电路板多次通过烘箱。然而,已经阅读本说明以及理解本发明概念的一些业内专业人士都能够采用适合于网板、组装和单次回流工艺的任何一种商业化的制造机器。
在参考上述较佳实施例具体显示和讨论本发明的同时,应该理解到,业内的专业人士可以在不脱离本发明的精神和范围的条件下作出各种形式及细节上的变化。
Claims (17)
1.一种用于组装具有三维阵列半导体芯片的电路板的方法,其特征在于,该方法包括下列步骤:
a)制备多个芯片载体的芯片接收面,以接收芯片和无源元件;
b)将所述芯片载体置于位于所述电路板上第一层芯片上,使得所述芯片载体与所述电路板上预选的电触点相接触;
c)将半导体芯片与无源元件一起放置在每一所述芯片载体上;并且
d)将所述芯片、无源元件和芯片载体以永久方式与所述电路板互连起来。
2.如权利要求1所述的方法,其特征在于,还包括下列步骤:
a)确认多个芯片载体上的电触点已恰当对准用于组装工序;
b)制备电路板用于芯片组装工序;并且
c)使所述电路板与第一层芯片和无源元件组装在一起,放置所述芯片和无源器件,使之与预选预定的电触点相接触。
3.如权利要求1所述的方法,其特征在于,它还包括将所述多个芯片载体保持在芯片载体架内步骤,其中,所述芯片载体放置成平面矩形阵列,所述多个芯片载体中每一的芯片接收侧暴露在所述载体架的上部,从而在所述模板印刷步骤期间,可以接近每一芯片的所述芯片承载面,并且使得在所述放置步骤中,能够在所述放置步骤中取出每一芯片。
4.如权利要求3所述的方法,其特征在于,将所述芯片载体保持在芯片载体架中的所述步骤包括在所述载体架的上侧和底侧提供腔室开口矩阵,所述载体架具有一个保护屏障,用以在芯片载体放置在腔室内时,能够保护凹陷部分内的芯片载体。
5.如权利要求4所述的方法,其特征在于,它包括,在所述模板印刷工序中,采用具有类似凸起阵列的矩阵的印刷固定支架来确保和放置所述芯片载体的步骤;每一凸起部分的位置和尺寸都适合于与所述载体架内的腔室底部配合,且可靠并且可拆卸地啮合所述腔室中的芯片载体的底侧,从而可以在所述底模板印刷工艺期间,将所述芯片载体提到所述保护屏障的上方,当完成且将所述芯片载体返回到所述凹陷位置时,确保所述芯片载体能脱离所述模板印刷工序。
6.如权利要求5所述的方法,其特征在于,确保所述芯片载体的所述步骤包含所述凸起部分在邻近所述芯片载体底面的所述凸起部分表面的顶部,利用孔隙产生的真空来保护所述芯片载体的底面。
7.一种用于将电路板与三维阵列的半导体芯片组装在一起的系统,其特征在于,它包括:
a)多个安装在电路板上的芯片载体,其具有用于将芯片直接放置到每一芯片载体下的所述电路板上的空间,以及用于将芯片放置到所述芯片载体上,从而在所述电路板上产生三维的芯片阵列;和
b)用于在电路板组装工序期间,保持和移动所述多个芯片载体的载体架,所述载体架具有腔室矩阵,其结构类似于至少在所述载体架的顶侧打开的腔室的形状,形成的每一腔室用于在电路板的组装工序期间,保持芯片载体,所述芯片载体放置在所述载体架的每一所述腔室内,所述芯片载体的顶部、芯片接收侧从所述载体架的顶部向外,从而使得在所述电路板的组装工序中能够进入所述芯片载体的所述顶侧。
8.如权利要求7所述的系统,其特征在于,还包括保护屏障,用以在所述组装工序期间,使所述芯片载体免受非故意之改变。
9.如权利要求8所述的系统,其特征在于,
a)所述载体架的所述腔室在所述载体架的底侧处也是开口的,且所述保护屏障包括在每一所述腔室的上部外围边缘周围的多个结合点,所述芯片载体具有制动法兰,使之能够停留在所述载体架的腔室中且不会落入其内,所述结合点的位置使得当芯片载体在所述腔室中时,其顶部低于所述结合点的顶部,从而受到所述结合点的保护而免受非故意之改变;以及
b)所述系统还包括具有类似于抬高部分的阵列的矩阵的印刷固定支架,所述抬高部分阵列的位置和形状使得每一抬高部分对应于所述载体架的腔室,从而当所述印刷固定支架位于所述载体架下方而将面向所述载体架的抬高部分中每一抬高部分配合到相邻腔室的底部开口中时,所述抬高部分的周长小于所述腔室的内周长,使得所述抬高部分的顶面能够向上靠住所述腔室中的芯片载体的底面,并在电路板组装工序期间固定并且是可拆卸地保持所述芯片载体。
10.如权利要求9所述的系统,其特征在于,所述抬高部分中的每一部分在相邻位于所述腔室中的芯片载体的底侧的顶侧处具有一个孔隙,从而在所述抬高部分和所述芯片载体之间可以产生真空,以便于在所述模板印刷工艺期间能固定并且是可拆卸地保持所述芯片载体。
11.如权利要求9所述的系统,其特征在于,在所述电路板组装工序期间,所述印刷固定支架安装在所述电路板组装工序期间的移动和定位机构上,使得它能够位于具有芯片载体的所述载体架下方,从而在所述模板印刷步骤期间,保持所述芯片载体,并且在所述模板印刷步骤期间恰当地放置所述芯片载体,并在所述模板印刷步骤完成以后,确保所述芯片载体脱离。
12.如权利要求7所述的系统,其特征在于,还包括在所述组装工序期间移动和放置所述载体架的机构,从而可以制备由所述载体架所保持的所述多个芯片载体,以便于在所述组装工序期间接收芯片,并容易从所述载体架上进入、移动芯片,并且放置在芯片位于所述每一芯片载体上而直接位于所述电路板上方的所述电路板上,从而在所述电路板上产生三维阵列的芯片。
13.一种在半导体制造工序期间用于放置并以可拆卸固定方式保持芯片模块的装置,其特征在于,它包括:
保持芯片模块的载体架,所述载体架具有二维矩阵的腔室,所述腔室在所述载体架的第一和第二相向侧处是开口的,所述腔室具有能够容纳和保持芯片载体的腔室尺寸,并且所述腔室还包括保护屏障,用于保护位于所述腔室中的芯片载体;
印刷固定支架,它具有二维矩阵的抬高部分,该部分与所述载体架的所述腔室矩阵配合,从而所述抬高部分的尺寸使得所述凸起部分能够一个一个地从所述载体架的第二侧装入所述载体架的所述腔室内;并且
其中,当用芯片模块填入所述腔室并且当所述印刷固定支架在所述载体架处与所述载体架结合时,所述抬高部分的第二侧将使位于所述腔室中的芯片模块抬高到一加工位置上,从该工作位置上,可以从所述载体架的第一侧对其进行加工。
14.如权利要求13所述的设备,其特征在于,所述抬高部分在其各个顶部都具有开口,每一开口可进入所述印刷固定支架中的内部空间内,并且当所述印刷固定支架与所述载体架结合时,所述抬高部分的顶部靠住位于每一腔室中芯片模块的底部,并且在所述抬高部分的所述顶部和所述芯片模块顶部之间产生真空,从而在对其进行加工时,以可拆卸固定方式保持所述芯片模块,所述真空是通过采用安装在所述印刷固定支架底部处的开口处的空心轴将所述印刷固定支架的底部安装到真空机器上来获得的,所述开口伸入所述印刷固定支架的内部空间内。
15.如权利要求13所述的设备,其特征在于,所述芯片模块是芯片载体。
16.如权利要求13所述的设备,其特征在于,当所述载体架的所述腔室具有位于其间的芯片模块并且所述印刷固定支架并不与所述载体架结合在一起时,所述模块的顶面完全隐藏在低于所述载体架的所述第一侧的顶面的所述腔室内,而当所述印刷固定支架与所述载体架结合在一起从而抬高所述模块时,所述每一模块的底部伸出高于所述载体架第一侧的顶面上方。
17.如权利要求13所述的设备,其特征在于,所述保护屏障是一系列位于所述腔室的顶部外边缘周围处的抬高邻接点,并且所述芯片载体具有制动法兰,使所述芯片载体停留在低于所述邻接点高度的腔室中。
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2002
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- 2002-03-14 JP JP2002571757A patent/JP4484430B2/ja not_active Expired - Fee Related
- 2002-03-14 EP EP02719349A patent/EP1378152A4/en not_active Withdrawn
- 2002-03-14 KR KR1020037012004A patent/KR100897314B1/ko not_active IP Right Cessation
- 2002-03-14 CN CNB028095707A patent/CN100369536C/zh not_active Expired - Fee Related
- 2002-03-14 WO PCT/US2002/009203 patent/WO2002074024A2/en active Application Filing
- 2002-03-14 AU AU2002250437A patent/AU2002250437A1/en not_active Abandoned
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2004
- 2004-01-21 JP JP2004013722A patent/JP4484532B2/ja not_active Expired - Fee Related
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106885982A (zh) * | 2013-11-11 | 2017-06-23 | 罗斯柯公司 | 用于处理构件的载体,组件和方法 |
CN115440684A (zh) * | 2022-09-22 | 2022-12-06 | 聊城市吉星新能源科技有限公司 | 一种芯片降温装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4484532B2 (ja) | 2010-06-16 |
US7103970B2 (en) | 2006-09-12 |
WO2002074024A3 (en) | 2002-12-27 |
JP4484430B2 (ja) | 2010-06-16 |
EP1378152A2 (en) | 2004-01-07 |
HK1066967A1 (en) | 2005-04-01 |
KR20030083734A (ko) | 2003-10-30 |
US20040194301A1 (en) | 2004-10-07 |
WO2002074024A2 (en) | 2002-09-19 |
JP2004134814A (ja) | 2004-04-30 |
CN100369536C (zh) | 2008-02-13 |
EP1378152A4 (en) | 2006-02-01 |
US20020162215A1 (en) | 2002-11-07 |
JP2004523915A (ja) | 2004-08-05 |
KR100897314B1 (ko) | 2009-05-14 |
AU2002250437A1 (en) | 2002-09-24 |
US7316060B2 (en) | 2008-01-08 |
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