CN1519926A - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
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- CN1519926A CN1519926A CNA2004100025575A CN200410002557A CN1519926A CN 1519926 A CN1519926 A CN 1519926A CN A2004100025575 A CNA2004100025575 A CN A2004100025575A CN 200410002557 A CN200410002557 A CN 200410002557A CN 1519926 A CN1519926 A CN 1519926A
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- Prior art keywords
- film
- infrared absorption
- semiconductor device
- diffusion barrier
- key
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- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003024350 | 2003-01-31 | ||
JP024350/2003 | 2003-01-31 | ||
JP175627/2003 | 2003-06-19 | ||
JP2003175627A JP4746829B2 (ja) | 2003-01-31 | 2003-06-19 | 半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1519926A true CN1519926A (zh) | 2004-08-11 |
CN1319165C CN1319165C (zh) | 2007-05-30 |
Family
ID=32775207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100025575A Expired - Fee Related CN1319165C (zh) | 2003-01-31 | 2004-01-30 | 半导体器件及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7045895B2 (zh) |
JP (1) | JP4746829B2 (zh) |
CN (1) | CN1319165C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101017808B (zh) * | 2006-02-06 | 2010-06-16 | 恩益禧电子股份有限公司 | 半导体器件及其制造方法 |
Families Citing this family (18)
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WO2007001337A2 (en) * | 2004-08-18 | 2007-01-04 | Dow Corning Corporation | Coated substrates and methods for their preparation |
US7253121B2 (en) * | 2004-09-09 | 2007-08-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for forming IMD films |
US8084294B2 (en) | 2005-02-18 | 2011-12-27 | Nec Corporation | Method of fabricating organic silicon film, semiconductor device including the same, and method of fabricating the semiconductor device |
JP4656147B2 (ja) | 2005-09-13 | 2011-03-23 | 日本電気株式会社 | 多孔質絶縁膜の形成方法および半導体装置 |
WO2007061134A1 (ja) | 2005-11-24 | 2007-05-31 | Nec Corporation | 多孔質絶縁膜の形成方法、半導体装置の製造装置、半導体装置の製造方法及び半導体装置 |
US7595556B2 (en) * | 2005-12-28 | 2009-09-29 | Dongbu Hitek Co., Ltd. | Semiconductor device and method for manufacturing the same |
CN101495674B (zh) | 2006-07-21 | 2013-07-17 | 瑞萨电子株式会社 | 多孔质绝缘膜的形成方法 |
US20080124946A1 (en) * | 2006-11-28 | 2008-05-29 | Air Products And Chemicals, Inc. | Organosilane compounds for modifying dielectrical properties of silicon oxide and silicon nitride films |
DE102007004860B4 (de) * | 2007-01-31 | 2008-11-06 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zur Herstellung einer Kupfer-basierten Metallisierungsschicht mit einer leitenden Deckschicht durch ein verbessertes Integrationsschema |
US8334204B2 (en) * | 2008-07-24 | 2012-12-18 | Tokyo Electron Limited | Semiconductor device and manufacturing method therefor |
WO2010098151A1 (ja) | 2009-02-24 | 2010-09-02 | 日本電気株式会社 | 半導体装置およびその製造方法 |
US8349746B2 (en) * | 2010-02-23 | 2013-01-08 | Applied Materials, Inc. | Microelectronic structure including a low k dielectric and a method of controlling carbon distribution in the structure |
JP5607394B2 (ja) * | 2010-03-16 | 2014-10-15 | 大陽日酸株式会社 | 層間絶縁膜の成膜方法および層間絶縁膜 |
US10510665B2 (en) * | 2014-11-20 | 2019-12-17 | Samsung Electronics Co., Ltd. | Low-k dielectric pore sealant and metal-diffusion barrier formed by doping and method for forming the same |
US9735028B2 (en) * | 2015-03-12 | 2017-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for forming semiconductor device structure with fine line pitch and fine end-to-end space |
US9865609B2 (en) * | 2016-01-28 | 2018-01-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | One-time-programming (OTP) memory cell with floating gate shielding |
JP6711673B2 (ja) * | 2016-04-06 | 2020-06-17 | キヤノン株式会社 | 光電変換装置、光電変換装置の製造方法及び撮像システム |
JP2021082703A (ja) * | 2019-11-19 | 2021-05-27 | キオクシア株式会社 | 半導体装置およびその製造方法 |
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TW362118B (en) * | 1995-10-30 | 1999-06-21 | Dow Corning | Method for depositing amorphous SiNC coatings |
JP3226479B2 (ja) * | 1996-08-29 | 2001-11-05 | 松下電器産業株式会社 | 層間絶縁膜の形成方法 |
US6340435B1 (en) * | 1998-02-11 | 2002-01-22 | Applied Materials, Inc. | Integrated low K dielectrics and etch stops |
US6436824B1 (en) * | 1999-07-02 | 2002-08-20 | Chartered Semiconductor Manufacturing Ltd. | Low dielectric constant materials for copper damascene |
US6593653B2 (en) * | 1999-09-30 | 2003-07-15 | Novellus Systems, Inc. | Low leakage current silicon carbonitride prepared using methane, ammonia and silane for copper diffusion barrier, etchstop and passivation applications |
US6784485B1 (en) | 2000-02-11 | 2004-08-31 | International Business Machines Corporation | Diffusion barrier layer and semiconductor device containing same |
US6417092B1 (en) * | 2000-04-05 | 2002-07-09 | Novellus Systems, Inc. | Low dielectric constant etch stop films |
US6489030B1 (en) * | 2000-04-14 | 2002-12-03 | Honeywell International, Inc. | Low dielectric constant films used as copper diffusion barrier |
JP4048112B2 (ja) * | 2000-08-18 | 2008-02-13 | 東京エレクトロン株式会社 | 半導体装置の製造方法および半導体装置 |
JP2002083870A (ja) * | 2000-09-11 | 2002-03-22 | Tokyo Electron Ltd | 半導体装置及びその製造方法 |
US6441491B1 (en) * | 2000-10-25 | 2002-08-27 | International Business Machines Corporation | Ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device containing the same |
JP2002319619A (ja) | 2001-04-20 | 2002-10-31 | Matsushita Electric Ind Co Ltd | 半導体装置およびエッチング方法 |
US6737747B2 (en) * | 2002-01-15 | 2004-05-18 | International Business Machines Corporation | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof |
US6764952B1 (en) * | 2002-03-13 | 2004-07-20 | Novellus Systems, Inc. | Systems and methods to retard copper diffusion and improve film adhesion for a dielectric barrier on copper |
-
2003
- 2003-06-19 JP JP2003175627A patent/JP4746829B2/ja not_active Expired - Fee Related
-
2004
- 2004-01-23 US US10/763,847 patent/US7045895B2/en not_active Expired - Lifetime
- 2004-01-30 CN CNB2004100025575A patent/CN1319165C/zh not_active Expired - Fee Related
-
2006
- 2006-03-22 US US11/386,234 patent/US7482263B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101017808B (zh) * | 2006-02-06 | 2010-06-16 | 恩益禧电子股份有限公司 | 半导体器件及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US7482263B2 (en) | 2009-01-27 |
CN1319165C (zh) | 2007-05-30 |
US20040150110A1 (en) | 2004-08-05 |
JP4746829B2 (ja) | 2011-08-10 |
JP2004289105A (ja) | 2004-10-14 |
US7045895B2 (en) | 2006-05-16 |
US20060166488A1 (en) | 2006-07-27 |
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