CN1441472A - 半导体装置及其制造方法、电路板和电子仪器 - Google Patents
半导体装置及其制造方法、电路板和电子仪器 Download PDFInfo
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- CN1441472A CN1441472A CN03103779A CN03103779A CN1441472A CN 1441472 A CN1441472 A CN 1441472A CN 03103779 A CN03103779 A CN 03103779A CN 03103779 A CN03103779 A CN 03103779A CN 1441472 A CN1441472 A CN 1441472A
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
本发明提供一种半导体装置的制造方法,该方法包含:(a)在模具(40)的凹部(42)设置多个散热体(32)一体化的集合体(30);(b)在模具(40)中设置平面排列配置了多个半导体片(20)的基板,使多个半导体片(20)配置在凹部(42)内;(c)通过在凹部(42)中填充密封材料,密封多个半导体片(20),并且安装集合体(30)的工序。利用本发明的半导体装置的制造方法,可提高具有散热体的半导体装置的生产性。
Description
技术领域
本发明涉及半导体装置及其制造方法、电路板和电子仪器。
背景技术
在公知技术中有一种具有散热体的半导体装置。散热体通常被称作散热片。当密封半导体片时,通过至少把一部分嵌入密封部中而设置散热片。在密封时,常常应用使用金属模的模塑工序。通过设置散热片,能提高半导体装置的散热性。
在以往的模塑工序中,把切断为单片的多个散热片分别配置在用于形成密封部的任意空腔中。即有必要分散地处理多个单片的散热片,所以说在生产性方面还有待于改善。
发明内容
本发明就是为了解决上述的问题,其目的在于:提高具有散热体的半导体装置的生产性。
(1)本发明的半导体装置的制造方法包含:
(a)在模具的凹部设置多个散热体一体化的集合体;
(b)将平面排列配置了多个半导体片的基板,以把所述多个半导体片配置在所述凹部内的方式配置在所述模具中。
(c)通过在所述凹部中填充密封材料,密封所述多个半导体片,并且安装所述集合体。
根据本发明,通过在模具中设置多个散热体一体化的集合体,能把多个散热体统一安装在基板上。因此,能提高例如多个散热体对多个半导体片的统一定位等具有散热体的半导体装的生产性。
(2)在该半导体装置的制造方法中,在所述(a)工序中,可以在使其接触所述凹部的底面的状态下,设置所述集合体的所述散热体的部分。
据此,能使散热体在与基板相反一侧从密封材料露出。因此,能提高半导体片的散热性。另外,因为密封材料不蔓延到集合体和模具的接触部分,所以能减少密封材料的附着导致的模具的清理的次数。
(3)在该半导体装置的制造方法中,所述集合体的外周可以直立形成;
在所述(a)工序中,通过所述直立部,以从所述凹部的底面浮起的状态设置所述集合体的所述散热体的部分。
据此,能使散热体在与基板相反一侧由密封材料覆盖。
(4)在该半导体装置的制造方法中,可以在所述集合体的所述散热体的部分可以形成了凸部;
在所述(a)工序中,使所述凸部向着所述凹部的开口一侧,设置所述集合体。
据此,能向着半导体片配置散热体的凸部。因此,散热体和半导体片的距离减小,所以能进一步提高半导体片的散热性。
(5)在该半导体装置的制造方法中,所述凸部可以由半蚀刻形成。
(6)在该半导体装置的制造方法中,所述集合体的至少任意一方的面可以形成了粗糙面。
据此,集合体的单面或双面形成了粗糙面。例如如果使散热体的部分中从密封材料的露出面为粗糙面,则能增大散热体的露出面积,所以能进一步提高半导体片的散热性。另外,例如如果使散热体的部分中的与密封材料的接触面为粗糙面,就能提高散热体和密封材料的紧贴性。
(7)在该半导体装置的制造方法中,在所述集合体的所述散热体的部分上可以形成了多个通孔。
据此,密封材料也进入通孔内,所以能提高散热体和密封材料的紧贴性。
(8)在该半导体装置的制造方法中,在所述(c)工序后,还可以包含:(d)通过把所述密封部和所述基板按各所述集合体切断,形成具有所述散热体的单片。
(9)在该半导体装置的制造方法中,可以在所述集合体上,沿着所述(d)工序中的切断线,形成了纵剖面几乎连续的形状的突起部;
在所述(d)工序中,通过切断所述突起部,使所述散热体在所述单片的上部和侧部露出。
(10)在该半导体装置的制造方法中,在所述集合体上,可以连接多个所述散热体,形成了局部吊起所述散热体的吊起部。
据此,能在半导体装置的平面的一部分上设置散热体。因此,能实现散热体的轻型化和小型化。另外,能避开接合在半导体片上的引线而配置散热体。因此,能防止散热体对引线的电信号的干扰。
(11)在该半导体装置的制造方法中,所述吊起部延伸为与所述(d)工序中的切断线交叉;
在所述(d)工序中,切断所述集合体中的所述吊起部。
(12)在该半导体装置的制造方法中,在所述集合体上,可以形成了:所述散热体的外框;连接所述散热体和所述外框,并且局部吊起所述散热体的吊起部。
据此,在集合体上形成了散热体的外框。
(13)在该半导体装置的制造方法中,所述外框沿着所述(d)工序中的切断线延伸;
在所述(d)工序中,切断所述集合体中的所述吊起部。
(14)在该半导体装置的制造方法中,所述半导体片的外形形成了矩形;
所述吊起部形成在与所述半导体片的角部对应的位置。
(15)在该半导体装置的制造方法中,所述集合体的所述散热体的部分的外形可以形成了矩形;
所述吊起部吊起所述散热体的部分的多个角部。
(16)在该半导体装置的制造方法中,所述集合体的所述散热体的部分可以通过所述吊起部在规定方向移动;
在所述(a)工序中,向着所述凹部的开口一侧设置所述散热体的移动的一侧。
据此,能在与基板相反的一侧用密封材料覆盖散热体。另外,因为散热体靠近半导体片,所以能进一步提高半导体片的散热性。
(17)本发明的半导体装置由所述方法制造。
(18)本发明的半导体装置具有:基板;
平面并列配置在所述基板上的多个半导体片;
在所述基板上统一密封所述多个半导体片的密封部;
包含多个成为所述半导体片的散热体的部分,所述多个散热体的部分一体化形成的集合体。
(19)在该半导体装置中,所述集合体可以在与所述基板相反一侧从所述密封部露出。
(20)在该半导体装置中,所述集合体的至少一部分可以在与所述基板相反一侧由所述密封部覆盖。
(21)本发明的电路板安装了所述半导体装置。
(22)本发明的电子仪器具有所述半导体装置。
附图说明
图1是表示本发明实施例1的图。
图2是表示本发明实施例1的图。
图3是表示本发明实施例1的图。
图4是表示本发明实施例1的图。
图5是表示本发明实施例1的图。
图6是表示本发明实施例1的图。
图7是表示本发明实施例2的图。
图8是表示本发明实施例2的图。
图9是表示本发明实施例3的图。
图10是表示本发明实施例4的图。
图11是表示本发明实施例4的图。
图12是表示本发明实施例5的图。
图13是表示本发明实施例5的图。
图14是表示本发明实施例6的图。
图15是表示本发明实施例6的图。
图16是表示本发明实施例7的图。
图17是表示本发明实施例7的图。
图18是表示本发明实施例7的变形例的图。
图19是表示本发明实施例7的变形例的图。
图20是表示本发明实施例7的图。
图21是表示本发明实施例7的图。
图22是表示本发明实施例8的图。
图23是表示本发明实施例9的电路基板的图。
图24是表示本发明实施例9的电子机器的图。
图25是表示本发明实施例9的电子机器的图。
图中:10-基板;20-半导体片;30-集合体;32-散热体;40-模具;42-凹部;44-底面;50-密封部;60-集合体;62-散热体;70-集合体;72-散热体;80-集合体;82-散热体;84-通孔;90-集合体;92-散热体;94-凸部;100-集合体;102-散热体;104-直立部;110-集合体;112-散热体;114-突起部;115-侧部;120、130、140、150-集合体;122、132、142、152-散热体;124、134、144、154-吊起部;126、136、146-外框;138-直立部。
具体实施方式
下面,参照附图说明本发明实施例。但是,本发明并不局限于以下的实施例。
(实施例1)
图1~图6是表示本发明实施例1的半导体装置的制造方法的图。首先,如图1所示,在基板10上配置多个半导体片20。基板10如果成为单片,就成为半导体装置的插入物。
基板10可以由有机类(聚酰亚胺基板)或无机类(陶瓷基板、玻璃基板)的任意材料形成,也可以由它们的复合构造(玻璃环氧基板)形成。虽然未限定基板10的平面形状,但是如图1所示,常常为矩形。基板10可以是单层或多层基板。
为了在基板10上配置多个半导体片20,设置了多个配置区域12。配置区域12形成在基板10的任意一方或两方的面上。在图1所示的例子中,多个配置区域12在基板10的面上配置为多行多列(矩阵状)。
基板10具有由多条布线构成的布线图形14(参照图3)。具体而言,布线图形14形成在各配置区域12中。在基板10上可以形成用于电连接一方的面和另一方的面的多个通孔16(参照图3)。通孔16可以由导电材料嵌入,也可以电镀内壁面,成为通孔。通过这样,能从基板10的两面实现电连接。
虽然并未限定半导体片20的形状,但是如图1所示,常常形成长方体(包含立方体)。半导体片20形成由未图示的晶体管和存储元件等构成的集成电路。半导体片20具有电连接了集成电路的至少一个(常常为多个)电极(图中未示出)。电极可以在半导体片20的面的端部,沿着外形的2边或4边配置,也可以形成在面的中央部。电极可以由铝或铜类的金属形成。另外,在半导体片20上,避开电极的中央部,覆盖端部,形成了钝化膜(图中未示出)。钝化膜例如由SiO2、SiN、聚酰亚胺树脂等形成。
如图1所示,在基板10的多个配置区域12上分别配置半导体片20。把多个半导体片20平面地排列在基板10上。
如图2所示,电连接配置区域12和布线图形14。可以由引线24实现两者的电连接。这时,可以应用球凸台法。即让引出到工具(例如毛细管)的外部的引线24的顶端部熔化成球状,通过把它的顶端部热压接在电极上(最好同时使用超声波振动),把引线24电连接在电极22上。例如,可以把引线24接合了半导体芯片20的电极22后,接合基板10的布线图形14。这时,如图3所示,在电极22形成了凸台。
如图2所示,准备包含多个散热体(发散半导体片20的热)的集合体30。多个集合体30是一体化的。如果集合体30成为单片,就成为半导体片20的散热体32(参照图6)。散热体32也能称作散热片。集合体30最好由适于热交换的材料形成,但是未限定它的材料。例如,可以用铜类或铁类的材料形成。在图2所示的例子中,集合体30形成了板状。据此,因为加工简单,所以能抑制成本。集合体30可以一体加工一个构件,也可以通过组合多个构件而形成。例如,可以用半蚀刻或电镀法(电解或非电解电镀)等化学地加工,也可以用冲压加工或切断加工等机械地加工。
在集合体30上可以形成图中未示出的金属覆盖膜(例如电镀覆盖膜)。例如在集合体30中在外部露出的部分(在图4中,从密封部路出的部分)形成金属覆盖膜。当由铜类的材料形成了集合体30时,可以进行镀镍作为金属覆盖膜。通过这样,能提高集合体30(散热体32)的热传导。
在本实施例中,使用模具40密封基板10上的多个半导体片20,并且把集合体30安装在基板10上。
模具40具有凹部42。模具40可以是金属模。凹部42由能容纳多个凹部42的尺寸(宽度和深度)形成。凹部42的底面44可以是平面。
如图3所示,把集合体30设置在模具40的凹部42中。如果使集合体30的平面形状与凹部42的平面形状(例如底面44的形状)对应(例如同一形状)而形成,就能通过把集合体投入凹部42中,而简单地设置。
在图3所示的例子中,在使集合体30(成为散热体32的部分)接触凹部40的底面44的状态下设置。具体而言,在使形成板状的集合体30的一方的面与集合体30的底面44接触的状态下设置。据此,如图4所示能使散热体32在与基板10相反一侧从密封材料露出。因此,能提高半导体片20的散热性。另外,密封材料不延伸到集合体30和模具40的接触部分,所以能减少为了清洗密封材料的附着的模具40的清理次数。
接着,在模具40中设置基板10。这时,多个半导体片20位于凹部42内。然后,通过使密封材料流入凹部42,统一密封多个半导体片20。对密封材料可以使用树脂。这时,也能把树脂称作模压树脂。据此,因为统一密封多个半导体片20,所以能提高生产性。
这样,在多个半导体片20和集合体30之间设置密封材料。集合体30被接合在密封材料上。即通过密封材料的填充,能在基板10上安装集合体30。
这样,如图4所示,能制造内置多个半导体片20的半导体装置1。半导体装置1包含:基板10、多个半导体片20、密封多个半导体片20的密封部50、多个散热体32的部分一体化而形成的集合体30。在图4所示的例子中,集合体30在与基板10相反一侧从密封部50露出。在之后的工序中,半导体装置1切断为单片。即半导体装置1是用于制造多个单片的半导体装置3(参照图6)的中间制品。
在切断半导体装置1的工序之前,如图4所示,可以在基板10上设置多个外部端子52。在该时刻,因为能在多个半导体装置3上统一设置外部端子52,所以生产性优异。外部端子52可以是焊锡球。外部端子52可以设置在基板10的布线图形14的连接盘上。在图4所示的例子中,外部端子52配置在通孔的位置。
接着,如图5所示,切断半导体装置1(内置多个半导体片20)。具体而言,把密封部50和基板10按各集合体30切断。由切断工具(例如,硅片的切断中使用的刀)54切断。如图5所示,可以从集合体30一侧切断,或者可以从基板10一侧切断。如果预先形成切断线L(例如,双点划线表示的线),切断的定位就变得容易。
这样,如图6所示,能制造具有散热体32的单片的半导体装置3。半导体装置3包含:基板11、半导体片20、密封半导体片20的密封部51、散热体32。在图6所示的例子中,散热体32在与基板10相反一侧从密封部50露出。
根据本实施例的半导体装置的制造方法,通过把包含多个散热体32的集合体30设置在模具40中,能统一把多个散热体32安装在基板10上。因此,能提高例如使多个散热体32对多个半导体片20统一定位等的具有散热体32的半导体装置的生产性。
本实施例的半导体装置包含从想由上述的制造方法选择的任意的特定事项导出的结构,本实施例的半导体装置的效果具有上述的效果。如图4所示,本实施例的半导体装置包含有上述的制造方法的过程制造的。
本发明并不局限于本实施例,能应用于各种形态。在以下的实施例的说明中,省略了与其它实施例公共的事项(结构、作用、功能和效果)。须指出的是,也包含通过组合多个实施例能实现的事项。
(实施例2)
图7和图8是表示实施例2的单片的半导体装置的图。在本实施例中,集合体(在图7和图8中,是切断后的散热体)的形态与上述不同。具体而言,集合体的至少一方的面(单面或双面)形成了粗糙面。
如图7所示,集合体60的向着基板10一侧的面64可以是粗糙面。可以对集合体60的面64进行粗糙化处理,使其失去平坦性。能使用喷沙机械地破坏集合体60的面64,或使用等离子体、紫外线、臭氧等物理地破坏集合体60的面64,或使用蚀刻剂化学地破坏集合体60的面64。须指出的是,至少集合体60的散热体62的部分形成了粗糙面。
据此,集合体60(或散热体62)的向着基板10一侧成为与密封材料(密封部51)的接触部。因此,能增大集合体60和密封材料的接触面积,或增大物理、化学上的接合力,能提高两者的紧贴性。
如图8所示,集合体70的与基板10相反一侧的面74可以是粗糙面。在图8所示的例子中,集合体70的面74从密封材料露出。至少集合体70的散热体72的部分可以形成粗糙面。
据此,通过使集合体70的(或散热体72)与相反一侧的面74为粗糙面,能增大露出面积。因此,能进一步提高半导体片的散热性。
与图示的例子不同,也可以在集合体的两面(至少成为散热体的部分的两面)形成粗糙面。通过这样,能实现上述的双方的效果。
(实施例3)
图9是表示实施例3的单片的半导体装置的图。在实施例中,在集合体80(在图9中,是切断后的散热体82)上形成了多个通孔84。通孔84贯穿集合体80的向着基板10的面和与相反的面。多个通孔84可以由蚀刻化学地形成,或由钻等物理地形成。
通过在集合体80上形成通孔84,因为密封材料也进入通孔84内,所以能提高集合体80(或散热体82)和密封材料(或密封部51)的紧贴性。
(实施例4)
图10和图11是表示实施例4的半导体装置的制造方法的图。在本实施例中,在集合体90上形成了凸部94。
如图10所示,把凸部94向着模具40的凹部42的开口一侧设置。即让凸部94与半导体片20相对。
在集合体90的多个成为散热体92的部分形成凸部94。即让一个凸部94与任意一个半导体片20对应而形成。凸部94的平面形状可以比半导体片20的平面形状小。例如,如图10所示,当沿着半导体片20的各边配置多个电极22时,凸部94可以具有可以配置在由多个电极22围成的区域的内侧的平面形状。据此,能避开引线24配置凸部94,所以能避免集合体90和引线24的接触。另外,因为可以不受引线24的环形高度的限制,使散热体92由于凸部94而局部地增厚,所以能提高半导体片20的散热性。须指出的是,如图10所示,凸部94可以与半导体片20的面不接触。
对集合体90形成凸部94的方法例如可以应用半蚀刻法形成。或,用电镀法形成。这时,集合体90由一个构件形成。与这些不同,也可以通过在集合体90的成为散热体92的部分安装另外的构件(无论是相同材料还是不同材料),在集合体90设置凸部94。这时,可以通过焊接或粘接或机械的接合(铆接等)安装两者。
然后,进行规定的工序(密封工序和切断工序),就能取得图11所示的单片的半导体装置。
根据本实施例,把散热体92的凸部94向着半导体片20配置。因此,缩小了散热体92和半导体片20的距离,所以能进一步提高半导体片20的散热性。
(实施例5)
图12和图13是表示实施例5的半导体装置的制造方法的图。在本实施例中,在集合体100的外周端部形成了直立部104。即直立形成了集合体100的外周。
如图12所示,通过直立部104把集合体100的散热体102的部分以从凹部42的底面44浮起的状态设置。在图12所示的例子中,集合体100在除去直立部104的部分,与凹部42的底面44是不接触的。
直立部104可以设置在直立部104的外周端部的全部上,也可以局部(例如矩形的集合体100的角部或相对的2边)。直立部104的形成方法例如通过进行半蚀刻、电镀法或机械的深冲加工而从一个构件形成。或者,通过在集合体100的外周端部安装另外的构件(无论是相同材料还是不同材料),设置直立部104。
然后,进行规定的工序(密封工序和切断工序),就能取得图13所示的单片的半导体装置。因为是从凹部42的底面44浮起的状态下密封了散热体104,所以如图13所示,在与基板10相反一侧能用密封材料覆盖散热体104。通过这样,使散热体102不在外部露出,能提高半导体片20的散热性。须指出的是,如图13所示,散热体102可以从半导体装置的侧部露出。
(实施例6)
图14和图15是表示实施例6的半导体装置的制造方法的图。在本实施例中,在集合体110上沿着切断线L(参照图5)形成了纵剖面几乎成连续的形状的的突起部114。即在集合体110的俯视图中,突起部114具有沿着切断线L延伸的带状(具有规定的宽度),由突起部114划分的区域成为散热体112。突起部114的宽度最好比切断工序中的切断工具(参照图5)的刀的宽度还大。通过这样,能简单地切断突起部114的中心轴。
如图14所示把突起部114向着模具40的凹部42的开口一侧设置。即把突起部114向着基板10设置。在图14所示的例子中,在突起部114中带有突起的顶端部变细的锥度。
如图14所示,在集合体110的与突起部114相反一侧形成了凹陷116。凹陷116为纵剖面几乎连续的形状。即在集合体110的俯视图中,凹陷116成为沿着切断线L延伸的沟。在图14所示的例子中,在凹陷116上带有开口变宽的锥度。通过这样,当从凹陷116一侧切断集合体110时,能使切断工具54的刀的位置与凹陷116(或凹陷116)的中心轴一致,所以能正确地切断。须指出的是,在凹陷116也可以不填充密封材料。
对集合体110形成突起部114(以及凹陷116)的方法可以是通过进行机械的深冲加工,由一个构件形成。或者,通过安装另外的构件而形成。
然后,进行规定的工序(密封工序和切断工序),就能取得图15所示的单片的半导体装置。在切断工序中,因为切断突起部114(以及凹陷116),所以在单片的半导体装置的上部113和侧部115露出了散热体112。在图15所示的例子中,散热体112构成角锥台形状的一部分。作为变形例,散热体112可以构成球体的一部分(例如半球)。
据此,因为设置散热体112使其包围半导体片20,所以能进一步提高半导体片20的散热性。另外,通过形成凹陷116,能识别切断线L的位置,所以切断的位置变得容易。
(实施例7)
图16~图21是表示实施例7的半导体装置的制造方法的图。在本实施例中,集合体120包含:多个集合体120、局部吊起集合体120的吊起部124、散热体122的外框126。在本实施例中,集合体120具有与半导体装置的封装时使用的引线框的构造类似的构造。
通过加工板材,集合体120可以形成图16所示的形状。这时,可以通过蚀刻化学地加工,也可以冲压和冲切,物理地加工。例如可以应用制造引线框的工序形成。
散热体122的平面形状可以比半导体片20的平面形状小。例如当沿着半导体片20的各边配置了多个电极时,散热体122可以具有可以配置在由多个电极包围的区域的内侧的平面形状。通过这样,至少能避免散热体122和引线24的接触。另外,因为可以不受引线24的环形高度的限制,使散热体122增厚,所以能提高半导体片20的散热性。须指出的是,散热体122可以与半导体片20的面不接触。
散热体122形成角形(三角形、四角形和其他多角形)。例如,散热体122可以是与呈现矩形的半导体片20(在图16中,用双点划线表示)的相似形状。或者,散热体122可以是圆形或其他的形状。
一个散热体122最好由多个吊起部124吊起。吊起部124连接多个散热体122。吊起部124可以在与半导体片20的角部对应的位置吊起散热体122。通过这样,能避开接合在半导体片20上的引线24配置吊起部124,能避免两者的接触。吊起部124可以吊起为角形的散热体122的多个角部,在图16所示的例子中,吊起为矩形的散热体122的四个角部。
散热体122的外框126沿着切断线L延伸。即在密封工序后,沿着外框126切断了集合体120。通过设置外框126,能确保集合体120的强度,能容易地处理集合体120。
图17是图16所示的XVII-XVII线剖视图。如图17所示,通过吊起部124可以把散热体122的部分在规定方向(向着散热体122的一方的面(在图17中为上表面)的方向)移动。通过使吊起部124弯曲,能使散热体122移动。
如图20所示把上述的集合体120设置在模具40的凹部42中。具体而言,把散热体122的移动的一侧向着凹部42的开口一侧设置。据此,在与基板10相反一侧用密封材料覆盖了散热体122。另外,因为能使散热体122接近半导体片20,所以能进一步提高半导体片20的散热性。
然后进行规定的工序(密封工序和切断工序),就能得到图21所示的单片的半导体装置。
根据本实施例,能在半导体装置的平面的一部分设置散热体122。因此,能实现半导体装置的轻型化和小型化。另外,例如能避开接合在半导体片20上的引线24配置散热体122。因此,能防止散热体122对引线的电信号造成干扰。
图18和图19是表示集合体的变形例的图。
如图18所示,集合体130包含多个散热体132、吊起部134和外框136,还包含形成在外周端部的直立部138。这时,通过直立部138,在从凹部的底面浮起的状态下,设置集合体130的散热体132的部分。须指出的是,直立部138的事项如实施例5中所说明的。
如图19所示,集合体140具有多个散热体142、吊起部144和外框146,可以不使散热体142移动。须指出的是,当散热部142比其他部分还突起时,突起的方向(在图19中,向下)可以向着基板10一侧。
(实施例8)
图22是表示实施例8中使用的集合体的图。在本实施例中,与实施例7相比,省略了外框。即集合体包含多个散热体152和局部吊起散热体152的吊起部154。散热体152和154的事项如上所述。
如图22所示,吊起部154在与切断线L交叉的方向延伸。而且,在切断线L上只配置了吊起部154,据此,切断与切断线L交叉延伸的吊起部154,所以能简单地切断集合体150,能实现半导体装置的质量的稳定化。即能在不残留集合体150的切断屑的前提下,进行切断工序。
(实施例9)
图23表示了应用了上述的实施例的电路板。半导体装置3安装在电路板1000上。电路板1000一般使用例如玻璃环氧基板等有机类基板。在电路板1000上形成由铜等构成的布线图形,使其成为所需的电路,接合了布线图形和半导体装置的外部端子。
作为具有本发明实施例的半导体装置的电子仪器,图24表示笔记本型个人电脑2000,图25表示移动电话3000。
本发明并不局限于上述的实施例,能有各种变形。例如,本发明包含与实施例中说明的结构实质上相同的结构(例如,功能、方法以及结果相同的结构或目的以及结果相同的结构)。另外,本发明包含置换了实施例中说明的结构的非本质的部分的结构。另外,本发明包含与实施例中说明的结构能产生相同的作用的结构或能实现相同的目的的结构。另外,本发明包含在实施例中说明的结构中附加了众所周知的技术的结构。
Claims (22)
1.一种半导体装置的制造方法,包含:
(a)在模具的凹部设置多个散热体一体化的集合体;
(b)将平面排列配置了多个半导体片的基板,以把所述多个半导体片配置在所述凹部内的方式配置在所述模具中;
(c)通过在所述凹部中填充密封材料,密封所述多个半导体片,并且安装所述集合体。
2.根据权利要求1所述的半导体装置的制造方法,其中:在所述(a)工序中,在使其接触所述凹部的底面的状态下,设置所述集合体的所述散热体的部分。
3.根据权利要求1所述的半导体装置的制造方法,其中:所述集合体的外周直立形成;
在所述(a)工序中,通过所述直立部,以从所述凹部的底面浮起的状态设置所述集合体的所述散热体的部分。
4.根据权利要求1~3中的任意一项所述的半导体装置的制造方法,其中:在所述集合体的所述散热体的部分形成了凸部;
在所述(a)工序中,使所述凸部向着所述凹部的开口一侧,设置所述集合体。
5.根据权利要求4所述的半导体装置的制造方法,其中:所述凸部由半蚀刻形成。
6.根据权利要求1~5中的任意一项所述的半导体装置的制造方法,其中:所述集合体的至少任意一方的面形成了粗糙面。
7.根据权利要求1~6中的任意一项所述的半导体装置的制造方法,其中:在所述集合体的所述散热体的部分上形成了多个通孔。
8.根据权利要求1~7中的任意一项所述的半导体装置的制造方法,其中:在所述(c)工序后,还包含:(d)通过把所述密封部和所述基板按各所述集合体切断,形成具有所述散热体的单片。
9.根据权利要求8所述的半导体装置的制造方法,其中:在所述集合体上,沿着所述(d)工序中的切断线,形成了纵剖面几乎连续的形状的突起部;
在所述(d)工序中,通过切断所述突起部,使所述散热体在所述单片的上部和侧部露出。
10.根据权利要求1~8中的任意一项所述的半导体装置的制造方法,其中:在所述集合体上,连接多个所述散热体,形成了局部吊起所述散热体的吊起部。
11.根据引用了权利要求8的权利要求10所述的半导体装置的制造方法,其中:所述吊起部延伸为与所述(d)工序中的切断线交叉;
在所述(d)工序中,切断所述集合体中的所述吊起部。
12.根据权利要求1~8中的任意一项所述的半导体装置的制造方法,其中:在所述集合体上,形成了:所述散热体的外框;连接所述散热体和所述外框,并且局部吊起所述散热体的吊起部。
13.根据引用了权利要求8的权利要求12所述的半导体装置的制造方法,其中:所述外框沿着所述(d)工序中的切断线延伸;
在所述(d)工序中,切断所述集合体中的所述吊起部。
14.根据权利要求10~13中的任意一项所述的半导体装置的制造方法,其中:所述半导体片的外形形成了矩形;
所述吊起部形成在与所述半导体片的角部对应的位置。
15.根据权利要求14所述的半导体装置的制造方法,其中:所述集合体的所述散热体的部分的外形形成了矩形;
所述吊起部吊起所述散热体的部分的多个角部。
16.根据权利要求10~15中的任意一项所述的半导体装置的制造方法,其中:所述集合体的所述散热体的部分通过所述吊起部在规定方向移动;
在所述(a)工序中,向着所述凹部的开口一侧设置所述散热体的移动的一侧。
17.一种由权利要求1~16中的任意一项所述的半导体装置的制造方法制造的半导体装置。
18.一种半导体装置,具有:基板;
平面并列配置在所述基板上的多个半导体片;
在所述基板上统一密封所述多个半导体片的密封部;
包含多个成为所述半导体片的散热体的部分,所述多个散热体的部分一体化形成的集合体。
19.根据权利要求18所述的半导体装置,其中:所述集合体在与所述基板相反一侧从所述密封部露出。
20.根据权利要求18所述的半导体装置,其中:所述集合体的至少一部分在与所述基板相反一侧由所述密封部覆盖。
21.一种安装了权利要求17~20中的任意一项所述的半导体装置的电路板。
22.一种具有权利要求17~20中的任意一项所述的半导体装置的电子仪器。
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-
2002
- 2002-02-25 JP JP2002048322A patent/JP3888439B2/ja not_active Expired - Fee Related
-
2003
- 2003-02-19 CN CNB031037798A patent/CN1316578C/zh not_active Expired - Fee Related
- 2003-02-24 US US10/371,441 patent/US6921683B2/en not_active Expired - Fee Related
Cited By (4)
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CN102036467A (zh) * | 2009-09-24 | 2011-04-27 | 李尔公司 | 电力电子印刷电路板和基板间的减小的热阻的系统和方法 |
CN102036467B (zh) * | 2009-09-24 | 2014-11-26 | 李尔公司 | 电力电子印刷电路板和基板间的减小的热阻的系统和方法 |
CN104051373A (zh) * | 2013-03-14 | 2014-09-17 | 矽品精密工业股份有限公司 | 散热结构、半导体封装件及其制法 |
CN104051373B (zh) * | 2013-03-14 | 2019-04-02 | 矽品精密工业股份有限公司 | 散热结构及半导体封装件的制法 |
Also Published As
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US6921683B2 (en) | 2005-07-26 |
CN1316578C (zh) | 2007-05-16 |
US20030164549A1 (en) | 2003-09-04 |
JP3888439B2 (ja) | 2007-03-07 |
JP2003249512A (ja) | 2003-09-05 |
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