CN1423276A - 薄膜压电体元件及其制造方法以及使用该薄膜压电体元件的致动器装置 - Google Patents
薄膜压电体元件及其制造方法以及使用该薄膜压电体元件的致动器装置 Download PDFInfo
- Publication number
- CN1423276A CN1423276A CN02148216A CN02148216A CN1423276A CN 1423276 A CN1423276 A CN 1423276A CN 02148216 A CN02148216 A CN 02148216A CN 02148216 A CN02148216 A CN 02148216A CN 1423276 A CN1423276 A CN 1423276A
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- piezoelectric
- piezoelectric element
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Links
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Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/54—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head into or out of its operative position or across tracks
- G11B5/55—Track change, selection or acquisition by displacement of the head
- G11B5/5521—Track change, selection or acquisition by displacement of the head across disk tracks
- G11B5/5552—Track change, selection or acquisition by displacement of the head across disk tracks using fine positioning means for track acquisition separate from the coarse (e.g. track changing) positioning means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/206—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Moving Of The Head To Find And Align With The Track (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Moving Of Heads (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Description
Claims (26)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001296829 | 2001-09-27 | ||
JP2001-296829 | 2001-09-27 | ||
JP2001296829A JP4904656B2 (ja) | 2001-09-27 | 2001-09-27 | 薄膜圧電体素子およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1423276A true CN1423276A (zh) | 2003-06-11 |
CN1251228C CN1251228C (zh) | 2006-04-12 |
Family
ID=19117999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021482160A Expired - Fee Related CN1251228C (zh) | 2001-09-27 | 2002-09-27 | 薄膜压电体元件及其制造方法以及使用该薄膜压电体元件的致动器装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6912760B2 (zh) |
EP (1) | EP1298735B1 (zh) |
JP (1) | JP4904656B2 (zh) |
CN (1) | CN1251228C (zh) |
DE (1) | DE60224148T2 (zh) |
HK (1) | HK1056040A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100411015C (zh) * | 2004-09-28 | 2008-08-13 | 新科实业有限公司 | 微驱动器、设有该微驱动器的磁头折片组合以及磁盘驱动器 |
CN104662608B (zh) * | 2012-09-27 | 2017-05-03 | 株式会社村田制作所 | 压电促动器及其制造方法、磁盘装置 |
CN106849741A (zh) * | 2015-11-13 | 2017-06-13 | 精工爱普生株式会社 | 压电致动器、层叠致动器、压电马达、机器人以及机械手 |
CN109643059B (zh) * | 2016-08-29 | 2023-08-04 | 爱沃特株式会社 | 防尘薄膜组件的制造方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3503386B2 (ja) | 1996-01-26 | 2004-03-02 | セイコーエプソン株式会社 | インクジェット式記録ヘッド及びその製造方法 |
US20030048041A1 (en) * | 2001-09-07 | 2003-03-13 | Hiroyuki Kita | Piezoelectric thin-film element and a manufacturing method thereof |
US7000459B2 (en) * | 2002-07-10 | 2006-02-21 | Seagate Technology Llc | Strain sensor patterned on MEMS flex arms |
WO2004040611A1 (en) * | 2002-10-29 | 2004-05-13 | Matsushita Electric Industrial Co., Ltd. | Switching apparatus, electric field applying method and switching system |
CN100399597C (zh) | 2002-12-03 | 2008-07-02 | 松下电器产业株式会社 | 薄膜压电体元件和其制造方法以及使用其的驱动器 |
JP4806896B2 (ja) * | 2003-03-06 | 2011-11-02 | パナソニック株式会社 | 薄膜圧電体素子、アクチュエータおよびディスク装置 |
US7884698B2 (en) * | 2003-05-08 | 2011-02-08 | Panasonic Corporation | Electronic component, and method for manufacturing the same |
US7456932B2 (en) * | 2003-07-25 | 2008-11-25 | Asml Netherlands B.V. | Filter window, lithographic projection apparatus, filter window manufacturing method, device manufacturing method and device manufactured thereby |
JP4433727B2 (ja) * | 2003-09-02 | 2010-03-17 | Tdk株式会社 | フレクシャ、サスペンションおよびヘッドジンバルアセンブリ |
JP4997716B2 (ja) * | 2005-06-21 | 2012-08-08 | Tdk株式会社 | 電子デバイスの製造方法 |
JP2007019290A (ja) * | 2005-07-08 | 2007-01-25 | Tdk Corp | 圧電薄膜振動子およびその製造方法、並びにそれを用いた駆動装置および圧電モータ |
JP5032949B2 (ja) * | 2007-11-14 | 2012-09-26 | エイチジーエスティーネザーランドビーブイ | マイクロアクチュエータ、ヘッド・ジンバル・アセンブリ及びディスク・ドライブ装置 |
WO2009099438A1 (en) * | 2008-02-05 | 2009-08-13 | Morgan Advanced Ceramics, Inc. | Encapsulation coating to reduce particle shedding |
JP4897767B2 (ja) | 2008-10-21 | 2012-03-14 | Tdk株式会社 | 薄膜圧電体素子及びその製造方法並びにそれを用いたヘッドジンバルアセンブリ、及びそのヘッドジンバルアセンブリを用いたハードディスクドライブ |
US9401469B2 (en) | 2014-09-29 | 2016-07-26 | Sae Magnetics (H.K.) Ltd. | Thin-film piezoelectric material element, method of manufacturing the same, head gimbal assembly, hard disk drive, ink jet head, variable focus lens and sensor |
US10679679B1 (en) * | 2018-12-21 | 2020-06-09 | Seagate Technology Llc | Slider test socket with clamp, and related assemblies and methods of use |
US11387402B2 (en) * | 2019-08-28 | 2022-07-12 | Signal Solutions, Llc | Piezoelectric sensor assembly |
JP7446964B2 (ja) * | 2020-09-29 | 2024-03-11 | 日本発條株式会社 | ディスク装置用サスペンションの製造方法と、製造装置 |
Family Cites Families (18)
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JPS60242800A (ja) * | 1984-05-17 | 1985-12-02 | Yokogawa Medical Syst Ltd | ダイスト・トランスデユ−サの製造方法 |
JP2642663B2 (ja) * | 1988-03-10 | 1997-08-20 | ヤマハ発動機株式会社 | めっき型熱電対 |
JPH01308927A (ja) | 1988-06-07 | 1989-12-13 | Matsushita Electric Ind Co Ltd | 焦電形赤外検出素子アレイ、焦電形赤外検出器およびその製法 |
JP3377874B2 (ja) | 1994-02-07 | 2003-02-17 | 松下電器産業株式会社 | 薄膜センサエレメント及びその製造方法 |
JP3405618B2 (ja) * | 1995-04-11 | 2003-05-12 | 松下電器産業株式会社 | バイモルフ圧電アクチュエータ |
US5692279A (en) * | 1995-08-17 | 1997-12-02 | Motorola | Method of making a monolithic thin film resonator lattice filter |
JP3053069B2 (ja) | 1995-12-23 | 2000-06-19 | 川崎重工業株式会社 | 積層型アクチュエータとその配線方法 |
JP3695494B2 (ja) | 1996-11-13 | 2005-09-14 | セイコーエプソン株式会社 | 光変調デバイス、その製造方法および表示装置 |
JP3420915B2 (ja) * | 1997-07-10 | 2003-06-30 | 富士通株式会社 | 圧電素子を用いたアクチュエータ及びこのアクチュエータを使用したヘッドの微小移動機構 |
JPH11142753A (ja) | 1997-11-04 | 1999-05-28 | Seiko Epson Corp | 変形可能ミラーデバイスの製造方法 |
JPH11138809A (ja) * | 1997-11-13 | 1999-05-25 | Seiko Epson Corp | アクチュエータ及びインクジェット式記録ヘッド |
JP2000002714A (ja) * | 1998-04-13 | 2000-01-07 | Matsushita Electric Ind Co Ltd | 圧電型加速度センサ、加速度検出方法、および圧電型加速度センサの製造方法 |
JPH11345833A (ja) * | 1998-06-01 | 1999-12-14 | Matsushita Electric Ind Co Ltd | 電子部品の製造方法 |
JP2000074739A (ja) * | 1998-08-31 | 2000-03-14 | Matsushita Electric Ind Co Ltd | 電子部品の製造方法 |
JP3690135B2 (ja) * | 1998-09-10 | 2005-08-31 | セイコーエプソン株式会社 | デバイスの製造方法 |
FR2786565B1 (fr) * | 1998-11-27 | 2000-12-22 | Commissariat Energie Atomique | Structure micro-usinee a membrane deformable et son procede de realisation |
JP4000733B2 (ja) * | 1999-06-30 | 2007-10-31 | セイコーエプソン株式会社 | 水晶振動片のエッチング方法とエッチング装置及びエッチング用の水晶片の収容器 |
JP2001250348A (ja) * | 2000-03-03 | 2001-09-14 | Matsushita Electric Ind Co Ltd | 圧電素子の固定構造、ヘッドの支持機構および情報記録装置 |
-
2001
- 2001-09-27 JP JP2001296829A patent/JP4904656B2/ja not_active Expired - Fee Related
-
2002
- 2002-09-25 DE DE2002624148 patent/DE60224148T2/de not_active Expired - Lifetime
- 2002-09-25 US US10/253,889 patent/US6912760B2/en not_active Expired - Lifetime
- 2002-09-25 EP EP20020021764 patent/EP1298735B1/en not_active Expired - Lifetime
- 2002-09-27 CN CNB021482160A patent/CN1251228C/zh not_active Expired - Fee Related
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2003
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100411015C (zh) * | 2004-09-28 | 2008-08-13 | 新科实业有限公司 | 微驱动器、设有该微驱动器的磁头折片组合以及磁盘驱动器 |
CN104662608B (zh) * | 2012-09-27 | 2017-05-03 | 株式会社村田制作所 | 压电促动器及其制造方法、磁盘装置 |
CN106849741A (zh) * | 2015-11-13 | 2017-06-13 | 精工爱普生株式会社 | 压电致动器、层叠致动器、压电马达、机器人以及机械手 |
CN106849741B (zh) * | 2015-11-13 | 2020-02-21 | 精工爱普生株式会社 | 压电致动器、层叠致动器、压电马达、机器人以及机械手 |
CN109643059B (zh) * | 2016-08-29 | 2023-08-04 | 爱沃特株式会社 | 防尘薄膜组件的制造方法 |
Also Published As
Publication number | Publication date |
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US20030057804A1 (en) | 2003-03-27 |
DE60224148D1 (de) | 2008-01-31 |
EP1298735A3 (en) | 2006-03-15 |
JP2003101095A (ja) | 2003-04-04 |
EP1298735A2 (en) | 2003-04-02 |
CN1251228C (zh) | 2006-04-12 |
DE60224148T2 (de) | 2008-04-10 |
JP4904656B2 (ja) | 2012-03-28 |
EP1298735B1 (en) | 2007-12-19 |
US6912760B2 (en) | 2005-07-05 |
HK1056040A1 (en) | 2004-01-30 |
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