CN1396943A - 液状热固化性树脂组合物与印刷电路板及其制造方法 - Google Patents
液状热固化性树脂组合物与印刷电路板及其制造方法 Download PDFInfo
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- CN1396943A CN1396943A CN01804252A CN01804252A CN1396943A CN 1396943 A CN1396943 A CN 1396943A CN 01804252 A CN01804252 A CN 01804252A CN 01804252 A CN01804252 A CN 01804252A CN 1396943 A CN1396943 A CN 1396943A
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- composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
- C08G59/5086—Triazines; Melamines; Guanamines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
- Y10T428/249985—Composition of adhesive or bonding component specified
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
成分(重量份) | 实施例 | 比较例 | |||||||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 1 | 2 | 3 | 4 | 5 | |
双酚A型环氧树脂 | 100 | 100 | 50 | - | 100 | 100 | 100 | 100 | 50 | - | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
双酚F型环氧树脂 | 50 | 100 | 50 | 100 | |||||||||||||
2MZ-A | 6 | 6 | 6 | 6 | 6 | 6 | 9 | - | 6 | 6 | 6 | 6 | - | - | 6 | 6 | 6 |
双氰胺 | 7 | ||||||||||||||||
三乙撑四胺 | 2 | 10 | |||||||||||||||
2PHZ | 6 | ||||||||||||||||
二氧化硅 | 164 | 164 | 164 | 164 | 82 | 164 | 164 | 164 | 164 | 164 | 246 | 164 | 164 | 164 | 246 | - | 164 |
有机膨润土 | 4 | 4 | 4 | 4 | 2 | 4 | 4 | 4 | 4 | 4 | 6 | 4 | 4 | 4 | 6 | - | 4 |
钛酸酯系偶合剂 | - | - | - | - | - | - | - | 1 | 1 | 1 | 2 | - | - | - | - | - | - |
硅烷系偶合剂 | 1 | ||||||||||||||||
溶剂 | 2 | 15 | |||||||||||||||
备注 | 双酚A型环氧树脂:ジヤパエポキシ(株)制,商品名エピユ-ト828双酚F型环氧树脂:ジヤパエポキシ(株)制,商品名エピユ-ト8072MZ-A:日本四国化成工为(株)制固化催化剂,2,4-二氨基-6-[2’-甲基咪唑-(1’)]-乙基-S-二吖嗪,商品名キユァゾ-ル2MZ-A双氰胺:日本ヅヤパエポキシ(株)制固化催化剂,商品名FP-10三乙撑四胺:日本住友精化(株)制固化催化剂2PHZ:四国化成工业(株)制固化催化剂,2-苯基-4,5-二氢氧基甲基咪唑商品名キユァゾ-ル2PHZ钛酸酯系偶合剂:日本曹达(株)制偶合剂,商品名A-1硅烷系偶合剂:日ユニカ-(株)制偶合剂,商品名A-187溶剂:大阪有机化学工业(株)制乙氧基乙氧基乙基乙酸酯,商品名酢酸エチルジユ-キゾ-ル |
特性 | 实施例 | 比较例 | |||||||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 1 | 2 | 3 | 4 | 5 | |
25℃的粘度[dPa·s] | 1027 | 975 | 830 | 782 | 515 | 1030 | 1112 | 750 | 663 | 624 | 1260 | 820 | 915 | 963 | 2130 | 25 | 564 |
熔融粘度(100℃)[dPa·s] | 4.2 | 3.2 | 3.5 | 3.3 | 2.8 | 3.9 | 3.3 | 3.2 | 3.2 | 2.9 | 5.0 | 3.5 | 5.4 | 3.3 | 18 | 2.0 | 2.3 |
胶化时间(100℃)[秒] | >1800 | >1800 | >1800 | >1800 | >1800 | >1800 | >1800 | >1800 | >1800 | >1800 | >1800 | >1800 | 220 | >1800 | >1800 | >1800 | >1800 |
胶化时间(130℃)[秒] | 390 | 492 | 373 | 321 | 492 | 385 | 523 | 370 | 359 | 336 | 366 | 356 | 47 | 1343 | 347 | 640 | 670 |
裂纹 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × | ○ | × | × |
残留气孔 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × | ○ | × | ○ | × |
填充性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × | × | ○ |
研磨性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × | × |
固化收缩 | 无 | 无 | 无 | 无 | 无 | 无 | 无 | 无 | 无 | 无 | 无 | 无 | 无 | 无 | 无 | 有 | 有 |
体积膨胀 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × | ○ | × | × |
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP363719/00 | 2000-11-29 | ||
JP2000363719 | 2000-11-29 | ||
JP363719/2000 | 2000-11-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1396943A true CN1396943A (zh) | 2003-02-12 |
CN1235971C CN1235971C (zh) | 2006-01-11 |
Family
ID=18834785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB01804252XA Expired - Lifetime CN1235971C (zh) | 2000-11-29 | 2001-11-14 | 液状热固化性树脂组合物与印刷电路板及其制造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6916873B2 (zh) |
EP (1) | EP1338624B1 (zh) |
JP (1) | JP4298291B2 (zh) |
KR (1) | KR100797061B1 (zh) |
CN (1) | CN1235971C (zh) |
AU (1) | AU2002215211A1 (zh) |
TW (1) | TW507507B (zh) |
WO (1) | WO2002044274A1 (zh) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100459825C (zh) * | 2004-11-10 | 2009-02-04 | 华通电脑股份有限公司 | 电路板塞孔材料整平方法及设备 |
CN101409982B (zh) * | 2007-10-09 | 2010-06-16 | 南亚电路板股份有限公司 | 电路板的制造方法 |
CN101854778A (zh) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | 一种对线路板导电孔进行树脂塞孔的制造工艺 |
CN102348337A (zh) * | 2010-04-30 | 2012-02-08 | 深圳崇达多层线路板有限公司 | 一种含有阶梯形盲孔的线路板制作方法 |
CN101544863B (zh) * | 2008-03-28 | 2012-04-25 | 太阳控股株式会社 | 印刷电路板用树脂组合物、干膜以及印刷电路板 |
CN101575439B (zh) * | 2008-05-07 | 2012-05-30 | 太阳控股株式会社 | 填孔用热固化性树脂组合物 |
CN103068916A (zh) * | 2010-09-27 | 2013-04-24 | 太阳控股株式会社 | 热固性树脂填充材料 |
CN103384453A (zh) * | 2013-07-11 | 2013-11-06 | 电子科技大学 | 一种印制电路内层可靠孔和线的加工方法 |
CN105101643A (zh) * | 2015-07-17 | 2015-11-25 | 昆山旭发电子有限公司 | 树脂塞孔工艺 |
US10316182B2 (en) | 2015-12-16 | 2019-06-11 | Industrial Technology Research Institute | Low dielectric constant and solventless resin composition and substrate structure |
CN110291152A (zh) * | 2018-01-16 | 2019-09-27 | 太阳油墨制造株式会社 | 热固性树脂组合物、其固化物和印刷电路板 |
CN117881096A (zh) * | 2024-03-13 | 2024-04-12 | 江苏普诺威电子股份有限公司 | 散热封装基板及其加工方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003046034A (ja) * | 2001-07-31 | 2003-02-14 | Nec Kagobutsu Device Kk | 樹脂封止型半導体装置 |
US7438969B2 (en) | 2002-07-10 | 2008-10-21 | Ngk Spark Plug Co., Ltd. | Filling material, multilayer wiring board, and process of producing multilayer wiring board |
JP4365641B2 (ja) * | 2002-07-10 | 2009-11-18 | 日本特殊陶業株式会社 | 多層配線基板及び多層配線基板の製造方法 |
JP4172257B2 (ja) * | 2002-11-21 | 2008-10-29 | 日立化成工業株式会社 | 樹脂ペースト組成物及びこれを用いた半導体装置。 |
KR100499004B1 (ko) * | 2002-12-18 | 2005-07-01 | 삼성전기주식회사 | 광비아홀을 구비하는 인쇄회로기판 및 가공 공정 |
TWI336220B (en) * | 2003-06-20 | 2011-01-11 | Japan Circuit Ind Co Ltd | A method of forming a high density printed wiring board for mounting a semiconductor |
KR20060120198A (ko) * | 2003-12-15 | 2006-11-24 | 세키스이가가쿠 고교가부시키가이샤 | 열경화성 수지 조성물, 기판용 재료 및 기판용 필름 |
JP2005184630A (ja) * | 2003-12-22 | 2005-07-07 | Mitsui Chemicals Inc | 撮像装置用の半導体チップ収納用筐体と撮像装置 |
JP4841830B2 (ja) * | 2004-01-08 | 2011-12-21 | 日本特殊陶業株式会社 | 配線基板の製造方法 |
JP3896398B2 (ja) * | 2004-02-25 | 2007-03-22 | サンノプコ株式会社 | 熱硬化性樹脂組成物 |
US7396499B2 (en) * | 2004-09-28 | 2008-07-08 | Thomas E Frankel | Multiple layered membrane with fluorine containing polymer layer |
JP2006241449A (ja) * | 2005-02-07 | 2006-09-14 | San Nopco Ltd | 熱硬化性樹脂組成物 |
DE102006016964A1 (de) * | 2006-04-11 | 2007-10-18 | Conti Temic Microelectronic Gmbh | Verfahren zur Herstellung einer elektronischen Baugruppe, elektronische Baugruppe sowie Trägerkörper hierfür |
JP5542360B2 (ja) * | 2009-03-30 | 2014-07-09 | 太陽ホールディングス株式会社 | プリント配線板 |
JP5507162B2 (ja) * | 2009-09-01 | 2014-05-28 | 京セラケミカル株式会社 | 電気二重層キャパシタ |
CN103533780A (zh) * | 2012-07-06 | 2014-01-22 | 欣兴电子股份有限公司 | 软硬复合板制造方法 |
CN103687335A (zh) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | 线路板选择性树脂塞孔的制作方法 |
CN105530768B (zh) * | 2014-09-28 | 2019-02-05 | 深南电路有限公司 | 一种电路板的制作方法及电路板 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3056637B2 (ja) * | 1994-05-06 | 2000-06-26 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
US5719225A (en) * | 1994-06-13 | 1998-02-17 | Sumitomo Chemical Company, Ltd. | Filler-containing resin composition suitable for injection molding and transfer molding |
JP3242009B2 (ja) * | 1995-10-23 | 2001-12-25 | イビデン株式会社 | 樹脂充填剤 |
JPH10224034A (ja) * | 1997-02-06 | 1998-08-21 | Ibiden Co Ltd | 樹脂充填剤および多層プリント配線板 |
TW399398B (en) * | 1998-01-07 | 2000-07-21 | Taiyo Ink Seizo K K | Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereof |
JP3548691B2 (ja) * | 1998-01-07 | 2004-07-28 | 太陽インキ製造株式会社 | 液状熱硬化性充填用組成物及びそれを用いたプリント配線板の永久穴埋め方法 |
JPH11286535A (ja) * | 1998-02-03 | 1999-10-19 | Taiyo Ink Mfg Ltd | 感光性・熱硬化性樹脂組成物及びそれを用いた樹脂絶縁パターンの形成方法 |
JP3413462B2 (ja) * | 1998-04-21 | 2003-06-03 | タツタ電線株式会社 | ホール充填用ペースト |
JP2000273287A (ja) * | 1999-03-25 | 2000-10-03 | Shin Etsu Chem Co Ltd | フリップチップ型半導体装置用アンダーフィル材及びフリップチップ型半導体装置 |
JP2000294890A (ja) * | 1999-04-09 | 2000-10-20 | Ngk Spark Plug Co Ltd | スルーホール充填用ペースト並びにそれを用いたプリント配線板及びその製造方法 |
-
2001
- 2001-11-14 JP JP2002546629A patent/JP4298291B2/ja not_active Expired - Lifetime
- 2001-11-14 WO PCT/JP2001/009955 patent/WO2002044274A1/ja active Application Filing
- 2001-11-14 AU AU2002215211A patent/AU2002215211A1/en not_active Abandoned
- 2001-11-14 EP EP20010983799 patent/EP1338624B1/en not_active Expired - Lifetime
- 2001-11-14 CN CNB01804252XA patent/CN1235971C/zh not_active Expired - Lifetime
- 2001-11-14 KR KR1020027009700A patent/KR100797061B1/ko active IP Right Grant
- 2001-11-20 TW TW90128699A patent/TW507507B/zh not_active IP Right Cessation
-
2002
- 2002-10-31 US US10/284,304 patent/US6916873B2/en not_active Expired - Lifetime
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100459825C (zh) * | 2004-11-10 | 2009-02-04 | 华通电脑股份有限公司 | 电路板塞孔材料整平方法及设备 |
CN101409982B (zh) * | 2007-10-09 | 2010-06-16 | 南亚电路板股份有限公司 | 电路板的制造方法 |
CN101544863B (zh) * | 2008-03-28 | 2012-04-25 | 太阳控股株式会社 | 印刷电路板用树脂组合物、干膜以及印刷电路板 |
CN101575439B (zh) * | 2008-05-07 | 2012-05-30 | 太阳控股株式会社 | 填孔用热固化性树脂组合物 |
CN101854778A (zh) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | 一种对线路板导电孔进行树脂塞孔的制造工艺 |
CN101854778B (zh) * | 2010-04-30 | 2011-10-26 | 深圳崇达多层线路板有限公司 | 一种对线路板导电孔进行树脂塞孔的制造工艺 |
CN102348337A (zh) * | 2010-04-30 | 2012-02-08 | 深圳崇达多层线路板有限公司 | 一种含有阶梯形盲孔的线路板制作方法 |
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CN103068916A (zh) * | 2010-09-27 | 2013-04-24 | 太阳控股株式会社 | 热固性树脂填充材料 |
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CN105101643A (zh) * | 2015-07-17 | 2015-11-25 | 昆山旭发电子有限公司 | 树脂塞孔工艺 |
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CN110291152A (zh) * | 2018-01-16 | 2019-09-27 | 太阳油墨制造株式会社 | 热固性树脂组合物、其固化物和印刷电路板 |
CN110291152B (zh) * | 2018-01-16 | 2022-08-19 | 太阳油墨制造株式会社 | 热固性树脂组合物、其固化物和印刷电路板 |
CN117881096A (zh) * | 2024-03-13 | 2024-04-12 | 江苏普诺威电子股份有限公司 | 散热封装基板及其加工方法 |
CN117881096B (zh) * | 2024-03-13 | 2024-05-24 | 江苏普诺威电子股份有限公司 | 散热封装基板及其加工方法 |
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US20030129383A1 (en) | 2003-07-10 |
JPWO2002044274A1 (ja) | 2004-04-02 |
EP1338624B1 (en) | 2013-03-13 |
CN1235971C (zh) | 2006-01-11 |
KR100797061B1 (ko) | 2008-01-23 |
JP4298291B2 (ja) | 2009-07-15 |
TW507507B (en) | 2002-10-21 |
AU2002215211A1 (en) | 2002-06-11 |
US6916873B2 (en) | 2005-07-12 |
EP1338624A4 (en) | 2005-08-17 |
KR20020077398A (ko) | 2002-10-11 |
EP1338624A1 (en) | 2003-08-27 |
WO2002044274A1 (fr) | 2002-06-06 |
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