CN1326939C - 光固化性·热固化性树脂组合物及其固化物 - Google Patents

光固化性·热固化性树脂组合物及其固化物 Download PDF

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Publication number
CN1326939C
CN1326939C CNB031458297A CN03145829A CN1326939C CN 1326939 C CN1326939 C CN 1326939C CN B031458297 A CNB031458297 A CN B031458297A CN 03145829 A CN03145829 A CN 03145829A CN 1326939 C CN1326939 C CN 1326939C
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China
Prior art keywords
epoxy
light
expression
obtains
acid
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Expired - Lifetime
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CNB031458297A
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Chinese (zh)
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CN1472253A (zh
Inventor
小川勇太
今泷千雅
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Taiyo Holdings Co Ltd
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Taiyo Ink Mfg Co Ltd
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Publication of CN1472253A publication Critical patent/CN1472253A/zh
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/20Polyesters having been prepared in the presence of compounds having one reactive group or more than two reactive groups
    • C08G63/21Polyesters having been prepared in the presence of compounds having one reactive group or more than two reactive groups in the presence of unsaturated monocarboxylic acids or unsaturated monohydric alcohols or reactive derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08Epoxidised polymerised polyenes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CNB031458297A 2002-07-12 2003-07-11 光固化性·热固化性树脂组合物及其固化物 Expired - Lifetime CN1326939C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002203523A JP4087650B2 (ja) 2002-07-12 2002-07-12 光硬化性・熱硬化性樹脂組成物及びその硬化物
JP2002203523 2002-07-12

Publications (2)

Publication Number Publication Date
CN1472253A CN1472253A (zh) 2004-02-04
CN1326939C true CN1326939C (zh) 2007-07-18

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Family Applications (1)

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CNB031458297A Expired - Lifetime CN1326939C (zh) 2002-07-12 2003-07-11 光固化性·热固化性树脂组合物及其固化物

Country Status (3)

Country Link
JP (1) JP4087650B2 (ja)
KR (1) KR100908974B1 (ja)
CN (1) CN1326939C (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108300143A (zh) * 2016-09-16 2018-07-20 株式会社田村制作所 固化性树脂组合物

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100569825C (zh) * 2004-07-15 2009-12-16 太阳油墨制造株式会社 光固化性·热固化性树脂组合物及其固化物
JP4198101B2 (ja) * 2004-09-17 2008-12-17 株式会社Adeka アルカリ現像性樹脂組成物
JP4683182B2 (ja) * 2004-09-28 2011-05-11 山栄化学株式会社 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法
JP5109246B2 (ja) * 2004-12-09 2012-12-26 三菱化学株式会社 硬化性組成物、硬化物、カラーフィルタ及び液晶表示装置
TW200728379A (en) * 2005-09-06 2007-08-01 Taiyo Ink Mfg Co Ltd Resin composition, cured product of the same, and printed circuit board made of the same
TW200728917A (en) * 2005-10-27 2007-08-01 Toppan Printing Co Ltd Alkali development-type photosensitive resin composition, substrate with projections for liquid crystal division alignment control formed using the same, and liquid crystal display device
JP4840865B2 (ja) * 2006-11-07 2011-12-21 太陽ホールディングス株式会社 アルカリ現像可能な感光性樹脂組成物およびそれを用いたプリント配線板
WO2009011304A1 (ja) * 2007-07-18 2009-01-22 Showa Denko K. K. 熱硬化性樹脂組成物
CN101240109B (zh) * 2007-09-30 2010-07-14 广东生益科技股份有限公司 一种树脂组合物及应用其制备的印刷电路板用半固化片
CN100554335C (zh) * 2007-10-17 2009-10-28 太阳油墨(苏州)有限公司 用于印刷电路板的外观检查的树脂组合物
JP5739609B2 (ja) * 2009-09-16 2015-06-24 互応化学工業株式会社 感光性樹脂組成物、ソルダーレジスト用組成物及びプリント配線板
JP2011128224A (ja) * 2009-12-15 2011-06-30 Kuraray Co Ltd 表示装置の製造方法及び表示装置
JP5814691B2 (ja) * 2011-08-11 2015-11-17 互応化学工業株式会社 レジスト用樹脂組成物
JP6524572B2 (ja) * 2013-07-01 2019-06-05 互応化学工業株式会社 ソルダーレジスト用組成物及びプリント配線板
JP5878913B2 (ja) * 2013-12-17 2016-03-08 互応化学工業株式会社 感光性樹脂組成物、ソルダーレジスト用組成物、プリント配線板、及び感光性樹脂組成物の製造方法
KR101514745B1 (ko) * 2014-08-28 2015-04-23 애경화학 주식회사 정밀주조 열분해 마스터모델 성형용 광경화 조성물
JP6275620B2 (ja) * 2014-10-17 2018-02-07 日本化薬株式会社 感光性樹脂組成物及びその硬化物
JP6660575B2 (ja) * 2017-03-22 2020-03-11 Dic株式会社 酸基含有(メタ)アクリレート樹脂及びソルダーレジスト用樹脂材料
KR20190077220A (ko) * 2017-12-25 2019-07-03 닛뽄 가야쿠 가부시키가이샤 디스플레이용 봉지제 및 그것을 이용한 액정 디스플레이
JP7250591B2 (ja) * 2019-03-29 2023-04-03 日鉄ケミカル&マテリアル株式会社 重合性不飽和基含有アルカリ可溶性樹脂の製造方法、重合性不飽和基含有アルカリ可溶性樹脂、それを含む感光性樹脂組成物、それを硬化してなる硬化物、その硬化物を構成成分として含むタッチパネルおよびカラーフィルター
KR20200115361A (ko) * 2019-03-29 2020-10-07 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 중합성 불포화기 함유 알칼리 가용성 수지의 제조 방법, 중합성 불포화기 함유 알칼리 가용성 수지, 수소화 화합물 및 그 제조 방법, 감광성 수지 조성물, 그것을 경화시켜 이루어지는 경화막, 그 경화막을 구성 성분으로서 포함하는 터치 패널 및 컬러 필터

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5032746A (ja) * 1973-06-25 1975-03-29
GB2175908A (en) * 1985-04-19 1986-12-10 Taiyo Ink Mfg Co Ltd Photo-setting compositions

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JP3580445B2 (ja) * 1994-09-13 2004-10-20 日本化薬株式会社 フレキシブルプリント配線板用レジストインキ組成物及びその硬化物
JP3190251B2 (ja) * 1995-06-06 2001-07-23 太陽インキ製造株式会社 アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物
JP3247091B2 (ja) * 1997-11-28 2002-01-15 日立化成工業株式会社 光硬化性樹脂組成物及びこれを用いた感光性エレメント
JP3830330B2 (ja) * 2000-05-17 2006-10-04 三菱化学株式会社 感光性材料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5032746A (ja) * 1973-06-25 1975-03-29
GB2175908A (en) * 1985-04-19 1986-12-10 Taiyo Ink Mfg Co Ltd Photo-setting compositions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108300143A (zh) * 2016-09-16 2018-07-20 株式会社田村制作所 固化性树脂组合物

Also Published As

Publication number Publication date
KR100908974B1 (ko) 2009-07-22
CN1472253A (zh) 2004-02-04
JP2004045792A (ja) 2004-02-12
JP4087650B2 (ja) 2008-05-21
KR20040026122A (ko) 2004-03-27

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO INK MFG. Co.,Ltd.|FUJIMORI KOGYO Co.,Ltd.

Contract fulfillment period: 2008.11.26 to 2009.5.31

Contract record no.: 2009990000033

Denomination of invention: Active energy line cured resin, optical solidified and thermosetting resin composition containing said resin and its condensate

Granted publication date: 20070718

License type: General permission

Record date: 20090114

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Free format text: COMMON LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.11.26 TO 2009.5.31; CHANGE OF CONTRACT

Name of requester: TAIYANG PRINTING INK ( SUZHOU) CO., LTD.

Effective date: 20090114

EE01 Entry into force of recordation of patent licensing contract

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO INK MFG. Co.,Ltd.

Contract fulfillment period: 2009.5.26 to 2010.5.25

Contract record no.: 2009990000747

Denomination of invention: Active energy line cured resin, optical solidified and thermosetting resin composition containing said resin and its condensate

Granted publication date: 20070718

License type: General permission

Record date: 20090714

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Free format text: COMMON LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.5.26 TO 2010.5.25; CHANGE OF CONTRACT

Name of requester: TAIYANG PRINTING INK ( SUZHOU) CO., LTD.

Effective date: 20090714

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Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO INK MFG. Co.,Ltd.

Contract record no.: 2010990000679

Denomination of invention: Active energy line cured resin, optical solidified and thermosetting resin composition containing said resin and its condensate

Granted publication date: 20070718

License type: Common License

Open date: 20040204

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Address after: Tokyo, Japan

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Address before: Tokyo, Japan

Patentee before: TAIYO INK MFG. Co.,Ltd.

EC01 Cancellation of recordation of patent licensing contract

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