CN1307701C - 可b阶段双重固化的晶片级底层填料 - Google Patents

可b阶段双重固化的晶片级底层填料 Download PDF

Info

Publication number
CN1307701C
CN1307701C CNB028249372A CN02824937A CN1307701C CN 1307701 C CN1307701 C CN 1307701C CN B028249372 A CNB028249372 A CN B028249372A CN 02824937 A CN02824937 A CN 02824937A CN 1307701 C CN1307701 C CN 1307701C
Authority
CN
China
Prior art keywords
component
curing
compound
dispersed
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028249372A
Other languages
English (en)
Chinese (zh)
Other versions
CN1605122A (zh
Inventor
B·马
S·H·莱曼
Q·K·童
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Starch and Chemical Investment Holding Corp
Original Assignee
National Starch and Chemical Investment Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21799738&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1307701(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by National Starch and Chemical Investment Holding Corp filed Critical National Starch and Chemical Investment Holding Corp
Publication of CN1605122A publication Critical patent/CN1605122A/zh
Application granted granted Critical
Publication of CN1307701C publication Critical patent/CN1307701C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/29111—Tin [Sn] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83856—Pre-cured adhesive, i.e. B-stage adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01056—Barium [Ba]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Looms (AREA)
  • Solid Fuels And Fuel-Associated Substances (AREA)
  • Silicon Polymers (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CNB028249372A 2001-12-14 2002-11-19 可b阶段双重固化的晶片级底层填料 Expired - Fee Related CN1307701C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/020,638 US6833629B2 (en) 2001-12-14 2001-12-14 Dual cure B-stageable underfill for wafer level
US10/020,638 2001-12-14

Publications (2)

Publication Number Publication Date
CN1605122A CN1605122A (zh) 2005-04-06
CN1307701C true CN1307701C (zh) 2007-03-28

Family

ID=21799738

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028249372A Expired - Fee Related CN1307701C (zh) 2001-12-14 2002-11-19 可b阶段双重固化的晶片级底层填料

Country Status (11)

Country Link
US (1) US6833629B2 (fr)
EP (1) EP1461829B2 (fr)
JP (1) JP4299140B2 (fr)
KR (1) KR100932998B1 (fr)
CN (1) CN1307701C (fr)
AT (1) ATE383655T1 (fr)
AU (1) AU2002366498A1 (fr)
DE (1) DE60224581T2 (fr)
DK (1) DK1461829T3 (fr)
TW (1) TWI238476B (fr)
WO (1) WO2003052813A2 (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030129438A1 (en) * 2001-12-14 2003-07-10 Becker Kevin Harris Dual cure B-stageable adhesive for die attach
US6833629B2 (en) 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
US20030162911A1 (en) * 2002-01-31 2003-08-28 Yue Xiao No flow underfill composition
US7473995B2 (en) * 2002-03-25 2009-01-06 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US7846778B2 (en) * 2002-02-08 2010-12-07 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US20060194064A1 (en) * 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US7037399B2 (en) * 2002-03-01 2006-05-02 National Starch And Chemical Investment Holding Corporation Underfill encapsulant for wafer packaging and method for its application
US20060147719A1 (en) * 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
US20050049334A1 (en) * 2003-09-03 2005-03-03 Slawomir Rubinsztain Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications
US7022410B2 (en) * 2003-12-16 2006-04-04 General Electric Company Combinations of resin compositions and methods of use thereof
US7176044B2 (en) 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
US20040158008A1 (en) * 2003-02-06 2004-08-12 Xiping He Room temperature printable adhesive paste
US6885108B2 (en) * 2003-03-18 2005-04-26 Micron Technology, Inc. Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein
EP1669426B1 (fr) 2003-09-30 2008-06-18 Kansai Paint Co., Ltd. Composition de revetement, et procede de formation d'une pellicule de revetement
CN1946795B (zh) * 2003-11-21 2010-06-23 洛德公司 晶片用双阶段底部填充胶
US6908789B1 (en) * 2003-12-15 2005-06-21 Intel Corporation Method of making a microelectronic assembly
US7560519B2 (en) * 2004-06-02 2009-07-14 Lord Corporation Dual-stage wafer applied underfills
DE102005046280B4 (de) * 2005-09-27 2007-11-08 Infineon Technologies Ag Halbleiterbauteil mit einem Halbleiterchip sowie Verfahren zur Herstellung desselben
US20080121845A1 (en) * 2006-08-11 2008-05-29 General Electric Company Oxetane composition, associated method and article
US20080039560A1 (en) * 2006-08-11 2008-02-14 General Electric Company Syneretic composition, associated method and article
US20080039608A1 (en) * 2006-08-11 2008-02-14 General Electric Company Oxetane composition, associated method and article
US20080039542A1 (en) * 2006-08-11 2008-02-14 General Electric Company Composition and associated method
KR100792950B1 (ko) * 2007-01-19 2008-01-08 엘에스전선 주식회사 반도체 패키징 방법
TW200948888A (en) * 2008-04-16 2009-12-01 Henkel Corp Flow controllable B-stageable composition
JP5552423B2 (ja) * 2008-05-23 2014-07-16 パナソニック株式会社 実装構造体
US9093448B2 (en) 2008-11-25 2015-07-28 Lord Corporation Methods for protecting a die surface with photocurable materials
WO2010068488A1 (fr) * 2008-11-25 2010-06-17 Lord Corporation Procédés de protection de la surface d’une puce avec des matériaux photodurcissables
TWI456012B (zh) * 2010-06-08 2014-10-11 Henkel IP & Holding GmbH 使用脈衝式ｕｖ光源之晶圓背面塗覆方法
EP2948506B1 (fr) 2013-01-23 2019-08-14 Henkel IP & Holding GmbH Composition de matière de remplissage entre composants empilés et procédé d'encapsulation faisant intervenir celle-ci
JP6573882B2 (ja) * 2013-08-02 2019-09-11 アルファ・アセンブリー・ソリューションズ・インコーポレイテッドＡｌｐｈａ Ａｓｓｅｍｂｌｙ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． カプセル化用のデュアルサイド補強フラックス
WO2017062586A1 (fr) * 2015-10-07 2017-04-13 Henkel IP & Holding GmbH Formulations et utilisation pour emballages tsv 3d
JP6224188B1 (ja) * 2016-08-08 2017-11-01 太陽インキ製造株式会社 半導体封止材

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1158497A (zh) * 1996-03-01 1997-09-03 台湾通用器材股份有限公司 半导体的封装方法
CN1214545A (zh) * 1997-10-02 1999-04-21 松下电器产业株式会社 半导体封装及其制造方法
US6063649A (en) * 1996-06-13 2000-05-16 Nec Corporation Device mounting a semiconductor element on a wiring substrate and manufacturing method thereof
US6121689A (en) * 1997-07-21 2000-09-19 Miguel Albert Capote Semiconductor flip-chip package and method for the fabrication thereof

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3746686A (en) 1971-07-12 1973-07-17 Shell Oil Co Process for curing polyepoxides with polycarboxylic acid salts of an imidazole compound and compositions thereof
JPS535920B2 (fr) 1974-06-03 1978-03-02
JPS592445B2 (ja) 1978-11-10 1984-01-18 三菱電機株式会社 耐熱性樹脂の製造法
US4401499A (en) * 1980-06-09 1983-08-30 Sumitomo Bakelite Company Limited Crosslinked resin of epoxy compound and isocyanate and process for producing same
JPS5718815A (en) 1980-07-04 1982-01-30 Mitsubishi Heavy Ind Ltd Bearing device
US4426243A (en) † 1981-12-01 1984-01-17 Illinois Tool Works Inc. Room-temperature-curable, quick-setting acrylic/epoxy adhesives and methods of bonding
JPS59197154A (ja) 1983-04-22 1984-11-08 Hitachi Ltd 半導体装置およびその製造法
DE3572182D1 (en) † 1984-04-28 1989-09-14 Ciba Geigy Ag Curable compositions
JPS61237436A (ja) 1985-04-15 1986-10-22 Toshiba Chem Corp 半導体素子の製造方法
JPS62275123A (ja) 1986-05-23 1987-11-30 Toray Ind Inc プリプレグ用樹脂組成物
JPS6381187A (ja) † 1986-09-25 1988-04-12 Ibiden Co Ltd 熱硬化性接着シ−ト
JPS63154780A (ja) † 1986-12-18 1988-06-28 Ibiden Co Ltd 接着剤組成物及びその接着剤としての使用方法
US4816531A (en) 1987-02-05 1989-03-28 Shell Oil Company Bismaleimide resin composition containing epoxy resin and a phenolic curing agent therefor
US5082880A (en) * 1988-09-12 1992-01-21 Mitsui Toatsu Chemicals, Inc. Semiconductor sealing composition containing epoxy resin and polymaleimide
US5208188A (en) 1989-10-02 1993-05-04 Advanced Micro Devices, Inc. Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process
US5081167A (en) 1990-07-16 1992-01-14 Shell Oil Company Cyanamide-cured maleimide/epoxy resin blend
US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
US5261156A (en) † 1991-02-28 1993-11-16 Semiconductor Energy Laboratory Co., Ltd. Method of electrically connecting an integrated circuit to an electric device
DE4130329A1 (de) 1991-09-12 1993-03-18 Bayer Ag Waermehaertbare reaktionsharzgemische, ein verfahren zu ihrer herstellung und die verwendung zur herstellung von press-massen und formkoerpern
US5728633A (en) * 1992-01-23 1998-03-17 Jacobs; Richard L. Interpenetrating network compositions and structures
US5510633A (en) 1994-06-08 1996-04-23 Xerox Corporation Porous silicon light emitting diode arrays and method of fabrication
US5579573A (en) * 1994-10-11 1996-12-03 Ford Motor Company Method for fabricating an undercoated chip electrically interconnected to a substrate
US5494981A (en) * 1995-03-03 1996-02-27 Minnesota Mining And Manufacturing Company Epoxy-cyanate ester compositions that form interpenetrating networks via a Bronsted acid
US5654081A (en) * 1995-07-05 1997-08-05 Ford Motor Company Integrated circuit assembly with polymeric underfill body
US5756405A (en) * 1996-09-10 1998-05-26 International Business Machines Corporation Technique for forming resin-impregnated fiberglass sheets
KR100467897B1 (ko) * 1996-12-24 2005-01-24 닛토덴코 가부시키가이샤 반도체 장치 및 이의 제조방법
JPH1129748A (ja) * 1997-05-12 1999-02-02 Fujitsu Ltd 接着剤、接着方法及び実装基板の組み立て体
JP2001506313A (ja) 1997-07-24 2001-05-15 ロックタイト コーポレーション アンダーフィル密封材として有用な熱硬化性樹脂組成物
US20010020071A1 (en) 1997-10-10 2001-09-06 Capote Miguel Albert High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants
BR9812763A (pt) * 1997-10-23 2000-08-29 Ciba Sc Holding Ag Endurecedor para polìmeros contendo grupo anidrido
JP3184485B2 (ja) 1997-11-06 2001-07-09 三井金属鉱業株式会社 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板
US6194490B1 (en) 1998-02-27 2001-02-27 Vantico, Inc. Curable composition comprising epoxidized natural oils
US6265776B1 (en) 1998-04-27 2001-07-24 Fry's Metals, Inc. Flip chip with integrated flux and underfill
US6228678B1 (en) 1998-04-27 2001-05-08 Fry's Metals, Inc. Flip chip with integrated mask and underfill
JP4098403B2 (ja) 1998-06-01 2008-06-11 富士通株式会社 接着剤、接着方法及び実装基板の組み立て体
WO1999067324A1 (fr) 1998-06-22 1999-12-29 Loctite Corporation Compositions de resine thermodurcissable utilisees comme resines de remplissage
US6350840B1 (en) 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
US6057381A (en) 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
US6063828A (en) 1998-07-02 2000-05-16 National Starch And Chemical Investment Holding Corporation Underfill encapsulant compositions for use in electronic devices
AU2165100A (en) 1998-12-07 2000-06-26 Dexter Corporation, The Underfill film compositions
US6331446B1 (en) * 1999-03-03 2001-12-18 Intel Corporation Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state
US6528345B1 (en) 1999-03-03 2003-03-04 Intel Corporation Process line for underfilling a controlled collapse
JP2001015551A (ja) † 1999-06-29 2001-01-19 Toshiba Corp 半導体装置およびその製造方法
JP3601443B2 (ja) 1999-11-30 2004-12-15 日立化成工業株式会社 接着フィルムとその製造方法、半導体搭載用配線基板及び半導体装置
JP3562465B2 (ja) 1999-11-30 2004-09-08 日立化成工業株式会社 接着剤組成物、接着フィルム及び半導体搭載用配線基板
KR20010054743A (ko) 1999-12-08 2001-07-02 윤종용 이중 언더필 영역을 포함하는 반도체 패키지
JP2001205211A (ja) * 2000-01-28 2001-07-31 Sanyo Electric Co Ltd プラズマ洗浄装置
JP2001323246A (ja) † 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
WO2001072898A1 (fr) * 2000-03-29 2001-10-04 Georgia Tech Research Corporation Sous remplissages a l'epoxyde thermiquement degradables pour applications de puces a protuberances
US6307001B1 (en) 2000-05-18 2001-10-23 National Starch And Chemical Investment Holding Corporation Curable hybrid electron donor compounds containing vinyl ether
US6441213B1 (en) 2000-05-18 2002-08-27 National Starch And Chemical Investment Holding Corporation Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality
US6555628B2 (en) * 2000-12-14 2003-04-29 Dow Global Technologies Inc. Epoxy resins and process for making the same
US6686425B2 (en) * 2001-06-08 2004-02-03 Adhesives Research, Inc. High Tg acrylic polymer and epoxy-containing blend therefor as pressure sensitive adhesive
US6833629B2 (en) 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1158497A (zh) * 1996-03-01 1997-09-03 台湾通用器材股份有限公司 半导体的封装方法
US6063649A (en) * 1996-06-13 2000-05-16 Nec Corporation Device mounting a semiconductor element on a wiring substrate and manufacturing method thereof
US6121689A (en) * 1997-07-21 2000-09-19 Miguel Albert Capote Semiconductor flip-chip package and method for the fabrication thereof
CN1214545A (zh) * 1997-10-02 1999-04-21 松下电器产业株式会社 半导体封装及其制造方法

Also Published As

Publication number Publication date
US6833629B2 (en) 2004-12-21
TWI238476B (en) 2005-08-21
CN1605122A (zh) 2005-04-06
KR20040068145A (ko) 2004-07-30
DE60224581T2 (de) 2009-01-22
US20030141592A1 (en) 2003-07-31
WO2003052813A3 (fr) 2004-02-19
DE60224581D1 (de) 2008-02-21
JP4299140B2 (ja) 2009-07-22
EP1461829B2 (fr) 2014-04-02
DK1461829T3 (da) 2008-05-19
JP2005513779A (ja) 2005-05-12
KR100932998B1 (ko) 2009-12-21
TW200305608A (en) 2003-11-01
ATE383655T1 (de) 2008-01-15
AU2002366498A1 (en) 2003-06-30
EP1461829A2 (fr) 2004-09-29
EP1461829B1 (fr) 2008-01-09
WO2003052813A2 (fr) 2003-06-26

Similar Documents

Publication Publication Date Title
CN1307701C (zh) 可b阶段双重固化的晶片级底层填料
US7608487B2 (en) B-stageable underfill encapsulant and method for its application
CN100414677C (zh) 预先施用的底层填料密封剂的应用方法
JP4276085B2 (ja) ウェハーパッケージング用のアンダーフィル封入材及びその塗布方法
JP5958529B2 (ja) 半導体装置及びその製造方法
EP1818351A1 (fr) Agent d'encapsulation de sous-remplissage pour emballage de plaque et procédé pour son application
EP1470176B1 (fr) Composition de remplissage sous-jacent sans ecoulement
JPWO2018235854A1 (ja) 半導体用接着剤、半導体装置の製造方法及び半導体装置
US7004375B2 (en) Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
JP7544031B2 (ja) 半導体用接着剤、半導体装置の製造方法及び半導体装置
KR101035873B1 (ko) 고온 속경화형 접착필름 조성물 및 이를 이용한 접착필름
JP5557158B2 (ja) フリップチップ接続用アンダーフィル剤、及びそれを用いる半導体装置の製造方法
JP2019175898A (ja) 半導体装置の製造方法
WO2022024648A1 (fr) Procédé de fabrication de dispositif à semi-conducteurs et adhésif en film
JP2021134219A (ja) アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP2020136398A (ja) 半導体用接着剤

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070328

Termination date: 20101119