CN1256613A - 挠性电路板的制造方法 - Google Patents
挠性电路板的制造方法 Download PDFInfo
- Publication number
- CN1256613A CN1256613A CN99126650.1A CN99126650A CN1256613A CN 1256613 A CN1256613 A CN 1256613A CN 99126650 A CN99126650 A CN 99126650A CN 1256613 A CN1256613 A CN 1256613A
- Authority
- CN
- China
- Prior art keywords
- layer
- polyimide precursor
- polyimide
- conductor circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33155998A JP3541697B2 (ja) | 1998-11-20 | 1998-11-20 | フレキシブル配線板の製造方法 |
JP331559/1998 | 1998-11-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1256613A true CN1256613A (zh) | 2000-06-14 |
CN1203738C CN1203738C (zh) | 2005-05-25 |
Family
ID=18245024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN99126650.1A Expired - Fee Related CN1203738C (zh) | 1998-11-20 | 1999-11-20 | 挠性电路板的制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6344308B1 (zh) |
EP (1) | EP1002638B1 (zh) |
JP (1) | JP3541697B2 (zh) |
CN (1) | CN1203738C (zh) |
DE (1) | DE69920629T2 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6866368B2 (en) | 2001-04-25 | 2005-03-15 | Benq Corporation | Flexible circuit board |
CN100415878C (zh) * | 2000-10-11 | 2008-09-03 | 花王株式会社 | 高生产能力的α-淀粉酶 |
CN101636527B (zh) * | 2007-03-15 | 2011-11-09 | 日矿金属株式会社 | 铜电解液和使用该铜电解液得到的两层挠性基板 |
CN104282531A (zh) * | 2014-05-16 | 2015-01-14 | 上海华虹宏力半导体制造有限公司 | 半导体材料表面钝化层结构的形成工艺方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4570799B2 (ja) * | 2001-02-16 | 2010-10-27 | 日東電工株式会社 | 配線回路基板の製造方法 |
US20030002264A1 (en) * | 2001-06-29 | 2003-01-02 | Uflex Technology Co., Ltd. | Manufacturing method for a flexible PCB |
KR100514611B1 (ko) * | 2002-06-24 | 2005-09-13 | 삼신써키트 주식회사 | 양면 노출형 연성 인쇄 회로기판 제조 방법 |
JP2004079826A (ja) * | 2002-08-20 | 2004-03-11 | Nippon Steel Chem Co Ltd | 配線基板用積層体 |
EP1550889A3 (en) * | 2003-12-30 | 2005-12-14 | IBM Corporation | Opto-electronic module comprising flexible electric connection cable and method of making the same |
US7220920B1 (en) | 2004-01-23 | 2007-05-22 | Hutchinson Technology Incorporated | Flexible electrical circuit with slotted coverlay |
US20060016565A1 (en) * | 2004-07-22 | 2006-01-26 | Hoeppel Gary A | Floating pin lamination plate system for multilayer circuit boards |
CN100334926C (zh) * | 2004-08-13 | 2007-08-29 | 周伟 | 挠性电路板的层压工艺以及层压用辅助材料 |
KR100594299B1 (ko) * | 2004-10-29 | 2006-06-30 | 삼성전자주식회사 | 유연성 인쇄 회로 및 이것이 구비된 하드 디스크 드라이브 |
JP2006310689A (ja) * | 2005-05-02 | 2006-11-09 | Nippon Mektron Ltd | ダブルアクセス型可撓性回路基板の製造方法 |
US7772501B2 (en) * | 2006-04-25 | 2010-08-10 | Molex Incorporated | Flexible printed circuit board |
JP4852442B2 (ja) * | 2007-02-15 | 2012-01-11 | 日本オプネクスト株式会社 | 光送信モジュール |
US20100155109A1 (en) * | 2008-12-24 | 2010-06-24 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
CN102334393B (zh) * | 2009-02-28 | 2013-11-27 | 索尼化学&信息部件株式会社 | 布线基板 |
KR101106404B1 (ko) * | 2009-11-24 | 2012-01-17 | 삼성에스디아이 주식회사 | 이차 전지 및 그 제조 방법 |
DE102010016781A1 (de) * | 2010-05-04 | 2011-11-10 | Cicor Management AG | Verfahren zur Herstellung einer flexiblen Schaltungsanordnung |
CN103327755B (zh) * | 2012-03-19 | 2016-06-15 | 北大方正集团有限公司 | 一种阶梯板的制作方法以及阶梯板 |
FI126777B (fi) * | 2013-08-30 | 2017-05-15 | Elcoflex Oy | Menetelmä joustavan piirilevyn valmistamiseksi ja joustava piirilevy |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60157286A (ja) | 1984-01-27 | 1985-08-17 | 株式会社日立製作所 | フレキシブルプリント基板の製造方法 |
JPS60243120A (ja) | 1984-05-18 | 1985-12-03 | Hitachi Ltd | フレキシブルプリント基板の製造方法 |
JPS63239998A (ja) | 1987-03-27 | 1988-10-05 | 新日鐵化学株式会社 | 配線材料の製造方法 |
JPS63262898A (ja) * | 1987-04-21 | 1988-10-31 | 住友電気工業株式会社 | フレキシブル印刷配線板の製造方法 |
JPS63293996A (ja) * | 1987-05-27 | 1988-11-30 | Sharp Corp | 多層配線基板の製造方法 |
JPH01245586A (ja) | 1988-03-28 | 1989-09-29 | Nippon Steel Chem Co Ltd | フレキシブルプリント基板 |
US5217849A (en) * | 1989-08-28 | 1993-06-08 | Sumitomo Metal Mining Company Limited | Process for making a two-layer film carrier |
JP2738453B2 (ja) | 1989-10-03 | 1998-04-08 | 新日鐵化学株式会社 | 銅張積層板の製造方法 |
US6045975A (en) * | 1990-04-16 | 2000-04-04 | Fujitsu Limited | Photosensitive, heat-resistant resin composition for forming patterns |
JPH04162695A (ja) * | 1990-10-26 | 1992-06-08 | Nec Corp | 多層配線基板の製造方法 |
JPH0582927A (ja) * | 1991-09-19 | 1993-04-02 | Sumitomo Bakelite Co Ltd | ポリアミツク酸フイルム |
JP3059556B2 (ja) * | 1991-11-26 | 2000-07-04 | 日東電工株式会社 | 多層基板およびその製造方法 |
US5374469A (en) | 1991-09-19 | 1994-12-20 | Nitto Denko Corporation | Flexible printed substrate |
JPH05139027A (ja) | 1991-11-18 | 1993-06-08 | Oji Paper Co Ltd | 感熱記録体 |
JP3090768B2 (ja) * | 1992-03-10 | 2000-09-25 | 新日鐵化学株式会社 | 積層体 |
JP3205588B2 (ja) * | 1992-03-31 | 2001-09-04 | 新日鐵化学株式会社 | プリント配線板の製造方法 |
JP2775585B2 (ja) * | 1994-03-25 | 1998-07-16 | 日本メクトロン株式会社 | 両面配線基板の製造法 |
US6117616A (en) * | 1995-04-17 | 2000-09-12 | Nitto Denko Corporation | Circuit-forming substrate and circuit substrate |
JP2869969B2 (ja) * | 1995-04-28 | 1999-03-10 | ソニーケミカル株式会社 | フレキシブル回路基板の製造方法 |
-
1998
- 1998-11-20 JP JP33155998A patent/JP3541697B2/ja not_active Expired - Fee Related
-
1999
- 1999-11-15 US US09/440,167 patent/US6344308B1/en not_active Expired - Lifetime
- 1999-11-19 EP EP99123012A patent/EP1002638B1/en not_active Expired - Lifetime
- 1999-11-19 DE DE69920629T patent/DE69920629T2/de not_active Expired - Lifetime
- 1999-11-20 CN CN99126650.1A patent/CN1203738C/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100415878C (zh) * | 2000-10-11 | 2008-09-03 | 花王株式会社 | 高生产能力的α-淀粉酶 |
US6866368B2 (en) | 2001-04-25 | 2005-03-15 | Benq Corporation | Flexible circuit board |
CN101636527B (zh) * | 2007-03-15 | 2011-11-09 | 日矿金属株式会社 | 铜电解液和使用该铜电解液得到的两层挠性基板 |
CN104282531A (zh) * | 2014-05-16 | 2015-01-14 | 上海华虹宏力半导体制造有限公司 | 半导体材料表面钝化层结构的形成工艺方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1002638A2 (en) | 2000-05-24 |
DE69920629D1 (de) | 2004-11-04 |
EP1002638B1 (en) | 2004-09-29 |
JP3541697B2 (ja) | 2004-07-14 |
JP2000156555A (ja) | 2000-06-06 |
EP1002638A3 (en) | 2000-06-28 |
US6344308B1 (en) | 2002-02-05 |
CN1203738C (zh) | 2005-05-25 |
DE69920629T2 (de) | 2006-02-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NANKAI UNIVERSITY Free format text: FORMER OWNER: + Effective date: 20130329 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: + Free format text: FORMER NAME: SONY CHEMICALS CORPORATION |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: SONY CHEMICAL & INFORMATION DEVICE Corp. Address before: Tokyo, Japan Patentee before: Sony Chemicals Corp. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130329 Address after: Tokyo, Japan Patentee after: Sony Corp. Address before: Tokyo, Japan Patentee before: SONY CHEMICAL & INFORMATION DEVICE Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050525 Termination date: 20151120 |
|
EXPY | Termination of patent right or utility model |