CN1249776C - 衬底处理系统 - Google Patents

衬底处理系统 Download PDF

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Publication number
CN1249776C
CN1249776C CNB021518696A CN02151869A CN1249776C CN 1249776 C CN1249776 C CN 1249776C CN B021518696 A CNB021518696 A CN B021518696A CN 02151869 A CN02151869 A CN 02151869A CN 1249776 C CN1249776 C CN 1249776C
Authority
CN
China
Prior art keywords
substrate
mentioned
path unit
conveyance
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB021518696A
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English (en)
Chinese (zh)
Other versions
CN1426087A (zh
Inventor
田上真也
林诚
坂田富裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1426087A publication Critical patent/CN1426087A/zh
Application granted granted Critical
Publication of CN1249776C publication Critical patent/CN1249776C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CNB021518696A 2001-11-30 2002-11-29 衬底处理系统 Expired - Fee Related CN1249776C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP367010/01 2001-11-30
JP367010/2001 2001-11-30
JP2001367010A JP3911624B2 (ja) 2001-11-30 2001-11-30 処理システム

Publications (2)

Publication Number Publication Date
CN1426087A CN1426087A (zh) 2003-06-25
CN1249776C true CN1249776C (zh) 2006-04-05

Family

ID=19176824

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB021518696A Expired - Fee Related CN1249776C (zh) 2001-11-30 2002-11-29 衬底处理系统

Country Status (4)

Country Link
JP (1) JP3911624B2 (ko)
KR (1) KR100912280B1 (ko)
CN (1) CN1249776C (ko)
TW (1) TWI248657B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101136349B (zh) * 2006-08-30 2010-12-08 Asm日本子公司 衬底传送装置、衬底处理装置和传送衬底的方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101074388B1 (ko) 2004-12-22 2011-10-17 엘지디스플레이 주식회사 액정표시장치용 제조 장비
KR101079487B1 (ko) * 2005-01-28 2011-11-03 어플라이드 머티어리얼스, 인코포레이티드 기판 캐리어 핸들러의 향상된 동작을 위한 방법 및 장치
JP4745040B2 (ja) * 2005-12-05 2011-08-10 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
JP4560022B2 (ja) * 2006-09-12 2010-10-13 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
JP6339057B2 (ja) * 2015-09-29 2018-06-06 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラム
CN106044229A (zh) * 2016-07-22 2016-10-26 京东方科技集团股份有限公司 一种掩模板搬运设备及曝光机组系统
JP6601360B2 (ja) * 2016-09-30 2019-11-06 株式会社ダイフク 物品搬送設備
US10996661B2 (en) * 2017-01-13 2021-05-04 Fuji Corporation Manufacturing management device
JP6655689B1 (ja) * 2018-09-21 2020-02-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7142566B2 (ja) * 2018-12-27 2022-09-27 東京エレクトロン株式会社 基板処理装置および基板処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297258A (ja) * 1994-04-26 1995-11-10 Tokyo Electron Ltd 板状体の搬送装置
JP4045008B2 (ja) * 1998-03-26 2008-02-13 大日本スクリーン製造株式会社 基板処理装置
JPH11260883A (ja) * 1998-03-09 1999-09-24 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001117064A (ja) * 1999-10-19 2001-04-27 Tokyo Electron Ltd 搬送装置の位置合わせ機構および位置合わせ方法、ならびに基板処理装置
JP3645492B2 (ja) * 2000-02-01 2005-05-11 東京エレクトロン株式会社 基板処理装置
KR100701893B1 (ko) * 2000-02-24 2007-03-30 엘지.필립스 엘시디 주식회사 인라인 형태로 구성된 액정표시소자의 검사장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101136349B (zh) * 2006-08-30 2010-12-08 Asm日本子公司 衬底传送装置、衬底处理装置和传送衬底的方法

Also Published As

Publication number Publication date
CN1426087A (zh) 2003-06-25
KR20030044881A (ko) 2003-06-09
TW200302540A (en) 2003-08-01
JP2003168713A (ja) 2003-06-13
TWI248657B (en) 2006-02-01
JP3911624B2 (ja) 2007-05-09
KR100912280B1 (ko) 2009-08-17

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Granted publication date: 20060405

Termination date: 20141129

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