TW200302540A - Substrate processing system - Google Patents

Substrate processing system Download PDF

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Publication number
TW200302540A
TW200302540A TW091134095A TW91134095A TW200302540A TW 200302540 A TW200302540 A TW 200302540A TW 091134095 A TW091134095 A TW 091134095A TW 91134095 A TW91134095 A TW 91134095A TW 200302540 A TW200302540 A TW 200302540A
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TW
Taiwan
Prior art keywords
substrate
unit
transfer
processing
heat treatment
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Application number
TW091134095A
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Chinese (zh)
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TWI248657B (en
Inventor
Shinya Tagami
Makoto Hayashi
Tomihiro Sakata
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Tokyo Electron Ltd
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Publication of TWI248657B publication Critical patent/TWI248657B/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

This invention is a substrate processing system which transports two or more substrates one by one along passing line which shuttles between exposure devices from cassette station to the outside and processes it including: a first processing part installed on the upstream side along the passing line and a second processing part installed on the downstream side along the passing line; each of the processing part have two or more processing unit groups; and a first passing unit to accept substrate transported along passing line from the first processing part; and a second passing unit which sends off substrate which passed the first passing unit to the second processing part is arranged from the first passing unit to the downstream side; and thermal processing part installed up of passing units the first and / or second passing unit; and at least one buffer unit which makes substrate temporarily stay is installed downward of the passing units the first and second at least on the other hand evade the collision of the substrate on the passing line; and a handing over arm mechanism which transports substrate between the first and second passing unit and the buffer unit. Therefore, it is possible to offer the substrate processing system that makes the stagnation of the process flow and the decrease in throughput a minimum even if the process flow stagnates partially in the system.

Description

200302540 A7 B7 五、發明説明（1 ) 發明所屬之技術領域 本發明係相關於在如LCD基板之被處理基板之上藉由 (請先閱讀背面之注意事項再填寫本頁) 光刻法（Photolithography)形成電路圖案之基板處理系統 〇 先前技術 近來，LCD (液晶顯示板）大型化非常明顯。隨著製造 線之擴大，玻璃基板之搬送和處理益加困難。爲了應付如 此之LCD基板的大型化，於使用在LCD製造之塗敷顯影處 理系統，在使基板通過之搬送線（搬送路徑）並排敷設案 輥輪，藉由案滾輪將基板漸漸地搬送於水平方向，且沿著 搬送線採用藉由配置之處理裝置順序處理基板之所謂之「 平流方式」。在此平流方式之系統，按照光刻程序之流程 之順序（以下稱爲「程序流程」）順著搬送線直線排列地 配置多數之處理裝置。 經濟部智慧財產局員工消費合作社印製 在此種直線排列線型之系統，從任何一個部位發生故 障時和維修檢查上之必要性要使系統全體之處理停止，或 使處理慢下來。又，雖然未到停止處理的地步但即使在處 理停滯之場合，位在程序流程之上流側之全部之處理部受 到影響，不是停止各自之處理，就是不得不慢下來。 此種場合，在平流方式之處理部，爲了在順著水平搬 送路徑配置之各種工具通過旁邊之基板以一定之計時順序 施予一連串之處理能正常動作，若因在下游側之處理部處 理步驟停滯之影響使該水平搬送路徑上之基板停滯，處理 本紙張尺度適用中國國家標準（CNS ) A4規格（210/297公釐） -5- 200302540 A7 B7 五、發明説明（2) 內容和處理結果不能按照設定，且產量降低之缺點會產生 (請先閲讀背面之注意事項再填寫本頁) 發明內容 本發明之目的係提供一種基板處理系統，在系統內之 一部份即使程序流程停滞將上流側之處理部或被處理基板 受到的影響抑制在最小限度。 經濟部智慧財產局員工消費合作社印製 本發明之基板處理系統係沿著往復於從基板盒站（ Cassette Station)至曝光裝置之間之搬送線順序搬送複數之 基板而加以處理之基板處理系統，其特徵係具備；沿著前 述搬送線具有設在上流側之第1處理部和設在下游側之第2 處理部之複數處理單元群、從前述第1處理部接受沿著前 述搬送線所搬送之基板之第1搬送單元、配置在較前述地1 搬送單元更下游側而將通過第1搬送單元之基板送出至前 述第2處理部之第2搬送單元、設在前述第1和第2搬送 單元之中之至少一方之上方之熱處理部、設在前述第1和 第2搬送單元之中之至少一方之下方而爲了避免在前述搬 送線上之基板彼此之碰撞使基板停留之至少一個緩衝單元 、在前述第1和第2搬送單元和前述緩衝單元之間搬送基 板之交接臂機構。 在本發明之系統，隔著搬送單元下側之緩衝單元幾乎 完全隔離於上側之熱處理部之熱處理單元。藉此存放於緩 衝單元之基板只受到熱處理單元稍微之影響，特別是熱處 理單元之場合可避免受到熱的影響。又，在緩衝單元部使 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇x 297公釐） -6 - 200302540 A7 B7 五、發明説明（3) --I’------^^衣丨.-- (請先閲讀背面之注意事項再填寫本頁) 用中，搬送手段沒有必要通過緩衝單元更不必說甚至沒有 必要通過其旁，在處理單元集中配置之範圍內可非常地有 效率地完成搬送行程。 在本發明系統之典型之一形態，於控制手段判斷往熱 處理部和第2處理部之任何一個不可搬入基板時，藉由交 接臂機構使在第1搬送單元接收之基板收納在緩衝單元之 一。此場合，在不可搬入之熱處理部或第2處理部應該被 進行之處理之前1個或前複數個步驟之處理爲止已完畢之 後將基板收納於緩衝單元，由此可將處理流程之停滯和產 量之降低止於最小限度。 交接臂機構之較佳形態係具有可於垂直方向升降之升 降搬送體、在此升降搬送體上可繞著垂直軸迴轉之迴旋搬 送體以及在此迴旋搬送體上支持基板且在水平面內可於前 後方向伸縮之輸送臂固定器。交接臂機構對屬於左右一對 之多段單元部之單元群可自由地通過，在這些單元群可搬 入和搬出基板。 經濟部智慧財產局8工消費合作社印製 複數緩衝單元以多段方式疊積於第1和第2搬送單元 之下方，每個這些緩衝單元可收納各一片基板。在此場合 ，較好是更具有爲了在緩衝單元內形成惰性氣體之環境之 手段。 第1處理部形成搬送線之一部分，可具有以實質水平 姿勢於水平方向搬送基板之搬送路徑以及在搬送經前述搬 送路徑上之基板施予既定之處理之處理手段。藉此緩衝單 元之有用性特別高，可避免第1處理部之平面移動之處理 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 200302540 A7 B7_ 五、發明説明（4) 之不預期中斷。 --^------^— (請先閱讀背面之注意事項再填寫本頁) 熱處理部爲了對基板施予隨附第1或第2處理部之處 理之熱處理，可具有上下多段被疊積上之複數熱處理單元 。此場合，熱處理單元可包含由從加熱單元、冷卻單元和 附著單元所形成之群所選擇之1或2以上。 更且，可具有分擔控制複數處理單元和交接臂機構之 複數區控制器以及並排連接於各個區控制器，爲了在搬送 路徑上後到的基板不至於撞上前行的基板統籌控制前述複 數區控制器之主控制器較好。在此場合，主控制器在系統 內掌握時時刻刻變化之全部基板之現在位置，基於該掌握 之基板之現在位置可控制各個前述複數區控制器之時間。 圖式之簡單說明 J·. 第1圖係顯示依據本發明之一實施形態之之基板處理 系統之槪略平面圖； 經濟部智慧財產局員工消費合作社印製 第2圖係顯示第1熱處理部和基板搬送機構之側視圖 第3圖係顯示第2熱處理部和基板搬送機構之側視圖 j 第4圖係顯示第3熱處理部和基板搬送機構之側視圖 ， 第5圖係顯示基板處理系統之控制系統之方塊圖；以 及 第6圖係顯示基板處理系統之正常時之處理之程序之 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -8- 200302540 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（5) 流程圖。 圖號簡單說明 10塗敷顯像處理系統 12曝光裝置 14基板盒站（C /S) 16處理站 （P /S) 18介面站（I /S) 20基板盒台 22次臂機構 22a搬送臂挾持器挾持座 24洗淨處理部 26第1熱處理部 28塗敷處理部 30第2熱處理部 32顯像處理部 34脫色處理部 36第3熱處理部 40梭 41準分子UV照射單元（e-UV) 42洗滌器洗淨單元 44上流側之多段單元部（TB) 46交接臂機構 48下游側之多段單元部（TB) (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -9 - 200302540 A7 B7 五、發明説明（6) 50基板交接用搬送單元（PASS) 60下游側搬送單元（PASS) (請先閱讀背面之注意事項再填寫本頁) 68導軌 70升降搬送體 72迴旋搬送體 74臂挾持器 76驅動部 78驅動部 80驅動部 82光阻劑塗敷單元（CT) 84減壓乾燥單元 86修邊器單元 88多段單元部 90交接臂機構 92多段單元部（TB) 94顯像單元（DEV) 96 I線UV照射單元（I-UV) 經濟部智慧財產局員工消費合作社印製 98多段單元部 100交接臂機構 102多段單元 104搬送裝置 106緩衝台 108伸展冷卻站 110標題器/周邊曝光裝置 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -10- 200302540 A7 B7 五、發明説明（7) 經濟部智慧財產局員工消費合作社印製 521 加 熱 單 元 (DHP) 522 加 熱 單 元 (DHP) 523 加 熱 單 元 (DHP) 524 加 熱 單 元 (DHP) 621 冷卻 單 元 (COL) 622 冷卻 單 元 (COL) 671 衝 單 元 672 fm. 衝 單 元 673 衝 單 元 674 緩 衝 單 元 675 緩 衝 單 元 676 總 衝 單 元 201 控 制 器 (Β /C) 202 控 制 器 (Β /C) 203 區控 制 器 (Β /C) 204 區 控 制 器 (Β /C) 205 區 控 制 器 (Β /C) 206 區 控制 器 (Β /C) 207 區 控 制 器 (Β /C) 561 黏 著 單 元 562 黏 著 單 元 200 主控制 器 (Μ /C) 發明之實施例 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） K------衣 ^-- (請先閱讀背面之注意事項再填寫本頁) 訂 -11 - 200302540 A7 B7 五、發明説明（8) --f------衣 ^-- (請先閲讀背面之注意事項再填寫本頁) 以下，參照所附之圖示針對本發明之較佳之實施型態 加以說明。在本實施形態按照一連串之光刻法（ photolithography)程序處理做爲被處理基板之LCD基板之 塗敷顯影處理系統爲例說明。 如第1圖所示，塗敷顯影處理系統在無塵室內鄰接曝 光裝置12設置。在塗敷顯影處理系統1〇之中央部配置於X 軸方向伸展出之處理台（P/S) 16。處理站（P/S) 16之 一端連結於基板盒站（C/S) 14，另一端則連結於介面站 (I/F) 18。 基板盒台（C/ S )具備基板盒台20和次臂機構22，作 爲系統10中搬出入基板盒C之搬入出埠而作動。在基板盒 台20上4個基板盒C於Y軸方向直列並排地被承載著。在 基板盒C內水平收納複數片LCD基板G。 經濟部智慧財產局員工消費合作社印製 次臂機構22具備挾持基板G之搬送臂挾持器挾持座 22a以及使搬送臂挾持器挾持座22a於X、Y、Z和0似軸 動作之驅動機構（圖未示）。此次臂機構22在鄰接之處理 站（P/S) 16之搬送線A之輥輪台上搭載基板G，從搬送 線B之輥輪台上往上取下基板G。又，次臂機構22在與處 理站（P/ S ) 1 6側之梭40之間可直接交接基板G。 處理站（P/S) 16沿著於系統縱向方向（X軸方向） 延伸出之往復之搬送線A、B配置各處理部於程序流程或步 驟之順序。亦即，在從基板盒站（C/ S ) 14側向介面站（I / F ) 1 8側之往路之搬送線A按照洗淨處理部24、第1熱 處理部26、塗敷處理部28和第2熱處理部30之順序直線 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -12- 200302540 A7 B7 五、發明説明（9) 被排列著。 另一方面，在從介面站（1/F ) 18側向基板盒站（C/ S ) 14側之復路之搬送線B按照第2熱處理部30、顯影處 理部32、脫色處理部34和第3熱處理部36之順序直線被 排列著。在此搬送線，第2熱處理部30位於往路之搬送線 A之最末尾之位置，且在迴路之搬送顯B之最前頭位置， 橫跨於兩搬送線A、B間。 在兩搬送線A、B之間設有輔助搬送空間38，以1片 單元可水平地載置基板G之梭40藉由未圖示之驅動機構形 成可雙方向移動於搬送線方向（X軸方向）。 在上流部之搬送線A，洗淨處理部24包含著洗滌器洗 淨單元（SCR ) 42，在鄰接此洗滌器洗淨單元（SCR ) 42內 之基板盒站（C/S) 10之場所配置激磁UV照射單元（e-UV) 41。洗滌式洗淨單元（SCR) 42內之洗鏡部藉由輥輪 搬送或輸送帶搬送以水平姿勢於搬送線A方向搬送LCD基 板G且施予刷洗洗淨和沖洗洗淨於基板G。 鄰接於洗淨處理部24之下游側之第1熱處理部26沿 著搬送線A在中心部設置縱型之交接臂機構46，在其前後 兩側多段疊積配置複數單元。 具體而言，如第2圖所示，在上流部之多段單元部（ TB) 44，於基板交接用之搬送單兀50之上’多段疊積脫水 烤乾用之加熱單元（D HP) 521、522和附著單元（AD) 561 。此處，搬送單元（PASS ) 50提供爲了從洗滌器洗淨單元 (SCR) 42收取洗淨處理完畢之基板G。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29*7公釐） (請先閱讀背面之注意事項再填寫本頁) Γ200302540 A7 B7 V. Description of the invention (1) The technical field to which the invention belongs The present invention relates to the use of (on the back of the page, please read the precautions on the back) photolithography ) Substrate processing system for forming circuit patterns. Prior art Recently, the size of LCD (Liquid Crystal Display Panel) is very large. With the expansion of manufacturing lines, the handling and handling of glass substrates has become increasingly difficult. In order to cope with the increase in the size of such LCD substrates, a coating and development processing system used in LCD manufacturing is used to arrange the rollers side by side through a transfer line (conveying path) through which the substrates pass. Direction, and along the conveying line, a so-called "advection method" in which substrates are sequentially processed by a processing device arranged. In this advection system, a large number of processing devices are arranged linearly along the transfer line in the order of the lithography process flow (hereinafter referred to as "program flow"). Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In such a linear system, when a fault occurs from any part and the necessity of maintenance and inspection, the processing of the entire system should be stopped, or the processing should be slowed down. In addition, although it is not possible to stop processing, even in the case of processing stagnation, all processing units on the upstream side of the program flow are affected, either by stopping their own processing or by slowing down. In this case, in the processing section of the advection method, in order for various tools arranged along the horizontal conveying path to pass a series of processing in a certain timing sequence through the substrate on the side, it can operate normally. The effect of stagnation stagnates the substrate on the horizontal conveying path. The paper size applies to the Chinese National Standard (CNS) A4 specification (210/297 mm) -5- 200302540 A7 B7 V. Description of the invention (2) Contents and processing results Can not be set, and the disadvantage of reduced output will occur (please read the precautions on the back before filling this page) SUMMARY OF THE INVENTION The object of the present invention is to provide a substrate processing system, which will be upstream even if the program flow is stagnant in a part of the system. The influence of the processing unit on the side or the substrate to be processed is minimized. The substrate processing system printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is a substrate processing system that processes a plurality of substrates sequentially along a transfer line from a substrate box station (cassette station) to an exposure device. It is characterized in that it includes a plurality of processing unit groups including a first processing section provided on the upstream side and a second processing section provided on the downstream side along the transfer line, and receiving the transfer along the transfer line from the first processing section. The first transfer unit of the substrate is disposed on the downstream side of the first transfer unit, and the second transfer unit that transfers the substrate that has passed through the first transfer unit to the second processing unit is disposed on the first and second transfer units. At least one buffer unit located above at least one of the units, below the at least one of the first and second transfer units, and for preventing the substrates from colliding with each other on the transfer line to stop the substrates, A transfer arm mechanism for transferring a substrate between the first and second transfer units and the buffer unit. In the system of the present invention, the heat treatment unit of the heat treatment section on the upper side is almost completely isolated from the buffer unit on the lower side of the transport unit. Therefore, the substrate stored in the buffer unit is only slightly affected by the heat treatment unit, especially in the case of the heat treatment unit, it can be prevented from being affected by heat. In addition, in the buffer unit department, the paper size is applied to the Chinese National Standard (CNS) A4 specification (21 × 297 mm) -6-200302540 A7 B7 V. Description of the invention (3) --I '------ ^^ 衣 丨 .-- (Please read the precautions on the back before filling in this page) In use, the transportation means does not need to pass through the buffer unit, let alone even need not pass by it. It can be very concentrated in the range of centralized processing unit configuration. Efficiently complete the transportation stroke. In a typical form of the system of the present invention, when the control means determines that the substrate cannot be carried into either the heat treatment section or the second processing section, the transfer arm mechanism allows the substrate received in the first transfer unit to be stored in one of the buffer units. . In this case, the substrate is stored in the buffer unit after the processing of one or more steps before the heat treatment section or the second processing section which should not be carried in is completed, so that the stagnation of the processing flow and the yield can be achieved. The reduction ends to a minimum. The preferred form of the transfer arm mechanism is a lifting transport body that can be raised and lowered in the vertical direction, a swiveling transport body that can be rotated around a vertical axis on the lifting transport body, and a supporting substrate on the swiveling transport body, which can be used in the horizontal plane. Conveyor arm holder retractable in the front-rear direction. The transfer arm mechanism can freely pass through the unit groups belonging to the multi-segment unit units of the left and right pair, and the board can be carried in and out of these unit groups. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, 8th Industrial Cooperative Cooperative. Multiple buffer units are stacked in multiple stages under the first and second transport units, and each of these buffer units can accommodate a single substrate. In this case, it is preferable to further provide a means for forming an environment of an inert gas in the buffer unit. The first processing section forms a part of the transfer line, and may have a transfer path for transferring the substrate in a substantially horizontal posture in a horizontal direction, and a processing means for performing a predetermined process while transferring the substrate on the transfer path. The usefulness of the buffer unit is particularly high, which can avoid the processing of the plane movement of the first processing unit. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 200302540 A7 B7_ V. The description of the invention (4) Expected outage. -^ ------ ^-(Please read the precautions on the back before filling out this page) The heat treatment department can apply heat treatment to the substrate with the 1st or 2nd treatment unit. Multiple heat treatment units on the stack. In this case, the heat treatment unit may include 1 or 2 or more selected from the group consisting of a heating unit, a cooling unit, and an attachment unit. In addition, it may have a plurality of area controllers that share control of the multiple processing unit and the transfer arm mechanism, and are connected to each area controller side by side. In order to prevent the substrates arriving on the transport path from colliding with the forward substrates, the aforementioned multiple areas are collectively controlled. The main controller of the controller is better. In this case, the main controller grasps the current positions of all the substrates that change from moment to moment in the system, and based on the grasped current positions of the substrates, the time of each of the aforementioned plural zone controllers can be controlled. Brief description of the drawings J .. Figure 1 is a schematic plan view showing a substrate processing system according to an embodiment of the present invention; printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 2 is a diagram showing the first heat treatment section and Side view of the substrate transfer mechanism. Figure 3 shows the side view of the second heat treatment section and the substrate transfer mechanism. Figure 4 shows the side view of the third heat treatment section and the substrate transfer mechanism. Figure 5 shows the control of the substrate processing system. The block diagram of the system; and Figure 6 shows the paper size of the substrate processing system during normal processing. The paper size is applicable to China National Standard (CNS) A4 (210X297 mm) -8- 200302540 A7 B7 Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the employee consumer cooperative V. Description of invention (5) Flow chart. Brief description of drawing number 10 coating development processing system 12 exposure device 14 substrate box station (C / S) 16 processing station (P / S) 18 interface station (I / S) 20 substrate box table 22 secondary arm mechanism 22a conveying arm Holder holder 24 washing treatment section 26 first heat treatment section 28 coating treatment section 30 second heat treatment section 32 imaging treatment section 34 decolorization treatment section 36 third heat treatment section 40 shuttle 41 excimer UV irradiation unit (e-UV ) 42 Washer cleaning unit 44 Multi-stage unit section (TB) on the upstream side 46 Transfer arm mechanism 48 Multi-stage unit section (TB) on the downstream side (Please read the precautions on the back before filling this page) This paper size applies to China Standard (CNS) A4 specification (210X297 mm) -9-200302540 A7 B7 V. Description of the invention (6) 50 substrate transfer unit (PASS) 60 downstream side transfer unit (PASS) (please read the precautions on the back first) (Fill in this page) 68 guide rails 70 lifting and lowering conveyor 72 rotating conveyors 74 arm holders 76 driving unit 78 driving unit 80 driving unit 82 photoresist coating unit (CT) 84 decompression drying unit 86 trimming unit 88 multi-stage unit Section 90 Transfer arm mechanism 92 Multi-segment unit section (TB) 94 Imaging unit (DEV) 96 I-line UV irradiation unit (I-UV) Printed by the Consumer Property Cooperative of the Ministry of Economic Affairs and Intellectual Property Bureau 98 Multi-segment unit 100 100-transfer arm mechanism 102 Multi-segment unit 104 Transfer device 106 Buffer table 108 Extension cooling station 110 Header / periphery Exposure device This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -10- 200302540 A7 B7 V. Description of the invention (7) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperative 521 Heating unit (DHP) 522 Heating Unit (DHP) 523 heating unit (DHP) 524 heating unit (DHP) 621 cooling unit (COL) 622 cooling unit (COL) 671 punch unit 672 fm. Punch unit 673 punch unit 674 buffer unit 675 buffer unit 676 total punch unit 201 Controller (B / C) 202 Controller (B / C) 203 Zone Controller (B / C) 204 Zone Controller (B / C) 205 Zone Controller (B / C) 206 Zone Controller (B / C) ) 207 zone controller (B / C) 561 Adhesive unit 562 Adhesive unit 200 Main controller (M / C) Example of the invention The paper size is applicable National Standard (CNS) A4 Specification (210X297mm) K ------ Cloth ^-(Please read the precautions on the back before filling this page) Order-11-200302540 A7 B7 V. Description of Invention (8) --f ------ 衣 ^-(Please read the precautions on the back before filling out this page) The following describes the preferred implementation mode of the present invention with reference to the attached drawings. In this embodiment, a coating and development processing system that processes an LCD substrate as a substrate to be processed according to a series of photolithography programs is described as an example. As shown in Fig. 1, the coating and development processing system is installed adjacent to the exposure device 12 in a clean room. A processing table (P / S) 16 extending in the X-axis direction is arranged at the center of the coating and developing processing system 10. One end of the processing station (P / S) 16 is connected to the substrate box station (C / S) 14 and the other end is connected to the interface station (I / F) 18. The substrate cassette stage (C / S) includes a substrate cassette stage 20 and a secondary arm mechanism 22, and operates as a loading / unloading port for loading and unloading the substrate cassette C into and out of the system 10. On the substrate cassette stage 20, four substrate cassettes C are carried side by side in the Y-axis direction. A plurality of LCD substrates G are horizontally stored in the substrate box C. The printed sub-arm mechanism 22 of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs includes a transfer arm holder 22a that holds the substrate G, and a driving mechanism that causes the transfer arm holder 22a to act on the X, Y, Z, and 0 axes (Not shown). This time, the arm mechanism 22 mounts the substrate G on the roller table of the transfer line A of the adjacent processing station (P / S) 16, and removes the substrate G from the roller table of the transfer line B upward. The secondary arm mechanism 22 can directly transfer the substrate G to and from the shuttle 40 on the processing station (P / S) 16 side. The processing station (P / S) 16 arranges the processing units in the sequence of procedures or steps along the reciprocating transfer lines A and B extending in the longitudinal direction (X-axis direction) of the system. That is, the transfer line A from the substrate box station (C / S) 14 side to the interface station (I / F) 1 8 side follows the cleaning processing section 24, the first heat treatment section 26, and the coating treatment section 28. The order of the straight line with the second heat treatment part 30. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -12- 200302540 A7 B7 5. The description of the invention (9) is arranged. On the other hand, the transfer line B on the return path from the interface station (1 / F) 18 side to the substrate box station (C / S) 14 side is in accordance with the second heat treatment section 30, the development treatment section 32, the decolorization treatment section 34, and the first The order of the three heat treatment sections 36 is aligned in a straight line. In this transfer line, the second heat treatment section 30 is located at the last position of the transfer line A on the way, and spans between the two transfer lines A and B at the foremost position of the transfer display B of the loop. An auxiliary conveying space 38 is provided between the two conveying lines A and B. The shuttle 40 that can horizontally mount the substrate G in one unit is formed by a driving mechanism (not shown) and can be moved in both directions in the conveying line direction (X axis). direction). In the transfer line A of the upstream section, the cleaning processing section 24 includes a scrubber cleaning unit (SCR) 42 and a substrate box station (C / S) 10 adjacent to the scrubber cleaning unit (SCR) 42 An excitation UV irradiation unit (e-UV) 41 is provided. The mirror washing unit in the washing type cleaning unit (SCR) 42 conveys the LCD substrate G in a horizontal posture in the direction of the conveying line A by a roller conveyance or a conveyor belt conveyance, and scrubs and rinses the substrate G. The first heat treatment section 26 adjacent to the downstream side of the washing treatment section 24 is provided with a vertical transfer arm mechanism 46 at the center along the transfer line A, and a plurality of units are stacked on the front and rear sides in multiple stages. Specifically, as shown in FIG. 2, in the multi-stage unit section (TB) 44 of the upstream section, the multi-stage stacked dehydration and drying drying unit (D HP) 521 is placed above the transport unit 50 for substrate transfer. , 522, and attachment unit (AD) 561. Here, the transfer unit (PASS) 50 is provided to collect the substrate G after the cleaning process from the scrubber cleaning unit (SCR) 42. This paper size is applicable to China National Standard (CNS) A4 (210X29 * 7mm) (Please read the precautions on the back before filling this page) Γ

I 經濟部智慧財產局員工消費合作社印製 -13- 200302540 A7 B7 五、發明説明（10 (請先閱讀背面之注意事項再填寫本頁) 又，在下游側之多段單元部（TB ) 48，於基板交接用 之搬送單元（PASS) 50之上多段疊積冷卻單元（CL) 621 、622和附著單元（AD) 562。此處，搬送單元（PASS) 60 提供爲了向塗敷處理部28側傳遞應該接受光阻劑塗敷處理 之基板G之空間。 在上流側之搬送單元（PASS) 50之室內，洗滌器洗淨 單元（SCR ) 42之水平搬送路徑（圖未示）被引入。此種 水平搬送路徑構成搬送線之一部分。更且，可設置爲了以 水平姿勢舉起搬送路徑上之基板之可升降之撐桿（圖未示 )° 在本實施形態，上流側和下游側之兩多段單元部（TB )44、48個別設有1個或數個緩衝室（BUF)。亦即，如 第2圖所示，在上流側搬送單元（PASS ) 50之下方多段疊 積3個緩衝單元（BUF) 671、672、673，且在下游側搬送 單元（PASS) 60之下方亦多段疊積3個緩衝單元（BUF) 674、675、676。在緩衝單元（BUF) 671〜676之室內設置 數個撐桿（圖未示），而可從交接臂機構46交接基板G。 經濟部智慧財產局員工消費合作社印製 這些緩衝單元（BUF) 671〜676,屬於熱處理部之單元 之空間無，爲了避免在搬送線A、B上基板G之間互撞，利 用來作爲使基板暫時滯留（待機）之規避場所。 在第2圖，交接臂機構46具有沿著延長於鉛直方向之 導軌68可移動升降之升降搬送體70、在此升降搬送體70 上可旋轉或迴旋於0方向之迴旋搬送體72、在此迴旋搬送 體72上挾持基板且可於前後方向進退或伸縮之搬送臂挾持 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -14- 200302540 A7 B7 五、發明説明（11) (請先閲讀背面之注意事項再填寫本頁} 器或撐桿組74。爲了驅動升降搬送體70升降之驅動部76 設置在垂直導軌68之基端側，爲了驅動迴旋搬送體72迴 旋之驅動部78裝置在升降搬送體70，爲了驅動搬送臂挾持 器74進退之驅動部80裝置在旋轉搬送體72。各驅動部76 、78、80可例如由電子馬達等所構成。 交接臂機構46在區控制器205之控制下，不是高速升 降就是迴旋運動而通過從兩鄰之多段單元部（TB) 44、48 之中所選擇之任意單元，可搬入搬出基板G。又，交接臂I Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-13- 200302540 A7 B7 V. Description of the invention (10 (please read the precautions on the back before filling this page) Also, the multi-segment unit section (TB) on the downstream side 48, A plurality of stacked cooling units (CL) 621, 622, and an attachment unit (AD) 562 are provided above the transfer unit (PASS) 50 for substrate transfer. Here, the transfer unit (PASS) 60 is provided to the coating processing unit 28 side. Transfer the space of substrate G that should be subjected to photoresist coating. In the room of the upstream side transfer unit (PASS) 50, the horizontal transfer path (not shown) of the scrubber cleaning unit (SCR) 42 is introduced. This This kind of horizontal conveying path constitutes a part of the conveying line. Furthermore, a lifting rod (not shown) can be provided for lifting the substrate on the conveying path in a horizontal posture. The multi-stage unit section (TB) 44, 48 is provided with one or several buffer chambers (BUF). That is, as shown in FIG. 2, three buffers are stacked in multiple stages below the upstream side transport unit (PASS) 50 Unit (BUF) 671, 672, 673, and Below the downstream conveying unit (PASS) 60, three buffer units (BUF) 674, 675, and 676 are stacked in multiple stages. Several struts (not shown) are installed in the interior of the buffer units (BUF) 671 to 676, and The substrate G can be transferred from the transfer arm mechanism 46. These buffer units (BUF) 671 ~ 676 are printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and there is no space for the units belonging to the heat treatment department. In order to avoid the substrate G on the transfer line A, B The collision between them is used as a place for avoiding the temporary stagnation (standby) of the substrate. In FIG. 2, the transfer arm mechanism 46 includes a lifting and lowering transport body 70 that can move up and down along a guide rail 68 extending in the vertical direction. Conveying body 72 on the conveying body 70 can be rotated or swiveled in the 0 direction, and a conveying arm holding the substrate on the rotating conveying body 72 and capable of advancing and retracting or retracting in the forward and backward directions. (210X 297mm) -14- 200302540 A7 B7 V. Description of the invention (11) (Please read the precautions on the back before filling this page} device or strut group 74. In order to drive the lifting and lowering body 70, the driving section 7 6 The driving part 78 is provided on the base end side of the vertical guide rail 68, and the driving part 78 for rotating the rotary conveyance body 72 is mounted on the lifting and lowering conveyance body 70, and the driving part 80 for driving the conveying arm holder 74 forward and backward is provided on the rotating conveyance body 72. Each drive The sections 76, 78, 80 may be constituted by, for example, electronic motors, etc. The transfer arm mechanism 46 is controlled by the zone controller 205 and is either high-speed lifting or rotating movement, and passes through two adjacent multi-section unit sections (TB) 44, 48 Any unit selected in can be carried in and out of the substrate G. Also, the transfer arm

機構46與輔助搬送空間38側之梭40亦可直接交接基板G 〇 經濟部智慧財產局員工消費合作社印製 如第1圖所示，塗敷處理部28鄰接第1熱處理部26 之下游側而設置。在塗敷處理部28，光阻劑塗敷單元（CT )82、減壓乾燥單元（VD ) 84和修邊器單元（ER ) 86沿著 往路搬送線A成一列並排。圖示雖省略，在塗敷處理部28 內設置爲了按照步驟順序1片1片在這3個單元（CT ) 82 、（VD ) 84、（ ER ) 86搬入和搬出基板G之內部搬送裝置 (圖未示），在各單元（CT) 82、（ VD) 84、（ ER) 86內 以1片基板之單兀進行各處理。再者*內部搬送裝置（圖 未示）亦可通經第1熱處理部26之下游側之搬送單元（ PASS ) 60。 如第3圖所示，第2熱處理部30實質上與上述第1熱 處理部係相同構造，設置在往路搬送線A和復路搬送線B 之間。亦即，第2熱處理部30在往路搬送線A側（最末尾 )具有一方向之多段單元部（TB ) 88，在復路搬送線B側 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -15· 200302540 A7 B7 五、發明説明（1彡 (前頭）具有它方向之多段單元部（TB) 92。在第2處理 部30，於上流側之多段單元部（TB ) 88和下游側之多段單 元部（TB ) 92之間設置交接臂機構90，上流側之多段單元 部（TB) 88具備第1搬送單元50。第1搬送單元50形成 從修邊器86交接基板G。 在往路側之搬送單元（PASS) 50之上方預熱用之2個 加熱單元（DHP) 521、522和1個冷卻單元（COL) 621被 疊積著。更且，在搬送單元（PASS) 50之下方設置著3段 之緩衝單元（BUF) 671、67 2、$7 3。 另一方面，在復路側之多段單元部（TB) 92，設置爲 了向顯影處理部32傳遞基板G之搬送單元（PASS ) 60。在 此搬送單元（PASS) 60之上方亦疊積與熱用的2個加熱單 元（DHP) 523、524和1個冷卻單元（COL) 622。更且， 在搬送單元（PASS ) 60之下方亦設有3段之緩衝單元（ BUF ) 674、675 和 676。 交接臂機構90在區電腦（B/C) 205之控制之下，高 速升降乃至迴旋運動通經從兩相鄰之多段單元部88和92 之中所選擇之任意之單元可進行基板G之搬入出，藉由兩 搬送單元（PASS ) 50、60與塗敷處理部28和顯影處理部 32可以1片單元交接基板G。又，交接臂機構90與輔助搬 送空間3 8內之梭40和後述之介面站（1/ F ) 1 8亦可以1 片單元交接基板G。 在復路搬送線B，顯影處理部32以水平姿勢搬送基板 G且進行一連串之顯影處理步驟，包含所謂平流方式之顯 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ---：------^-- (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -16- 200302540 A7 B7 五、發明説明（ 影單元（DEV ) 94。在此顯影處理部32內，例如尺寸1000 〜1200mm之LCD基板G最大8片爲止可一列並排。 (請先閱讀背面之注意事項再填寫本頁) 在顯影處理部32之下游側隔著脫色處理部配置第3熱 處理部36。脫色處理部34具備爲了在基板之被處理面照射 I線（波長365nm)進行脫色處理之i線UV照射單元（i-UV ) 96 〇 如第4圖所示，第3熱處理部36與上述第2熱處理部 30實質上係相同構造，設置在復路搬送線B之I線UV照 射單元（i 一 UV ) 96和基板盒站20之間。亦即，第3熱處 理部36在上流側具有一個多段單元部（TB) 98，在下游處 具有另一個多段單元部（TB ) 102。在第3熱處理部36，於 上流側之多段單元部（TB) 98和下游側之多段單元部（TB )102之間設置交接臂機構100，上流側之多段單元部（TB )98具備第1搬送單元50。第1搬送單元50從i線UV照 射單元（i一 UV) 96可交接基板G。 經濟部智慧財產局員工消費合作社印製 在上流側之搬送單元（PASS) 50之上方燒烤後用之2 個加熱單元（DHP) 521、522和1個冷卻單元（COL) 621 被疊積著。更且，在搬送單元（PASS) 50之下方設有3段 之緩衝單元（BUF) 671、67 2和67 3。 另一方面，在復路搬送線B側之多段單元部（TB ) 102 ，設有爲了往基板盒站C/S20傳遞基板G之搬送單元（ PASS) 60。在此搬送單元（PASS) 60之上方一疊積有燒烤 後用之2個加熱單元（DHP) 523、524和1個冷卻單元（ COL) 622。更且，在搬送單元（PASS) 60之下方亦設有3 本紙張尺度適用中國國家標準（CNS ) A4規格（BOX29?公釐） -17- 200302540 A7 B7 五、發明説明（1绰 段緩衝單元（BUF ) 674、675和676。 ---：------衣 ^-- (請先閲讀背面之注意事項再填寫本頁) 第3熱處理部36具有與上述第1熱處理部26和第2 熱處理部3 0同樣之構造，沿著搬送線b設置著縱行之交接 臂機構100和在其前後兩側之一對多段單元部（TB) 98、 102 〇 交接臂機構100在區控制器205之控制下，高速升降 乃至旋轉運動可通經兩相鄰之多段單元部（TB ) 98、102之 中之任意單元，兩多段單元部（TB) 98、102之搬送單元經 由搬送洗淨單元（PASS · COL )各自與i線UV照射單元（ i— UV) 96和基板盒站（C/S) 14可以1片單元交接基板 G。又，交接臂機構1〇〇亦與輔助搬送空間38內之梭40以 一片單兀接收基板G。 經濟部智慧財產局員工消費合作社印製 介面站（I/F) 18在與曝光裝置12之間具有爲了基板 G之搬送裝置104。在搬送裝置104之周圍設置著緩衝台（ BUFS) 106、伸展冷卻台（EXT · COL) 108和周邊裝置110 。在緩衝台（BUFS) 106設置固定置放型之緩衝基板（圖 未示）。延伸冷卻台（EXT · COL) 108係具備冷卻機能之 基板交接用之台，使用在與處理站（P/ S ) 1 6側交接基板 之時。週邊裝置110係上下堆疊例如標題器（TITLER)和 周邊曝光裝置（EE)之構造。搬送裝置104具有次臂機構 l〇4a，與曝光裝置12和各單元（BUFS) 105、（ EXT · COL )106、（ TITLER/EE) 110進行基板G之交接。 如第5圖所示，主控制器（M/ C ) 200並排連接數個 區控制器（B/C) 201〜207，送達指令至B/C201〜207之 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -18- 200302540 A7 B7 五、發明説明（1冷 每一個統籌控制系統全體。各B/C201〜207分擔承接系統 內之機器和單元，個別控制承接範圍之機器和單元之動作 〇 (請先閲讀背面之注意事項再填寫本頁} 從第1至第5圖之B/C201〜205分擔處理站（P/S) 24之各部之控制。例如，第1B/C201承擔激磁UV照射單 元（e - UV) 41、洗滌器洗淨單元（SCR) 42和第1熱處理 部26之多段單元部（TB ) 44、48之控制。第2B/ C202承 擔塗敷單元（CT ) 82、減壓乾燥單元（VD ) 84、修邊器（ ER ) 86之控制。第3B/ C203承擔顯影單元（DEV ) 94、第 2熱處理部之多段單元88、92 ( TB)之控制。第4B/C204 承擔顯影單元（DEV) 94、I線UV照射單元（i — UV) 96 和第3熱處理部之多段單元98、102 ( TB)之控制。第5B /C205承擔第1〜第3交接臂機構46、90、100和梭40之 控制。 第6B/C206分擔基板盒站（C/S) 14之各部之控制 ，例如承擔次臂機構22和空調用FFU (圖未示）之控制。 經濟部智慧財產局員工消費合作社印製 第7B/C207分擔介面站（I/F) 18之各部之控制，例 如承擔例如次臂機構104、緩衝站106、伸展冷卻台（EXT • COL) 108、標題器（TITLER) /周邊曝光裝置（EE) 110之控制。 第6圖顯示基板處理系統之正常時之處理之順序之流 程圖。首先，在基板盒站（C/S) 14，次臂機構22從台20 上之既定之基板盒C之中取出1個基板，搬入處理站（P/ S) 16之洗淨處理部24之激磁UV照射單元（e - UV) 41 ( 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -19- 200302540 A7 B7 五、發明説明（1弓 步驟S 1 )。 (請先閲讀背面之注意事項再填寫本頁) 在激磁UV照射單元（e- UV) 41內基板G實施由紫外 線照射之乾式洗淨（步驟S2)。在紫外線洗淨結束後，基 板G藉由基板盒站（C/S) 14之次臂機構22移入洗淨處 理部24之洗滌器洗淨單元（SCR ) 42。 在洗滌器洗淨單元（SCR) 42，如上所示藉由輥輪搬送 或輸送帶搬送以水平姿勢於基線A方向平面移動搬送基板 G且藉由實施擦洗洗淨和吹洗洗淨於基板G之表面，從基 板表面除去粒子狀之髒污（S3)。之後，洗淨後亦平面移 動搬送基板G且實施沖洗處理，最後使用氣刀等乾燥基板 G 〇 經濟部智慈財產局員工消費合作社印製 在洗滌器洗淨單元（SCR) 42內洗淨處理完畢之基板G 搬入第1熱處理部26之上流側多段單元部（TB ) 44內之搬 送單元（PASS) 50。之後，基板G經由下游側多段單元部 (TB) 48之搬送單元60搬送於輥輪台上，或搬入緩衝單元 671〜676之中之任何之一，等待至停滯解除時間到來。一 到停滯解除時間到來，交接臂機構46從緩衝單元取出基板 G，搬送到搬送單元（PASS )，承載於下游側之輥輪台。 對於基板採取哪一路線搬送由M/ C200判斷。M/ C200掌握在系統內時刻變化之全部之基板之現在位置，基 於其掌握之基板之現在位置控制B/C201〜207之各個之時 間。首先，M/C200基於面板登錄表求得預測計時時間， 判定在基線A之輥輪台上後來之基板G是否撞上前面之基 板G 〇 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） •20- 200302540 A7 B7 五、發明説明（1为 (請先閱讀背面之注意事項再填寫本頁) 判定爲是時，M/ C200送出信號至B/ C205，更且B/ C205送出信號至交接臂機構46，在交接臂機構46搬入基 板G於例如第3緩衝單元673 (步驟S4 )。 另一方面，判定結果爲否時，M/C200送出信號至B /C205，更且B/C205送出信號至交接臂機構46，在交接 臂機構搬入第2搬送單元60 (步驟S5)。此否判定結果時 跳過步驟S4從S3進入S5。 以下，有關本實施形態之基板處理程式之幾個軟體用 語分別定義如下。 ^ (1) 「單元面板處理時間（unit panel processing time) 」係1片面板（基板）從進入某單元至處理完畢從該單元 出來爲止之時間。 (2) 「單元作業時間（unit tact time)」係搬送臂支撐 機構連接於單元可搬送之狀態，前面之面板移出單元，下 一個面板移出該單元爲止之時間。通常，在以複數片面板 進入之單元，以一次處理面板片數分割「單元面板處理時 間」求得「單元作業時間」 經濟部智慧財產局員工消費合作社印製 (3) 「流程作業時間（flow tact time)」係在以指定某 面板之流程通過之單元之中，於做所指定之處方處理之場 合，使符合最慢之面板之最大步驟作業時間。 (4) 「批量控制作業（lot control task)」係從裝置內 之批量一次通過之全部單元之中，使符合處理時間最長之 作業時間，送出往平面移動單元和光阻劑塗敷系統單元之 面板而控制。 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -21 - 200302540 A7 B7 五、發明説明（19 處理單元之各個處理時間在登錄面板流程之時處方轉 送於B/ C，算出花費於程序處理之總處理時間和作業時間 響應。 (5) 「面板登錄表（panel registration table )」係登 錄存在於基板處理系統內之全部處理單元之單元面板處理 時間之資料庫。 M/ C使用面板登錄表，預測後到基板撞到前行基板之 計時時間，經由B/C發出指令信號至交接臂機構。交接臂 機構接收指令信號時，爲了配合預測計時時間從輸送線提 起基板G。 再者，面板處理經過時間在單元送出面板時自動解除 。以後，面板處理經過時間藉由批量控制作業每一秒被增 加。再者，M/C基於批量控制作業判斷在基線上之基板之 停滯。 (6 ) 「面板流程表（panel flow table )」稱爲登錄程 序處理時間和作業時間之資料庫。此處「程序處理時間（ processing time)」稱爲在面板流程展開時M / C在B / C 進行權宜之計設定單元面板處理時間之時間。基於此程序 處理時間之値在批量作業時間使作動之時，求得在處理單 元內剩下之基板之片數。 (7) 「批量控制表（lot control table )」稱爲登錄批量 作業時間之資料庫。此處「批量作業時間（lot tact time ) 」稱爲在從基板盒取出第1片基板時，在面板流程表被設 定之作業時間之最大値。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） --：------衣 ^-- (請先閲讀背面之注意事項再填寫本頁) 、11 d 經濟部智慧財產局員工消費合作社印製 -22- 200302540 A7 B7 五、發明説明（θ (請先閱讀背面之注意事項再填寫本頁) 在第1熱處理部26,基板G藉由交接臂機構46以既定 之順序轉到熱處理系統的單元。例如，基板G最初從搬送 單元（PASS) 50轉移到加熱單元（DHP) 521、522之1個 ，在該處接受脫水處理（步驟S5)。 其次，基板G移到冷卻單元（COL) 621、622之1個 在該處至一定之基板溫度爲止被冷卻（步驟S6 )。之後， 基板G移到黏著單元（AD) 561、562之1個，在該處接受 排水化處理（步驟S7)。在此排水化處理結束之後，基板 在冷卻單元（COL) 621、622之1個冷卻至一定的基板溫 度爲止（步驟S8)。最後，基板G移到屬於下游側多段單 元部（TB) 48之搬送單元（PASS) 60。 如此，在第1熱處理部26內，基板G經由交接臂機構 46在上流側之多段單元部（TB ) 44和下游側之多段單元部 (TB ) 48之間可任意來去。再者，在第2和第3熱處理部 30、36亦進行同樣之基板搬送動作。 經濟部智慧財產局員工消費合作社印製 在第1熱處理部26接受如上述之一連串之熱或熱系統 之處理之基板從下游側多段單元部（TB ) 48內之搬送單元 (PASS)移往下游側鄰近之塗敷處理部28之光阻劑塗敷單 元（CT) 82。 基板在光阻劑塗敷單元（CT) 82藉由例如旋覆法塗敷 保護液於基板上面（被處理面），接著在下游側鄰近之減 壓乾燥單元（VD) 84接受由減壓之乾燥處理，其次在下游 側鄰近之修邊器單元（ER) 86去除基板邊緣部之多餘（不 要）之光阻劑（步驟S9)。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -23- 200302540 A7 B7 五、發明説明（2C| 接受如上述之光阻劑塗敷處理之基板G交接於屬於從 減壓乾燥單元（VD )相鄰之第2熱處理部30之上流側多段 單元部（TB) 88之搬送單元（PASS)。 在第2熱處理部30內，基板G藉由交接臂機構90以 既定之順序轉到熱處理單元。例如，基板G最初從該搬送 單元（PASS )移到加熱單元（PREBAKE )之1個，在該處 接受光阻劑塗敷後之加熱（步驟S10)。 其次，基板G移到冷卻單元（COL )之1個，在該處 冷卻至一定之基板溫度（步驟S 11 )。之後，基板G經由 下游側多段單元部（TB) 92側之搬送單元（PASS)或不經 由而往介面站（I/F) 18側之延伸洗淨台（EXT· COL) 10 6交接。 在介面站（I/F) 18，基板G從延伸洗淨台（EXT · COL) 106搬入周邊裝置110之周邊曝光裝置（EE)，在該 處接受爲了在顯影時除去附著於基板G之周邊部之光阻劑 之曝光後，送往鄰近之曝光裝置12(步驟S12)。 在曝光裝置12於曝光基板G上之光阻劑曝光既定之電 路模式。而後，結束模式曝光之基板G從曝光裝置12回到 面板站（I/F) 18(步驟S11)時，首先搬入周邊裝置110 之（TITLER )，在該處於基板上之既定之部位記錄既定之 資訊（步驟12 )。之後，基板G回到延伸洗淨台（EXT · C〇L) 106。與介面站（I/F) 18之基板G之搬送和曝光裝 置12之基板G之交換由搬送裝置104所進行。 在處理站（P/ S ) 16，於第2熱處理部30交接臂機構 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ^------^^衣：-- (請先閱讀背面之注意事項再填寫本頁) 、訂 經濟部智慧財產局員工消費合作社印製 -24- 200302540 A7 B7 五、發明説明（21) (請先閲讀背面之注意事項再填寫本頁) 90由延伸洗淨台（EXT · COL) 106收取曝光完畢之基板G ’經由基線B側之多段單元部（TB ) 92內之搬送單元（ PASS )交接至顯影處理部32，或搬入緩衝單元671〜676之 中之任一'個。 M/C200基於面板登錄表求得預測計時時間，判定在 基線A之輥輪台上後到之基板是否撞上前行基板。判定結 果爲是之時，M/C200傳送信號至B/C205，更且B/C205 傳送信號至交接臂機構90，在交接臂機構90使基板G搬入 例如第2緩衝單元672 (步驟S14)。 另一方面，判定結果爲否時，M/C200傳送信號至B / C205，更且B/ C205傳送信號至交接臂機構90，在交接 臂機構90使基板G搬入第2搬送單元60。此否之判定結果 之時跳過步驟S14從S13進入步驟S15。 經濟部智慧財產局員工消費合作社印製 在顯影處理部32，搬入從該多段單元部（TB ) 92內之 搬送單元（PASS )所接取之基板G至顯影單元（DEV ) 94 。在顯影單元（DEV ) 94基板G以平面移動方式搬送相機 線B之下游，在其搬送中顯影洗淨和乾燥之一連串之顯影 處理步驟被進行（步驟S 1 5 )。 在顯影處理部32接受顯影處理之基板G向下游側鄰近 之脫色處理部34搬入，在該處接受由i線照射之脫色處理 (步驟S16)。脫色處理完畢之基板G交接於第3熱處理部 36之上流側多段單元部（TB) 98內之搬送單元（PASS)。 在第3熱處理部（TB) 98，基板G最初從該搬送單元 (PASS)移至加熱單元（POBAKE)之1個，在該處接受後 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -25 - 200302540 A7 B7 五、發明説明（d 加熱（步驟S17)。 (請先閱讀背面之注意事項再填寫本頁) M/ C200基於面板登陸表求得預測計時時間，判定在 搬送線B之輥輪台上後到基板是否撞上前行基板。判定結 果爲是之時，M/C200傳送信號至B/C205，更且B/C205 傳送傳送信號至交接臂機構100在交接臂機構100使基板G 搬入例如第5緩衝單元675 (步驟S18)。 另一方面，判定結果爲否之時，M/C200傳送信號至 B/C205，更且B/C205傳送信號至交接臂機構100，在交 接臂機構100使基板G搬入第2搬送單元60。此否判定結 果之時跳過步驟S18從步驟S17進入步驟S19。 其次，基板G移到下游側多段單元部（TB ) 102內之 搬送淸洗單元（PASS · COL )，在該處冷卻至既定之基板 溫度（步驟S19)。第3熱處理部36之基板G之搬送藉由 交接臂機構被進行。 經濟部智慧財產局員工消費合作社印製 在基板盒站（C/S) 14側，次臂機構22從第3熱處理 部36之搬送淸洗單元（PASS · COL)接取塗敷顯影處理之 全部步驟完畢之基板G，接取之基板G收納於任何1個基 板盒C (步驟S1 )。 如上所述，在此塗敷顯影處理系統，限於各部（特別 是處理系統的各部）正常動作，從基板盒站（C/S) 14傳 遞至處理15/21站（P/S) 18側之基板G沿著搬送線A、 B移送或轉送經系統內之各部且順次接受所需要之各處理（ S2〜S19)，在一定時間內向基板盒站（C/S)14回送。 但是，在系統內之某處，特別是在處理部故障或其他 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -26- 200302540 A7 B7 五、發明説明（2含 (請先閱讀背面之注意事項再填寫本頁) 障礙產生時，可向從處理流程之上流側該障礙產生之處理 部轉送或搬入基板G。理所當然’在下游側對線上之基板G 可完成剩下的全部處理。 如此系統內之某處處理流程停止，或停滯的場合，在 此實施形態利用配置在較障礙產生場所更上游側之緩衝室 (BUF)做爲基板暫時之留置乃至於保管。 例如，在塗敷處理部28內障礙產生而往該處理部28 之基板搬入變得不可能之場合爲例說明。此場合，配置在 第1熱處理部26之緩衝單元（BUF) 671〜676用於基板G 之留置。 亦即，在塗敷處理部28內產生障礙時，從基板盒站（ C/ S ) 14對洗淨處理部24，特別是對洗滌器洗淨單元（ SCR ) 42停止基板G之新搬入。此時，在洗滌器洗淨單元 (SCR ) 42，於水平搬送路線上以既定間隔成一列搬送例如 5片之複數片基板G且進行平行移動方式之基板洗淨處理 ，若停止平行移動搬送那些基板G會成爲不良洗淨品。 經濟部智慧財產局員工消費合作社印製 在此實施形態，爲了不輸出該類不良洗淨品，在洗滌 室洗淨單元（SCR ) 42使對平面移動搬送終之基板G之洗 淨處理完成。因此，從洗滌器洗淨單元（SCR) 42對第1 熱處理部26與正常時相同之循環乃至於計時洗淨完畢之基 板G陸續被搬入。 在第1熱處理部26，各基板G儘可能與通常相同之順 序接受熱處理後容納於緩衝單元（BUF) 671〜676之任何 一個。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -27- 200302540 A7 B7 五、發明説明（Μ (請先閱讀背面之注意事項再填寫本頁) 更詳細地說，搬入較洗滌器洗淨單元（SCR) 42更上 游側之搬送單元（PASS) 50之各基板G在加熱單元（DHP )521、522之1個接受脫水處理（步驟S5)，在冷卻單元 (COL) 621、622之1個冷卻至一定之基板溫度（步驟S6 )，之後，在黏著單元（AD) 561、562之1個接受排水化 處理（步驟S7 )。至此之一連串之熱處理步驟S6— S7-> S8 之流程與平常相同。 但是，排水化處理之後，基板G若係平常以冷卻單元 (COL) 621、622之1個接受基板溫度固定化之熱處理（ 步驟S8)，其次應送往下游側之搬送單元（PASS) 60，但 是此異常之狀態，取消往冷卻單元（COL) 621、622和搬 送單元（PASS) 60之轉送而轉送於緩衝單元（BUF) 671〜 676之任何一個。 此處，省略基板溫度固定化之熱處理（步驟S8)之理 由係此熱處理將其之後緊接著在塗敷處理部28實施光阻劑 塗敷處理做爲前提之前處理，且係來自從交接臂機構46之 產量乃至於各部間之作業時間調整上之理由。 經濟部智慈財產局員工消費合作社印製 在此種塗敷顯影處理系統，一般而言，設置複數（N 個）同一機能之熱處理單元，藉由在那些N個熱處理單元 錯開固定之時間並排使同一循環時間之熱處理進行，熱處 理部全體之作業時間縮短成1 / N，配合前步驟和後步驟之 處理作業時間，例如，在此實施形態，洗滌器洗淨單元（ SCR ) 42之洗淨處理作業時間爲60秒，但第1熱處理部26 之各熱處理單元（AD) 、（DHP)和（COL)之循環時間係 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇X：297公釐） -28- 200302540 A7 B7 五、發明説明（2冷 100秒前後之場合，藉由如第2圖所示各熱處理部單元（ AD ) 、（ DHP )和（COL )各設2台以50秒前後之時間差 (請先閲讀背面之注意事項再填寫本頁) 使並排運轉，可使熱處理全體乃至於各部之作業時間配合 洗淨處理作業時間。 在如此之多單元方式之熱處理部26，交接機構46幾乎 不間斷地以固定之週期巡迴各熱處理單元般地滿滿的行程 匆忙地動作著，因係異常狀態在平常動作之中無法擠進往 緩衝單元（BUF )轉送基板G動作乃是平常的。在此實施 型態，已取消如在上所述最終段之熱處理步驟之基板溫度 固定化之熱處理（步驟S8)，搬送產量上或作業時間上之 阻礙不會來而實現往緩衝單元（BUF )之基板收納動作。 如上所述，妨礙產生時在洗滌器洗淨單元（SCR) 42 內正在接受著洗淨處理之基板G之全部（例如5片）沒有 任何滯留正常地被實施予平面移動之洗淨處理，且在下一 段之第1熱處理部26亦接受實質上與平常不變之一連串熱 處理之後以1片單元收納於緩衝單元（BUF) 671〜676。 經濟部智慧財產局Μ工消費合作社印製 在此實施形態緩衝單元（BUF) 671〜676多段裝置於 搬送單元（PASS) 50、60之下，幾乎完全從在搬送單元（ PASS) 50、60之上所多段裝置之熱處理系統單元（AD) 561、562,（ DHP) 521、522，（ COL) 621、622 隔離。因而 ，保持基板G在未持有溫度調整機能之緩衝單元（BUF ) 671〜676，那些基板G從熱處理系統單元側不會受到熱的 影響。 又，在此實施形態，異常時，特別是如本例停止往處 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公釐） -29- 200302540 A7 B7 五、發明説明（2冷 (請先閱讀背面之注意事項再填寫本頁) 理流程之下游側之基板轉送之時，因爲取消如上述最終段 之熱處理步驟之基板溫度固定化之熱處理（步驟S8 )和往 搬送單元（PASS) 60之轉送，所以即使增加在緩衝單元（ BUF) 671〜676收納基板G之搬送步驟，交接臂機構46之 負擔亦不變重。而不必像交接臂機構46如上述正常時以滿 滿的行程忙碌地巡迴作動各處理單元。 此點，在本實施狀態，全部之緩衝單元（BUF) 671〜 676多段重複配置在搬送單元（PASS) 50、60之下，全部 之熱處理系統單元（AD) 561、562，（ DHP) 521、522，（ C〇L) 621、6222多段重複配置在搬送單元（PASS)之上， 因而，在不必要通經緩衝單元（BUF) 671〜676之正常時 ，交接臂機構46以最小限度之移動範圍巡迴在搬送單元（ PASS) 50、60之上集中配置之熱處理系統單元（AD) 561 、5 62，（DHP) 521、522，( COL) 621、622，可有效率地 達成需要的搬送行程。 又，在此實施形態連接於上流側之搬送單元（PASS) 經濟部智慧財產局員工消費合作社印製 50和連接於下游側之搬送單元（PASS) 60隔著交接臂機構 46互相獨立，上流側之搬送單元50乃至於搬送路徑與下游 側之搬送單元（PASS) 60乃至搬送路徑可自由設在相同高 度或不同高度。 又，在第1熱處理部26內有某處故障其它障礙產生之 場合。例如，在黏著單元（AD) 561、562熱板故障變得不 能使用之場合爲例。 此場合，以切換至另一之黏著單元（AD) 562之單獨 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -30- 200302540 A7 B7 五、發明説明（2为 (請先閱讀背面之注意事項再填寫本頁) 或單部運轉，雖然作業時間變長系統可持續運轉。但是， 在第1熱處理部26切換作業時間之後，馬上從上流側之洗 滌器洗淨裝置（SCR) 42搬入淸洗障礙發生時平面移動搬 送中之基板G之全部爲止在正常作業洗淨完畢之基板G。 在此情形，於第1熱處理部26，以在熱處理之前或間歇暫 時留置從洗滌器洗淨單元（SCR ) 42接取之基板G於緩衝 單元（BUF) 671〜676，可進行作業時間之補償或調整。 在第2和第3熱處理部30、36亦可得與第1熱處理部 26同樣之機能和作用。可使在這些熱處理部26、30、36間 聯繫上述基板之留置獨立。緩衝單元（BUF )不僅限於上述 系統產生障礙之場合，因應必要可活用於各種情形。 在此實施形態，緩衝單元（BUF)雖可以正面開口之框 體構成，但亦可設置開關門或擋板。又，在室內可形成例 如氮氣之惰性氣體之環境。該場合，例如從單元框體之後 背部導入氮氣，經由多孔管形成氮氣之均一流動和環境。 又，在上述實施形態，在上述1個緩衝單元（BUF )雖然收 納1片基板，但亦可做成可收納數片之單元構造。 經濟部智慧財產局員工消費合作社印製 本發明之處理系統雖極爲適用於上述塗敷顯影處理系 統，但在系統構造和系統要件可有種種之變化，例如包含 膜形成裝置和蝕刻裝置等之串聯型系統亦可適用。本發明 之被處理基板被處理之基板不限於LCD基板，包含彩色過 濾器和半導體晶圓等之各種被處理基板。 藉由以上說明，若由本發明之處理系統，在系統內之 一部份即使處理流程停滯，上流側之處理部或被處理基板 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -31 - 200302540 A7 B7 五、發明説明（2每 受到的影響可止於最小限度，可得到處理效率和品質之提 昇0 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慈財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -32-The mechanism 46 and the shuttle 40 on the side of the auxiliary conveyance space 38 can also directly transfer the substrate G. As shown in FIG. 1, the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs has a coating processing section 28 adjacent to the downstream side of the first heat treatment section 26. Settings. In the coating processing section 28, a photoresist coating unit (CT) 82, a reduced-pressure drying unit (VD) 84, and an edger unit (ER) 86 are arranged side by side along the forward conveyance line A. Although not shown in the figure, an internal transfer device (CT) 82, (VD) 84, (ER) 86 for carrying in and out of the substrate G is provided in the coating processing unit 28 in order of one by one in the order of steps. (Not shown), each unit (CT) 82, (VD) 84, (ER) 86 performs each process in a unit of a substrate. In addition, * the internal transfer device (not shown) may pass through the transfer unit (PASS) 60 on the downstream side of the first heat treatment section 26. As shown in Fig. 3, the second heat treatment section 30 has substantially the same structure as the above-mentioned first heat treatment section system, and is provided between the forward transfer line A and the dual transfer line B. That is, the second heat treatment section 30 has a multi-section unit section (TB) 88 on one side (the end) of the forward conveyance line, and on the B side of the double conveyance line, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 (Mm) -15 · 200302540 A7 B7 V. Description of the invention (1 彡 (front) has a multi-section unit section (TB) 92 in its direction. In the second processing section 30, the multi-section unit section (TB) 88 on the upstream side is 88 and A transfer arm mechanism 90 is provided between the multi-stage unit section (TB) 92 on the downstream side, and a first transport unit 50 is provided on the multi-stage unit section (TB) 88 on the upstream side. The first transport unit 50 is configured to transfer the substrate G from the trimmer 86. Two heating units (DHP) 521, 522 and one cooling unit (COL) 621 for preheating are stacked above the conveying unit (PASS) 50 on the road side. Furthermore, the conveying unit (PASS) 50 A three-stage buffer unit (BUF) 671, 67 2, and $ 7 3 are provided below. On the other hand, a multi-stage unit unit (TB) 92 on the return side is provided with a transfer unit (for transferring the substrate G to the development processing unit 32) ( PASS) 60. On top of this conveying unit (PASS) 60 is also stacked and heated 2 heating units (DHP) 523, 524 and 1 cooling unit (COL) 622. Furthermore, there are 3 sections of buffer units (BUF) 674, 675 and 676 below the transfer unit (PASS) 60. Handover The arm mechanism 90 is controlled by the zone computer (B / C) 205, and high-speed lifting and even turning movement can be carried in and out of the substrate G through any unit selected from two adjacent multi-segment unit units 88 and 92. The substrate G can be transferred in a single unit by two transfer units (PASS) 50, 60 and the coating processing unit 28 and the development processing unit 32. Furthermore, the transfer arm mechanism 90 and the shuttle 40 in the auxiliary transfer space 38 and described later The interface station (1 / F) 1 8 can also transfer the substrate G in one unit. In the double-line transfer line B, the development processing unit 32 transfers the substrate G in a horizontal posture and performs a series of development processing steps, including the so-called parallel-flow display paper. Standards are applicable to China National Standard (CNS) A4 specifications (210X297 mm) ---: ------ ^-(Please read the precautions on the back before filling this page) Order the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Printing-16- 200302540 A7 B7 V. Description of the invention (DEV) 94. In this development processing section 32, for example, up to 8 LCD substrates G with a size of 1000 to 1200mm can be lined up side by side. (Please read the precautions on the back before filling this page.) In the development processing section 32, The third heat treatment section 36 is disposed on the downstream side with the decoloring treatment section interposed therebetween. The decoloring treatment section 34 includes an i-ray UV irradiation unit (i-UV) 96 for irradiating I-rays (wavelength 365 nm) on the substrate to be processed surface. The third heat treatment section 36 and the first heat treatment section 36 are as shown in FIG. 4. 2 The heat treatment section 30 has substantially the same structure and is provided between the I-line UV irradiation unit (i-UV) 96 of the double-line conveyance line B and the substrate box station 20. That is, the third heat treatment section 36 has one multi-stage unit section (TB) 98 on the upstream side and another multi-stage unit section (TB) 102 on the downstream side. In the third heat treatment section 36, a transfer arm mechanism 100 is provided between the upstream multi-stage unit section (TB) 98 and the downstream multi-stage unit section (TB) 102. The upstream side multi-stage unit section (TB) 98 includes a first section. Hauling unit 50. The first transfer unit 50 can transfer the substrate G from the i-line UV irradiation unit (i-UV) 96. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Two heating units (DHP) 521, 522, and one cooling unit (COL) 621 used for grilling above the upper-side transfer unit (PASS) 50 are stacked. Furthermore, three stages of buffer units (BUF) 671, 67 2 and 67 3 are provided below the conveying unit (PASS) 50. On the other hand, a multi-stage unit section (TB) 102 on the B side of the double-line transfer line is provided with a transfer unit (PASS) 60 for transferring the substrate G to the substrate box station C / S20. Above this transfer unit (PASS) 60 are stacked two heating units (DHP) 523, 524 and one cooling unit (COL) 622 for grilling. In addition, there are 3 paper sizes below the conveying unit (PASS) 60, which are applicable to the Chinese National Standard (CNS) A4 (BOX29? Mm) -17- 200302540 A7 B7 V. Description of the invention (1 segment buffer unit (BUF) 674, 675, and 676. ---: ------ clothing ^-(Please read the precautions on the back before filling out this page) The third heat treatment section 36 has the same properties as the first heat treatment section 26 and The second heat treatment section 30 has the same structure, and a vertical transfer arm mechanism 100 and a pair of multi-section unit sections (TB) 98 and 102 on the front and back sides are provided along the transfer line b. The transfer arm mechanism 100 is controlled in the zone. Under the control of the device 205, high-speed lifting and even rotary motion can pass through any of the two adjacent multi-section unit sections (TB) 98, 102, and the transport units of the two multi-section unit sections (TB) 98, 102 are cleaned by transport. Each of the unit (PASS · COL) and the i-ray UV irradiation unit (i-UV) 96 and the substrate box station (C / S) 14 can transfer the substrate G in a single unit. The transfer arm mechanism 100 is also used for the auxiliary transfer space. Shuttle 40 within 38 receives substrate G in a single unit. Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs The interface station (I / F) 18 has a transfer device 104 for the substrate G between the exposure device 12 and a buffer table (BUFS) 106, an extension cooling table (EXT · COL) 108, and the surroundings. Device 110. A buffer substrate (not shown) of a fixed type is installed on a buffer table (BUFS) 106. An extension cooling table (EXT · COL) 108 is a table for transferring substrates with a cooling function, and is used in a processing station ( P / S) When the substrate is transferred on the 6 side. The peripheral device 110 has a structure such as a titler (TITLER) and a peripheral exposure device (EE) stacked up and down. The transport device 104 has a secondary arm mechanism 104a, and the exposure device 12 and Each unit (BUFS) 105, (EXT · COL) 106, and (TITLER / EE) 110 transfer the substrate G. As shown in Figure 5, the main controller (M / C) 200 connects several zone controllers side by side ( B / C) 201 ~ 207, the paper size of the delivery instructions to B / C201 ~ 207 is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -18- 200302540 A7 B7 V. Description of the invention (1 cold each overall plan The entire control system. Each B / C201 ~ 207 share the equipment in the undertaking system And unit, individually controlling the machines and units in the scope of acceptance. (Please read the precautions on the back before filling out this page.) From B / C201 to 205 in Figures 1 to 5, the shared processing station (P / S) 24 of Control of various ministries. For example, the 1B / C201 is responsible for controlling the excitation UV irradiation unit (e-UV) 41, the scrubber washing unit (SCR) 42, and the multi-stage unit unit (TB) 44, 48 of the first heat treatment unit 26. The 2B / C202 is responsible for the control of the coating unit (CT) 82, the reduced pressure drying unit (VD) 84, and the edge trimmer (ER) 86. The 3B / C203 is responsible for the control of the developing unit (DEV) 94 and the multi-stage units 88, 92 (TB) of the second heat treatment section. The 4B / C204 is responsible for the control of the developing unit (DEV) 94, the I-line UV irradiation unit (i-UV) 96, and the multi-stage units 98, 102 (TB) of the third heat treatment section. The 5B / C205 controls the first to third transfer arm mechanisms 46, 90, 100 and shuttle 40. The 6B / C206 share the control of the various parts of the substrate box station (C / S) 14, for example, the control of the secondary arm mechanism 22 and the air-conditioning FFU (not shown). Ministry of Economic Affairs, Intellectual Property Bureau, Employee Consumer Cooperative, printed 7B / C207 shared control of the various sections of the interface station (I / F) 18, such as undertaking the secondary arm mechanism 104, the buffer station 106, the extension cooling station (EXT • COL) 108, Titler (TITLER) / peripheral exposure device (EE) 110 control. Fig. 6 is a flowchart showing the processing sequence of the substrate processing system during normal operation. First, at the substrate box station (C / S) 14, the secondary arm mechanism 22 takes one substrate out of the predetermined substrate box C on the stage 20, and carries it into the cleaning processing unit 24 of the processing station (P / S) 16. Excitation UV irradiation unit (e-UV) 41 (This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -19- 200302540 A7 B7 V. Description of the invention (1 bow step S 1). (Please read first Note on the back page, please fill in this page again) In the excitation UV irradiation unit (e-UV) 41, the substrate G is dry-cleaned by ultraviolet irradiation (step S2). After the ultraviolet cleaning is completed, the substrate G is passed through the substrate box station. (C / S) 14 The secondary arm mechanism 22 moves into the scrubber washing unit (SCR) 42 of the washing processing unit 24. At the scrubber washing unit (SCR) 42, as shown above, it is transported by a roller or a conveyor belt The substrate G is transported in a horizontal posture in a plane in the direction of the baseline A, and the surface of the substrate G is scrubbed and purged to remove particulate contamination from the surface of the substrate (S3). After that, it is also cleaned. The substrate G is transported in a plane and rinsed. Finally, the substrate G is dried using an air knife or the like. Printed substrates in the scrubber cleaning unit (SCR) 42 by the consumer cooperative of the Ministry of Economic Affairs and Intellectual Property of the Ministry of Economy and Social Affairs are transferred to the first heat treatment section 26 on the upstream side multi-segment unit section (TB) 44 and the transfer unit ( PASS) 50. Thereafter, the substrate G is transported on the roller table via the transport unit 60 of the downstream multi-stage unit section (TB) 48 or into any one of the buffer units 671 to 676, and waits until the stagnation release time comes. As soon as the stagnation release time comes, the transfer arm mechanism 46 takes out the substrate G from the buffer unit, transfers it to the transfer unit (PASS), and carries it on the roller table on the downstream side. It is determined by M / C200 which route the substrate will take. C200 grasps the current position of all the substrates that change at any time in the system, and controls the time of each of B / C201 to 207 based on the current position of the substrate it grasps. First, M / C200 obtains the predicted timing time based on the panel registration table, and judges Is the subsequent substrate G hitting the front substrate G on the roller table of the baseline A? This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) • 20- 200302540 A7 B7 5 、 Explanation of the invention (1 is (Please read the precautions on the back before filling in this page) When it is judged as yes, the M / C200 sends a signal to B / C205, and the B / C205 sends a signal to the transfer arm mechanism 46, at the transfer arm The mechanism 46 carries the substrate G into, for example, the third buffer unit 673 (step S4). On the other hand, when the determination result is no, the M / C200 sends a signal to the B / C205, and the B / C205 sends a signal to the transfer arm mechanism 46. The second transfer unit 60 is carried into the transfer arm mechanism (step S5). If the result of this determination is negative, skip step S4 and proceed from S3 to S5. Hereinafter, several software terms related to the substrate processing program of this embodiment are defined as follows. ^ (1) "Unit panel processing time" is the time from when a panel (substrate) enters a unit to when it finishes processing and exits from the unit. (2) "Unit tact time" refers to the time that the transport arm support mechanism is connected to the unit and can be transported. The front panel moves out of the unit and the next panel moves out of the unit. Normally, in the unit entered with multiple panels, the "unit panel processing time" is divided by the number of processing panels at a time to obtain the "unit operation time". (3) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. “tact time” ”refers to the maximum step time required for the slowest panel to be used in the process of specifying the panel. (4) "lot control task" refers to all the units that pass through the batch in the device at one time so that the operation time that meets the longest processing time is sent to the panel of the plane moving unit and the photoresist coating system unit And control. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -21-200302540 A7 B7 V. Description of the invention (19 Each processing time of the processing unit is transferred to B / C during the registration of the panel process and calculated Response of total processing time and operation time spent in program processing. (5) "Panel registration table" is a database of unit panel processing time for all processing units existing in the substrate processing system. M / C Use the panel registration table to predict the timing time from when the substrate hits the front substrate, and then send a command signal to the transfer arm mechanism via B / C. When the transfer arm mechanism receives the command signal, lift the substrate G from the conveyor line in order to match the predicted timing time. Moreover, the panel processing elapsed time is automatically canceled when the unit sends out the panel. In the future, the panel processing elapsed time is increased every second by the batch control operation. Furthermore, M / C determines the stagnation of the substrate on the baseline based on the batch control operation. (6) "Panel flow table" is a database of registration process processing time and operation time "Processing time" here is called the time when M / C performed expediently to set the unit panel processing time when the panel process is unfolded. Based on this program, the processing time is used in batch operation time. At the time of operation, find the number of substrates remaining in the processing unit. (7) "lot control table" is called a database for registering batch operation time. Here, "lot tact time ”” is called the maximum working time set on the panel flow chart when the first substrate is taken out of the substrate box. This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm)-: ------ yi ^-(Please read the notes on the back before filling this page), 11 d Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-22- 200302540 A7 B7 V. Description of the invention (θ (please Read the precautions on the back before filling this page.) In the first heat treatment section 26, the substrate G is transferred to the unit of the heat treatment system by the transfer arm mechanism 46 in a predetermined order. For example, the substrate G is initially transferred from the transfer unit (PASS) 50 To Canada One of the unit (DHP) 521 and 522 is subjected to a dehydration process there (step S5). Next, the substrate G is moved to the cooling unit (COL) 621 and 622 and is cooled to a certain substrate temperature there. (Step S6). Thereafter, the substrate G is moved to one of the adhesion units (AD) 561 and 562, where it is subjected to a drainage process (step S7). After the drainage process is completed, the substrate is placed in a cooling unit (COL). One of 621 and 622 is cooled to a certain substrate temperature (step S8). Finally, the substrate G is moved to a transfer unit (PASS) 60 belonging to the downstream multi-stage unit unit (TB) 48. In this manner, in the first heat treatment section 26, the substrate G can be arbitrarily moved between the upstream multi-stage unit section (TB) 44 and the downstream multi-stage unit section (TB) 48 via the transfer arm mechanism 46. The same substrate transfer operation is performed in the second and third heat treatment sections 30 and 36. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs in the first heat treatment section 26. The substrates subjected to the above-mentioned series of thermal or thermal system processing are moved from the transport unit (PASS) in the downstream multi-stage unit section (TB) 48 to the downstream. A photoresist coating unit (CT) 82 of the coating processing section 28 adjacent to the side. The substrate is applied to the photoresist coating unit (CT) 82 by, for example, spin coating, and a protective liquid is applied on the substrate (the surface to be processed), and then a decompression drying unit (VD) 84 adjacent to the downstream side receives the decompression The drying process is followed by removing the unnecessary (unnecessary) photoresist at the edge portion of the substrate at the edge trimmer unit (ER) 86 adjacent to the downstream side (step S9). This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) -23- 200302540 A7 B7 V. Description of the invention (2C | The substrate G that has been treated with the photoresist coating as described above is handed over to the decompression Transfer unit (PASS) of upstream multi-stage unit section (TB) 88 of the second heat treatment section 30 adjacent to the drying unit (VD). In the second heat treatment section 30, the substrate G is transferred by the transfer arm mechanism 90 in a predetermined order. Transfer to the heat treatment unit. For example, the substrate G is initially moved from the transfer unit (PASS) to one of the heating units (PREBAKE), where it is heated after being coated with a photoresist (step S10). Next, the substrate G is moved One of the cooling units (COL), where it is cooled to a certain substrate temperature (step S11). After that, the substrate G passes through the downstream multi-stage unit section (TB) 92 side transfer unit (PASS) or does not pass Transfer to the extension station (EXT · COL) 10 6 at the interface station (I / F) 18. At the interface station (I / F) 18, the substrate G is moved from the extension station (EXT · COL) 106 to the peripheral device. 110-peripheral exposure device (EE), where it is accepted in order to remove After the photoresist on the peripheral portion of the substrate G is exposed, it is sent to the neighboring exposure device 12 (step S12). The photoresist on the exposure substrate 12 is exposed to the predetermined circuit mode by the exposure device 12. Then, the pattern exposure is ended. When the substrate G is returned from the exposure device 12 to the panel station (I / F) 18 (step S11), it is first moved into the peripheral device 110 (TITLER), and the predetermined information is recorded at a predetermined position on the substrate (step 12) After that, the substrate G is returned to the extension cleaning stage (EXT · COL) 106. The substrate G is transferred to and from the interface station (I / F) 18 and the substrate G of the exposure device 12 is transferred by the transfer device 104. At the processing station (P / S) 16, transfer the arm mechanism to the second heat treatment section 30. The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm). ^ ------ ^^ Clothing:-( Please read the precautions on the back before filling this page), order printed by the Intellectual Property Bureau's Consumer Cooperatives of the Ministry of Economic Affairs-24- 200302540 A7 B7 V. Description of the invention (21) (Please read the precautions on the back before completing this page) 90 is collected by the extended cleaning station (EXT · COL) 106. The transfer unit (PASS) in the multi-segment unit unit (TB) 92 on the B side of the baseline is transferred to the development processing unit 32, or any one of the buffer units 671 to 676. M / C200 is calculated based on the panel registration table Predict the timing time to determine whether the substrate that came after the roller table on the baseline A hit the forward substrate. When the determination result is yes, the M / C200 transmits a signal to B / C205, and the B / C205 transmits a signal to the transfer arm mechanism 90, and the transfer arm mechanism 90 moves the substrate G into, for example, the second buffer unit 672 (step S14). On the other hand, if the determination result is no, the M / C200 transmits a signal to B / C205, and the B / C205 transmits a signal to the transfer arm mechanism 90, and the transfer arm mechanism 90 carries the substrate G into the second transfer unit 60. If the result of this determination is negative, step S14 is skipped and the process proceeds from step S13 to step S15. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In the development processing unit 32, the substrate G received from the transfer unit (PASS) in the multi-stage unit unit (TB) 92 is transferred to the development unit (DEV) 94. A series of developing processing steps of developing washing, washing, and drying are carried out during the conveyance of the developing unit (DEV) 94 substrate G downstream of the camera line B in a plane-moving manner (step S 1 5). The substrate G subjected to the development processing in the development processing section 32 is carried in to the decoloring processing section 34 adjacent to the downstream side, where it is subjected to a decoloring treatment irradiated with i rays (step S16). The decolorized substrate G is transferred to the transfer unit (PASS) in the upstream side multi-stage unit unit (TB) 98 of the third heat treatment unit 36. In the third heat treatment section (TB) 98, the substrate G was first moved from the conveying unit (PASS) to one of the heating units (POBAKE). After accepting it there, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297) (Mm) -25-200302540 A7 B7 V. Description of the invention (d heating (step S17). (Please read the precautions on the back before filling in this page) M / C200 based on the panel login form to obtain the predicted timing time, and determine that it is being transported Is the roller B on the line B hitting the substrate and hitting the forward substrate. When the judgment result is yes, the M / C200 sends a signal to B / C205, and the B / C205 sends a transfer signal to the transfer arm mechanism 100 at the transfer arm The mechanism 100 moves the substrate G into, for example, the fifth buffer unit 675 (step S18). On the other hand, when the determination result is no, the M / C200 transmits a signal to the B / C205, and the B / C205 transmits a signal to the transfer arm mechanism 100. When the transfer arm mechanism 100 transfers the substrate G into the second transfer unit 60. When this result is not determined, step S18 is skipped and step S17 is followed by step S19. Next, the substrate G is moved to the downstream multi-stage unit section (TB) 102. Transfer the cleaning unit (PASS · COL), where Cool to the predetermined substrate temperature (step S19). The transfer of the substrate G of the third heat treatment section 36 is performed by the transfer arm mechanism. The employee consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is printed on the substrate box station (C / S) 14 side The secondary arm mechanism 22 receives the substrate G that has completed all the steps of the coating and development process from the transfer cleaning unit (PASS · COL) of the third heat treatment section 36, and the received substrate G is stored in any one substrate box C (step S1). As described above, the coating and development processing system is limited to the normal operation of each part (especially each part of the processing system), and is transferred from the substrate box station (C / S) 14 to the processing 15/21 station (P / S). The substrate G on the 18 side is transferred or transferred along the transfer lines A and B through the various parts in the system and sequentially receives the required processing (S2 to S19), and returns to the substrate box station (C / S) 14 within a certain time. , Somewhere in the system, especially in the processing department failure or other paper standards apply Chinese National Standard (CNS) A4 specifications (210X297 mm) -26- 200302540 A7 B7 V. Description of the invention (2 included (please read first (Notes on the back, please fill out this page) The substrate G can be transferred to the processing part caused by the obstacle on the upstream side of the processing flow or taken into the substrate G. Of course, 'the substrate G on the line can complete the rest of the processing on the downstream side. In this way, the processing flow stops or stagnates somewhere in the system. In the case of this embodiment, a buffer room (BUF) arranged on the upstream side of the obstacle generation place is used as a temporary indwelling or even storage of the substrate. For example, a case where an obstacle occurs in the coating processing section 28 and it becomes impossible to carry in the substrate into the processing section 28 will be described as an example. In this case, buffer units (BUF) 671 to 676 arranged in the first heat treatment section 26 are used for leaving the substrate G. That is, when an obstacle occurs in the coating processing unit 28, the substrate G station 14 (C / S) 14 stops the new carrying-in of the substrate G to the cleaning processing unit 24, particularly to the scrubber cleaning unit (SCR) 42. At this time, in the scrubber cleaning unit (SCR) 42, for example, a plurality of substrates G of five substrates are transported in a row at a predetermined interval on a horizontal conveying route and the substrate cleaning processing is performed in parallel. The substrate G becomes a poorly cleaned product. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs In this embodiment, in order not to output such bad cleaning products, the cleaning process of the substrate G that has been transported by the plane is completed in the cleaning unit (SCR) 42 of the washing room. Therefore, the cycle from the scrubber cleaning unit (SCR) 42 to the first heat treatment section 26 is the same as that of the normal time, and even the substrate G that has been cleaned at a time is successively moved in. In the first heat treatment section 26, each of the substrates G is heat-treated in the same order as usual, and is accommodated in any one of buffer units (BUF) 671 to 676. This paper size applies Chinese National Standard (CNS) A4 (210X297 mm) -27- 200302540 A7 B7 V. Description of the invention (M (please read the precautions on the back before filling this page) In more detail, moving into The cleaning unit (SCR) 42 is further upstream of the conveying unit (PASS) 50. Each substrate G is subjected to dehydration processing in one of the heating units (DHP) 521 and 522 (step S5), and the cooling unit (COL) 621, One of 622 is cooled to a certain substrate temperature (step S6), and then one of the adhesive units (AD) 561 and 562 is subjected to drainage treatment (step S7). So far, one of the series of heat treatment steps S6—S7- > The process of S8 is the same as usual. However, after the drainage process, if the substrate G is usually heat-treated by one of the cooling unit (COL) 621, 622 to receive the substrate temperature fixation (step S8), it should be sent to the downstream side. Transfer unit (PASS) 60, but in this abnormal state, the transfer to the cooling unit (COL) 621, 622 and the transfer unit (PASS) 60 is canceled and transferred to any of the buffer units (BUF) 671 to 676. Here, Omit substrate temperature fixing The reason for the heat treatment (step S8) is that this heat treatment is performed immediately before the photoresist coating treatment is performed on the coating treatment section 28 as a prerequisite, and the output from the transfer arm mechanism 46 is even between the sections. Reasons for adjustment of operating time. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed this type of coating and development processing system. Generally, a plurality of (N) heat treatment units with the same function are provided. Units are staggered for a fixed time and side-by-side so that the heat treatment of the same cycle time is performed, and the operating time of the entire heat treatment department is shortened to 1 / N. With the processing time of the previous step and the subsequent step, for example, in this embodiment, the washing unit of the washing machine ( The cleaning processing time of SCR) 42 is 60 seconds, but the cycle time of each heat treatment unit (AD), (DHP), and (COL) of the first heat treatment section 26 is based on the Chinese paper standard (CNS) A4. (21 × X: 297 mm) -28- 200302540 A7 B7 V. Description of the invention (for 2 and 100 seconds before and after cooling, each heat treatment unit unit (AD as shown in Fig. 2) ), (DHP) and (COL) each set two units with a time difference of 50 seconds (please read the precautions on the back before filling in this page), and run side by side, which can make the entire heat treatment and even the operation time of each department cooperate with the cleaning treatment. Working time: In such a multi-unit heat treatment section 26, the transfer mechanism 46 patrols the heat treatment units with a fixed cycle almost constantly, and the full stroke is rushed, because the abnormal state is not possible during normal operation. It is normal to squeeze the transfer of the substrate G to the buffer unit (BUF). In this implementation form, the heat treatment for fixing the substrate temperature at the final heat treatment step as described above (step S8) has been canceled, and the obstacle in terms of transport yield or operation time will not come to the buffer unit (BUF). The substrate storage operation. As described above, all the substrates G (for example, 5 pieces) that are undergoing the cleaning process in the scrubber cleaning unit (SCR) 42 at the time of occurrence of the obstacle are normally subjected to a planar cleaning process without any retention, and After the first heat treatment section 26 in the next paragraph also undergoes a series of heat treatments that are substantially unchanged from usual, it is stored in a buffer unit (BUF) 671 to 676 in a single unit. The Ministry of Economic Affairs ’Intellectual Property Bureau ’s Consumer Industry Cooperative has printed more than 671 to 676 pieces of buffer units (BUF) in this embodiment. They are installed under the transfer unit (PASS) 50 and 60, almost completely from the transfer unit (PASS) 50 and 60. The heat treatment system units (AD) 561, 562, (DHP) 521, 522, and (COL) 621, 622 of the above multi-stage equipment are isolated. Therefore, if the buffer units (BUF) 671 to 676 that do not have the temperature adjustment function are used to keep the substrates G, those substrates G are not affected by heat from the heat treatment system unit side. Also, in this embodiment, when abnormal, especially as this example stops, the paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -29- 200302540 A7 B7 V. Description of the invention (2 Cold ( Please read the precautions on the back before filling in this page.) When transferring the substrate downstream of the processing process, the heat treatment (step S8) and transfer to the transfer unit (PASS) will be cancelled because the substrate temperature is fixed as described in the final heat treatment step above. The transfer of 60, so even if the transfer steps of the storage unit G in the buffer unit (BUF) 671 to 676 are increased, the burden of the transfer arm mechanism 46 does not change. Instead of the transfer arm mechanism 46 being normal as described above with a full stroke In this implementation state, all buffer units (BUF) 671 to 676 are repeatedly arranged under the transfer unit (PASS) 50, 60, and all heat treatment system units (AD) 561. , 562, (DHP) 521, 522, (C0L) 621, 6222 are repeatedly arranged on the conveying unit (PASS), so when it is not necessary to pass through the buffer unit (BUF) 671 ~ 676 normal The transfer arm mechanism 46 traverses the heat treatment system units (AD) 561, 5 62, (DHP) 521, 522, (COL) 621, 622 that are centrally arranged above the transfer unit (PASS) 50, 60 with a minimum moving range. In addition, in this embodiment, it is printed on the upstream side transfer unit (PASS), printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and printed on the downstream side transfer unit (PASS) 60. The transfer unit 50 on the upstream side and even the transfer path (PASS) 60 on the downstream side can be freely set at the same height or different heights via the transfer arm mechanism 46. In the first heat treatment section 26, There is a place where a fault occurs and other obstacles occur. For example, where the hot plate failure of the adhesive unit (AD) 561, 562 becomes unusable as an example. In this case, switch to another adhesive unit (AD) 562. Separate paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) -30- 200302540 A7 B7 V. Invention description (2 is (Please read the precautions on the back before filling this page) It can be operated in a single unit, although the operating time becomes longer. The system can continue to operate. However, immediately after the first heat treatment unit 26 switches the operating time, it is moved from the scrubber cleaning device (SCR) 42 on the upper side to the plane when the washing obstacle occurs. The substrate G that has been cleaned by normal operations until all the substrates G are being transported. In this case, in the first heat treatment section 26, it is temporarily removed from the scrubber cleaning unit (SCR) 42 before the heat treatment or intermittently. The substrate G is in the buffer unit (BUF) 671 ~ 676, which can compensate or adjust the working time. The second and third heat treatment sections 30 and 36 can also obtain the same functions and functions as the first heat treatment section 26. It is possible to separate the placement of these substrates between the heat treatment sections 26, 30, and 36 in contact with the substrate. The buffer unit (BUF) is not limited to the occasion where the above-mentioned system causes an obstacle, and can be used in various situations as necessary. In this embodiment, although the buffer unit (BUF) may be constituted by a frame with an opening on the front side, a door or a shutter may be provided. Moreover, an environment of an inert gas such as nitrogen can be formed in the room. In this case, for example, nitrogen gas is introduced from the back of the unit casing, and a uniform flow of nitrogen and an environment are formed through the porous tube. Furthermore, in the above-mentioned embodiment, although one substrate is housed in the one buffer unit (BUF), a unit structure capable of accommodating several pieces may be used. Although the processing system of the present invention printed by the employee's consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is extremely suitable for the above-mentioned coating and developing processing system, there can be various changes in the system structure and system requirements, such as a series including a film forming device and an etching device. Type system is also applicable. The substrate to be processed in the present invention is not limited to an LCD substrate, and includes various substrates to be processed such as a color filter and a semiconductor wafer. Based on the above description, if the processing system of the present invention has a stagnant processing flow in a part of the system, the processing section on the upstream side or the substrate to be processed applies the Chinese National Standard (CNS) A4 specification (210X297 mm). -31-200302540 A7 B7 V. Explanation of the invention (2Each impact can be minimized, and the processing efficiency and quality can be improved. 0 (Please read the precautions on the back before filling this page). Intellectual Property Office of the Ministry of Economic Affairs The paper size printed by the employee consumer cooperative is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -32-

Claims (1)

200302540 A8 B8 C8 D8 六、申請專利範圍1 (請先閲讀背面之注意事項再填寫本頁) 1. 一種基板處理系統，爲沿著往復於從基板盒站至外部 的曝光裝置之間的輸送線來依次搬送處理數個基板之基板 處理系統，其特徵係具備： 具有沿著前述搬送線而設置於上流側的第1處理部和 設置於下游側的第2處理部之複數處理單元群；及 從前述第1處理部來接受沿著前述搬送線所搬送的基 板之第1搬送單元；及 配置在較第1搬送單元更下游側而，將通過前述第1 搬送單元的基板送出至Μ述第2處理部之第2搬送單元； 及 設置於前述第1和第2搬送單元中的至少的一方的上 方之熱處理部；及 設置於前述第1和第2搬送單元中的至少一方的下方 ，爲了避免在前述搬送線上基板互撞，而使基板暫時停留 之至少一個緩衝單元；及 在前述第1和第2搬送單元和前述緩衝單元之間搬送 基板之交接臂機構。 經濟部智慧財產局員工消費合作社印製 2. 如申請專利範圍第1項之基板處理系統，其中更具有 基板無法搬入前述熱處理部時或基板無法搬入前述第2處 理部時，以能夠從前述第1搬送早元搬出基板，且將基板 搬入前述緩衝單元之方式來控制前述交接臂機構之控制手 段。 3. 如申請專利範圍第2項之基板處理系統，其中，前述 控制手段是在使不能搬入的前述熱處理部或前述第2處理 本&張尺度適用中國國家標準（CNS ) Α4規格（210Χ：297公釐） 7^1 200302540 A8 B8 C8 D8 六、申請專利範圍 2 部所應進行的處理之前1個或前2個以上之步驟的處理預 先完成之後，搬入前述基板至前述緩衝單元。 (請先閲讀背面之注意事項再填寫本頁) 4.如申請專利範圍第1項之基板處理系統，其中，前述 交接臂機構具備可升降於垂直方向之升降搬送體，及在前 述升降搬送體上可旋轉於垂直軸周圍之旋轉搬送體，及在 前述旋轉搬送體上支持前述基板且在水平面內可伸縮於前 後方向之搬送臂支撐器。 5·如申請專利範圍第1項之基板處理系統，其中在前述 第1和第2搬送單元的下方各自堆疊複數前述緩衝單元成 上下多段，且分別在前述緩衝單元收納各一片基板。 6·如申請專利範圍第1項之基板處理系統，其中更具有 供以在前述緩衝單元內形成惰性氣體的環境之手段。 7·如申請專利範圍第1項之基板處理系統，其中，前述 第1處理部具有：形成前述搬送線之一部份，供以實質水平 姿勢來將基板搬送於水平方向基板之搬送路徑，及對搬送 於前述搬送路徑上的基板施予既定的處理之處理手段。 經濟部智慧財產局員工消費合作社印製 8·如申請專利範圍第1項之基板處理系統，其中，前述 熱處理部具有爲了對基板施予附隨於前述第1或第2處理 部的處理之熱處理，而上下多段地堆積上之複數個熱處理 單元。 9·如申請專利範圍第8項之基板處理系統，其中，前述 熱處理單元包含從由加熱單元、冷卻單元和黏結單元所形 成的群選擇之1或2以上。 10.如申請專利範圍第1項之基板處理系統，具有 本^張尺度適用中國國家標準(CNS ) A4規格（210X297公釐） =34 -—" 200302540 A8 B8 C8 D8 六、申請專利範圍 3 分擔控制前述複數個處理單元和前述交接臂機構之複 數個區控制器；及 並排連接前述各個區控制器，以能夠在前述搬送線上 ，爲了後到之基板不致撞上前行的基板統籌地控制前述複 數區控制器之主控制器。 11.如申請專利範圍第10項之基板處理系統，其中，前 述主控制器在系統內掌握時刻變化之全部基板的現在位置 ，根據該掌握之基板的現在位置來分別時間控制前述複數 個區控制器。 -----------®^ΙΊ — (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -35-200302540 A8 B8 C8 D8 6. Scope of patent application 1 (Please read the precautions on the back before filling in this page) 1. A substrate processing system is a conveying line that reciprocates from the substrate box station to the external exposure device A substrate processing system for sequentially transferring and processing a plurality of substrates includes a plurality of processing unit groups including a first processing unit provided on the upstream side and a second processing unit provided on the downstream side along the transfer line; and A first transfer unit that receives a substrate transferred along the transfer line from the first processing unit; and is disposed further downstream than the first transfer unit and sends the substrate that has passed through the first transfer unit to the first A second transfer unit of the 2 processing unit; and a heat treatment unit provided above at least one of the first and second transfer units; and provided below at least one of the first and second transfer units in order to At least one buffer unit that prevents substrates from colliding with each other on the transfer line and temporarily stops the substrate; and transfers between the first and second transfer units and the buffer unit Board transfer arm mechanism. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 2. If the substrate processing system of item 1 of the patent application scope includes a substrate that cannot be moved into the heat treatment section or a substrate that cannot be moved into the second processing section, 1 Conveying the early element to take out the substrate, and to move the substrate into the buffer unit to control the control means of the transfer arm mechanism. 3. For the substrate processing system in the second scope of the patent application, wherein the aforementioned control means is to make the aforementioned heat treatment department or the aforementioned second processing book & Zhang scale which cannot be carried in apply the Chinese National Standard (CNS) A4 specification (210 ×: 297 mm) 7 ^ 1 200302540 A8 B8 C8 D8 VI. Processing to be performed in the 2nd patent application scope 1 or 2 steps before the processing is completed in advance, the substrate is transferred to the buffer unit. (Please read the precautions on the back before filling out this page) 4. If the substrate processing system of the first patent application scope, the transfer arm mechanism has a lifting and lowering body that can be raised and lowered in the vertical direction, and the lifting and lowering body A rotary conveying body capable of rotating around a vertical axis, and a conveying arm supporter which supports the substrate on the rotary conveying body and is retractable in the horizontal direction in the horizontal plane. 5. The substrate processing system according to item 1 of the scope of the patent application, wherein a plurality of the buffer units are stacked below the first and second conveying units, respectively, into upper and lower stages, and each substrate is stored in the buffer unit. 6. The substrate processing system according to item 1 of the patent application scope, further comprising means for forming an environment of an inert gas in the buffer unit. 7. The substrate processing system according to item 1 of the scope of patent application, wherein the first processing unit has a part of the aforementioned transport line for transporting the substrate to a horizontal substrate transport path in a substantially horizontal posture, and A processing means that applies a predetermined process to a substrate transferred on the transfer path. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 8. If the substrate processing system of item 1 of the scope of patent application is applied, the aforementioned heat treatment section has a heat treatment for subjecting the substrate to the processing accompanying the aforementioned first or second processing section And, a plurality of heat treatment units are stacked on the upper and lower stages. 9. The substrate processing system according to item 8 of the application, wherein the heat treatment unit includes one or more selected from the group consisting of a heating unit, a cooling unit, and a bonding unit. 10. If the substrate processing system in item 1 of the scope of patent application has this standard, the Chinese standard (CNS) A4 specification (210X297 mm) is applicable = 34 -— " 200302540 A8 B8 C8 D8 6. Scope of patent application 3 Share and control the plurality of processing units and the plurality of zone controllers of the transfer arm mechanism; and connect the zone controllers side by side so as to be able to perform overall control on the transfer line so that the substrates arriving later do not collide with the substrates traveling ahead The main controller of the aforementioned plural zone controller. 11. The substrate processing system according to item 10 of the patent application scope, wherein the main controller in the system grasps the current positions of all the substrates that change from time to time, and respectively controls the foregoing plurality of zone controls according to the current positions of the substrates. Device. ----------- ® ^ ΙΊ — (Please read the notes on the back before filling out this page) Order printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs This paper applies Chinese National Standard (CNS) A4 Specifications (210X297 mm) -35-
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