KR100912280B1 - Substrate processing system - Google Patents

Abstract

A substrate processing system for sequentially conveying and processing a plurality of substrates along a pass line reciprocating from a cassette station to an external exposure apparatus, the first processing portion provided upstream and downstream provided along the pass line. A plurality of processing unit groups having a second processing unit, a first pass unit that receives the substrate conveyed along the pass line, and a first pass unit that receives the first pass unit, are disposed downstream from the first pass unit, and pass through the first pass unit. A second pass unit for sending a substrate to the second processing unit, a heat treatment unit disposed above at least one of the first and second pass units, and at least one of the first and second pass units below; At least one buffer oil to temporarily hold the substrate to avoid collision between the substrates on the pass line And a transfer arm mechanism for transferring the substrate between the nits and the first and second pass units and the buffer unit.

Description

Substrate Processing System {SUBSTRATE PROCESSING SYSTEM}

1 is a schematic plan view showing a substrate processing system according to an embodiment of the present invention.

2 is a side view showing a first heat treatment part and a substrate transport mechanism.

3 is a side view showing a second heat treatment part and a substrate transport mechanism.

4 is a side view showing a third heat treatment part and a substrate transport mechanism.

5 is a block diagram illustrating a control system of a substrate processing system.

6 is a flowchart showing a procedure of normal processing in the substrate processing system.

The present invention relates to a substrate processing system for forming a circuit pattern by photolithography on a substrate to be processed, such as an LCD substrate.

In recent years, LCDs (liquid crystal display displays) are remarkably large in size, and as the production line is enlarged, conveyance and handing of glass substrates becomes more difficult. In order to cope with such an increase in size of LCD substrates, in a coating and developing processing system used for LCD manufacturing, table rollers are placed side by side on a pass line (transport path) through which the substrate passes, and the substrate rollers are conveyed in a horizontal direction in turn. In addition, a method of sequentially processing substrates (hereinafter, referred to as a "flow method") is adopted by a processing apparatus arranged along a pass line. In this planar flow method, a plurality of processing apparatuses are arranged in series along a pass line according to the order of flow of the photolithography process (hereinafter referred to as "process flow").

In such a series-line system, either the system stops processing or slows down processing when either one fails or needs maintenance. In addition, although the processing is not stopped, even if the processing is stalled, all processing units located upstream of the process flow are affected, and each processing must be stopped or slowed down.

In this case, in the processing unit of the flat flow method, in order to make it normal operation to sequentially perform a series of processes at a constant timing on a substrate passing along sideways by various tools arranged along the horizontal transport path, If the substrate in the horizontal conveying path is held by the processing unit in the processing section of the processing unit, the processing contents or the processing result may not be as set, and there is a problem in that the ratio of the product to the raw material when operating is lowered. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing system which minimizes the influence of an upstream processing unit or a substrate to be processed even when a process flow is stagnant in a part of the system.                         

The substrate processing system of the present invention is a substrate processing system for sequentially conveying and processing a plurality of substrates in accordance with a pass line reciprocating between external exposure apparatuses in a cassette station, and a first processing portion provided upstream along the pass line. And a plurality of processing unit groups having a second processing unit provided on the downstream side, a first pass unit that receives the substrate conveyed along the pass line in the first processing unit, and a downstream side of the first pass unit. A second pass unit disposed in the first pass unit and passing the substrate passing through the first pass unit to the second processing unit, a heat treatment unit disposed above at least one of the first and second pass units, and the first pass unit; And a substrate provided below at least one of the second pass units to temporarily prevent the substrates from colliding on the pass lines. At least one buffer yuniteugwa, the first and the argument for transferring the substrate between passes yuniteugwa the buffer unit of the second place to stay characterized in that it includes a delivery arm mechanism.

In the system of the present invention, a pass unit is fitted, and the lower buffer unit is almost completely isolated from the heat treatment unit of the upper heat treatment unit. As a result, the substrate stored in the buffer unit can be prevented from being affected by any heat in the heat treatment unit, particularly in the case of the heat treatment unit. In addition, when the buffer unit is not in use, the conveying means does not need to access the buffer unit, nor does it need to pass through it, and the conveyance schedule can be efficiently processed in the area where the processing units are arranged.

In one typical form of the system of the present invention, when the control means determines that neither the heat treatment unit nor the second processing unit is capable of carrying in the substrate, the substrate may be buffered by the take-in arm mechanism. Store in one of the units. In this case, the substrate is stored in the buffer unit after the processing of one or more processes before the processing to be carried out in the heat-treatment unit or the second processing unit which cannot be carried in, and thus the process flow is minimized and the decrease in throughput is minimized. It can be suppressed.

A preferred form of the take-up guide arm mechanism is a lifting carrier which can be lifted in the vertical direction, a pivoting carrier that can pivot about a vertical axis on the lifting carrier, and a substrate on the pivoting carrier while supporting the substrate in the horizontal direction in the front and rear directions. It has an elastic carrier arm holder. The delivery arm mechanism can freely access a group of units belonging to a pair of left and right multi-stage unit parts, and can carry in and out boards.

A plurality of buffer units are stacked in multiple stages below the first and second pass units, and one substrate can be accommodated in each of these buffer units. In this case, it is preferable to further have means for forming an atmosphere of inert gas in the buffer unit.

The first processing unit may have a conveying path for forming a part of the pass line, and conveying the substrate in a horizontal direction in a substantially horizontal posture, and processing means for performing a predetermined process on the substrate conveyed on the conveying path. . As a result, the benefit of the buffer unit is particularly high, and unwanted interruption of the horizontally flowing process in the first processing unit can be avoided.

The heat treatment unit may have a plurality of heat treatment units stacked in multiple stages up and down in order to perform a thermal treatment accompanying the processing of the first or second treatment unit with respect to the substrate. In this case, the heat treatment unit may include one or two or more selected from the group consisting of a heating unit, a cooling unit, and an attachment unit.

Further, a plurality of block controllers which share and control a plurality of processing units and take-up guide arm mechanisms, and each of the block controllers are connected in parallel, so that the plurality of blocks do not collide with a preceding substrate on a pass line so that the subsequent substrates do not collide. It is desirable to have a main controller that collectively controls the controller. In this case, the main controller can grasp the current positions of all the substrates that are changed from time to time in the system, and can time-control each of the plurality of block controllers based on the identified current positions of the substrates.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described, referring an accompanying drawing. In this embodiment, an application processing system for processing an LCD substrate as a substrate to be processed by a series of photolithography processes will be described as an example.

As shown in FIG. 1, the coating and developing processing system 10 is provided adjacent to the exposure apparatus 12 in a clean room. At the center of the coating and developing processing system 10, a process station (P / S) 16 extending in the X-axis direction is disposed. One end side of the process station (P / S) 16 is connected to the cassette station (C / S) 14, and the other end side is connected to the interface station (I / F) 18.

The cassette station (C / S) 14 is provided with a cassette stage 20 and a subarm mechanism 22, and functions as a carrying in / out port for putting the cassette C in and out of the system 10. On the cassette stage 20, four cassettes C are placed in series in the Y-axis direction. In the cassette C, a plurality of LCD substrates G are stored horizontally.

The sub arm mechanism 22 is provided with the conveyance arm holder 22a which hold | maintains the board | substrate G, and the drive mechanism (not shown) which operates the conveyance arm holder 22a to four axes of X, Y, Z, and (theta). Doing. The sub-arm mechanism 22 places the substrate G on the roller table of the pass line A of the adjacent process station (P / S) 16, and the substrate (on the roller table of the pass line B). Adopt G). The sub-arm mechanism 22 can also take over the substrate G directly with the shuttle 40 on the process station (P / S) 16 side.

The process station (P / S) 16 is arranged in the order of a process plug or a process in accordance with the pass lines A and B of the reciprocation extending in the system longitudinal direction (X-axis direction). That is, the cleaning process part 24 and the first heat treatment part 26 are provided in the pass line A of the path from the cassette station (C / S) 14 side to the interface station (I / F) 18 side. The coating process part 28 and the 2nd heat processing part 30 are arrange | positioned in this order in series.

On the other hand, the second heat treatment unit 30 and the developing process unit (B) are provided in the path line B of the return path from the interface station (I / F) 18 side to the cassette station (C / S) 14 side. 32, the discoloration process part 34 and the 3rd heat processing part 36 are arrange | positioned in this order in series. In this line form, the second heat treatment unit 30 is located at the rear of the path line A of the return path, and is located at the head of the path line B of the return path. On.

Auxiliary transport space 38 is provided between both passlines A and B, and a shuttle mechanism in which a shuttle 40 capable of horizontally placing the substrate G horizontally in units of one sheet is not shown in the passline direction (X-axis direction). ) Can move in both directions.

In the pass line A of the upstream portion, the cleaning process section 24 includes a scrubber cleaning unit (SCR) 42, and the cassette station (C /) in the scrubber cleaning unit (SCR) 42. An excimer UV irradiation unit (e-UV) 41 is disposed at a position adjacent to S) 10. The cleaning unit in the scrubber cleaning unit (SCR) 42 performs brushing cleaning or blow cleaning on the substrate G while conveying the LCD substrate G in the horizontal direction in the pass line A direction by roller conveyance or belt conveyance. It is supposed to be done.

The first heat treatment part 26 adjacent to the downstream side of the cleaning process part 24 is provided with a vertical delivery guide arm mechanism 46 at its center in the center along the pass line A, and on both front and rear sides thereof. Units are stacked in multiple stages.

Specifically, as shown in FIG. 2, in the upstream multi-stage unit (TB) 44, a heating unit (DHP) for dewatering bake is placed on the substrate-passing delivery pass unit (PASS) 50. 521, 522 and Adhesion Unit (AD) 561 are stacked in multiple stages. Here, the pass unit (PASS) 50 provides a space for receiving the substrate (G) after the cleaning process in the scrubber cleaning unit (SCR) 42.

In addition, the downstream multistage unit (TB) 48 has a cooling unit (CL) 621 and 622 and an attachment unit (AD) 562 on the pass unit (PASS) 50 for substrate transfer. Stacked in this multistage. Here, the pass unit (PASS) 60 provides a space for passing the substrate G to be subjected to the resist coating process to the application process portion 28 side.                     

A horizontal conveyance path (not shown) of the scrubber cleaning unit (SCR) 42 is led in the interior of the upstream pass unit PASS 50. These horizontal carriers constitute part of the pass line. Moreover, you may provide the liftable lift pin (not shown) for lifting a board | substrate horizontally on a conveyance path.

In the interior of each heat treatment system unit ((DHP: 521, 522), (AD: 561, 562), (CL: 621, 622)), a hot plate (not shown) for placing and heating the substrate G horizontally. A lift pin (not shown) or the like that is capable of taking over the substrate G on the hot plate is provided. In the interior of the downstream pass unit (PASS) 60, a substrate support part configured to be accessible from the adjacent coating process part 28 side, i.e., capable of carrying out the substrate, for example, a plurality of support pins (not shown) are provided. .

In this embodiment, one or more buffers BUF are provided in the upstream and downstream multistage unit units TB, 44 and 48, respectively. That is, as shown in FIG. 2, three buffer units BUF 671, 672, and 673 are stacked in multiple stages below the upstream pass unit PASS 50, and at the same time, the downstream pass unit PASS ( Below the 60, three buffer units (BAF) 674, 675, 676 are stacked in multiple stages. A plurality of support pins (not shown) are provided inside the buffer units BUFs 671 to 676 so that the substrate G can be taken over by the take-in arm mechanism 46.

These buffer units (BUFs) 671 to 676 have no free space in units belonging to the heat treatment portion, and temporarily stay in the substrate to avoid collision between the substrates G on the pass lines A and B. It is used as a evacuation site.                     

In FIG. 2, the take-in arm mechanism 46 is a lifting carrier 70 which is capable of lifting and lowering according to a guide rail 68 extending in the vertical direction, and rotates or rotates on the lifting carrier 70 in the θ direction. The pivoting carrier 72 and the arm holder or tweezers 74 which can move forward and backward or stretch in the front-rear direction while supporting the substrate G on the pivoting carrier 72 are provided. A drive unit 76 for lifting and lowering the lifting carrier 70 is provided at the proximal end of the vertical guide rail 68, and the driving unit 78 for pivoting the swing carrier 72 is a lifting carrier 70. ), A drive unit 80 for advancing and driving the carrier arm holder 74 is mounted to the rotary carrier 72. Each drive part 76, 78, 80 may be comprised, for example with an electric motor.

Under the control of the block controller 205, the take-up arm mechanism 46 moves up or down at high speed to access any unit selected from the multi-stage unit units (TB) 44, 48, and the substrate ( You can import and export G). The delivery arm mechanism 46 can take over the substrate G directly to the shuttle 40 on the side of the auxiliary transport space 38.

As shown in FIG. 1, the coating process part 28 is provided adjacent to the downstream side of the 1st heat processing part 26. As shown in FIG. In the coating process unit 28, a resist coating unit (CT) 82, a reduced pressure drying unit (VD) 84, and an edge remover and a unit (ER) 86 are lined up in a line along the route pass line A. Built. Although not shown in the drawing, the coating process unit 28 loads and unloads the substrate G into each of these three units (CT: 82), (VD: 84), and (ER: 86) one by one in the process order. An internal conveying apparatus (not shown) is provided, and in each unit (CT: 82), (VD: 84), (ER: 86), each processing is performed in units of one substrate. The internal conveying apparatus (not shown) is also accessible to a pass unit (PASS) 60 on the downstream side of the first heat treatment unit 26.

As shown in FIG. 3, the 2nd heat processing part 30 is substantially the same structure as the said 1st heat processing part 26, and is arrange | positioned between the return path line A and the return path line B. As shown in FIG. have. That is, the second heat treatment unit 30 has one multi-stage unit (TB) 88 on the path path A side (first back), and the other multi-stage unit on the return path line B side (head). It has a portion (TB) 92. In the second heat treatment unit 30, a delivery guide arm mechanism 90 is provided between the upstream side stage unit section (TB) 88 and the downstream side stage stage unit section (TB) 92, and the upstream side. The multi-stage unit (TB) 88 has a first pass unit 50. In the first pass unit 50, the substrate G is taken over by the edge remover 86.

Two heating units (DHP) 521 and 522 for prebaking and one cooling unit (COL) 621 are stacked on the upper side of the pass unit PASS 50. Further, three stage buffer units (BUFs) 671, 672, and 673 are provided below the pass unit PASS.

On the other hand, a pass unit (PASS) 60 for passing the substrate G to the developing process part 32 is provided in the multi-stage unit part TB on the return side. Two heating units (DEP) 523 and 524 for prebaking and one cooling unit (COL) 622 are stacked above the pass unit PASS 60. In addition, a three-stage buffer unit (BUF) 674, 675, 676 is provided below the pass unit PASS 60.                     

The take-up arm mechanism 90 moves up or down at high speed under the control of a block computer (B / C) 205 and is an arbitrary unit selected from both multi-stage unit units (TB) 88, 92. It is possible to access and carry out the substrate G, and the coating process unit 28, the developing process unit 32, and the substrate G are formed in units of one through the two pass units PASS 50 and 60. You can take over. In addition, the transfer arm mechanism 90 is capable of taking over the board | substrate G also by the shuttle 40 in the auxiliary conveyance space 38, and the interface station (I / F) 18 which are mentioned later. .

In the return path line B, the developing process 32 includes a so-called flat flow developing unit DEV 94 for carrying out a series of developing treatment steps while conveying the substrate G in a horizontal posture. . In the developing process section 32, for example, the LCD substrate G having a size of 1000 to 1200 mm can be lined up to eight sheets.

On the downstream side of the developing process portion 32, a third heat treatment portion 36 is disposed with a discoloration process portion 34 interposed therebetween. The decolorization process part 34 is provided with the i-ray UV irradiation unit (i-UV) 96 for irradiating i line | wire (wavelength 365nm) to the to-be-processed surface of the board | substrate G, and performing a decolorization process.

As shown in FIG. 4, the third heat treatment unit 36 has a configuration substantially the same as that of the second heat treatment unit 30, and the i-ray UV irradiation unit (i-UV) of the return path line (B). It is arranged between 96 and the cassette station 20. That is, the third heat treatment unit 36 has one multi-stage unit (TB) 98 on the side of the stream and a multi-stage unit (TB) 102 on the other side of the downstream side. In the third heat treatment part 36, the delivery lead arm opening sphere 100 is provided between the upstream multistage unit part (TB) 98 and the downstream multistage unit part (TB) 102, and the upstream side. The multi-stage unit (TB) 98 has a first pass unit 50. The first pass unit 50 is capable of taking over the substrate G from the i-ray UV irradiation unit (i-UV) 96.

Two heating units (DHP) 521 and 522 for post-baking and one cooling unit (COL) 621 are stacked above the upstream pass unit PASS 50. Further, three stage buffer units (BUFs) 671, 672, and 673 are provided below the pass unit PASS.

On the other hand, the multi-stage unit (TB) 102 on the return path line B side is provided with a pass unit PASS 60 for passing the substrate G to the cassette station C / S 20. . Above the pass unit PASS 60, two heating units (DHP) 523 and 524 for post-baking and one cooling unit (COL) 622 are stacked. In addition, a three-stage buffer unit (BUF) 674, 675, 676 is provided below the pass unit PASS 60.

The third heat treatment part 36 has the same configuration as the first heat treatment part 26 or the second heat treatment part 30, and has a vertical delivery guide arm mechanism 100 along the pass line B. FIG. ) And a pair of multi-stage unit (TB) 98, 102 are provided on both sides.

The take-up arm mechanism 100 is capable of gaining access to any unit of the multi-stage unit units (TB) 98, 102 by lifting and turning at high speed under the control of the block controller 205, and the two-stage unit. I-UV irradiation unit (i-UV) 96 and cassette station (C / S) (through pass units (PASS), paths and cooling units (PASS and COL) of TB (98, 102) ( 14) and the board | substrate G can be acquired by one sheet. In addition, the transfer arm mechanism 100 is capable of taking over the substrate G by one piece of the shuttle 40 in the auxiliary transport space 38.

The interface station (I / F) 18 has a conveying apparatus 104 for taking over the substrate G between the exposure apparatuses 12. A buffer stage (BUFS) 106, an extension cooling stage (EXT COL) 108, and a peripheral device 110 are arranged around the conveyer 104. The buffer stage (BUFS) 106 is placed with a standing buffer cassette (not shown). The extension cooling stage (EXT / COL) 108 is a stage for taking over the substrate with a cooling function, and is used when taking over the process station (P / S) 16 side and the substrate. The peripheral device 110 may be, for example, a configuration in which a titler TITLER and a peripheral exposure device EE are stacked up and down. The conveying apparatus 104 has the sub-arm mechanism 104a, and the exposure apparatus 12, each unit (BUFS) 105, (EXT * COL) 106, (TITLER / EE) 110, and the substrate ( The acquisition of G) can be performed.

As shown in FIG. 5, the main controller (M / C) 200 is connected in parallel to a plurality of block controllers (B / C) 201 to 207, and is connected to each of the B / Cs 201 to 207. It is to send a command and to control the whole system. Each of the B / Cs 201 to 207 shares the devices and units in the system and controls the operation of the devices and units of the received bumping.

The first to fifth B / Cs 201 to 205 share the control of each part of the process station (P / S) 24. For example, the first B / C 201 is an excimer UV irradiation unit (e-UV) 41, a scrubber cleaning unit (SCR) 42, and a multi-stage unit part of the first heat treatment unit 26. (TB) 44, 48 is responsible for the control. The second B / C 202 is in charge of controlling the coating unit (CT) 82, the reduced pressure drying unit (VD) 84, and the edge remover (ER) 86. The third B / C 203 is responsible for controlling the developing unit (DEV) 94 and the multi-stage units 88 and 92 (TB) of the second heat treatment unit. The fourth B / C 204 controls the development unit (DEV) 94, the i-ray UV irradiation unit (i-UV) 96, and the multi-stage units 98, 102 (TB) of the third heat treatment unit. In charge of. The fifth B / C 205 is responsible for controlling the first to third takeover arm mechanisms 46, 90, 100 and the shuttle 40.

The sixth B / C 206 shares the control of each part of the cassette station (C / S) 14 and, for example, is responsible for the control of the subarm mechanism 22 and the air conditioning FFU (not shown). .

The 7th B / C 207 shares control of each part of the interface station (I / F) 18, for example, the subarm mechanism 104, the buffer stage 106, and the extension cooling stage (EXT / COL). 108), and is responsible for the control of the TITLER / peripheral exposure apparatus (EE) (110).

6 is a flowchart showing the procedure of normal processing in the substrate processing system. First, in the cassette station (C / S) 14, the sub-arm mechanism 22 takes out one substrate G from the predetermined cassette C on the stage 20, and the process station P / S. It carries in to the excimer UV irradiation unit (e-UV) 41 of the washing | cleaning process part 24 of (16) (step S1).

In the excimer UV irradiation unit (e-UV) 41, the substrate G is subjected to dry cleaning by ultraviolet irradiation (step S2). Ultraviolet cleaning mainly removes organic matter from the substrate surface. After the end of the UV cleaning, the substrate G is transferred to the scrubber cleaning unit (SCR) 42 of the cleaning process part 24 by the subarm mechanism 22 of the cassette station (C / S) 14. .

In the scrubber cleaning unit (SCR) 42, the substrate G is brushed on the surface of the substrate G while conveying the substrate G in the horizontal direction in the pass line A direction by roller conveyance or belt conveyance as described above. By washing or blow-cleaning, particle-shaped dirt is removed from the substrate surface (step S3). Then, even after washing, the substrate G is rinsed while being conveyed by the flow current method, and finally, the substrate G is dried using an air knife or the like.

The substrate G, which has been cleaned in the scrubber cleaning unit (SCR) 42, is loaded into the pass unit PASS 50 in the upstream side multi-stage unit section TB 44 of the first heat treatment section 26. do. Subsequently, the substrate G is conveyed onto the roller table through the pass unit 60 of the downstream multi-stage unit (TB) 48, or is carried in one of the buffer units 671 to 676, and is retained. Wait for the release time. When the retention time is reached, the delivery arm mechanism 46 takes the substrate G out of the buffer unit, conveys it to the pass unit PASS 60, and puts it on the downstream roller table.

The M / C 200 determines whether or not the substrate G is selected and conveyed. The M / C 200 grasps the current positions of all the substrates that change every moment in the system, and controls each of the B / Cs 201 to 207 based on the current positions of the identified substrates. First, the M / C 200 obtains the predictive timing time based on the panel registration table, and determines whether or not the subsequent substrate G collides with the preceding substrate G on the roller table of the pass line A. FIG.                     

When the determination result is YES, the M / C 200 sends a signal to the B / C 205, and the B / C 205 sends a signal to the take over arm mechanism 46, and the take over arm mechanism ( The substrate G is loaded into the third buffer unit 673, for example (step S4).

On the other hand, when the determination result is NO, the M / C 200 sends a signal to the B / C 205, and the B / C 205 sends a signal to the takeover arm mechanism 46, and takes over the takeover arm. The board | substrate G is carried in to the 2nd pass unit 60 by the mechanism 46 (step S5). When it is this NO determination result, it progresses beyond process S4 to process S3 from process S3.

Hereinafter, some software terms related to the substrate processing program of the present embodiment are defined as follows, respectively.

① "Unit panel processing time" refers to the time from when the unit enters a unit with one panel (substrate) until the processing is completed and the unit exits.

(2) "Unit tact time" is a state in which the carrier arm holder mechanism can convey the panel (substrate) continuously to the unit, and the time until the preceding panel exits the unit and the next panel exits the unit. Say. Normally, in a unit containing a plurality of panels, "unit touch" is obtained by dividing the "unit panel processing time" by the number of panels processed at one time.

(3) "Flow tact time" means the maximum step tact for the latest panel when a specified recipe processing is performed among units that a panel passes through the designated flow.                     

(4) The "lot control task" refers to a panel that flows flatly in the unit and resist coating system unit in accordance with the tact with the longest processing time among all units through which the lot in the device passes at least once. To control.

Each processing time in the processing unit transmits a recipe to the B / C at the time of registering the panel flow, selects the end processing time and the tact for processing, and receives a response.

(5) The "panel registration table" refers to a database in which unit panel processing times of all processing units existing in the substrate processing system are registered.

The M / C uses the panel registration table to predict the timing time at which the subsequent board will collide with the preceding board, and sends a command signal to the takeover arm mechanism via the B / C. The receiving arm mechanism adopts the substrate G in the pass line so as to time the predicted timing time when the command signal is received.

In addition, the panel processing elapsed time is automatically released when the panel is sent to the unit. Thereafter, the panel processing elapsed time is incremented every second by the lot control task. The M / C also determines the identity of the substrate on the passline based on the value of the lot control task.

(6) The "panel flow table" refers to a database in which process processing time and tact time are registered. Here, " processing time " means a time at which M / C inquires B / C and sets a unit panel processing time at the time of panel flow development. Based on the value of this process processing time, the M / C calculates the number of sheets remaining in the processing unit when operating with lottact.

⑦ "lot control table" means a database in which lot contact is registered. Here, "lot tact time" means the maximum value of the tact time set in the panel flow table when taking out the first board | substrate from a cassette.

In the first heat treatment unit 26, the substrate G is rotated by the take-in arm mechanism 46 to turn the unit of the heat treatment system in a predetermined sequence. For example, the substrate G is first moved from the pass unit PASS 50 to one of the heating units DHP 521 and 522, where it is subjected to dehydration (step S5).

Subsequently, the substrate G is transferred to one of the cooling units (COL) 621 and 622, where it is cooled to a constant substrate temperature (step S6). Subsequently, the substrate G is transferred to one of the AD units 561 and 562 and subjected to hydrophobic treatment therein (step S7). After completion of this hydrophobization treatment, the substrate G is cooled to a constant substrate temperature in one of the cooling units (COL) 621 and 622 (step S8). Finally, the substrate G is transferred to a pass unit (PASS) 60 belonging to the downstream multi-stage unit (TB) 48.

Thus, in the 1st heat processing part 26, the board | substrate G is the upstream multistage unit part TB (TB) 44 and the downstream multistage unit part TB through the take-in arm mechanism 46. As shown in FIG. You can come and go arbitrarily between (48). The same substrate transfer operation can also be performed in the second and third heat treatment units 30 and 36.

The substrate G subjected to the above-described series of thermal or thermal treatments in the first heat treatment part 26 is near the downstream side in the pass unit PASS 60 in the downstream multistage unit part TB 48. Is transferred to a resist coating unit (CT) 82 of the coating process section 28 of FIG.

The substrate G is coated with a resist liquid on the upper surface (to-be-processed surface) of the resist coating unit (CT) 82, for example, by a spin coating method, and immediately after the reduced pressure drying unit (VD) 84 near the downstream side. ), And the excess (unnecessary) resist at the periphery of the substrate is removed from the edge remover and the unit (ER) 86 near the downstream side (step S9).

The substrate G subjected to the resist coating process as described above is transferred to the pass unit PASS belonging to the upstream side multi-stage unit part TB of the second heat treatment part 30 in the reduced pressure precursor unit VD. Take over the argument.

In the second heat treatment unit 30, the substrate G is turned by the take-in arm mechanism 90 to turn the heat treatment unit in a predetermined sequence. For example, the substrate G is first moved from the pass unit PASS to one of the heating units PREBAKE, and thereafter, the substrate G is subjected to baking after applying the resist (step S10).

Subsequently, the substrate G is transferred to one of the cooling units COL, where it is cooled to a constant substrate temperature (step S11). Subsequently, the substrate G extends and cools on the interface station (I / F) 18 side via or without a pass unit PASS on the downstream multi-stage unit (TB) 92 side. It is passed over to (EXT COL) 106.                     

In the interface station (I / F) 18, the substrate G is carried in the peripheral exposure apparatus EE of the peripheral device 110 in the extension and cooling stage (EXT COL) 106, where the substrate ( After the exposure to remove the resist attached to the periphery of G) at the time of development, it is sent to a nearby exposure apparatus 12 (step S12).

In the exposure apparatus 12, a predetermined circuit pattern is exposed to the resist on the substrate G. The substrate G after the pattern exposure is returned to the interface station (I / F) 18 by the exposure apparatus 12 (step S11), and is first loaded into the titler TITLRER of the peripheral apparatus 110. There, predetermined information is described in the predetermined part on a board | substrate (step S12). Subsequently, the substrate G is turned to the extension cooling stage (EXT COL) 106. The conveyance of the board | substrate G in the interface station (I / F) 18, and the exchange of the board | substrate G with the exposure apparatus 12 are performed by the conveyance apparatus 104. FIG.

In the process station (P / S) 16, in the second heat treatment unit 30, the take-in arm mechanism 90 receives the substrate G that has been exposed at the extension cooling stage (EXT COL) 106. And pass to the developing process unit 32 via the pass unit PASS in the multi-stage unit section TB 92 on the pass line B side, or carry it into one of the buffer units 671 to 676. do.

The M / C 200 obtains the prediction timing time based on the panel registration table, and determines whether or not the subsequent substrate G collides with the preceding substrate G on the roller table of the pass line A. FIG. When the determination result is YES, the M / C 200 sends a signal to the B / C 205, and the B / C 205 sends a signal to the takeover arm mechanism 90, and the takeover arm mechanism. In step 90, the substrate G is loaded into, for example, the second buffer unit 672 (step S14).

On the other hand, when the determination result is NO, the M / C 200 sends a signal to the B / C 205, and the B / C 205 sends a signal to the takeover arm mechanism 90 and takes over. The substrate G is loaded into the second pass unit 60 by the arm mechanism 90. When the result of the NO determination is reached, the process goes to step S14 and the process proceeds from step S13 to step S15.

In the developing process section 32, the substrate G received from the pass unit PASS in the multi-stage unit section TB 92 is loaded into the developing unit DEV 94.

In the developing unit (DEV) 94, the substrate G is conveyed in a flat flow manner downstream of the pass line B, and a series of development treatment steps of developing rinsing and drying are performed during the conveyance (step S15).

The substrate G subjected to the developing process in the developing process part 32 is carried into the decolorizing process part 34 near the downstream side and is subjected to the decolorizing process by i-ray irradiation therein (step S16). The substrate G after the decolorization treatment is transferred to the pass unit PASS in the upstream side multi-stage unit part TB 98 of the third heat treatment part 36.

In the third heat treatment unit (TB) 98, the substrate G is first transferred from the pass unit PASS to one of the heating units POBAKE and subjected to postbaking therein (step S17).

The M / C 200 obtains the predictive timing time based on the panel registration table, and determines whether or not the subsequent substrate G collides with the preceding substrate G on the roller table of the pass line B. FIG. When the determination result is YES, the M / C 200 sends a signal to the B / C 205, and the B / C 205 sends a signal to the take over arm mechanism 90, and the take over arm mechanism ( The substrate G is loaded into the fifth buffer unit 675, for example (step S18).

On the other hand, when the determination result is NO, the M / C 200 sends a signal to the B / C 205, and the B / C 205 sends a signal to the argument delivery arm mechanism 100, The substrate G is loaded into the second pass unit 60 by the arm mechanism 100. When the result of the NO determination is reached, the process proceeds from step S18 to step S19.

Subsequently, the substrate G is transferred to the pass cooling in the downstream multi-stage unit (TB) 102 and the unit (PASS COL), where it is cooled to a predetermined substrate temperature (step S19). The conveyance of the board | substrate G in the 3rd heat processing part 36 is performed by the delivery guide mechanism 100. As shown in FIG.

On the cassette station (C / S) 14 side, the sub-arm mechanism 22 has completed the pass-cooling of the third heat treatment unit 36, and the substrate (G) having completed all of the coating and developing processes in the unit PASS / COL. Is received, and the received board | substrate G is accommodated in either cassette C (process S1).

As described above, in this coating and developing processing system, as long as each part (particularly, each part of the processing system) is operating normally, the cassette station (C / S) 14 to the process (15/21) station (P / S) ( The substrate G handed to the side 18 receives the necessary processing (steps S2 to S19) sequentially while transferring or transferring each part in the system along the pass lines A and B, and the cassette station C within a predetermined time. / S) 14 is to be returned.

However, when a failure or other failure occurs somewhere in the system, particularly in the processing section, the substrate G cannot be transferred or carried to the processing section where the failure occurred upstream of the process flow. Above all, on the downstream side, all the other processing can be completed for the substrate G on the line.

When the process flow is stopped or blocked somewhere in the system as described above, in this embodiment, the buffer chamber BUF disposed upstream of the occurrence point of the obstacle is used for temporary placement or storage of the substrate G.

For example, the case where an obstacle occurs in the coating process part 28 and the board | substrate carrying into the said process part 28 becomes impossible is taken as an example.

In this case, buffer units (BUFs) 671 to 676 disposed in the first heat treatment unit 26 are used to attract the substrate G.

In other words, when a failure occurs in the coating process section 28, the cassette station (C / S) 14 is used to clean the substrate (with respect to the cleaning process section 24, particularly with respect to the scrubber cleaning unit (SCR) 42). New import of G) is stopped. At this time, the scrubber cleaning unit (SCR) 42 performs a flat-flow substrate cleaning process while conveying a plurality of substrates G, for example, five substrates G, in a row at a predetermined interval on a horizontal transport path, and flowing flat. When conveyance is stopped, the board | substrate G from that time will be treated as a defective washing product.

In this embodiment, in the scrubber cleaning unit (SCR) 42, the cleaning process with respect to the board | substrate G in a flat flow is completed so that such a cleaning defective product may not be produced. Therefore, in the scrubber cleaning unit (SCR) 42, the substrate G, which has been cleaned at the same cycle or timing as in the normal state, is sequentially loaded into the first heat treatment unit 26.

In the first heat treatment unit 26, each substrate G is subjected to heat treatment in the same sequence as usual, and then stored in any one of the buffer units (BUFs) 671 to 676. As shown in FIG.

More specifically, each substrate G carried into the pass unit PASS 50 upstream from the scrubber cleaning unit SCR 42 is dewatered by one of the heating units DHP 521 and 522. After being treated (step S5), one of the cooling units (COL) 621 and 622 is cooled down to a constant substrate temperature (step S6), and then hydrophobized in one of the adhering units (AD) 561 and 562. The process is received (step S7). The flow of a series of heat treatment steps S6? S7? S8 so far is not different from usual.

However, after the hydrophobization treatment, the substrate G is subjected to a constant heat treatment (step S8) of the substrate temperature in one of the cooling units (COL) 621 and 622 as usual, and then the pass unit PASS 60 on the next downstream side. In this emergency, the transmission to the cooling unit (COL) (621, 622) or the pass unit (PASS) 60 is canceled and sent to either of the buffer units (BUF) (671 to 676). Is sent.

Here, the reason why the constant heat treatment of the substrate temperature (step S8) is omitted is pretreatment on the premise that the resist coating treatment is performed in the coating process section 28 immediately after this heat treatment. This is because of the throughput of the control and the tact adjustment between the parts.

In this type of coating and developing system, in general, a plurality of heat treatment units having the same function are provided (N), and the heat treatment units having the same cycle time are performed in parallel with the N heat treatment units at a constant time apart, so that the entire heat treatment unit is applied. Is reduced to 1 / N, and, for example, in this embodiment, the cleaning treatment tact in the scrubber cleaning unit (SCR) 42 is applied. When the cycle time of each of the heat treatment units AD, DHP, and COL in the first heat treatment unit 26 is about 100 seconds, the heat treatment unit AD is 60 seconds. By installing two (DHP) and two (COL), and operating in parallel at a time difference of about 50 seconds, the entire heat treatment to each butt can be matched to the cleaning treatment tact.

In such a multi-unit heat treatment unit 26, the take-in arm mechanism 46 is busy on the best schedule to circulate each heat treatment unit in a constant cycle, most simply, and it is called between emergency and normal circulation operations. It is common that there is no margin enough to interrupt the operation of transferring the substrate G to the buffer unit BUF. In this embodiment, by canceling the heat treatment (step S8) of the substrate temperature constant which is the heat treatment step of the last stage as described above, the substrate to the buffer unit BUF without causing any disturbance in throughput or tact. The storage operation is realized.

As described above, a cleaning treatment is performed in which all of the substrates G (for example, five sheets) that have been cleaned in the scrubber cleaning unit (SCR) 42 at the time of the occurrence of a failure flow normally flat without any clogging. Further, the first heat treatment unit 26 in the next stage is also stored in the buffer units (BUF) 671 to 676 in units of one after receiving a series of heat treatments which are substantially different from the usual.

In this embodiment, the heat treatment system unit (AD) in which the buffer units (BUFs) 671 to 676 are arranged in multiple stages under the pass units (PASS) 50 and 60 and arranged in multiple stages above the pass units (50 and 60). It is almost completely isolated from (561, 562), (DHP) (521, 522), and (COL) (621,622). For this reason, even if the board | substrate G is guaranteed to the buffer units (BUF) 671-676 which do not have a temperature adjustment function, those board | substrates G do not have a possibility of being thermally affected by the heat processing system unit side.

In this embodiment, in case of emergency, in particular, when the substrate transfer to the downstream side of the process flow is stopped as in the present example, the heat treatment (step S8) and the pass unit of the substrate temperature constant which is the heat treatment step of the last stage as described above. Since the transfer to the PASS) 60 is canceled, even if the conveyance step of storing the substrate G in the buffer units (BUFs) 671 to 676 is increased, the burden on the delivery arm mechanism 46 is not heavy. Rather, the takeover arm mechanism 46 operates while the normal time is busy, circulating each heat treatment unit on the best schedule as described above.

In this regard, in this embodiment, all the buffer units (BUFs) 671 to 676 are arranged under the pass units PASS 50 and 60 in a multi-stage stack, and all the heat treatment system units AD and 562 are 562. , (DHP) 521, 522, and (COL) 621, 622 are arranged on the pass units PASS 50, 60 in multiple stages of overlap. For this reason, in the normal time in which it is not necessary to access the buffer units (BUFs) 671 to 676, the take-in arm mechanism 46 is a heat treatment system intensively arranged on the pass units PASS 50 and 60. The unit (AD) 561, 562, the DHPs 521, 522, and the COLs 621, 622 can be traversed to a minimum moving range to efficiently process the required return schedule.

In this embodiment, the pass units (PASS) 50 and 60 connected to the upstream side and the pass units (PASS) 60 connected to the downstream side are independent of each other by fitting the take-in arm mechanism 46. It is possible to freely set the upstream pass units PASS 50 to the conveyance path and the downstream pass units PASS 60 to the conveyance path to the same height or to different heights.

By the way, even in the 1st heat processing part 26, a fault and other trouble may arise somewhere. For example, the case where the hot plate breaks down and becomes unusable in the AD units 561 and 562 is taken as an example.

In this case, by changing the other Advance Unit (AD) 562 to single or one operation, the tact time is long (late), but the system can continue to operate. However, immediately after the tact is changed in the first heat treatment part 26, the upstream side scrubber cleaning unit (SCR) 42 may erase all of the substrate G in the conveyance which flowed flat at the time of failure. The board | substrate G wash | cleaned with the normal tact is carried in until it carries. Also in this case, in the first heat treatment unit 26, the substrate G received from the scrubber cleaning unit (SCR) 42 is temporarily placed in the buffer units BUF 671 to 676 before or during the heat treatment. By attracting, tact can be compensated or adjusted.

In the second and third heat treatment units 30 and 36, the same functions and actions as those of the first heat treatment unit 26 can be obtained. It is possible to make the above-mentioned substrate placement or cooperation between these heat treatment parts 26, 30, 36 independent. The buffer unit BUF is not limited to the case where a system failure occurs as described above, but may be utilized in various cases as necessary.

In this embodiment, although the buffer unit BUF can be comprised with the front opening cylinder, it is also possible to provide an opening door or a shutter. It is also possible to form an air atmosphere of an inert gas such as nitrogen gas in the room. In this case, for example, nitrogen gas may be introduced from the rear of the unit cylinder, and a uniform flow and atmosphere of nitrogen gas may be formed through the porous plate. In the above-described embodiment, one substrate G is stored in one buffer unit BUF, but it is also possible to have a unit structure capable of storing a plurality of sheets.

Although the treatment system of the present invention is very suitable for application to the coating and developing treatment system as described above, various modifications can be made in the system configuration and system elements, and it is also applicable to an inline type system including, for example, a film forming apparatus or an etching apparatus. This is possible. In the present invention, the substrate to be processed is not limited to the LCD substrate, and various substrates such as color filters and semiconductor wafers are included.

As described above, in the processing system of the present invention, even if a process flow is blocked in a part of the system, it is possible to minimize the influence of the processing section or the substrate to be processed upstream and to improve the processing efficiency and quality. can do.

Claims (12)

A substrate processing system for sequentially conveying and processing a plurality of substrates along a pass line reciprocating between a cassette station and an external exposure apparatus. A plurality of processing unit groups having a first processing portion provided upstream and a second processing portion provided downstream, along the pass line; A first pass unit receiving the substrate conveyed along the pass line in the first processing unit; A second pass unit disposed downstream of the first pass unit and sending the substrate passing through the first pass unit to the second processing unit; A thermal processing unit provided above at least one of the first and second pass units; A heating unit installed in the thermal processing unit to heat-process the substrate processed in the first processing unit; A cooling unit installed in the thermal processing unit to cool the heat treated substrate; At least one buffer unit which is provided below at least one of the first and second pass units, and temporarily holds the substrate to avoid collision between the substrates on the pass line; And a delivery guide arm mechanism for transferring a substrate between the first and second pass units and the buffer unit, When a failure occurs in the second processing unit or the thermal processing unit, the processing in the first processing unit is completed, and the substrate processed in the first processing unit is temporarily left in the buffer unit, and the second processing unit The substrate processing system according to claim 1, wherein when an obstacle occurs, transfer to the buffer unit is canceled for transfer to the cooling unit from the substrate subjected to the heat treatment by the heating unit. delete delete A substrate processing system for sequentially conveying and processing a substrate along a pass line reciprocating from a cassette station to an external exposure apparatus, A plurality of processing unit groups having a first processing portion provided upstream and a second processing portion provided downstream, along the pass line; A first pass unit which receives the substrate conveyed along the pass line in the first processing unit; A second pass unit disposed downstream of the first pass unit and sending the substrate passing through the first pass unit to the second processing unit; A thermal processing unit provided on at least one of the first and second pass units; At least one buffer unit disposed below at least one of the first and second pass units and temporarily holding the substrate to avoid collision between the substrates on the pass line; And a delivery guide arm mechanism for transferring a substrate between the first and second pass units and the buffer unit, When carrying in the said thermal processing part or the 2nd processing part of the said board | substrate is impossible to carry in to the said thermal processing part or the 2nd processing part, after completing the process of 1 or 2 or more steps of the process which should be performed in the said thermal processing part or the 2nd processing part which cannot be carried out previously, The substrate processing system, wherein the transfer guide arm mechanism stores the substrate received in the first pass unit in one of the buffer units. The method according to claim 1 or 4, The take over arm mechanism includes a lifting carrier capable of lifting in a vertical direction; A pivoting carrier which is pivotable about a vertical axis by the lifting carrier; And a carrier arm holder capable of stretching in the front and rear direction in a horizontal plane while supporting the substrate on the pivotal carrier. The method according to claim 1 or 4, And a plurality of the buffer units are stacked in multiple stages above and below the first and second pass units, and one substrate is accommodated in each of the buffer units. The method according to claim 1 or 4, And means for forming an atmosphere of inert gas in the buffer unit. The method according to claim 1 or 4, The first processing unit forms a part of the pass line, and has a conveying path for conveying the substrate in a horizontal direction in a substantially horizontal posture, and processing means for performing a predetermined process on the substrate conveyed on the sheet conveying path. Substrate processing system, characterized in that. The method according to claim 1 or 4, And the heat treatment part has a plurality of heat treatment units stacked in multiple stages up and down in order to perform thermal treatment on the substrate to accompany the processing of the first or second treatment part. The method according to claim 9, The heat treatment unit is a substrate processing system, characterized in that it comprises one or more selected from the group consisting of heating unit, cooling unit, adjunction unit. The method according to claim 1 or 4, A plurality of block controllers which share and control the plurality of processing units and the argument delivery arm mechanism; And a main controller for collectively controlling the plurality of block controllers such that each of the block controllers is connected in parallel and a subsequent substrate does not collide with a preceding substrate on the pass line. The method according to claim 11, And the main controller grasps the current positions of all the substrates that change every time in the system, and controls each of the plurality of block controllers based on the current positions of the identified substrates.

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