KR20100027039A - Processing system - Google Patents

Abstract

PURPOSE: A processing system is provided to reduce the whole length of system by arranging a plurality of process units on a round-transferring type process line based on the order of process flow. CONSTITUTION: A forward transferring process line(A) transfers a substrate(G) to a first direction. A backward transferring process line(B) transfers the substrate to a second direction. The second direction is opposed to the first direction. A middle process line(C) is installed a hollow space(15) between the forward transferring process line and the backward transferring process line. The middle process line includes an elevation type transfer unit.

Description

Processing System {PROCESSING SYSTEM}

The present invention relates to an inline processing system for conveying a substrate to be processed in a flat stream in the order of a process flow in a series of processing steps.

Background Art Conventionally, in the resist coating and developing system for manufacturing a flat panel display (FPD), in order to cope with an increase in size of a substrate to be processed, the substrate is horizontally placed on a flat flow conveyance path formed by laying a carrier such as a roller or a roller in a horizontal direction. Process a plurality of processing units including a flat flow type processing unit which imparts a predetermined liquid, gas, light or the like to a processing target surface of the substrate and carries out the required substrate processing while conveying the same. The system configuration or layout which arranges serially along the line of a substantially horizontal direction in order of a flow is standardized (for example, refer patent document 1).

As described in Patent Document 1, this kind of layout arranges a horizontally long process station in the center of the system, and arranges cassette stations and interface stations at both ends thereof in the longitudinal direction. In the cassette station, a cassette is loaded in and out of a plurality of unprocessed or processed substrates between the stage in the station and the outside of the system, and the substrate is loaded in and out between the cassette on the stage and the processing station. In the interface station, the substrate is transferred between the adjacent exposure apparatus and the processing station.

The process station has two rows of process lines, a return path and a return path, with the cassette station as the starting point and the end point, and the interface station as the return point. In general, a unit of a cleaning process system, a unit of a resist coating process system, a unit of a thermal process system, and the like are adjacent to each other in a process line of a route, or are arranged in a line with a unit of a conveying system in between. In the return process line, the units of the developing system, the units of the thermal processing system, the units of the inspection system, and the like are adjacent to each other or arranged in a line with the units of the conveying system interposed therebetween.

[Patent Document 1] Japanese Patent Application Publication No. 2007-200993

As described above, an inline type processing system in which a plurality of processing units including a flow type processing unit are arranged in series in a sequence of process flows along a straight path and a return line is accompanied by an enlargement of an FPD substrate. As a result, the system longitudinal size (full length size) becomes larger, which is a disadvantage in terms of footprint in an FPD manufacturing plant.

Moreover, the processing speed of an exposure apparatus is speeding up, and also the shortening of the tact time of each processing unit is calculated | required also in a resist coating image development processing system. Among these, when the process of pressure reduction drying is sandwiched between a resist coating process and a prebaking process, since the pressure reduction drying process requires a comparatively long time, shortening the tact time of the pressure reduction drying unit is most difficult.

Therefore, in order to shorten the tact time of the pressure reduction drying unit, the pressure reduction drying unit is divided into three chambers along the process line, and is loaded into the chambers at the front and rear ends with an intermediate chamber which always maintains the reduced pressure state. The three-part chamber system which has a lock function is also examined. According to this three-divided chamber method, a depressurizing operation in which the substrate is brought in in the front chamber and the atmosphere is changed from atmospheric pressure to reduced pressure, and the resist coating film on the substrate is maintained at a high ratio in the middle of the chamber at a constant pressure. Each of the three steps of the main pressure drying process of drying under reduced pressure in the furnace and the decompression release operation of returning the atmosphere from reduced pressure to atmospheric pressure in the chamber in the rear stage and carrying out the substrate can be performed in parallel or simultaneously in a pipelined manner. The tact time of the vacuum drying unit can be significantly shortened.

However, there is a trade off problem in that the size of the reduced pressure drying unit is increased three times on the process line, and the system longitudinal size (total length size) is also increased by employing the three-divided chamber system as described above.

SUMMARY OF THE INVENTION The present invention has been made in view of the problems of the prior art as described above, and an empty space is effectively used in an inline system in which a plurality of processing units are arranged in a process flow order in a linearly extending reciprocating line. It aims at providing the processing system which implement | achieves shortening of the system full-length size by using.

In order to achieve the above object, the processing system of the present invention is an inline type processing system which connects a plurality of processing units in the order of process flow to perform a series of processing including thermal processing on a substrate to be processed, the system length In the direction, a processing path of the first group of processing units of the first group in a row and having a horizontal path conveying path for conveying the substrate in the first direction in the direction of flow in the first direction; A return path process line having a return flow path and a return path for arranging processing units of a second group located downstream of the flow in a row and conveying the substrate in a flow direction in a second direction opposite to the first direction; Installed between the process line and the return process line, located downstream of the process flow than the return process line And a third group of processing units located in an upstream side of the process flow rather than in the return process line in a row or in multiple stages, and can directly or indirectly connect to a terminal portion of the cross-flow flat flow conveyance path. The first intermediate flat stream conveying path conveying in the flat direction in the second direction and the first intermediate flat stream conveying path are installed above or below the first intermediate flat flow conveying path, and can be directly or indirectly connected to the start end of the return home flat flow conveying path. It has an intermediate process line which has a 2nd intermediate | middle plane flow conveyance path conveyed by the horizontal flow in a said 1st direction, and a lifting-type transfer part which raises and lowers a board | substrate, and transfers from a said 1st intermediate | middle plane flow conveyance path to the said 2nd intermediate | middle plane flow conveyance path. .

In the above-described configuration, an intermediate process line is provided between the return process line and the return process line, and in the intermediate process line, the substrate is moved in the horizontal flow on the intermediate flat flow conveying path returned in the longitudinal direction, and the processing unit of the third group is moved. Receive the necessary substrate treatment during the passage. Conventionally, the entire length of the process line back and forth by moving the processing unit that belonged to the process line (the first group or the second group of processing units) to the intermediate process line (the third group of processing units). Furthermore, the overall length of the system can be significantly shortened.

In particular, in the case of the layout in which the intermediate process line is installed between the return process line and the return process line in the system width direction orthogonal to the system length direction, the system overall size is greatly shortened without increasing the system width size. Can be planned.

In the processing system of the present invention, the lift type transfer part has a third intermediate flat flow conveying path that can be moved up and down between the height position of the first intermediate flat flow conveying path and the height position of the second intermediate flat flow conveying path, and the first intermediate flat flow The substrate is conveyed in the second direction in the second direction on the third intermediate planar conveyance path connected to the terminal end of the conveying path, and the substrate is conveyed in the first direction on the third intermediate planar conveyance path connected to the start end of the second intermediate planar conveyance path. Can be suitably employed. In such a structure, a board | substrate can be conveyed in flat flow from the start end of a 1st intermediate planar conveyance path to the end part of a 2nd intermediate planar conveyance path, without using a conveyance robot in an intermediate process line.

Moreover, as one suitable form, the processing unit of the 3rd group includes the baking unit for heat-processing a board | substrate, and the cooling unit for cooling the board | substrate immediately after receiving heat processing by this baking unit to predetermined temperature. Preferably, a baking unit is installed along the first intermediate planar conveyance path, and a cooling unit is installed along the second intermediate planar conveyance path. When the baking unit and the cooling unit are incorporated into the system as a flat stream processing unit, the size of the flat flow direction of those units becomes relatively large, but in the present invention, all of the sizes of these thermal processing units are terminated in the intermediate process line, Or it does not affect the size of the process line back home.

In addition, the processing system of the present invention includes a lift type transfer unit which receives a third intermediate flat flow conveyance path adjacent to the baking unit and the cooling unit, and cooling for cooling the substrate on the third intermediate flat flow conveyance path in the lift type transfer unit. The structure with a mechanism can be employ | adopted suitably. According to this structure, the cooling process immediately after a baking process can be started quickly using the time during a transfer from a 1st intermediate planar conveyance path to a 2nd intermediate planar conveyance path.

As a suitable aspect of this invention, the processing unit of a 1st group includes the resist coating unit which apply | coats a resist liquid to a board | substrate on a path | route flat flow conveyance path, and the drying unit which dries the resist coating film on a board | substrate on a path | route flat flow conveyance path. .

In this case, as a suitable aspect, the drying unit may be a vacuum drying unit for drying the resist coating film on the substrate under reduced pressure. In particular, the reduced pressure drying unit carries in a board | substrate under atmospheric pressure, carries out the 1st chamber which changes the atmosphere around a board | substrate from atmospheric pressure state to a reduced pressure state, and carries in a board | substrate under reduced pressure from this 1st chamber, and is made the pressure reduction state all over time. The second chamber placed therein and the third chamber may be brought in from the second chamber under reduced pressure to change the atmosphere around the substrate from a reduced pressure state to an atmospheric pressure state.

Moreover, in the processing system of this invention, it has a 4th intermediate flat flow conveyance path provided above or below a 1st or 2nd intermediate flat flow conveyance path, and keeps a board | substrate on this 4 intermediate intermediate flow conveyance path so that entry and exit are possible. In order to do this, the structure which conveys a board | substrate to a stream in a 2nd direction or a 1st direction on a 4th intermediate flat flow conveyance path can be employ | adopted suitably. With such a configuration, it is possible to further expand the storage function or the buffer function for temporarily placing the substrate on the intermediate flat stream conveyance path when a failure or an abnormality occurs in the processing part of the post process.

Moreover, as one suitable form, at one end of the system longitudinal direction, an unprocessed substrate is taken out from one of the cassettes inserted into the system and transferred to the route processing line, and the substrate having completed all necessary processes in the system is returned to the return process. A first transfer robot is disposed that receives from the line and stores in one of the cassettes to be discharged from the system.

Moreover, the 2nd which carries out the board | substrate which arrived at the terminal part of the said 2nd intermediate | middle plane flow conveyance path to the other end part of a system longitudinal direction from there, passes through one or more processing apparatuses, and carries it in to the said return flow stream conveyance path | route. The transfer robot may be arranged. In this case, the flat flow type transfer part for transferring a board | substrate to the flat stream may be provided from the terminal part of a route flat flow conveyance path to the start end of a 1st intermediate flat flow conveyance path. Or the structure which a 2nd conveyance robot carries out the board | substrate which arrived at the terminal part of the path | route flat flow conveyance path from there, and carries it in to a 1st intermediate flat stream conveyance path is also possible.

According to the processing system of the present invention, an empty space is effective in an inline system in which a plurality of processing units are arranged in a process flow order in a process line of a linearly extending reciprocating path by the above-described configuration and action. It is possible to realize a reduction in the overall length of the system.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described with reference to an accompanying drawing.

(1st embodiment)

The layout structure of the application | coating development system 10 in 1st Embodiment of this invention is shown in FIG. This coating and developing processing system 10 is installed in a clean room, for example, using a glass substrate as a processing target substrate G, and cleaning in the photolithography process, resist coating, prebaking, developing and A series of processes, such as post-baking, are performed. An exposure process is performed by the external exposure apparatus 12 provided adjacent to this system.

This coating and developing processing system 10 arranges a horizontally long process station (P / S) 16 at the center, and has a cassette station (C / S) 14 and an interface station at both ends thereof in the longitudinal direction (X direction). (I / F) 18 is disposed.

The cassette station (C / S) 14 is a cassette loading / exporting port of the system 10. The cassettes C / S 14 are stacked in multiple stages so that a plurality of cassettes C can be accommodated in one horizontal direction (Y direction). The cassette stage 20 which can arrange | position up to and arrange | position, and the conveyance robot 22 which carries out the board | substrate G with respect to the cassette C on this stage are provided. The transfer robot 22 has the transfer arm 22a which can hold the board | substrate G by one sheet | seat, is operable in four axes of X, Y, Z, and (theta), and is adjacent to the process station P / S It is possible to transfer the side (16) and the substrate (G).

The process station (P / S) 16 is a one-way forward process line (A) and return process line (B) and between them parallel to each other in the horizontal system longitudinal direction (X direction) and extending straight in the reverse direction. It has the return process intermediate process line C arrange | positioned at the empty space 15, and arrange | positions many processing units in order of A-> C-> B according to a process flow or a process sequence.

An import unit (IN-PASS) 24 is provided as a first group of units on the route process line A from the cassette station (C / S) 14 side to the interface station (I / F) 18 side. , Excimer UV irradiation unit (E-UV) 26, scrubber cleaning unit (SCR) 28, adventure unit (AD) 30, cooling unit (COL) 32, sorter unit ( SORTER 34, resist coating unit (CT) 36, sorter unit (SORTER) 38, reduced pressure drying unit 40 and export unit (OUT-PASS) 42 are arranged in this order have.

Here, the excimer UV irradiation unit (E-UV) 26, the scrubber cleaning unit (SCR) 28, the advice unit (AD) 30, the cooling unit (COL) 32, the resist coating unit (CT) Both the 36 and the pressure reduction drying unit 40 are configured as processing units of the flat flow method, and are processing units 26 to 40 from the IN-PASS 24 to the OUT-PASS 42. ), A first cross-flow flat flow conveying path 44, for example, which consists of a roller conveying path or a floating conveying path, is provided.

On the other hand, in the return process line B from the interface station (I / F) 18 side to the cassette station (C / S) 14 side, an import unit (not shown), development as a second group of units Unit (DEV) 46, Post-Bake Unit (POST-BAKE) 48, Cooling Unit (COL) 50, Inspection Unit (IP) 52 and Export Unit (OUT-PASS) 54. They are arranged in line in order. Here, the import unit (not shown) is provided below the peripheral device (TITLER / EE) 72, that is, on the same floor as the developing unit (DEV) 46.

The developing unit (DEV) 46, the post-baking unit (POST-BAKE) 48, the cooling unit (COL) 50, and the inspection unit (IP) 52 are all configured as a processing unit of the flat flow method. Returning to the flat stream conveying the processing unit 46-52 extended from the said carrying unit (not shown) to the carrying out unit (OUT-PASS) 54, for example, which consists of a roller conveyance path or a floating conveyance path, etc. The furnace 56 is laid.

The return process intermediate process line (C) has a two-layer structure, and is a unit of the third group, in which the import unit (IN-PASS) 58 and the pre-baking unit (PRE-BAKE) 60 are routed on the first floor. On the second floor, the cooling unit (COL) 62 and the export unit (OUT-PASS) 64 are arranged in the same direction in this order in the reverse direction to the process line A, and in the same direction as the route process line A. It is arranged in a line in this order. Further, at one end (return point) of the intermediate process line C, the substrate G is moved up and down from the pre-baking unit (PRE-BAKE) 60 on the first floor to the cooling unit (COL) 62 on the second floor. A return lift type transfer unit (EV) 66 for transfer is provided.

The prebaking unit (PRE-BAKE) 60 and the cooling unit (COL) 62 are both configured as a processing unit of the flat flow method. In the intermediate process line C, the pre-baking unit (PRE-BAKE) 60, the lifting type transfer unit (EV) 66, and the cooling unit (COL) 62 are passed from the loading unit IN-PASS. Intermediate flat conveyance paths 68 (120, 124, 130), for example, consisting of a roller conveyance path or a floating conveyance path, etc., which extend over two floors to an export unit (OUT-PASS) 64, are laid. .

The interface station (I / F) 18 is a conveyance robot for exchanging the back and forth process lines A and B, the intermediate process line C, and the substrate G with the adjacent exposure apparatus 12. 70, a peripheral device (TITLER / EE) 72 and a rotary stage (not shown) are disposed next to the transfer robot 70. The transfer robot 70 has a transfer arm 70a capable of holding the substrate G in a single unit, and is capable of arm stretching operation and two axis (Z, θ) operation of the main body. The peripheral device 72 includes a peripheral exposure device EE and a titler TITLER. The rotary stage is a stage for rotating the substrate G in a horizontal plane in order to change the direction of the rectangular substrate G in the transfer with the exposure apparatus 12. In the present embodiment, the end portion of the royal process line A is terminated. It is arrange | positioned at the upper layer of the carrying out unit (OUT-PASS) 42 located in.

Here, the processing procedure of the whole process with respect to one board | substrate G in this coating-development processing system is demonstrated. First, in the cassette station (C / S) 14, the transfer robot 22 takes out one board | substrate G from any cassette C on the stage 20, and removes the board | substrate ( G) is carried in to the loading unit (IN-PASS) 24 on the side of the route process line A of the process station (P / S) 16. In the carrying-in unit (IN-PASS) 24, the board | substrate G is mobilely mounted or thrown on the path | route flat flow conveyance path 44. As shown in FIG.

The substrate G put on the cross-flow flat flow conveying path 44 is initially provided to the excimer UV irradiation unit (E-UV) 26 and the scrubber cleaning unit (SCR) 28 in the cleaning process sections 26 and 28. Ultraviolet rays washing process and scrubbing washing process are performed sequentially. The scrubber cleaning unit (SCR) 28 removes particulate contamination from the surface of the substrate by performing brushing or blow cleaning on the substrate G that moves substantially horizontally on the flat flow conveyance path 44 in the horizontal flow. After that, a rinse treatment is performed, and finally, the substrate G is dried using an air knife or the like. When a series of cleaning processes are complete | finished by the scrubber cleaning unit (SCR) 28, the board | substrate G will go down the royal path flow path 44 as it is, and will pass through the thermal processing parts 30 and 32. FIG.

In the thermal processing units 30 and 32, the substrate G is first subjected to an adhesion treatment using a vapor-shaped HMDS in the advice unit AD 30, so that the surface to be treated is hydrophobic. . After the completion of this advice processing, the substrate G is cooled to a predetermined substrate temperature in the cooling unit (COL) 32. Then, the board | substrate G descends the path | route flat flow conveyance path 44, and is carried in to the application | coating process part 34-42.

When it enters into an application | coating process part, the board | substrate G is carried in to the resist application | coating unit (CT) 36 from the sorter unit (SORTER) 34. As shown in FIG. The resist coating unit (CT) 36 applies the resist liquid to the surface of the substrate by a spinless spin method of supplying the resist liquid from the long slit nozzle onto the substrate while conveying the substrate G on the floating stage. . Subsequently, the substrate G is sent to the reduced pressure drying unit VD 40 through the sorter unit SORTER 38, where a resist coating film on the substrate G is attached to the drying treatment under reduced pressure.

In addition, although the illustration of the sorter unit (SORTER) 34 of the carry-in side is not shown, about the roller conveyance path which comprises one segment of the outward route flow conveyance path 44 (FIG. 1), and the board | substrate on this roller conveyance path, A plurality of adsorption pads capable of vacuum adsorption / detaching and a substrate transfer mechanism for bidirectionally moving the adsorption pads in parallel with the transport direction are provided at the corners of the substrate back surface. When the substrate on which the cooling process is completed is received in the upstream side cooling unit (COL) 32 on the roller conveying path in the upstream, the adsorption pad rises and is adsorbed to the rear surface corner of the substrate to adsorb and hold the substrate. The substrate transfer mechanism is adapted to transfer the substrate to the floating stage of the resist coating unit (CT) 36 through the suction pad. After the substrate is loaded into the floating stage, the suction pad is separated from the substrate, and the substrate transfer mechanism and the suction pad are then returned to their original positions.

The sorter unit (SORTER) 38 on the carry-out side also has the reverse order and direction of operation, and has the same configuration as the sorter unit (SORTER) 34 on the carry-in side.

The configuration and operation of the reduced pressure drying unit (VD) 40 will be described in detail later with reference to FIG. 2.

After receiving the pressure reduction drying process in the pressure reduction drying unit (VD) 40, the board | substrate G enters the carrying-out unit (OUT-PASS) 42 on the path | route flat flow conveyance path 44, and stops there. Immediately thereafter, the transfer robot 70 of the interface station (I / F) 18 accesses the carrying out unit (OUT-PASS) 42 to carry out the substrate G from the freeway flow stream conveyance path 44. Subsequently, the transfer robot 70 pivots 90 degrees, accesses the carry-in unit (IN-PASS) 58 of the intermediate process line C, and carries the substrate G onto the intermediate planar conveyance path 68. do.

In the intermediate process line C, the substrate G is conveyed on the intermediate planar conveyance path 68 in planar flow. First, the substrate G passes through one layer of pre-baking unit (PRE-BAKE) 60 and is subjected to prebaking as a heat treatment after resist coating or a heat treatment before exposure. By this prebaking, the solvent remaining in the resist film on the substrate G is removed by evaporation, thereby enhancing the adhesion of the resist film to the substrate. Subsequently, the substrate G passes through two layers of cooling units (COL) 62, where it is cooled to a predetermined substrate temperature. Then, the board | substrate G is taken in to the conveyance robot 70 from the carrying out unit (OUT-PASS) 64 of the end point of the intermediate | middle flat stream conveyance path 68. As shown in FIG.

In the interface station (I / F) 18, the substrate G is subjected to, for example, a 90 degree orientation change in a rotary stage (not shown) at the top of the OUT-PASS 42. It is carried in to the peripheral exposure apparatus EE of the peripheral apparatus 72, and after receiving exposure for removing at the time of image development the resist attached to the periphery of the board | substrate G, it is sent to the next exposure apparatus 12. .

In the exposure apparatus 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Subsequently, when the substrate G, which has completed the pattern exposure, is returned from the exposure apparatus 12 to the interface station (I / F) 18, first, the substrate G is brought into the titler TITLER of the peripheral apparatus 72, and there Predetermined information is recorded at predetermined sites on the substrate. Then, the board | substrate G is carried in to the loading unit (not shown) of the lower layer of the peripheral apparatus 72 by the transfer robot 70.

In this way, the board | substrate G moves to the cassette station (C / S) 14 by the horizontal flow conveyance on the return flow stream conveyance path 46 attached to the process line B of the return path this time.

In the first developing unit (DEV) 46, a series of developing processes such as developing, rinsing and drying are performed while the substrate G is conveyed in the flat stream.

The board | substrate G which completed the series of image development processes in the image development unit (DEV) 46 sequentially descends the thermal processing path 48, 50, and the inspection unit (IP) 52, as it descend | falls the flat stream conveyance path 46 as it is. Pass through the enemy.

In the thermal processing units 48 and 50, the substrate G is first subjected to post-baking as a heat treatment after development treatment in a post-baking unit (POST-BAKE) 48. By this post-baking, the developer or cleaning solution remaining in the resist film on the substrate G is evaporated and removed to enhance the adhesion of the resist pattern to the substrate G. Subsequently, the substrate G is cooled to a predetermined temperature in the cooling unit COL 50. In the inspection unit (IP) 52, non-contact line width inspection, film quality, film thickness inspection, and the like are performed on the resist pattern on the substrate G.

The carrying-out unit (OUT-PASS) 54 transfers the board | substrate G which reached | attained the terminal part of the flat stream conveyance path 48 to the return after finishing the process of the whole process, and the transfer robot 22 of the cassette station (C / S) 14. ). On the cassette station (C / S) 14 side, the transfer robot 22 uses the cassette G of any one (usually original) of the substrate G on which the processing received from the export unit (OUT-PASS) 54 is completed. To C).

2 shows a configuration of a reduced pressure drying unit (VD) 40 incorporated in the coating and developing processing system of the present embodiment. This vacuum drying unit (VD) 40 adopts a three-part chamber method, and carries in a substrate under atmospheric pressure, and carries-in load lock chamber (VD _A ) 40A which changes the atmosphere around the substrate from an atmospheric pressure state to a reduced pressure state. ), The main pressure reduction drying chamber VD _B 40B for carrying in the substrate G from the carry-in load lock chamber VD _A 40A under reduced pressure and putting the substrate G under reduced pressure over time; The substrate G is brought in from the reduced pressure drying chamber VD _B 40B under reduced pressure, and has a carrying-out load lock chamber VD _C 40C which changes the atmosphere around the substrate from the reduced pressure state to the atmospheric pressure state. .

The roller conveyance path 74 which comprises one section of the outward-path flat flow conveyance path 44 is provided so that these three chambers 40A, 40B, 40C may be terminated in a board | substrate conveyance direction (X direction). The roller drive part (not shown) which drives this roller conveyance path 74 performs independent conveyance operation | movement for every section by making each chamber into one section.

On the roller conveyance path 74, the door valve 75 is provided in the inlet and outlet of 40 A of loading-side load lock chambers, and 40 A of loading-side load lock chambers and main pressure reduction drying process chamber 40B are gate valves ( Spatially connected via 76, the main pressure reduction drying chamber 40B and the carry-out load lock chamber 40C are spatially connected via the gate valve 78, and the carry-out port of the carry-out load lock chamber 40C. The door valve 80 is provided.

The carry-in load lock chamber 40A forms, for example, an exhaust port 82 at the bottom of the chamber, and a purging gas inlet 84 at the ceiling of the chamber. A vacuum pump 88 is connected to the exhaust port 82 via an exhaust pipe 86, and an opening / closing valve 90 is provided in the middle of the exhaust pipe 86. The purging gas supply part 92 is connected to the purge gas inlet 84 via the gas supply pipe 85, and the opening / closing valve 94 is provided in the middle of the gas supply pipe 85.

When carrying in the board | substrate G to 40 A of carrying-in load lock chambers, the door valve 75 is opened and the room is in atmospheric pressure. On the other hand, the gate valve 76 is closed and both on-off valves 90 and 94 are also closed. After the board | substrate G is carried in, the door valve 75 is closed, the opening-closing valve 90 is opened, and a vacuum is started and the inside of chamber 40A becomes a pressure reduction state. Therefore, decompression drying is started in this loading-side load lock chamber 40A substantially.

The main pressure reduction drying chamber 40B forms, for example, an exhaust port 96 at the bottom of the chamber. The vacuum pump 100 is connected to the exhaust port 96 via an exhaust pipe 98, and the chamber 40B is always kept in a reduced pressure state. In addition, although illustration is abbreviate | omitted, Preferably, the height position (position on the roller conveyance path 74) shown by the dotted line for carrying in / out in chamber 40B, and the height position (roller conveyance shown by the solid line for pressure reduction drying process) are shown. A lift pin mechanism (not shown) for raising and lowering the substrate G may be provided between the positions floated upward from the furnace 74.

As described above, when the atmosphere in the carry-in load lock chamber 40A is switched to the depressurized state, the gate valve 76 is opened to transfer the substrate G from the carry-in load lock chamber 40A to the main pressure reduction drying chamber 40B. ) Is moved. The gate valve 76 is immediately closed when passing through the substrate G. In the main pressure reduction drying chamber 40B, the substrate G is placed in a reduced pressure state at a constant vacuum degree, and drying of the resist coating film on the substrate G (evaporation of the organic solvent) proceeds at a high rate.

In the loading-side load lock chamber 40A, when the substrate G is sent out to the main pressure reduction drying chamber 40B, the opening / closing valve 90 of the exhaust system is closed and the opening / closing valve 94 of the purging system is opened. The purging gas (air or nitrogen gas, etc.) from the purging gas supply unit 92 is introduced into the room. Then, the door valve 75 is opened, and the room is opened to the atmosphere. In this way, the next substrate G can be received under atmospheric pressure.

The carrying-out load lock chamber 40C forms the exhaust port 102 in the chamber bottom, and forms the purge gas inlet 104 in the chamber ceiling, for example. A vacuum pump 108 is connected to the exhaust port 102 via an exhaust pipe 106, and an opening / closing valve 110 is provided in the middle of the exhaust pipe 106. The purging gas supply part 114 is connected to the purge gas inlet 104 via the gas supply pipe 112, and the opening / closing valve 116 is provided in the middle of the gas supply pipe 112.

By the time the above-mentioned pressure reduction drying process in the main pressure reduction drying chamber 40B is complete | finished, 40 C of carrying out side load lock chambers are empty (substrateless), and are in a reduced pressure state. That is, the door valve 80 and the opening / closing valve 116 of the purging system are closed, the opening / closing valve 110 of the exhaust system is opened, and the room is evacuated by vacuum.

When the decompression drying processing time in the main decompression drying chamber 40B is timed up, the gate valve 78 is opened to transfer the substrate G from the main decompression drying chamber 40B to the carrying-out load lock chamber 40C. Transferred. The gate valve 78 closes immediately upon passing through the substrate G.

In the loading-side load lock chamber 40C, when the substrate G is loaded, the opening / closing valve 110 of the exhaust system is closed, and the opening / closing valve 116 of the purging system is opened to release from the purging gas supply part 114. Purging gas is introduced into the room. Then, the door valve 80 is opened, and the room is opened to the atmosphere. In this manner, the substrate G can be carried out from the room under atmospheric pressure. In addition, even in the carrying-out load lock chamber 40C, although the board | substrate G is in a reduced pressure state, a certain amount of organic solvents evaporate from the resist coating film on the board | substrate G.

In this manner, the reduced-pressure drying unit (VD) 40 has a reduced-pressure input operation in the loading-side load lock chamber 40A, a main-pressure drying process in the main-pressure drying processing chamber 40B, and a loading-side load lock chamber 40C. By performing the decompression release operation in Fig.) In parallel or simultaneously, a significant reduction in the tact time is realized.

The structure of each part of the intermediate process line C built in the coating and developing process system of this embodiment is shown in FIG.

As shown, the intermediate process line C has a two-layer structure. On the first floor, for example, the roller conveying path is used to terminate the IN-PASS 58 and the pre-baking unit 60 in one direction in the X direction (from the right side to the left side in the drawing). The first intermediate flat flow conveyance path 120 is provided. The roller drive part (not shown) which drives this intermediate | middle flat flow conveyance path 120 may be divided | segmented for each unit 58 and 60, and may operate independently, respectively. In the pre-baking unit (PRE-BAKE) 60, a plurality of prebaking heating elements, for example, sheath heaters 122, are disposed along the intermediate flat flow conveying path 120 at regular intervals.

The second layer is formed of, for example, a roller conveying path so as to terminate the cooling unit (COL) 62 and the carrying out unit (OUT-PASS) 64 in the other direction in the X direction (from left to right in the drawing). 2 intermediate | middle flat flow conveyance path 124 is provided. The roller drive part (not shown) which drives this intermediate | middle flat flow conveyance path 124 may be divided | segmented for each unit 62 and 64, and may operate independently. In the cooling unit (COL) 62, along the intermediate flat flow conveying path 124, for example, inside the cooling mechanism 126 and / or the roller 124a of the type which blows cold air temperature-controlled to constant temperature. The cooling mechanism 128 of the system which forms the flow path and supplies the cooling water temperature-controlled by the fixed temperature in the flow path is arrange | positioned.

In the lifting type transfer unit (EV) 66, a lifting device made of, for example, a roller conveying path, for transferring the substrate G from the first intermediate planar conveying path 120 to the second intermediate planar conveying path 124. The mold intermediate flat flow conveyance path 130 is provided. An exclusive roller drive unit (not shown) is also provided in the lift type intermediate flat flow conveying path 130.

This elevating intermediate flat flow conveyance path 130 is provided in the roller support part 132 which can move up and down, for example, by the elevating drive of the elevating drive part 134 which consists of an air cylinder. It can move up and down between the 1st height position which can be connected with 120, and the 2nd height position which can connect with the intermediate | middle flat flow conveyance path 124 of 2nd floor.

On the ceiling of the lifting type transfer unit (EV) 66, a surface blower 135 such as a fan filter unit (FFU) for supplying cold air of a downflow temperature controlled at a constant temperature to the room is provided. In connection with this, an exhaust port 136 connected to an exhaust system (not shown) is formed in the bottom wall of the unit (EV) 66. The partition plate 137 separating the elevating transfer unit (EV) 66 and the first-floor pre-baking unit (PRE-BAKE) 60 is made of a heat insulating material, and the partition plate 137 is provided with a substrate G. An opening 138 is formed for passing the gas in a flat stream, and an opening and closing gate 139 is provided in the opening 138.

In this intermediate process line C, the transfer robot 70 first performs a first-floor process so that the pre-baking unit (PRE-BAKE) 60 and the cooling unit (COL) 62 can be thermally processed in a flat flow manner. The board | substrate G is carried in to the loading unit 58 of IN-PASS. Immediately after this, the roller conveyance operation is started in the first intermediate flat stream conveyance path 120. The board | substrate G moves on the intermediate | middle flat flow conveyance path 120 to the flat flow, and enters the pre-baking unit (PRE-BAKE) 60 from the IN-PASS 58, and there, the sheath heater 122 ) Is heated to a constant temperature (eg 160 ° C.) and subjected to a prebaking treatment.

When the substrate G approaches the partition plate 137, the opening / closing gate 139 is opened, and the elevating intermediate planar conveying path 130 stands by on the first floor in the elevating transfer unit (EV) 66. have. Thus, the board | substrate G is moved to the lifting-type intermediate | middle level flow conveyance path 130 of the 1st-floor intermediate level flow conveyance path 120 through the opening 138, and from the prebaking unit (PRE-BAKE) 60. It is carried out to the lifting type transfer unit (EV) 66.

When the board | substrate G is completely moved to the lifting type intermediate | middle flat flow conveyance path 130, the opening-closing gate 139 will close and roller conveyance will stop. Subsequently, the lift drive unit 134 operates to lift the lift type intermediate flat flow conveyance path 130, and the substrate G is moved to the second floor. Next, the roller conveyance operation | movement is performed on the elevating intermediate | middle flat flow conveyance path 130 and the intermediate | middle parallel flow conveyance path 124 of 2 layers, and the board | substrate G is cooled from the lifting type transfer unit EV (66) (COL). It is carried in (62).

In the lifting type transfer unit (EV) 66, the substrate G receives cold air of the downflow from the surface blower 135, so that the cooling treatment immediately after prebaking is substantially started here.

When it enters into a cooling unit (COL) 62, the board | substrate G is cooled by the cooling mechanism 126, 128, moving on the intermediate | middle flat flow conveyance path 124, and a board | substrate temperature falls gradually. And when exiting the cooling unit (COL) 62, it will become predetermined | prescribed substrate temperature (for example, 23 degreeC).

When the substrate G exits the cooling unit (COL) 62 and arrives at the unloading unit (OUT-PASS) 64, the roller conveying operation on the intermediate flat flow conveying path 124 is stopped. Thereafter, the transfer robot 70 comes to receive the substrate G and takes it out of the carry-out unit (OUT-PASS) 64.

4 and 5 show an example of the configuration of the import unit (IN-PASS) 58.

In the carrying-in unit (IN-PASS) 58, as shown in FIG. 4, a pair of horizontal frame 140A, 140B extended in parallel in a conveyance direction (X direction) at the interval larger than the board | substrate G is shown. Is installed. A plurality of rod-shaped support members 142 are arranged in parallel between these horizontal frames 140A and 140B at appropriate intervals. Each rod-shaped support member 142 is supported by a plurality of beams 144 (three in the illustrated example) extending in the direction (Y direction) orthogonal to the conveying direction (X direction). Both ends of the beam 144 are fixed to the lower surfaces of the horizontal frames 140A and 140B, respectively, as shown in FIG.

On the upper surface of the rod-shaped support member 142, a large number of ball-shaped free rollers 146 for mounting and supporting the substrate G are provided at a constant pitch.

As viewed from the inlet side of the carrying-in unit (IN-PASS) 58, the bridge | crosslinking drive roller 148 is provided in the rear end part (rear part) of the horizontal frames 140A and 140B. The driving roller 148 integrally fixes a plurality of small wheel-shaped rollers or rollers 148b at regular intervals to the rotating shaft 148a interposed between the horizontal frames 140A and 140B, and the pulley 150. Rotation is driven by the rotation drive unit 152 through.

A plurality of cantilever drive rollers 154 are provided in the horizontal frames 140A and 140B at regular intervals in the longitudinal direction thereof. These drive rollers 154 are driven to rotate through the drive belt 156 on the outside of the horizontal frames 140A and 140B. Here, the drive belt 156 is connected to the rotation drive unit 152 through the pulley 150.

The drive rollers 148 and 154 and the free roller 146 comprise the intermediate | middle board | substrate conveyance path 120 mentioned above.

The structure in the carrying out unit (OUT-PASS) 64 is also the same as the structure in the carrying-in unit (IN-PASS) 58 mentioned above except the conveyance direction and conveyance operation | work are reversed.

As described above, the coating and developing processing system 10 includes a backward process line A, a return process line B, and an intermediate line extending the process station P / S 16 in one direction (X direction) in parallel. It consists of the process line C, and arrange | positions the processing unit of the parallel flow in these process lines A, B, and C, and does not install one conveyance robot in the process station P / S 16, either. not. Thereby, the stress during conveyance with respect to the board | substrate G is reduced, and the risk of the oscillation resulting from operation | movement of a conveyance system is also reduced.

In addition, among the various processing units incorporated in the resist coating and developing processing system, particularly for the reduced pressure drying unit in which the processing time for one substrate is long, the reduced pressure drying unit VD of the three-division chamber method having a short tact time as described above ( 40 is disposed in the route process line A of the process station (P / S) 16. Thereby, the main factor which speeded the tact time of the whole system disappears, and even if the processing speed of the exposure apparatus 12 speeds up, this application | coating development system can fully respond with a margin.

And about the point in which the system longitudinal direction (X direction) size of the coating | coating process part extended by incorporating the 3 division chamber-type reduced-pressure drying unit (VD) 40, if it is a conventional system, a route process line is downstream from the coating process part. The prebaking unit (PRE-BAKE) 60 and the cooling unit (COL) 62 of the thermal processing unit to be disposed on (A) are incorporated in the intermediate process line C in this embodiment. Since the intermediate process line C is provided in the empty space 15 formed between the return process line A and the return process line B in the system width direction (Y direction), it constitutes the intermediate process line C. All occupied spaces, such as pre-baking unit (PRE-BAKE) 60 and cooling unit (COL) 62, are all absorbed into the empty space 15 in the middle, so that both process lines A and B Since it is not included, the increase in the system full length size (X direction size) by the three-segment chamber pressure reduction drying unit (VD) 40 is not accompanied by an increase in the system width size (Y direction size). Can be.

(Other embodiment)

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to the above-mentioned embodiment, A different embodiment or various deformation | transformation are possible within the scope of the technical idea.

For example, as shown in FIGS. 6-9, in the intermediate process line C, the lifting type intermediate flat flow conveying path 130 is divided into two equal parts 130A and 130B in the conveying direction, and those half lifting and lowering are performed. It is also possible to perform the movement operation | movement and roller conveyance operation which are independent and linked each other to mold | type intermediate | middle flat flow conveyance path 130A and 130B, respectively.

As shown in FIG. 6, when carrying in the board | substrate G _i from the pre-baking unit (PRE-BAKE) 60 of the chamber which adjoins on the 1st floor, a pair of semi-lifting intermediate | middle flat flow conveyance paths 130A, 130B) are arranged in a row at the same height to perform a roller conveyance operation together.

And when the board | substrate G _i is fully loaded, a pair of semi-lift type intermediate | middle flat flow conveyance paths 130A and 130B will stop roller conveyance operation | movement simultaneously, and as shown in FIG. It moves up to the height position connected with 124 together. Subsequently, the roller conveyance operation | movement of reverse direction is started, and the board | substrate G _i is sent to the intermediate | middle flat flow conveyance path 124 of two layers by a flat stream.

Here, 130 A of half-lifting intermediate | middle flow stream conveyance paths 130A located on the outer side immediately descend | fall immediately, as soon as the rear end of the board | substrate G _i is moved to the semi-lifting intermediate | middle flow stream conveyance path 130B of the other side (inside). The movement is started, and as shown in FIG. 8, it moves to the front of the entrance opening 138 (shutter 139) of the 1st floor, and it is the middle flat flow of the 1st floor from the pre-baking unit (PRE-BAKE) 60 side. The next board | substrate G _{i + 1 which} is sent on the conveyance path 120 in a flat stream goes first.

The other half lift type intermediate flat flow conveyance path 130B descends to the first floor as soon as the rear end of the board | substrate G _i is moved to the two level lift type intermediate flat flow conveyance path 124, as shown in FIG. It moves, and arrives next to the outer side of 130 A of intermediate | middle flat flow conveyance paths (arranged in line), and carries the following board | substrate G _{i + 1} together by roller conveyance.

Thus, by setting it as the two-part type lift type intermediate | middle flat stream conveyance path 130A, 130B, the conveyance tact time of the whole intermediate flat stream conveyance path 68 can be shortened.

In addition, the cooling mechanism installed in the lifting type transfer unit (EV) 66 can be modified in various ways, for example, a configuration in which the cold wind fan is moved up and down integrally with the lifting type intermediate flat flow conveying path 130, Or it is also possible to cool the board | substrate G through the roller 130a by flowing cooling water in the roller 130a of the intermediate | middle flat flow conveyance path 130. FIG.

In addition, in the above-described embodiment, since the intermediate flat flow conveying path 68 of the intermediate process line C installed in the empty space 15 in a two-layer structure can have an arbitrary long conveying distance, There can be a sufficiently large gap between two substrates G _i , G _{i + 1} moving to. Thereby, when a trouble occurs in the process part of a post process, for example, the exposure apparatus 12, the developing unit (DEV) 46, etc., a considerable number of board | substrates G are spaced on the intermediate planar conveyance path 68 at intervals. ) Can be attracted (temporarily kept).

According to the present invention, as shown schematically in Fig. 10, the intermediate process line C is made into three layers, whereby the above buffer function of the intermediate planar conveyance path 68 can be further extended.

In this case, carrying in of the board | substrate G on the intermediate | middle flat stream conveyance path 162 provided in the temporary storage (buffer room) 160 of 3rd floor is normally performed from the conveyance robot 70 side, but it is a lifting type transfer It is also possible to carry out from the unit (EV) 66 side, ie, via the lifting type intermediate flat flow conveyance path 130.

In addition, as shown in FIG. 11, the intermediate flat stream conveyance path 68 of the intermediate process line C (more precisely, the first intermediate part) is provided at the end portion of the route flat flow conveyance path 44 of the route process line A. A flat conveyor conveyance path 120 may be provided with a cross conveyor (CR-PASS) 170 for moving the substrate G to the flat stream. Here, the cross conveyor (CR-PASS) 170 has a flat flow conveying path in the X direction and a flat flow conveying path in the Y direction, and is configured to selectively switch the flat direction X direction conveyor operation and the flat flow Y direction conveyor operation. .

In this layout, the rotary stage (R / S) 172 in the interface station (I / F) 18 can be arranged next to the cross conveyor (CR-PASS) 170 on the first floor.

In addition, the route flat flow conveyance path 44 does not necessarily need to be continuously provided from the start end to the end of the route process line A, and may be started from the middle. In addition, the some path | route flat-flow conveyance path 44 may be provided in the path | route process line A discontinuously. The return home stream conveyance path 56 may also be provided in a section of the return process line B, or the plurality of return home flow conveyance paths 56 may be provided discontinuously in the home flow plan conveyance path 56.

In addition, in the application | coating development process system of above-mentioned embodiment, the atmospheric pressure drying unit of the horizontal flow system which dries the resist coating film on a board | substrate under normal pressure (atmospheric pressure), moving a board | substrate to the flat stream instead of the vacuum drying unit (VD) 40. As shown in FIG. It is also possible to embed.

The substrate to be processed in the present invention is not limited to the glass substrate for LCD, but other flat panel display substrates, semiconductor wafers, CD substrates, photomasks, printed substrates, and the like can also be used.

BRIEF DESCRIPTION OF THE DRAWINGS The top view which shows the layout structure of the application | coating development system in 1st Embodiment of this invention.

FIG. 2 is a schematic cross-sectional view showing a configuration of a reduced pressure drying unit incorporated in the coating and developing processing system of FIG. 1. FIG.

3 is a schematic cross-sectional view showing a configuration of an intermediate process line incorporated in the coating and developing processing system of FIG. 1.

FIG. 4 is a plan view showing a configuration inside the loading unit of FIG. 3. FIG.

FIG. 5 is a front view illustrating a configuration inside the carrying unit of FIG. 4. FIG.

6 is a diagram of one step showing a modification of the lift type transfer unit included in the intermediate process line;

7 is a diagram of one step showing a modification of the lift type transfer unit included in the intermediate process line;

8 is a diagram of one step showing a modification of the lift type transfer unit included in the intermediate process line;

Fig. 9 is a diagram of one step showing a modification of the lift type transfer unit included in the intermediate process line.

10 is a diagram schematically illustrating a modification of the intermediate process line.

11 is a plan view illustrating a layout configuration of a coating and developing treatment system in one modification.

<Explanation of symbols for the main parts of the drawings>

10: coating and developing treatment system

14: cassette station (C / S)

16: process station (P / S)

18: interface station (I / F)

22: conveying device

24: export unit (OUT-PASS)

36: resist coating unit (CT)

40: pressure reduction unit (VD)

58: import unit (IN-PASS)

60: pre-baking unit (PRE-BAKE)

62: cooling unit (COL)

64: export unit (OUT-PASS)

66: lifting type transfer unit (EV)

68: intermediate flat flow conveying path

70: carrier robot

120: first intermediate flat flow conveying path

124: second intermediate flat stream conveying path

130: third intermediate flat flow conveying path

A: Roadway Process Line

B: in-process line

C: intermediate process line

Claims (14)

It is an inline type processing system which connects a plurality of processing units in order of a process flow, and performs a series of processes including thermal processing to a to-be-processed substrate, In the longitudinal direction of the system, a route processing line having a route route flow path for arranging the processing units of the first group in a line and conveying the substrate in the flow direction in the first direction; In the system longitudinal direction, a second group of processing units located downstream of the process flow are arranged in a line than the first process line, and the substrate is conveyed in a flat flow in a second direction opposite to the first direction. An in-line process line having a return flow path, A third group of processing units disposed between the return process line and the return process line, located downstream of the process flow from the return process line, and located upstream of the process flow from the return process line; A first intermediate flat flow conveying path which is arranged in multiple stages and is directly or indirectly connected to an end portion of the cross-flow flat flow conveying path, and conveys a substrate in a flat stream in the second direction, and the first intermediate flat flow conveying path Or a second intermediate flat stream conveying path which is laid below and which can be directly or indirectly connected to the beginning end of the return flat path conveying path, and conveys the substrate in flat flow in the first direction, and moves the substrate to move up and down. An intermediate process line having a lifting type transfer portion for transferring from an intermediate planar conveying path to the second intermediate planar conveying path With, the processing system. The said elevating type | mold transfer part has a 3rd intermediate | middle flat flow conveyance path which can move up and down between the height position of the said 1st intermediate | middle flat flow conveyance path, and the height position of the said 2nd intermediate | middle flat flow conveyance path, The said 1st The third intermediate planar conveyance path, which conveys the substrate in the flow direction in the second direction on the third intermediate planar conveyance path connected to the end of the intermediate planar conveyance path, and is connected to the start end of the second intermediate planar conveyance path. The processing system which conveys a board | substrate in planar flow in the said 1st direction on a surface. The processing unit of claim 1, wherein A baking unit for heating the substrate, And a cooling unit for cooling the substrate immediately after the heat treatment in the baking unit to a predetermined temperature. The said baking unit is provided along the said 1st intermediate | middle flat-flow conveyance path, And the cooling unit is installed along the second intermediate stream flow path. 5. The lifting type transfer unit according to claim 4, further comprising: a lift type transfer unit receiving the third intermediate flat flow conveyance path adjacent to the baking unit and the cooling unit; And a cooling mechanism portion for cooling the substrate on the third intermediate planar conveyance path in the lift type transfer unit. The processing unit according to any one of claims 1 to 5, wherein A resist coating unit for applying a resist liquid onto a substrate on the forward path flow path; And a drying unit for drying the resist coating film on the substrate on the crossway flow path. The processing system according to claim 6, wherein the drying unit is a reduced pressure drying unit that dries a resist coating film on a substrate under reduced pressure. The method of claim 7, wherein the reduced pressure drying unit, A first chamber carrying the substrate under atmospheric pressure to change the atmosphere around the substrate from the atmospheric pressure to the reduced pressure; A second chamber brought in from the first chamber under reduced pressure, and placed in a reduced pressure state over time; And a third chamber carrying the substrate from the second chamber under reduced pressure to change the atmosphere around the substrate from the reduced pressure to the atmospheric pressure. The substrate according to any one of claims 1 to 5, further comprising a fourth intermediate planar conveying path which is placed above or below the first or second intermediate planar conveying path, and on the fourth intermediate planar conveying path. The processing system which conveys a board | substrate to the stream in the said 2nd direction or the said 1st direction on the said 4th intermediate | middle flat flow conveyance path, in order to store | easily store in and out. The processing system according to any one of claims 1 to 5, wherein the intermediate process line is provided between the return process line and the return process line in a system width direction perpendicular to the system longitudinal direction. 6. The raw substrate according to any one of claims 1 to 5, wherein an untreated substrate is taken out from one of the cassettes inserted into the system at one end in the longitudinal direction of the system, and transferred to the route process line, and all necessary processing in the system is completed. And a first transfer robot for receiving the substrate from the process line into the ear and storing it in one of the cassettes to be ejected from the system. The board | substrate which arrived at the terminal part of the said 2nd intermediate | middle plane flow conveyance path in the other end part of a system longitudinal direction was carried out from there, and was passed through one or several processing apparatus in any one of Claims 1-5. And a second transfer robot brought into the flat flow transfer path to the home afterwards. 13. The processing system according to claim 12, further comprising a flat flow transfer portion for transferring the substrate to the flat stream from a terminal end of the cross-flow flat flow transport path to a start end of the first intermediate flat flow transport path. The processing system according to claim 12, wherein the second transfer robot takes out a substrate that has arrived at an end portion of the cross-way flat flow transfer path from there and carries it into the first intermediate flat flow transfer path.

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