JP2010056375A - Processing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently reduce the total length size of an inline type processing system in which a plurality of processing units are arranged in the order of a process flow in a process line of linearly-extending outward and return paths. <P>SOLUTION: The application/development processing system 10 includes an outward process line A and a return process line B in parallel to each other and extending oppositely to each other in a horizontal system longitudinal direction, and a turned-back type intermediate process line C arranged between them, wherein multiple processing units are arranged in the order of A, C and B according to the process flow. The intermediate process line C is formed into two tiers and turned-back type, wherein a pre-bake unit (PRE-BAKE) 60 and a cooling unit (COL) 62 are arranged on the first tier and the second tier, respectively, and a turning-back vertical movement type transfer unit (EV) 66 for vertically moving and transferring a board G from the first tier to the second tier is arranged. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an in-line type processing system that transports a substrate to be processed in a process flow in a series of processes in a series of processing steps.

  Conventionally, in a resist coating and developing processing system in FPD (flat panel display) manufacturing, in order to cope with an increase in the size of a substrate to be processed, a carrier such as a roller or a roller is laid in a horizontal flow path. Equipped with a flat-flow type processing unit that applies the prescribed liquid, gas, light, etc. to the processing surface of the substrate while transporting the substrate horizontally, and performs the required substrate processing. A system configuration or layout in which a large number of processing units are serially arranged in a process flow order along a substantially horizontal line is standardized (for example, see Patent Document 1).

  As described in Patent Document 1, this type of layout has a horizontally long process station at the center of the system and a cassette station and an interface station at both ends in the longitudinal direction. In the cassette station, a cassette for storing a plurality of unprocessed or processed substrates is loaded between the stage in the station and the outside of the system, and the substrate is loaded between the cassette on the stage and the processing station. Out is done. In the interface station, the substrate is transferred between the adjacent exposure apparatus and the processing station.

The process station has two lines of process lines, a forward path and a return path, each having a cassette station as a start point and an end point, and an interface station as a turning point. In general, in a forward process line, a cleaning processing unit, a resist coating processing unit, a thermal processing unit, and the like are arranged next to each other or in a row with a conveyance unit interposed therebetween. In the process line on the return path, a development processing unit, a thermal processing system unit, an inspection system unit, and the like are arranged next to each other or in a row with the transport system unit interposed therebetween.
JP 2007-200993 A

  As described above, an in-line processing system that arranges a number of processing units including a flat-flow processing unit in series in the order of the process flow along a straight forward / rearward process line increases the size of the FPD substrate. Along with this, the size in the longitudinal direction of the system (full length size) has been increasing, and this has become a disadvantage in terms of footprint in FPD manufacturing factories.

  Further, the processing speed of the exposure apparatus is increased, and each processing unit is required to shorten the tact time in the resist coating and developing processing system. Among them, when a vacuum drying process is sandwiched between the resist coating process and the pre-baking process, the vacuum drying process requires a relatively long time, so the tact time of the vacuum drying unit is most difficult to shorten. Has been.

  Therefore, in order to shorten the takt time of the vacuum drying unit, the vacuum drying unit is divided into three chambers along the process line, and load-locked to the upstream and downstream chambers with an intermediate chamber that always maintains the vacuum state. A three-divided chamber system that provides a function is also being studied. According to this three-divided chamber method, the substrate is loaded into the previous chamber and the atmosphere is changed from atmospheric pressure to reduced pressure, and the substrate is placed under the reduced pressure throughout the middle (intermediate) chamber. Each of the three phases of the main vacuum drying process for drying the resist coating film at a high rate under reduced pressure and the decompression release operation for returning the atmosphere from the reduced pressure to the atmospheric pressure in the subsequent chamber and carrying out the substrate are performed in parallel in a pipeline manner. Therefore, the tact time of the vacuum drying unit can be greatly shortened.

  However, when the three-divided chamber system as described above is employed, there is a trade-off problem that the size of the vacuum drying unit increases three times on the process line, and the system longitudinal direction size (full length size) also increases.

  The present invention has been made in view of the above-described problems of the prior art, and is not available in an in-line system in which a plurality of processing units are arranged in the order of the process flow on a linearly extending round-trip process line. It is an object of the present invention to provide a processing system that can effectively reduce the overall length of the system by effectively using space.

  In order to achieve the above object, a processing system of the present invention is an inline processing system that connects a plurality of processing units in the order of process flow and performs a series of processing including thermal processing on a substrate to be processed. In the longitudinal direction of the system, a first group of processing units are arranged in a line, and an outward path process line having a forward flow path for transporting the substrate in the first direction is transported, and in the longitudinal direction of the system, the first path The second group of processing units positioned downstream of the process line is arranged in a line, and the substrate is transported in a reverse flow in a second direction opposite to the first direction. A return process line having a path, and located between the outbound process line and the outbound process line, and located downstream of the outbound process line. And a third group of processing units located upstream of the return process line in a process flow are arranged in a single row or in multiple stages, and can be directly or indirectly connected to the end of the forward parallel flow path, Directly or indirectly at the beginning of the return flat flow conveying path, which is laid on or below the first intermediate flat flow conveying path and the first intermediate flat flow conveying path that carries the flat flow in the second direction. A second intermediate flat flow path that transports the substrate in the first direction and the second intermediate path from the first intermediate flat flow path by moving the substrate up and down. And an intermediate process line having an up-and-down type transfer unit that transfers to a flat flow path.

  In the above configuration, an intermediate process line is provided between the forward process line and the return process line. In the intermediate process line, the substrate moves in a flat flow on the intermediate flat flow that is folded in the vertical direction, and the third group of The required substrate processing is performed while passing through the processing unit. The process line of the forward path or the return path is transferred to the intermediate process line (processing unit of the third group) by transferring the processing unit that has conventionally belonged to the process line of the forward path or the return path (the first group or the second group of processing units). The overall length of the system, and thus the overall length of the entire system, can be greatly shortened.

  In particular, in the case of a layout in which the intermediate process line is provided between the outbound process line and the inbound process line in the system width direction orthogonal to the system longitudinal direction, the system overall size is significantly increased without increasing the system width size. Shortening can be achieved.

  In the processing system of the present invention, the elevating type transfer unit is movable up and down between the height position of the first intermediate flat flow path and the height position of the second intermediate flat flow path. The substrate is transported in the second direction on the third intermediate flat transport path connected to the end of the first intermediate flat transport path, and the second intermediate flat transport path is transported. A configuration in which the substrate is conveyed in a flat flow in the first direction on the third intermediate flat flow conveyance path connected to the starting end of the flow conveyance path can be suitably employed. In such a configuration, the substrate can be transported in a flat flow from the start end of the first intermediate flat flow path to the end of the second intermediate flat flow path without using a transfer robot in the intermediate process line.

  In a preferred embodiment, the third group of processing units includes a baking unit for heat-treating the substrate, and a cooling unit for cooling the substrate immediately after being subjected to the heat-treatment in the baking unit to a predetermined temperature. And are included. Preferably, the baking unit is provided along the first intermediate flat flow and the cooling unit is provided along the second intermediate flat flow. When a baking unit or a cooling unit is incorporated in a system as a flat-flow processing unit, the size of the unit in the flat-flow direction is relatively large. In the present invention, these thermal processing units are all sized in the intermediate process line. And will not affect the size of the outbound or inbound process line.

  In addition, the processing system of the present invention includes an elevating transfer unit that accommodates a third intermediate flat transfer path adjacent to the baking unit and the cooling unit, and a third intermediate flat transfer transfer in the elevating transfer unit. A configuration having a cooling mechanism for cooling the substrate on the road can be suitably employed. According to this configuration, it is possible to quickly start the cooling process immediately after the baking process by using the time during the transition from the first intermediate flat transport path to the second intermediate flat transport path.

  As a preferred aspect of the present invention, the first group of processing units is coated with a resist coating unit for applying a resist solution to the substrate on the forward flow and transport path, and a resist coating film on the substrate is dried on the forward flow and transport path. And a drying unit.

  In this case, as a preferred embodiment, the drying unit may be a reduced pressure drying unit that dries the resist coating film on the substrate under reduced pressure. In particular, the reduced pressure drying unit carries the substrate under atmospheric pressure, changes the atmosphere around the substrate from the atmospheric pressure state to the reduced pressure state, and carries the substrate from the first chamber under reduced pressure. A second chamber that is kept under reduced pressure throughout a certain period of time, and a third chamber that carries a substrate from the second chamber under reduced pressure and changes the atmosphere around the substrate from a reduced pressure state to an atmospheric pressure state. It's okay.

  Further, the processing system of the present invention has a fourth intermediate flat flow conveyance path laid on or below the first or second intermediate flat flow conveyance path, and on the fourth intermediate flat flow conveyance path. In order to store the substrate so that it can be taken in and out, a configuration in which the substrate is conveyed in the second direction or in the first direction on the fourth intermediate common flow conveyance path can be suitably employed. With this configuration, it is possible to further expand the storage function or the buffer function for temporarily holding the substrate on the intermediate flattened transport path when a failure or abnormality occurs in the processing unit in the subsequent process.

  Also, as a preferred embodiment, at one end in the longitudinal direction of the system, an unprocessed substrate is taken out from any cassette put in the system and passed to the outward process line, and all necessary processing in the system is completed. A first transfer robot is provided that receives substrates from the return path process line and stores them in any cassette to be dispensed from the system.

  Further, the substrate that has arrived at the end of the second intermediate flat flow path is unloaded from the other end in the longitudinal direction of the system, and is then passed through one or a plurality of processing apparatuses before the return flat flow path. A second transfer robot may be provided to be carried into the vehicle. In this case, there may be provided a flat flow type transfer unit for transferring the substrate by flat flow from the end of the forward flat flow transfer path to the beginning of the first intermediate flat flow transfer path. Alternatively, a configuration in which the second transfer robot unloads the substrate that has flown in the forward path and arrived at the end of the transfer path, and loads the substrate into the first intermediate flow and transfer path is also possible.

  According to the processing system of the present invention, with the above-described configuration and operation, an empty space is effectively used in an inline system in which a plurality of processing units are arranged in the order of the process flow on a linearly extending round-trip process line. The overall system size can be shortened.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
(First embodiment)

  FIG. 1 shows a layout configuration of a coating and developing treatment system 10 according to the first embodiment of the present invention. This coating and developing processing system 10 is installed in a clean room. For example, a glass substrate is a processing target G, and a series of processing such as cleaning, resist coating, pre-baking, developing, and post-baking in a photolithography process in an LCD manufacturing process. Is to do. The exposure process is performed by an external exposure device 12 installed adjacent to this system.

  In the coating and developing system 10, a horizontally long process station (P / S) 16 is disposed at the center, and a cassette station (C / S) 14 and an interface station (I / F) are disposed at both ends in the longitudinal direction (X direction). ) 18.

  The cassette station (C / S) 14 is a cassette loading / unloading port of the system 10, and arranges up to four cassettes C that can accommodate a plurality of substrates C in a horizontal direction (Y direction) by stacking substrates G in multiple stages. A cassette stage 20 that can be placed and a transfer robot 22 that puts and removes the substrate G to and from the cassette C on the stage 20 are provided. The transfer robot 22 has a transfer arm 22a that can hold the substrate G in units of one unit, and can operate on four axes of X, Y, Z, and θ, and the adjacent process station (P / S) 16 side and the substrate. G can be delivered.

  The process station (P / S) 16 is arranged in a unidirectional forward process line A and a return process line B, and a free space 15 therebetween, which extend straight in parallel and opposite to each other in the horizontal system longitudinal direction (X direction). A folded-back intermediate process line C is arranged, and a large number of processing units are arranged in the order of A → C → B according to the process flow or process order.

  In the outward process line A from the cassette station (C / S) 14 side to the interface station (I / F) 18 side, a carry-in unit (IN-PASS) 24, an excimer UV irradiation unit (E -UV) 26, scrubber cleaning unit (SCR) 28, adhesion unit (AD) 30, cooling unit (COL) 32, sorter unit (SORTER) 34, resist coating unit (CT) 36, sorter unit (SORTER) 38 The vacuum drying unit 40 and the carry-out unit (OUT-PASS) 42 are arranged in a line in this order.

  Here, an excimer UV irradiation unit (E-UV) 26, a scrubber cleaning unit (SCR) 28, an adhesion unit (AD) 30, a cooling unit (COL) 32, a resist coating unit (CT) 36, and a vacuum drying unit 40 Are configured as a flat-flow type processing unit, and extend vertically from the carry-in unit (IN-PASS) 24 to the carry-out unit (OUT-PASS) 42 through the processing units 26 to 40, for example, a roller conveyance path or a floating conveyance. A first forward flat transport path 44 composed of a path or the like is laid.

  On the other hand, in the return path process line B from the interface station (I / F) 18 side to the cassette station (C / S) 14 side, as a second group of units, a carry-in unit (not shown), a developing unit (DEV) 46, a post-bake unit (POST-BAKE) 48, a cooling unit (COL) 50, an inspection unit (IP) 52, and a carry-out unit (OUT-PASS) 54 are arranged in a line in this order. The carry-in unit (not shown) is provided below the peripheral device (TITLER / EE) 72, that is, on the same floor as the development unit (DEV) 46.

  The developing unit (DEV) 46, the post-bake unit (POST-BAKE) 48, the cooling unit (COL) 50, and the inspection unit (IP) 52 are all configured as a flat-flow processing unit. For example, a return flat flow conveying path 56 including a roller conveying path or a floating conveying path is laid in a longitudinal manner extending from the carry-in unit (not shown) to the carry-out unit (OUT-PASS) 54. Yes.

  The folded-back intermediate process line C has a two-story structure. As a third unit, a carry-in unit (IN-PASS) 58 and a pre-bake unit (PRE-BAKE) 60 are connected to the outbound process line A on the first floor. The cooling units (COL) 62 and the carry-out units (OUT-PASS) 64 are arranged in this order in the same direction as the forward process line A on the second floor. . Further, at one end (folding point) of the intermediate process line C, the folding up / down for transferring the substrate G by moving it up and down from the pre-bake unit (PRE-BAKE) 60 on the first floor to the cooling unit (COL) 62 on the second floor. A mold transfer unit (EV) 66 is provided.

  Both the pre-bake unit (PRE-BAKE) 60 and the cooling unit (COL) 62 are configured as a flat-flow processing unit. In the intermediate process line C, the carry-in unit (OUT-PASS) is transferred from the carry-in unit (IN-PASS) to the pre-bake unit (PRE-BAKE) 60, the elevating transfer unit (EV) 66 and the cooling unit (COL) 62. ) An intermediate flat flow path 68 (120, 124, 130) comprising, for example, a roller conveyance path or a floating conveyance path extending up to the second floor up to 64 is laid.

  The interface station (I / F) 18 includes a transfer robot 70 for exchanging the substrate G with the forward, return process lines A and B, the intermediate process line C, and the adjacent exposure apparatus 12. Next to this, a peripheral device (TITLER / EE) 72 and a rotary stage (not shown) are arranged. The transfer robot 70 has a transfer arm 70a that can hold the substrate G in units of one unit, and can perform an arm expansion / contraction operation and a two-axis (Z, θ) operation of the main body. The peripheral device 72 includes a peripheral exposure device (EE) and a titler (TITLER). The rotary stage is a stage that rotates the substrate G in a horizontal plane in order to change the direction of the rectangular substrate G when it is transferred to and from the exposure apparatus 12. In this embodiment, the carry-out unit ( OUT-PASS) 42 is arranged on the upper floor.

  Here, the processing procedure of all the steps for one substrate G in the coating and developing processing system will be described. First, in the cassette station (C / S) 14, the transfer robot 22 takes out one substrate G from any one of the cassettes C on the stage 20, and takes out the taken substrate G in the process station (P / S) 16. Carry in to the carry-in unit (IN-PASS) 24 on the outbound process line A side. In the carry-in unit (IN-PASS) 24, the substrate G flows in the forward direction and is transferred or loaded onto the transport path 44.

  The substrate G put on the forward flattened transport path 44 is first cleaned and scrubbed by the excimer UV irradiation unit (E-UV) 26 and the scrubber cleaning unit (SCR) 28 in the cleaning process section (26, 28). A cleaning process is sequentially performed. The scrubber cleaning unit (SCR) 28 removes particulate dirt from the surface of the substrate by performing brushing cleaning and blow cleaning on the substrate G that moves flatly on the flat flow transport path 44 and moves horizontally. Thereafter, rinsing is performed, and finally the substrate G is dried using an air knife or the like. When a series of cleaning processes are completed in the scrubber cleaning unit (SCR) 28, the substrate G flows as it is, flows down the transport path 44, and passes through the thermal processing units (30, 32).

  In the thermal processing units (30, 32), the substrate G is first subjected to an adhesion process using vapor HMDS in the adhesion unit (AD) 30, and the surface to be processed is hydrophobized. After completion of this adhesion process, the substrate G is cooled to a predetermined substrate temperature by a cooling unit (COL) 32. Thereafter, the substrate G flows down the forward path and is carried down the transport path 44 to the coating process section (32 to 42).

  When entering the coating process section, the substrate G is carried from the sorter unit (SORTER) 34 to the resist coating unit (CT) 36. The resist coating unit (CT) 36 applies the resist solution to the substrate surface by a flat-flow spinless method in which the resist solution is supplied onto the substrate from the long slit nozzle while the substrate G is floated and conveyed on the floating stage. Next, the substrate G is sent to a reduced pressure drying unit (VD) 40 via a sorter unit (SORTER) 38, where the resist coating film on the substrate G is subjected to a drying process under reduced pressure.

  Although not shown in the figure, a sorter unit (SORTER) 34 on the carry-in side has a roller transport path that constitutes a section of the forward flow and transport path 44 (FIG. 1), and a back surface of the substrate relative to the substrate on the roller transport path. A plurality of suction pads that can be sucked / removed from the vacuum, and a substrate feed mechanism that moves these suction pads in both directions parallel to the transport direction. When the substrate that has been cooled by the upstream cooling unit (COL) 32 is flown flat and received onto the roller transport path, the suction pad rises and is sucked to the back edge of the substrate, and sucks and holds the substrate. A substrate feeding mechanism moves the substrate to the floating stage of the resist coating unit (CT) 36 through the pad. Then, after the substrate is carried into the levitation stage, the suction pad is separated from the substrate, and then the substrate feed mechanism and the suction pad are returned to the original positions.

  The carry-out side sorter unit (SORTER) 38 has the same configuration as the carry-in side sorter unit (SORTER) 34 except that the order and direction of operation are reversed.

  The configuration and operation of the vacuum drying unit (VD) 40 will be described in detail later with reference to FIG.

  After the substrate G is subjected to the decompression drying process in the decompression drying unit (VD) 40, the substrate G flows into the forward path, enters the unloading unit (OUT-PASS) 42 on the transportation path 44 and stops there. Immediately after that, the transfer robot 70 of the interface station (I / F) 18 accesses the carry-out unit (OUT-PASS) 42, flows in the forward path, and unloads the substrate G from the transfer path 44. Next, the transfer robot 70 turns 90 degrees, accesses the carry-in unit (IN-PASS) 58 of the intermediate process line C, and carries the substrate G onto the transfer path 68 in an intermediate flat flow.

  In the intermediate process line C, the substrate G is conveyed in a flat flow on the intermediate flat flow path 68. First, the substrate G passes through a pre-bake unit (PRE-BAKE) 60 on the first floor, where it is pre-baked as a heat treatment after resist coating or a heat treatment before exposure. By this pre-baking, the solvent remaining in the resist film on the substrate G is evaporated and removed, and the adhesion of the resist film to the substrate is enhanced. Next, the substrate G passes through the cooling unit (COL) 62 on the second floor, where it is cooled to a predetermined substrate temperature. Thereafter, the substrate G is taken up by the transport robot 70 from the unloading unit (OUT-PASS) 64 at the end point of the intermediate flat transport path 68.

  In the interface station (I / F) 18, the substrate G is subjected to, for example, a 90-degree direction change at a rotary stage (not shown) on the upper floor of the carry-out unit (OUT-PASS) 42, and then the peripheral exposure of the peripheral device 72 is performed. After being carried into an apparatus (EE) and subjected to exposure for removing the resist adhering to the peripheral portion of the substrate G during development, the resist is sent to the adjacent exposure apparatus 12.

  In the exposure device 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Then, when the substrate G that has undergone pattern exposure is returned from the exposure apparatus 12 to the interface station (I / F) 18, first, it is carried into a titler (TITLER) of the peripheral device 72, where it is transferred to a predetermined portion on the substrate. Is recorded. Thereafter, the substrate G is loaded into a loading unit (not shown) below the peripheral device 72 by the transfer robot 70.

  In this way, the substrate G is moved toward the cassette station (C / S) 14 by the flat flow transfer on the return flow transfer route 46 that is laid on the return process line B.

  In the first development unit (DEV) 46, the substrate G is subjected to a series of development processes of development, rinsing and drying while being transported in a flat flow.

  The substrate G that has undergone a series of development processes in the development unit (DEV) 46 passes through the thermal processing units (48, 50) and the inspection unit (IP) 52 in sequence while returning and flowing down the transport path 46.

  In the thermal processing section (48, 50), the substrate G is first subjected to post-baking as post-development heat treatment in the post-baking unit (POST-BAKE) 48. By this post-baking, the developer and the cleaning solution remaining in the resist film on the substrate G are removed by evaporation, and the adhesion of the resist pattern to the substrate G is enhanced. Next, the substrate G is cooled to a predetermined temperature by a cooling unit (COL) 50. In the inspection unit (IP) 52, the resist pattern on the substrate G is subjected to non-contact line width inspection, film quality / film thickness inspection, and the like.

  The carry-out unit (OUT-PASS) 54 transfers the substrate G, which has finished the processing of all the processes and arrived at the end of the transfer path 48, to the transfer robot 22 of the cassette station (C / S) 14. On the cassette station (C / S) 14 side, the transfer robot 22 stores the processed substrate G received from the carry-out unit (OUT-PASS) 54 in any one (usually the original) cassette C.

FIG. 2 shows the configuration of a vacuum drying unit (VD) 40 incorporated in the coating and developing treatment system of this embodiment. This reduced pressure drying unit (VD) 40 adopts a three-divided chamber system, and carries a substrate under atmospheric pressure, and changes the atmosphere around the substrate from an atmospheric pressure state to a reduced pressure state. _A ) 40A, a main vacuum drying treatment chamber (VD _B ) 40B for loading the substrate G from the loading side load lock chamber (VD _A ) 40A under reduced pressure and keeping it under reduced pressure for a certain period of time, and a main vacuum drying treatment There is a loading-side load lock chamber (VD _C ) 40C that carries the substrate G from the chamber (VD _B ) 40B under reduced pressure and changes the atmosphere around the substrate from the reduced pressure state to the atmospheric pressure state.

  A roller transport path 74 that constitutes a section of the forward transport path 44 is laid in such a manner that the three chambers 40A, 40B, and 40C are vertically cut in the substrate transport direction (X direction). A roller driving unit (not shown) that drives the roller conveyance path 74 performs an independent conveyance operation for each section with each chamber as one section.

  On the roller conveyance path 74, a door valve 75 is attached to the carry-in entrance of the carry-in side load lock chamber 40A, and the carry-in side load lock chamber 40A and the main reduced pressure drying treatment chamber 40B are spatially connected via a gate valve 76. The main vacuum drying treatment chamber 40B and the carry-out side load lock chamber 40C are spatially connected via a gate valve 78, and a door valve 80 is attached to the carry-out port of the carry-out side load lock chamber 40C.

  In the loading-side load lock chamber 40A, for example, an exhaust port 82 is provided at the bottom of the chamber, and a purging gas introduction port 84 is provided at the ceiling of the chamber. A vacuum pump 88 is connected to the exhaust port 82 via an exhaust pipe 86, and an opening / closing valve 90 is provided in the middle of the exhaust pipe 86. A purging gas supply unit 92 is connected to the purging gas introduction port 84 via a gas supply pipe 85, and an opening / closing valve 94 is provided in the middle of the gas supply pipe 85.

  When the substrate G is loaded into the loading-side load lock chamber 40A, the door valve 75 is opened and the room is in an atmospheric pressure state. On the other hand, the gate valve 76 is closed, and both the on-off valves 90 and 94 are also closed. After the substrate G is loaded, the door valve 75 is closed and the on-off valve 90 is opened to start evacuation, and the chamber 40A is decompressed. Therefore, the drying under reduced pressure is actually started in the loading side load lock chamber 40A.

  The main vacuum drying treatment chamber 40B is provided with an exhaust port 96 at the bottom of the chamber, for example. A vacuum pump 100 is connected to the exhaust port 96 through an exhaust pipe 98, and the inside of the chamber 40B is always kept in a reduced pressure state. Although not shown in the drawings, preferably, a height position (position on the roller conveyance path 74) indicated by a dotted line for loading / unloading in the chamber 40B and a height position (roller conveyance path) indicated by a solid line for decompression drying processing. A lift pin mechanism (not shown) for raising and lowering the substrate G may be provided.

  When the atmosphere in the loading-side load lock chamber 40A is switched to the reduced pressure state as described above, the gate valve 76 is opened, and the substrate G is transferred from the loading-side load lock chamber 40A to the main reduced pressure drying processing chamber 40B. When the gate valve 76 passes through the substrate G, it is immediately closed. The substrate G is placed under a reduced pressure of a certain degree of vacuum in the main vacuum drying treatment chamber 40B, and the drying of the resist coating film on the substrate G (evaporation of the organic solvent) proceeds at a high rate.

  In the loading-side load lock chamber 40A, when the substrate G is sent to the main vacuum drying chamber 40B, the exhaust system on / off valve 90 is closed, and the purging system on / off valve 94 is opened. A purging gas (such as air or nitrogen gas) is introduced into the room. Then, the door valve 75 is opened, and the room is opened to the atmosphere. In this way, the next substrate G can be placed under atmospheric pressure.

  In the carry-out side load lock chamber 40C, for example, an exhaust port 102 is provided in the bottom of the chamber, and a purging gas introduction port 104 is provided in the chamber ceiling. A vacuum pump 108 is connected to the exhaust port 102 via an exhaust pipe 106, and an open / close valve 110 is provided in the middle of the exhaust pipe 106. A purging gas supply unit 114 is connected to the purging gas introduction port 104 via a gas supply pipe 112, and an opening / closing valve 116 is provided in the middle of the gas supply pipe 112.

  When the reduced-pressure drying process in the main reduced-pressure drying process chamber 40B as described above is completed, the carry-out side load lock chamber 40C is in a reduced pressure state because the room is empty (no substrate). That is, the door valve 80 and the purging system on / off valve 116 are closed, the exhaust system on / off valve 110 is opened, and the room is evacuated to a vacuum.

  When the vacuum drying process time in the main vacuum drying process chamber 40B is up, the gate valve 78 is opened, and the substrate G is transferred from the main vacuum drying process chamber 40B to the unloading side load lock chamber 40C. The gate valve 78 is immediately closed when the substrate G is passed.

  In the carry-out side load lock chamber 40C, when the substrate G is carried in, the exhaust system on / off valve 110 is closed and the purging system on / off valve 116 is opened, so that the purging gas from the purging gas supply unit 114 is put into the room. be introduced. Then, the door valve 80 is opened, and the room is opened to the atmosphere. Thus, the substrate G can be carried out from the room under atmospheric pressure. It should be noted that the substrate G is placed under reduced pressure even in the carry-out side load lock chamber 40C for a short time, and a certain amount of organic solvent evaporates from the resist coating film on the substrate G.

  As described above, the decompression drying unit (VD) 40 includes the decompression charging operation in the carry-in side load lock chamber 40A, the main decompression drying process in the main decompression drying process chamber 40B, and the decompression in the delivery side load lock chamber 40C. The tact time is greatly shortened by performing the releasing operation in parallel or simultaneously.

  FIG. 3 shows the configuration of each part of the intermediate process line C incorporated in the coating and developing treatment system of this embodiment.

  As shown in the figure, the intermediate process line C has a two-story structure. On the first floor, for example, a roller transport path is provided so that the carry-in unit (IN-PASS) 58 and the pre-bake unit (PRE-BAKE) 60 are cut in one direction in the X direction (from right to left in the figure). One intermediate flat flow path 120 is laid. A roller driving unit (not shown) for driving the intermediate flat flow path 120 is divided for each of the units 58 and 60 and may be operated independently. In the pre-bake unit (PRE-BAKE) 60, a large number of pre-baking heating elements, such as sheathed heaters 122, are arranged at regular intervals along the intermediate flat flow conveyance path 120.

  On the second floor, a second unit comprising a roller conveyance path, for example, is provided so as to cut the cooling unit (COL) 62 and the carry-out unit (OUT-PASS) 64 in the other direction in the X direction (from left to right in the figure). An intermediate flat flow path 124 is laid. A roller driving section (not shown) for driving the intermediate flat flow path 124 is divided for each of the units 62 and 64 and may operate independently. In the cooling unit (COL) 62, a flow path is formed in the cooling mechanism 126 and / or the roller 124a, for example, which blows out cold air whose temperature is adjusted to a constant temperature along the intermediate flat flow path 124. A cooling mechanism 128 of a type that supplies cooling water whose temperature is adjusted to a constant temperature is disposed in the flow path.

  In the up-and-down transfer unit (EV) 66, an up-and-down intermediate flat for example comprising a roller transfer path for transferring the substrate G from the first intermediate flat transfer path 120 to the second intermediate flat transfer path 124. A sink conveyance path 130 is provided. A dedicated roller driving unit (not shown) is also used for the elevating-type intermediate flat flow path 130.

  The lift-type intermediate flat flow path 130 is attached to a roller support part 132 that can be moved up and down, and is connected to the intermediate flat flow path 120 on the first floor by, for example, a lift drive unit 134 formed of an air cylinder. It can be moved up and down between a possible first height position and a second height position that can be connected to the intermediate flat flow path 124 on the second floor.

  A planar blower 135 such as a fan fitter unit (FFU) for supplying cold air of a downflow whose temperature is adjusted to a constant temperature to the room is attached to the ceiling of the elevating transfer unit (EV) 66. In this connection, an exhaust port 136 connected to an exhaust system (not shown) is provided on the bottom wall of the unit (EV) 66. The partition plate 137 that separates the elevating transfer unit (EV) 66 and the pre-bake unit (PRE-BAKE) 60 on the first floor is made of a heat insulating material, and an opening 138 for passing the substrate G through the partition plate 137 in a flat flow. The opening / closing gate 139 is attached to the opening 138.

  In this intermediate process line C, in order to cause the pre-bake unit (PRE-BAKE) 60 and the cooling unit (COL) 62 to perform thermal treatment in a flat flow manner, first, the transfer robot 70 is moved to the first floor carry-in unit (IN− The substrate G is carried into the PASS) 58. Immediately after, the roller conveyance operation is started in the first intermediate flat flow path 120. The substrate G is moved in a flat flow on the intermediate flat transfer path 120 and enters the pre-bake unit (PRE-BAKE) 60 from the carry-in unit (IN-PASS) 58, where it is fixed at a constant temperature (for example, 160 ° C.) by the sheath heater 122. ) And subjected to a pre-baking treatment.

  When the substrate G approaches the partition plate 137, the open / close gate 139 is opened, and in the lift transfer unit (EV) 66, the lift type intermediate flat flow is waiting on the first floor. Thus, the substrate G passes through the opening 138 and is transferred from the intermediate flat flow transfer path 120 on the first floor to the lift intermediate flow transfer path 130 and from the pre-bake unit (PRE-BAKE) 60 to the lift transfer unit (EV) 66. It is carried out to.

  When the substrate G is completely moved up and down to the intermediate flat flow and transferred to the transfer path 130, the open / close gate 139 is closed and the roller transfer is stopped. Next, the elevating drive unit 134 is operated, the elevating type intermediate flat flow and the conveying path 130 are raised, and the substrate G is moved to the second floor. Next, a roller transport operation is performed on the liftable intermediate flat flow path 130 and the intermediate flat flow path 124 on the second floor, and the substrate G is transferred from the lift type transfer unit (EV) 66 to the cooling unit (COL) 62. It is brought in.

  In the up-and-down transfer unit (EV) 66, the substrate G receives the cold air of the downflow from the planar fan 135, so that the cooling process immediately after the pre-baking is substantially started here.

  When entering the cooling unit (COL) 62, the substrate G flows through the intermediate flat surface and is cooled by the cooling mechanisms 126 and 128 while moving on the transport path 124, and the substrate temperature is gradually lowered. And when it leaves the cooling unit (COL) 62, it reaches a predetermined substrate temperature (for example, 23 ° C.).

  When the substrate G passes through the cooling unit (COL) 62 and arrives at the carry-out unit (OUT-PASS) 64, the intermediate flat flow and the roller conveyance operation on the conveyance path 124 are stopped. Thereafter, the transfer robot 70 receives the substrate G and carries it out of the carry-out unit (OUT-PASS) 64.

FIG. 4 and FIG. 5 show a configuration example of the carry-in unit (IN-PASS) 58.
In the carry-in unit (IN-PASS) 58, as shown in FIG. 4, a pair of horizontal frames 140 </ b> A and 140 </ b> B extending in parallel to the transport direction (X direction) with a larger interval than the substrate G is provided. . Between these horizontal frames 140A and 140B, a plurality (four in the illustrated example) of rod-like support members 142 are arranged in parallel with an appropriate interval. Each rod-like support member 142 is supported by a plurality of (three in the illustrated example) beams 144 extending in a direction (Y direction) orthogonal to the transport direction (X direction). As shown in FIG. 5, both ends of the beam 144 are fixed to the lower surfaces of the horizontal frames 140A and 140B, respectively.

  A large number of ball-shaped free rollers 146 for mounting and supporting the substrate G are attached to the upper surface of the rod-like support member 142 at a constant pitch.

  A bridge-type drive roller 148 is attached to the rear end portions (rearmost portions) of the horizontal frames 140A and 140B when viewed from the entrance side of the carry-in unit (IN-PASS) 58. The drive roller 148 has a large number of coma-shaped rollers or rollers 148b fixed integrally with a rotating shaft 148a spanned between the horizontal frames 140A and 140B, and is rotated via a pulley 150. The drive unit 152 is rotationally driven.

  A large number of cantilevered driving rollers 154 are attached to the horizontal frames 140A and 140B at regular intervals in the length direction. These driving rollers 154 are rotationally driven via a driving belt 156 outside the horizontal frames 140A and 140B. Here, the drive belt 156 is connected to the rotation drive unit 152 via the pulley 150.

  The drive rollers 148 and 154 and the free roller 146 constitute the intermediate substrate transfer path 120 on the first floor described above.

  The configuration in the carry-out unit (OUT-PASS) 64 is the same as the configuration in the carry-in unit (IN-PASS) 58 except that the transport direction and the transport operation are reversed.

  As described above, the coating and developing processing system 10 includes the process station (P / S) 16 including the forward process line A, the backward process line B, and the intermediate process line C extending in parallel in one direction (X direction). These process lines A, B, and C are all provided with a plain flow processing unit, and no transfer robot is provided in the process station (P / S) 16. Thereby, the stress during the conveyance with respect to the board | substrate G is reduced, and the risk of the dust generation resulting from the operation | movement of a conveyance system is also reduced.

  Among the various processing units incorporated in the resist coating and developing processing system, the reduced-pressure drying unit having a long processing time for one substrate, particularly, the three-chambered reduced-pressure drying unit (tact time as described above) ( VD) 40 is arranged in the forward process line A of the process station (P / S) 16. As a result, the main factor that determines the tact time of the entire system is eliminated, and even if the processing speed of the exposure apparatus 12 is increased, the coating and developing processing system can cope with a sufficient margin.

In addition, regarding the fact that the system longitudinal direction (X direction) size of the coating processing unit has been extended by incorporating the three-chambered vacuum drying unit (VD) 40, the conventional system has a downstream side of the coating processing unit. In this embodiment, a pre-bake unit (PRE-BAKE) 60 and a cooling unit (COL) 62 of the thermal processing section that should be arranged on the outward process line A are incorporated in the intermediate process line C. Since the intermediate process line C is provided in the empty space 15 formed between the forward process line A and the return process line B in the system width direction (Y direction), all units constituting the intermediate process line C, that is, pre-baking The occupied space such as the unit (PRE-BAKE) 60 and the cooling unit (COL) 62 is all absorbed in the intermediate empty space 15 and is not included in both process lines A and B. Therefore, the system width size (Y direction size) ), The increase in the total length of the system (size in the X direction) due to the three-chambered vacuum drying unit (VD) 40 can be canceled.
(Other embodiments)

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and other embodiments or various modifications can be made within the scope of the technical idea.

  For example, as shown in FIGS. 6 to 9, in the intermediate process line C, the up-and-down type intermediate flat flow conveyance path 130 is divided into two equal parts (130A and 130B) in the conveyance direction, and these semi-elevation type intermediate flat flow conveyance is performed. It is also possible to cause the paths 130A and 130B to perform a moving operation and a roller transporting operation that are independent and in cooperation with each other.

As shown in FIG. 6, when loading the first floor from the pre-baking unit adjacent room (PRE-BAKE) 60 substrate G _i, a pair of semi-lift type spur flow conveyance path 130A, in a row 130B is at the same height Roll the rollers together.

When the substrate G _i completely drive over a pair of semi-lift type spur flow conveyance path 130A, 130B is stopped roller conveyor operate simultaneously, as shown in FIG. 7, a conveying path 124 upstairs spur sink Move up to the connecting height. Then, start the reverse roller transport operation, the substrate G _i a flat sink upstairs spur flow feeding to the transport path 124.

Here, one of the half-lift type spur flow conveying path 130A located outside the semi-lift type spur flow conveyance path 130B to possess as soon as the trailing end of the substrate G _i and the other (inner), the downward movement immediately As shown in FIG. 8, it moves to the front of the first-floor entrance 138 (shutter 139), and flows through the pre-bake unit (PRE-BAKE) 60 side on the first-floor intermediate flat flow path 120. The next board G _{i + 1} to be sent is picked up one step ahead.

The other half lift type spur flow conveyance path 130B is to possess as soon as the transport path 124 the rear end of the substrate G _i is the second floor of the elevator-type spur flow, as shown in FIG. 9, and moves downward to the first floor Then, they arrive next to the first intermediate flat flow path 130A (in a line), and carry in the next substrate G _{i + 1} together by roller conveyance.

  In this way, by using the two-divided lift type intermediate flat flow path 130A, 130B, the transfer tact time of the entire intermediate flat flow path 68 can be shortened.

  In addition, the cooling mechanism provided in the lifting / lowering transfer unit (EV) 66 can be variously modified, for example, a configuration in which the cold air fan moves up and down integrally with the lifting / lowering intermediate flat flow and the conveyance path 130 is possible, or It is also possible to cool the substrate G through the rollers 130a by flowing cooling water into the rollers 130a of the intermediate flat flow path 130.

Further, in the above-described embodiment, the intermediate flat flow path 68 of the intermediate process line C provided in a two-story structure in the empty space 15 can have an arbitrary long transfer distance, and therefore moves in a flat flow before and after 2. A sufficiently large space can be provided between the two substrates G _i and G _{i + 1} . As a result, when a trouble occurs in a processing unit in a later process, such as the exposure apparatus 12 or the development unit (DEV) 46, a considerable number of substrates G are held on the intermediate flat flow path 68 at intervals (temporary). Storage).

  According to the present invention, as shown schematically in FIG. 10, the buffer function as described above of the intermediate flat flow path 68 can be further expanded by making the intermediate process line C three stories. is there.

  In this case, the substrate G is normally carried in from the side of the transport robot 70 on the intermediate flat transport path 162 provided in the temporary storage (buffer chamber) 160 on the third floor. It is also possible to carry out from the (EV) 66 side, that is, through the up-and-down type intermediate flat flow path 130.

  Further, as shown in FIG. 11, at the end of the forward flat feed path 44 of the forward process line A, the intermediate flat feed path 68 of the intermediate process line C (more precisely, the first intermediate flat feed path 120). It is also possible to provide a cross conveyor (CR-PASS) 170 for transferring the substrate G in a flat flow. Here, the cross conveyor (CR-PASS) 170 has an X-direction flat flow conveyance path and a Y-direction flat flow conveyance path, and the flat flow X-direction conveyor operation and the flat flow Y-direction conveyor operation. And can be selectively switched.

  In this layout, the rotary stage (R / S) 172 can be arranged next to the cross conveyor (CR-PASS) 170 on the first floor in the interface station (I / F) 18.

  It is not always necessary that the forward flattened transport path 44 is continuously laid from the start end to the end of the forward process line A, and may be started halfway. In addition, a plurality of forward parallel flow paths 44 may be provided discontinuously in the forward process line A. The return-side flat transport path 56 may also be provided in a part of the return-path process line B, or a plurality of return-side flat-flow transport paths 56 may be provided in the return-side flat transport path 56. .

  In the coating and developing treatment system of the above-described embodiment, instead of the reduced pressure drying unit (VD) 40, the resist coating film on the substrate is dried under normal pressure (atmospheric pressure) while moving the substrate in a flat flow. It is also possible to incorporate a flat-flow type atmospheric drying unit.

  The substrate to be processed in the present invention is not limited to a glass substrate for LCD, and other flat panel display substrates, semiconductor wafers, CD substrates, photomasks, printed substrates and the like are also possible.

1 is a plan view showing a layout configuration of a coating and developing treatment system in a first embodiment of the present invention. It is a schematic sectional drawing which shows the structure of the reduced pressure drying unit integrated in the coating and developing treatment system of FIG. FIG. 2 is a schematic cross-sectional view showing a configuration of an intermediate process line incorporated in the coating and developing treatment system of FIG. 1. It is a top view which shows the structure inside the carrying-in unit of FIG. It is a front view which shows the structure inside the carrying-in unit of FIG. It is a one-stage figure which shows the modification of the raising / lowering type transfer unit contained in an intermediate process line. It is a one-stage figure which shows the modification of the raising / lowering type transfer unit contained in an intermediate process line. It is a one-stage figure which shows the modification of the raising / lowering type transfer unit contained in an intermediate process line. It is a one-stage figure which shows the modification of the raising / lowering type transfer unit contained in an intermediate process line. It is a figure which shows typically the modification of an intermediate | middle process line. It is a top view which shows the layout structure of the application | coating development processing system in one modification.

Explanation of symbols

10 Coating and Development Processing System 14 Cassette Station (C / S)
16 Process station (P / S)
18 Interface station (I / F)
22 Transport device 34 Unloading unit (OUT-PASS)
36 resist coating unit (CT)
40 Pressure reducing unit (VD)
58 Carry-in unit (IN-PASS)
60 Pre-bake unit (PRE-BAKE)
62 Cooling unit (COL)
64 Unloading unit (OUT-PASS)
66 Lift type transfer unit (EV)
68 Intermediate flat flow path 70 Transfer robot 120 First intermediate horizontal flow path 124 Second intermediate horizontal flow path 130 Third intermediate horizontal transfer path A Outward process line B Return path process line C Intermediate process line

Claims (14)

An in-line type processing system for connecting a plurality of processing units in the order of process flow and performing a series of processing including thermal processing on a substrate to be processed.
In the longitudinal direction of the system, a forward process line having a forward flow transport path in which the first group of processing units are arranged in a line and the substrate is transported in a flat direction in the first direction;
In the longitudinal direction of the system, a second group of processing units positioned downstream of the first process line in the process flow is arranged in a row, and the substrate is flattened in a second direction opposite to the first direction. A return path process line having a return-flow flat-feed transfer path for transfer in a sink;
A third group provided between the forward process line and the return process line, located downstream of the forward process line and upstream of the process flow from the backward process line; A first intermediate flow transport path that is arranged in a row or in multiple stages, can be connected directly or indirectly to the end of the forward flow transport path, and transports the substrate in a second flow in the second direction; , Which is laid above or below the first intermediate flat flow path, can be directly or indirectly connected to the starting end of the return flat flow path, and transports the substrate in the first direction. And an intermediate process line having an up-and-down transfer unit that moves the substrate up and down to transfer the substrate from the first intermediate flat transfer route to the second intermediate flat transfer route. Yes Processing system.   Third elevating transfer unit that can be moved up and down between the height position of the first intermediate flat flow path and the height position of the second intermediate horizontal flow path. A substrate having a path and transporting the substrate in the second direction in the second direction on the third intermediate stream transport path connected to the end of the first intermediate stream transport path; 2. The processing system according to claim 1, wherein the substrate is transported in a flat flow in the first direction on the third intermediate flat flow transport path connected to a starting end of the transport path. In the third group of processing units,
A baking unit for heat-treating the substrate;
The processing system according to claim 1, further comprising: a cooling unit for cooling the substrate immediately after being subjected to the heat treatment in the baking unit to a predetermined temperature. The baking unit is provided along the first intermediate flow path;
The cooling unit is provided along the second intermediate flow path;
The processing system according to claim 3. An elevating transfer unit that accommodates the third intermediate flat flow conveyance path adjacent to the baking unit and the cooling unit;
The processing system according to claim 4, further comprising: a cooling mechanism unit for cooling the substrate on the third intermediate flat flow transport path in the elevating transfer unit. In the first group of processing units,
A resist application unit for applying a resist solution to the substrate on the forward flow and conveying path;
The processing system as described in any one of Claims 1-5 including the drying unit which dries the resist coating film on a board | substrate on the said forward flow and conveyance path.   The processing system according to claim 6, wherein the drying unit is a reduced-pressure drying unit that dries the resist coating film on the substrate under reduced pressure. The vacuum drying unit comprises:
A first chamber that carries a substrate under atmospheric pressure and changes an atmosphere around the substrate from an atmospheric pressure state to a reduced pressure state;
A second chamber for loading the substrate from the first chamber under reduced pressure and placing the substrate under reduced pressure throughout a period of time;
The processing system according to claim 7, further comprising: a third chamber that carries a substrate from the second chamber under reduced pressure and changes an atmosphere around the substrate from a reduced pressure state to an atmospheric pressure state.   To have a fourth intermediate flat flow transfer path laid on or below the first or second intermediate flat flow transfer path, and to store the substrate in the fourth intermediate flat flow transfer path so that it can be taken in and out. The processing system according to any one of claims 1 to 8, wherein the substrate is transported in a flat flow in the second direction or the first direction on the fourth intermediate flat flow transport path.   The processing system according to claim 1, wherein the intermediate process line is provided between the forward process line and the return process line in a system width direction orthogonal to a system longitudinal direction.   At one end in the longitudinal direction of the system, an unprocessed substrate is taken out from one of the cassettes loaded in the system and transferred to the outbound process line, and a substrate that has been subjected to all necessary processing in the system is received from the return path process line. The processing system according to claim 1, further comprising a first transfer robot that is housed in any cassette to be paid out from the system.   At the other end in the longitudinal direction of the system, the substrate that has arrived at the end of the second intermediate flat flow is taken out of the substrate, passed through one or more processing apparatuses, and then loaded into the return flat flow. The processing system according to any one of claims 1 to 11, further comprising a second transfer robot.   The processing system according to claim 12, further comprising a flat flow type transfer unit for transferring a substrate by flat flow from a terminal end of the forward flat flow transfer path to a start end of the first intermediate flat flow transfer path.   The processing system according to claim 12, wherein the second transport robot unloads the substrate that has arrived at the end of the forward flow and the transport path, and transports the substrate to the first intermediate flow and transport path.

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