CN1249776C - Lining treatment system - Google Patents
Lining treatment system Download PDFInfo
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- CN1249776C CN1249776C CNB021518696A CN02151869A CN1249776C CN 1249776 C CN1249776 C CN 1249776C CN B021518696 A CNB021518696 A CN B021518696A CN 02151869 A CN02151869 A CN 02151869A CN 1249776 C CN1249776 C CN 1249776C
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- 238000011282 treatment Methods 0.000 title claims description 51
- 239000000758 substrate Substances 0.000 claims abstract description 211
- 238000012545 processing Methods 0.000 claims abstract description 65
- 230000007246 mechanism Effects 0.000 claims abstract description 64
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims description 74
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 3
- WSZPRLKJOJINEP-UHFFFAOYSA-N 1-fluoro-2-[(2-fluoro-2,2-dinitroethoxy)methoxy]-1,1-dinitroethane Chemical compound [O-][N+](=O)C(F)([N+]([O-])=O)COCOCC(F)([N+]([O-])=O)[N+]([O-])=O WSZPRLKJOJINEP-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 28
- 230000008569 process Effects 0.000 abstract description 26
- 230000032258 transport Effects 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 description 29
- 238000000576 coating method Methods 0.000 description 29
- 238000004140 cleaning Methods 0.000 description 27
- 238000005406 washing Methods 0.000 description 18
- 238000013519 translation Methods 0.000 description 12
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 9
- 238000001816 cooling Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 230000002209 hydrophobic effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000007723 transport mechanism Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000003223 protective agent Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
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- 230000001105 regulatory effect Effects 0.000 description 1
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- 230000002459 sustained effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
This invention is a substrate processing system which transports two or more substrates one by one along passing line which shuttles between exposure devices from cassette station to the outside and processes it including: a first processing part installed on the upstream side along the passing line and a second processing part installed on the downstream side along the passing line; each of the processing part have two or more processing unit groups; and a first passing unit to accept substrate transported along passing line from the first processing part; and a second passing unit which sends off substrate which passed the first passing unit to the second processing part is arranged from the first passing unit to the downstream side; and thermal processing part installed up of passing units the first and/or second passing unit; and at least one buffer unit which makes substrate temporarily stay is installed downward of the passing units the first and second at least on the other hand evade the collision of the substrate on the passing line; and a handing over arm mechanism which transports substrate between the first and second passing unit and the buffer unit.
Description
Technical field
The present invention relates to a kind of lining treatment system that adopts photoetching on the such processed substrate of LCD substrate, to form circuit pattern.
Background technology
In recent years, LCD (LCDs) is obviously to large scale development, and along with the maximization of production line, glass substrate transportation and the difficulty of handling increase day by day.In order to satisfy the maximization requirement of this LCD substrate, adopt the hauling operation line (conveyance path) that substrate is passed through to go up tiling in the coating video picture treatment system that is used for LCD production roller roller is arranged, when transporting substrate, by what is called " translation mode " along the processing unit sequential processes substrate of hauling operation line configuration by the roller roller continuous horizontal.In this translation mode system,, many processing unit are arranged along hauling operation line configured in series according to photoetching flow sequence (hereinafter to be referred as " technological process ").
In this linear array type treatment system, in case break down in certain position and will stop the entire process system during daily maintenance or slow down handling.In addition, when processing does not stop but handling the generation sluggishness, also can influence all processing that are positioned at the technological process upstream side, thereby cause stopping to deal with separately or having to the speed of service that slows down.
At this moment, in the handling part of translation mode, because carrying out a succession of processing successively as regular event with predetermined timing along each instrument of horizontal conveyance via configuration substrate by the next door, if the influence of incuring loss through delay because of the handling part treatment process in downstream is stayed the substrate on this horizontal carrying channel, then contents processing or result are improper with regard to what can not have qualification rate to descend as the appearance of setting.
Summary of the invention
Even the object of the present invention is to provide and a kind ofly delay, also upstream side handling part or the suffered influence of processed substrate can be suppressed at minimal lining treatment system at intrasystem a part of process flow.
The invention provides a kind of lining treatment system, along from the case district to hauling operation line reciprocal the outside exposure device, multiple substrates is handled in conveyance successively, it is characterized in that this system comprises: have along above-mentioned hauling operation line and be arranged on the 1st handling part of upstream side and be arranged on many processing components groups of the 2nd handling part in downstream; And by 1st path unit of above-mentioned the 1st handling part reception along the substrate of aforementioned hauling operation line conveyance; And be arranged on than above-mentioned the 1st path unit downstream also, will send the 2nd path unit of above-mentioned the 2nd handling part through the substrate of above-mentioned the 1st path unit to; And be located in the above-mentioned the 1st or the 2nd path unit heat treatment portion of at least one path unit top; And be located at the above-mentioned the 1st or the below of the 2nd at least one path unit of path unit, and collide between the substrate on the above-mentioned hauling operation line for avoiding, can stay at least one surge chamber of substrate temporarily; Reach the arm connecting mechanism of conveyance substrate between the above-mentioned the 1st and the 2nd path unit and above-mentioned surge chamber.
In system of the present invention, the surge chamber of downside and the heat processing unit of upside heat treatment portion are separated basically fully to seize path unit ground on both sides by the arms.Adopt this layout, can avoid substrate that surge chamber takes care of and be subjected to any influence, the particularly influence of heat processing unit high temperature from heat processing unit.In addition, when surge chamber was idle, transportation means need access in surge chamber, does not need certainly by its bypass, in the intensive layout scope of processing unit, just can efficiently finish the conveyance operation of substrate.
In a representative configuration of system of the present invention, when any one in control assembly is judged heat treated portion and the 2nd handling part can not be moved into substrate, will be stored in the surge chamber at the substrate that the 1st path unit receives by the handing-over arm mechanism.At this moment, by front should handling at the heat treatment portion that can not move into or the 2nd handling part or even the substrate all do not handled of a plurality of fronts operation leave in the surge chamber, the decline of technological process production line sluggishness and productivity ratio is stoped in Min..
The best form of arm connecting mechanism has, can be at the lifting transport mechanism of vertical direction lifting; With on this lifting transport mechanism, can be along the rotation transport mechanism of rotation around the vertical axis; With on this rotation transport mechanism, but support substrate limit, limit flexible carrying arm anchor clamps of fore-and-aft direction in horizontal plane.The arm connecting mechanism can be freely to the unit group access under the pair of right and left multi-level unit portion, can take out of substrate moving into for each unit group.
Be provided with multilayer laminated a plurality of surge chambers below the 1st and the 2nd path unit, each surge chamber can be deposited a substrate.At this moment, be preferably in the parts that are useful on the formation inert gas atmosphere in the surge chamber again.
The 1st handling part can have the part that forms the hauling operation line and in fact along continuous straight runs under the flat-hand position transport the conveyance passage of substrate and to above-mentioned conveyance passage on the substrate carried carry out the processing unit of predetermined processing.Like this, the helpfulness of surge chamber can be higher, but also undesirable interruption is handled in the translation that can avoid the 1st handling part.
For substrate being implemented to attach the heat treatment of handling at the 1st or the 2nd handling part, heat treatment portion can be arranged to a plurality of heat processing units of multilayer accumulation up and down.At this moment, heat processing unit can comprise that selection is more than 1 or 2 from the group of being made up of heater block, cooling-part, adhesive attachment means.
In addition, preferably set a plurality of Parts Controllers and the master controller of controlling many processing unit and arm connecting mechanism respectively, it is in parallel with Parts Controller respectively, does not collide mutually for making successive substrates and front substrate on the hauling operation line, controls above-mentioned a plurality of Parts Controller blanketly.Like this, master controller just can be grasped in system the current location of the whole substrates that change at any time, and according to the substrate current location of its grasp, can control each of above-mentioned a plurality of Parts Controllers in good time.
The drawing explanation
Fig. 1 is the general view of the lining treatment system of expression the invention process form.
Fig. 2 is the end view of expression the 1st heat treatment portion and substrate conveyance mechanism.
Fig. 3 is the end view of expression the 2nd heat treatment portion and substrate conveyance mechanism.
Fig. 4 is the end view of expression the 3rd heat treatment portion and substrate conveyance mechanism.
Fig. 5 is the calcspar of the control system of expression lining treatment system.
Fig. 6 is the flow chart of expression lining treatment system normal process order.
Embodiment
Summarized with regard to best form of implementation of the present invention below with reference to accompanying drawings.And illustrate in this form of implementation according to the coating video picture treatment system of a succession of photoetching process processing as the LCD substrate of processed substrate.
As shown in Figure 1, in dust free room, coating video picture treatment system 10 is set in abutting connection with exposure device 12 ground.Central part in coating video picture treatment system 10 is provided with the treatment region (P/S) 16 that extends along X-direction.One of treatment region (P/S) 16 distolaterally links to each other with case district 14, and another is distolateral to join with interface station (I/F) 18.
Case district (C/S) 14 is equipped with case luggage carrier 20 and auxiliary arm mechanism 22, and has the function of moving into mouth of taking out of that makes case C turnover coating video picture treatment system 10.On case luggage carrier 20,4 case C have been deposited side by side to array along Y-axis.Horizontal storage has polylith LCD substrate G in case C.
At treatment region (P/S) 16, by the order of handling process or operation, along vertically reciprocating type hauling operation line A, the B of (X axis) extension are equipped with each handling part to system.That is, from the hauling operation line A in the outlet of case district (C/S) 14 side direction interface stations (I/F) 18 sides, array disposes handling part the 24, the 1st heat treatment portion 26 that cleans, coating handling part the 28, the 2nd heat treatment portion 30 in order.
In addition, on the loop hauling operation line B of interface station (I/F) 18 side direction case districts 14 sides, array disposes the 2nd heat treatment portion 30, video picture handling part 32, decolouring handling part the 34, the 3rd heat treatment portion 36 in order.In this production line form, the 2nd heat treatment portion 30 is positioned at the least significant end of the hauling operation line A in outlet, is positioned at the front end of loop hauling operation line B simultaneously, crosses between two hauling operation line A, B.
Between two hauling operation line A, B, be provided with auxiliary conveyance space 38, with the shuttle 40 of a unit level mounting substrate G,, can move along hauling operation line direction (X axis) is two-way by there not being illustrated drive unit.
On the hauling operation line A of upstream portion, clean portion 24 comprises washing cleaning part (SCR) 42, is being provided with excimer UV irradiation part (e-uv) 41 with the place of washing case district (C/S) 10 adjacency in the cleaning part (SCR) 42.Cleaning part in washing cleaning part (SCR) 42 transmits by roller or belt, when LCD substrate G is transported to hauling operation line A direction with flat-hand position, also can wash and purge substrate G.
With the 1st heat treatment section portion of clean portion 24 downstream adjacency, along hauling operation line A, the position is provided with vertical arm connecting mechanism 46 therebetween, and both sides are multilayer laminated before and after it disposes a plurality of parts.
Specifically, as shown in Figure 2, in the multilevel-cell portion (TB) 44 of upstream side, use on the path unit (PASS) 50 heater block that multilayer laminated dewatered drying is used (DHP) 521,522 and adhesive attachment means (AD) 561 in the substrate handing-over.Herein, path unit (PASS) 50 is provided for receiving the space of the intact substrate G of clean from washing cleaning part (SCR) 42.
In addition, the multilevel-cell portion (TB) 48 in the downstream, substrate handing-over with path unit (PASS) 60 on, multilayer laminated have cooling-part (CL) 621,622 and an adhesive attachment means (AD) 562.Here, path unit (PASS) 60 is provided for passing on the space that should accept the substrate that the diaphragm coating handles to coating handling part 28 sides.
The horizontal carrying channel (not shown) of washing cleaning part (SCR) 42 is introduced in indoor at the path unit (PASS) 50 of upstream side.This horizontal carrying channel belongs to the part of hauling operation line.In addition, in order to lift the substrate on the carrying channel with flat-hand position, can also set liftable lifting arm (not shown).
Indoor at each heat processing unit (DHP) 521,522, (AD) 561,562, (CL) 621,622 is provided with the hot plate (not shown) of horizontal mounting and heated substrate G and for the Liftable type lifting arm (not shown) that carries out substrate G handing-over on this hot plate etc.Indoor at the path unit (PASS) 60 in downstream is provided with and can promptly constitutes for example a plurality of cramp bars of the substrate support portion that can take out of substrate (not shown) from the 28 side accesses of adjacent coating handling part.
In this form of implementation, in two multilevel-cell portions (TB) 44,48 in upstream side and downstream, be respectively equipped with one or number many surge chambers (BUF).That is, as shown in Figure 2, at multilayer laminated 3 surge chambers in the below of upstream side path unit (PASS) 50 (BUF) 671,672,673, simultaneously, at multilayer laminated 3 surge chambers in the below of downstream path unit (PASS) 60 (BUF) 674,675,676.At the indoor a plurality of cramp bars (not shown) that are provided with of surge chamber (BUF) 671-676, by arm exchange mechanism 46 handing-over substrate G.
The free time that does not belong to heat treatment portion unit, but, make substrate park (standby) for the substrate G that avoids on hauling operation line A, the B collides mutually temporarily, utilize these surge chambers (BUF) 671-676 as dodging the place.
As shown in Figure 2, handing-over arm mechanism 46 is equipped with: the lifting conveyance body 70 that moves of guiding rail 68 liftables of Yan Shening vertically; And on this lifting conveyance body 70, can be along the rotation conveyance body 72 of rotation of θ direction or rotation; And on this rotation conveyance body 72, support substrate G limit, limit, the limit can be at fore-and-aft direction advance and retreat or flexible carrying arm anchor clamps or title tweezers 74.The drive division 76 that is used for lifting driving lifting conveyance body 70 is set at the base end side of vertically-guided guide rail 68, be used to rotate the driver part 78 that drives rotation conveyance body 72 and be installed in lifting and transport body 70, the driver part 80 that drives carrying arm anchor clamps 74 advance and retreat that is used to advance and retreat is installed in rotation conveyance body 72.Each drive division 76,78,80 for example can be made of motor etc.
As shown in Figure 1, be located to coating handling part 28 adjacency the downstream of the 1st heat treatment portion 26.At coating handling part 28, along outlet hauling operation line A several rows of row diaphragm coating member (CT) 82, decompression drying unit parts (VD) 84 and edge demoulding parts (ER) 86.Though the diagram of omission, but in coating handling part 28, also be provided with inner carrying device (not shown), it can move into every piece of substrate G, take out of in these 3 parts (CT) 82, (VD) 84, (ER) 86 by process sequence, in each parts (CT) 82, (VD) 84, (ER) 86, be that unit deals with separately with a substrate.In addition, inner carrying device (not shown) also can carry out access at the path unit (PASS) 60 in the 1st heat treatment portion 26 downstreams.
As shown in Figure 3, the 2nd heat treatment portion 30 is actually same structure with above-mentioned the 1st heat treatment portion 26, is configured between outlet hauling operation line A and the loop hauling operation line B.That is, the 2nd heat treatment portion 30 is provided with a multilevel-cell portion (TB) 88 in outlet hauling operation line A side (least significant end), in loop hauling operation line B side (front end), is provided with another multilevel-cell portion (TB) 92.In the 2nd heat treatment portion 30, be provided with arm connecting mechanism 90 between upstream side multi-level unit portion (TB) 88 and the downstream multilevel-cell portion (TB) 92, upstream side multilevel-cell portion (TB) 88 is furnished with the 1st path unit 50.The 1st path unit 50 is from edge demoulding device 86 handing-over substrate G.
In the top of outlet side path unit (PASS) 50, stacked prebake is with 521,522 and cooling-parts of two heater blocks (DHP) (COL) 621.In addition, in the below of path unit (PASS) 50, be provided with three layers of surge chamber (BUF) 671,672,673.
In addition, in loop side multilevel-cell portion (TB) 92, be provided with path unit (PASS) 60 to video picture handling part 32 handing-over substrate G.523,524 and cooling-parts of two heater blocks (DHP) (COL) 622 that also stacked prebake is used in the top of this path unit (PASS) 60.Be provided with three layers of surge chamber (BUF) 674,675,676 equally in the below of path unit (PASS) 60.
On loop hauling operation line B, video picture handling part 32 includes under flat-hand position in the conveyance substrate G, and what carry out a series of video picture treatment process is so-called parallel-moving type video picture assembly (DEL) 94.In this video picture handling part 32, can the maximum 8 LCD substrate G that are of a size of 1000-1200mm of several rows of row.
Seize decolouring handling part 34 ground in the downstream of video picture handling part 32 on both sides by the arms and dispose the 3rd heat treatment portion 36.Decolouring handling part 34 sets the promising i ray UV irradiation part (I-UV) 96 that decolours and handle on processed of the substrate G that i ray (wavelength 365mm) is radiated at.
As shown in Figure 4, in fact the 3rd heat treatment portion 36 is same structure with above-mentioned the 2nd heat treatment portion 30, is provided between the i line UV irradiation part (i-UV) 96 and case district 20 of loop hauling operation line B.Promptly the 3rd heat treatment portion 36 is provided with a multilevel-cell portion (TB) 98 at upstream side, is provided with another multilevel-cell portion (TB) 102 in the downstream.In the 3rd heat treatment portion 36, between the multilevel-cell portion (TB) 102 in (TB) 98 of multilevel-cell portion of upstream side and downstream, be provided with arm connecting mechanism 100, the multilevel-cell portion (TB) 98 of upstream side is provided with the 1st path unit 50.The 1st path unit 50 is from i line UV irradiation part (i-UV) 96 handing-over substrate G.
In the top of the path unit (PASS) 50 of upstream side, 521,522 and cooling-parts of heater block (DHP) (COL) 621 of oven dry usefulness after stacked two.In addition, be provided with three layers of surge chamber (BUF) 671,672,673 in the below of path unit (PASS) 50.
In addition, in the multilevel-cell portion (TB) 102 of loop hauling operation line B side, be provided with substrate G is joined path unit (PASS) 60 to case district (C/S) 20.Also stacked 523,524 and cooling-parts of two heater blocks that are used to dry (DHP) (COL) 622 in the top of this path unit (PASS) 60.And also be provided with three layers of surge chamber (BUF) 674,675,676 in the below of path unit (PASS) 60.
In fact the 3rd heat treatment portion 36 is same structure with above-mentioned the 1st heat treatment portion 26 and the 2nd heat treatment portion 30, is provided with vertical arm connecting mechanism 100 and is provided with a pair of multilevel-cell portion (TB) 98,102 in its both sides, front and back along hauling operation line B.
Interface station (I/F) 18 and exposure device 12 between be provided with and be used to join the carrying device 104 of substrate G.Around carrying device 104, dispose buffered station (BUFS) 106, prolong cooling stations (EXT.COL) 108 and peripheral components 110.In buffered station (BUFS) 106, be provided with fixed baffle-box (not shown).Prolong cooling stations (EXT.COL) 108 and be the station that a handing-over substrate that has a refrigerating function is used, with treatment region (P/S) 16 handing-over substrates the time, use.Peripheral components 110 is preferably for example with the structure of captions video camera (TITLER) with external exposure device (EE) stacked on top of one another.Carrying device 104 is provided with an auxiliary arm mechanism 104a, carries out substrate G handing-over with exposure device 12 and each buffered station (BUFS) 106, (EXT.COL) 108, (TITLER/EE) (110).
As shown in Figure 5, master controller (M/C) 200 is in parallel with a plurality of Parts Controllers (B/C) 201-207, gives (B/C) 201-207 each transmission instruction, blanket control whole system.Each Parts Controller (B/C) 201-207 takes on intrasystem machinery and parts respectively, and the action of the machine and the parts of scope is taken in control respectively.
(B/C) 201-205 of the from the 1st to the 5th shares the control of treatment region (P/S) 24 each one.As, 1B/C201 is responsible for controlling excimer UV irradiation portion (e-UV) 41,26 multilevel-cell portions (TB) 44,48 of washing cleaning part the 42, the 1st heat treatment portion.2B/C202 is responsible for the control of coating member (CT) 82, decompression oven dry parts (VD) 84, edge demoulding parts (ER) 86.3B/C203 is responsible for the control of video picture parts (DEV) the 94, the 2nd heat treatment portion multi-level unit district 88,92 (TB).4B/C204 is responsible for the control of video picture parts (DEV) 94, i line UV irradiation part (i-UV) the 96, the 3rd heat treatment portion multi-level unit district 98,102 (TB).5B/C205 is responsible for the control of 1-the 3rd arm connecting mechanism 46,90,100 and shuttle 40.
The 6th B/C206 is responsible for the control of case district (C/S) 14 each one, for example takes on the control of auxiliary arm mechanism 22 and idle call FFU (not shown).
The 7th B/C207 is responsible for the control of interface station (I/F) 18 each one, for example is responsible for the control of auxiliary arm mechanism 104, buffered station 106, prolongation cooling stations (EXT.COL) 108, captions video camera (TITLER)/external exposure device (EE) 110.
Fig. 6 is for representing the lining treatment system flow chart of processing sequence just often.At first,, take out a substrate G the case C of auxiliary arm mechanism 22 appointment from case luggage carrier 20, and send into the excimer UV irradiation part (e-UV) 41 (operation 81) of the clean portion 24 of treatment region (P/S) 16 at case district (C/S) 14.
In excimer UV irradiation part (e-UV) 41,, substrate G is implemented dry method clean (operation S2) by ultraviolet irradiation.In cleaning, ultraviolet ray mainly removes the organic substance of substrate surface.Ultraviolet ray is transferred substrate G in the washing cleaning part (SCR) 42 of clean portion 24 by the auxiliary arm mechanism 22 of case district (C/S) 14 after cleaning and finishing.
In washing cleaning part (SCR) 42, as mentioned above, adopt roller conveyance or belt conveyance, with substrate G in flat-hand position lower edge hauling operation line A direction translation conveyance, by enforcement flushing of substrate G surface and stream are washed, remove the particular pollutant (operation S3) on the substrate surface.Again with substrate G translation conveyance, carry out rinsing simultaneously and handle after the cleaning, with air knife A etc. substrate G is dried at last.
In washing cleaning part (SCR) 42,, move into the path unit (PASS) 50 that is positioned at 26 upstream side multilevel-cell portions (TB) 44 of the 1st heat treatment portion through the substrate G after cleaning.Afterwards, substrate G is by the path 60 of downstream multilevel-cell portion (TB) 48, and conveyance is to roller roller or move among the surge chamber 671-676 that any one is indoor, up to being detained the standby of releasing time.After being detained the releasing time, from cushioning indoor taking-up, conveyance places on the roller roller in downstream to path unit (PASS) 60 arm connecting mechanism 46 with substrate G.
Adopt any bar circuit to transport for substrate G, judge by M/C200, the present position of the whole substrates that change at any time in the M/C200 grasp system, and according to the present position of grasp substrate control at any time B/C201-207 each.M/C200 at first asks for the prediction timing time according to the control cubicle record sheet, and then judges whether the successive substrates G on the hauling operation line A roller roller can bump with front substrate G.
When result of determination was YES (being), M/C200 gave B/C205 with signal, gave arm connecting mechanism 46 by B/C205 with signal again, by arm connecting mechanism 46 substrate G was moved into for example the 3rd surge chamber 673 (operation S4).
In addition, when result of determination was No (denying), M/C200 gave B/C205 with signal, and B/C205 gives arm connecting mechanism 46 with signal, and arm connecting mechanism 46 is moved into the 2nd path unit 60 (operation S5) with substrate G.When result of determination is NO (denying), crosses operation S4 by operation S3 and directly enter operation S5.
Below, the several software terms that just relate to the substrate processing program of this form of implementation define as following separately.
1) " cell board processing time (unit panel processing time) " is meant after a plate (substrate) enters certain parts and begins, to handling the time that finishes and come out from these parts.
2) " unit intermittent time (unit tact time) " is meant at the carrying arm clamp mechanism continuously under the state of each part conveyance plate (substrate), transports the unit from the lastblock plate, transports the time of same assembly of elements to next piece plate.Usually when the polylith plate enters single part, divided by " cell board processing time ", obtain " unit intermittent time " by the plate number of single treatment.
(3) " flow process intermittent time ", be meant certain piece plate in by the parts of specifying flow process to pass through, finish the processing of appointment after, the largest interval intermittent time that cooperates with substrate at the latest.
(4) so-called " control task in batches ", be one group of plate in finger device from one-pass all components, control ordinatedly with the intermittence that the processing time is the longest, substrate is sent to translation unit and diaphragm coating member.
Each processing time of processing unit, when the data board flow process, pass on by B/C, calculate operation and handle required total processing time and intermittence, accept to reply.
(5) so-called " plate record sheet " is meant that record is in the master database in the cell board processing time of the whole processing units in the lining treatment system.
M/C uses the plate inking chart, the prediction successive substrates can with the timing time of front substrate collision, and send command signal to the arm connecting mechanism by B/C.When the arm connecting mechanism is received command signal, before the prediction timing, substrate G is taken out from the hauling operation line with this period with matching.
In addition, the plate processing elapsed time automatically terminates when plate transports parts.After this, plate is handled the elapsed time and is pressed a second increase by the batch control task.In addition, M/C then according to the value of batch control task, judges the sluggishness at hauling operation line upper plate.
(6) so-called " plate flow table " is meant the master database that writes down operation processing time and intermittent time.When so-called here " operation processing time " fingerboard flow process was launched, M/C was to the B/C inquiry and the time in setup unit plate processing time.M/C asks for substrate bulk number residual in the processing unit according to the value in this operation processing time when moving under batch time conditions at intermittence.
(7) so-called " bulk management tables of data " is meant the record master database of batch intermittent time.Here so-called " intermittent time in batches ", be meant when first substrate taken out in case, be recorded in the maximum of the intermittent time in the substrate flow chart.
In the 1st heat treatment portion 26, substrate G is transmitted in each parts of heat treatment system by arm connecting mechanism 46 by designated program.For example, substrate G is first from the transfer of path unit (PASS) 50 in heater block (DHP) 521,522, and accepts processed (operation S5) herein.
Then, the place in cooling-part (COL) 621,622 shifts with substrate, is cooled to constant underlayer temperature (operation 56) herein.Then the place of substrate G in adhesive attachment means (AD) 561,562 shifted, accept hydrophobic treatment (operation S7) at this.After hydrophobic treatment was finished, the place of substrate G in cooling-part (COL) 621,622 was cooled to constant underlayer temperature (operation S8).At last, substrate G is admitted in the path unit (PASS) 60 that belongs to downstream multilevel-cell portion (TB) 48.
Like this, in the 1st heat treatment portion 26, substrate G can contact between upstream side multilevel-cell portion (TB) 44 and downstream layer multilevel-cell portion (TB) 48 arbitrarily by arm connecting mechanism 46.In addition, in the 2nd and the 3rd heat treatment portion 30,36, also can carry out same substrate conveyance operation.
In the 1st heat treatment portion 26, the substrate G after accept above-mentioned a succession of heat or heat system the processing, the diaphragm coating member 82 of path unit (PASS) the 60 coating handling part 28 that side is adjacent downstream in the downstream multilevel-cell portion (TB) 48 shifts.
Substrate G is in diaphragm coating member (CT) 82; adopt the spin coating process that protective agent is coated on substrate surface (processed face); in the adjacent drying under reduced pressure parts (VD) 84 in downstream, accept drying under reduced pressure then and handle, then in the side neighboring edge demoulding parts (ER) 86 in downstream, remove the unnecessary protective agent (operation S9) of substrate perimeter portion.
Accept the substrate G after the said protection film coating is handled, be handed off to the path unit (PASS) of the 30 upstream side multilevel-cell portions (TB) 88 of the 2nd heat treatment portion that belong to adjacent by drying under reduced pressure parts (VD).
In the 2nd heat treatment portion 30, substrate G is shifted in heat processing unit by arm connecting mechanism 90 by designated program.For example, substrate G transfers to a heater block (PREBAKE prebake) from this path unit (PASS) earlier, and accepts the low temperature drying (operation S10) after the diaphragm coating herein.
Substrate G is transplanted in the cooling-part (COL) again, is cooled to constant underlayer temperature (operation S11) at this.Substrate G is via the path unit (PASS) of downstream multilevel-cell portion (TB) 92 sides then, or directly is handed off to the prolongation cooling stations (EXTCOL) 108 of interface station (I/F) 18 sides.
At interface station (I/F) 18; substrate G moves into the limit portion exposure device (EE) of peripheral unit 110 by prolonging cooling stations (EXTCOL) 108, at this, when removing video picture attached to the diaphragm of substrate G limit portion; after exposure, send into adjacent exposure device 12 (operation S12).
In exposure device 12, make diaphragm on the substrate G by the specified circuit pattern exposure.In addition, substrate G after pattern exposure finishes, when turning back to interface station (I/F) 18 (operation S11), at first move into peripheral unit 110 captions video cameras (TITCRER), remember the information (operation S12) of the appointed part defined on the substrate at this by exposure device 12.Substrate G returns and prolongs cooling stations (EXTCOL) 108 then.The conveyance of substrate G and send to get with the substrate G of exposure device and finish in interface station (I/F) 18 by carrying device 104.
In the 2nd heat treatment portion 30 of treatment region (P/S) 16, arm connecting mechanism 90 is from prolonging the substrate G after cooling class (EXTCOL) 108 receives exposure, and by the path unit (PASS) in the multilevel-cell portion (TB) 92 of hauling operation line B side, handing-over is given video picture handling part 32 or is moved among the surge chamber 671-676 any one.
M/C200 obtains the prediction timing according to the substrate record sheet, judges whether the successive substrates G on the hauling operation line A roller roller can bump with the front substrate.When declaring the result for "Yes" (YES), M/C200 gives B/C205 with signal, and then, B/C205 sends signal to arm connecting mechanism 90, by arm connecting mechanism 90 substrate G is moved into to for example the 2nd surge chamber 672 interior (operation S14).
When result of determination was "No" (No), M/C200 gave B/C205 with signal, and then, B/C205 is transferred to arm connecting mechanism 90 with signal, by arm connecting mechanism 90 substrate G was moved into to the 2nd path unit 60.When result of determination is "No" (No), will cross operation S14, directly enter operation S15 by operation S13.
At video picture handling part 32, will move into video picture processing unit (DEU) 94 from the substrate G that the path unit (PASS) in the multilevel-cell portion (TB) 92 receives.In video picture processing unit (DEU) 94, substrate G by the downstream of conveyance to hauling operation line B, and in the conveyance process, carries out video picture rinsing, dry a succession of video picture treatment process (operation S15) with translation mode.
Substrate G after 32 video pictures of video picture handling part are handled moves into the decolouring handling part 34 adjacent to the downstream, adopts the irradiation of i line to accept decolouring at this and handles (operation S16).Substrate G after decolouring is handled joins to the path unit (PASS) in the 36 upstream side multilevel-cell portions (TB) 98 of the 3rd heat treatment portion.
In the upstream side multilevel-cell portion (TB) 98 of the 3rd heat treatment portion 36, substrate G shifts to a heater block (POBAKE should be PROBAKE, and the translator annotates) from this path unit (PASS) earlier, at this, accepts the back oven dry and handles (operation S17).
M/C200 obtains the prediction timing according to the substrate record sheet, judges whether the successive substrates G on the hauling operation line B roller roller can bump with the front substrate.When declaring the result for "Yes" (YES), M/C200 gives B/C205 with signal, and then, B/C205 is transferred to arm connecting mechanism 100 with signal, by arm connecting mechanism 100 substrate G is moved into for example the 5th surge chamber 675 interior (operation S18).
When result of determination was "No" (No), M/C200 gave B/C205 with signal, and then, B/C205 is transferred to arm connecting mechanism 100 with signal, by arm connecting mechanism 100 substrate G was moved in the 2nd path unit 60.When result of determination is "No" (No), will cross operation S18, directly enter operation S19 by operation S17.
Then, the path cooling-part (PASS, COL) of substrate-transfer to the downstream multilevel-cell portion (TB) 102 is cooled to constant underlayer temperature (operation S19) at this.In the 3rd heat treatment portion 36, the conveyance of substrate G is undertaken by arm connecting mechanism 100.
In case district (C/S) 14 sides, auxiliary arm mechanism 22 finishes receiving that the substrate G of whole operations is handled in the coating video picture and with the substrate G that receives pack into (operation S1) any one case C from the path cooling-part (PASS.COL) of the 3rd heat treatment portion 36.
As described above, in coating video picture treatment system, each one (particularly each parts in the treatment system) is only limited to normal operation, give the substrate G of interface station (I/F) 18 sides from case district (C/S) 14, along hauling operation line A, B, when in system, transferring in each one or pass on, accept desired every processing (operation S2-S19) successively, and turn back to case district (C/S) 14 within a certain period of time.
But, no matter in system any one, particularly in handling part, break down or during other problems, then substrate G can not be transmitted or move into the handling part that has broken down from the upstream side of technological process., to the substrate G on the hauling operation line, can continue to finish all follow-up processing operations in the downstream.
For this reason, in system any one, technological process stops or when sluggish, in this form of implementation take place than fault the place also the surge chamber (BUF) that is equipped with of upstream side can be used for temporarily depositing of substrate G or keeping.
For example, be example with break down in the handling part 28 this coating handling part 28 of can not again substrate being packed into of coating.At this moment, surge chamber (BUF) 671-676 that is equipped with in the 1st heat treatment portion 26 can be used for the indwelling of substrate G.
That is, when coating is broken down in the handling part 28, will stop substrate G from case district (C/S) 14 to clean portion 24, particularly newly moving into to washing cleaning part (SCR) 42.At this moment,, in level carrying line sending,, carry out a series of conveyances at regular intervals, and carry out parallel-moving type substrate G clean,, will make substrate G become the cleaning defective products if the translation conveyance stops with several piece 5 substrate G for example at washing cleaning part (SCR) 42.
In this form of implementation, for above-mentioned cleaning defective products not occurring, finish the clean of the substrate G in the translation conveyance at washing cleaning part (SCR) 42.Therefore, the 1st heat treatment portion 26, can from washing cleaning part (SCR) 42 with the same each substrate G that is circulated to after cleaning is moved in timing just often.
In the 1st heat treatment section 26, each substrate G is stored in any one surge chamber of surge chamber (BUF) 671-676 to accept after heat treatment with identical usually program as much as possible again.
More particularly, move into each substrate G of the path unit (PASS) 50 of upstream side from washing cleaning part (SCR) 42, after heater block (DHP) 521 or 522 is accepted processed (operation S5), be cooled to constant underlayer temperature (operation S6) by cooling-part (COL) 621 or 622, accept hydrophobic treatment (operation S7) in adhesive attachment means (AD) 561 or 562 then.So far the flow process of all heat treatment step S6 → S7 → S8 is identical with normal flow.
Yet, after the substrate G hydrophobic treatment, generally, to accept the heat-transmission of underlayer temperature constant temperature at cooling-part (COL) 621 or 622 and handle (operation S8), answer fed downstream side path unit (PASS) 60 then, but under special emergency, the conveying of desirable disorientation cooling-part (COL) 621,622 and path unit (PASS) 60, and be transported in any one surge chamber of surge chamber (BUF) 671-676.
At this, the reason that (operation S8) handled in the heat-transmission of omission underlayer temperature constant temperature is that this heat treatment is to be treated to the pre-treatment of prerequisite and the efficiency of loading and unloading of adjustment arm connecting mechanism 46 to implement the diaphragms coating at coating handling part 28 thereafter, and intermittence between each one.
In this coating video picture treatment system, generally speaking, the heat processing unit that a plurality of (N platforms) have same function is set, in N heat processing unit, carry out the heat treatment of same cycle time by the certain hour that staggers is parallel, can be compressed into 1/N whole intermittences of bulk heat treatmet portion, and intermittently consistent with the processing of anterior operation and back operation.For example, under this form of implementation, the clean of washing cleaning part 42 only is 60 seconds intermittently, the cycle time of each heat processing unit (AD) of the 1st heat treatment portion 26, (DHP), (COL) is when 100 seconds front and back, then as shown in Figure 2, by two each heat processing units (AD) separately, (DHP), (COL) being set and, intermittently can being coordinated with clean the intermittence of whole heat treatment and each one with about 50 seconds time difference paired running.
In the heat treatment section 26 of this a plurality of parts modes, arm connecting mechanism 46 is remembered in action by numerous and diverse program, almost is to go the rounds between each heat processing unit with some cycles incessantly.Take place if run into emergency, in common touring operation, it is common not making substrate G be sent to the slack time that the action in the surge chamber (BUF) clamp-ons.In this form of implementation, as previously mentioned, cancel the constant heat-transmission of the underlayer temperature that belongs to the terminal stage heat treatment step and handle (operation S8) like that by above-mentioned, can not give conveyance efficient and intermittently on bring influence, but also can realize the action of in surge chamber (BUF), depositing substrate.
As mentioned above, when fault takes place, all substrate G (supposing 5) that accepting clean do not have any delay in the washing cleaning part (SCR) 42, can normally carry out the translation clean, and in the 1st heat treatment portion 26 of next stage, in fact the same with normal condition, after accepting a series of heat treatments, be that unit can deposit surge chamber (BUF) 671-676 in one.
In this form of implementation, surge chamber (BUF) 671-676 multilayer is arranged on below the path unit (PASS) 50,60, and the heat processing unit (AD) 561,562, (DHP) 521,522, (COL) 621,622 that are arranged on the path unit (PASS) 50,60 with multilayer isolate basically fully.Therefore, even in the surge chamber that does not possess temp regulating function (BUF) 671-676, deposited substrate G, do not worry that these substrates G is subjected to the temperatures involved from each parts of heat treatment system yet.
In addition, in this form of implementation, in the time of very, particularly as this example, stopping when substrate is transmitted in the technological process downstream, as mentioned above, handle (operation S8) and to the transmission of path unit (PASS) 60 owing to cancelled to the constant heat-transmission of the substrate of terminal stage heat treatment step, so even increase substrate G is stored in conveyance operation in surge chamber (BUF) 671-676, the also burden of weighting arm connecting mechanism 46 not.As mentioned above, arm connecting mechanism 46 would rather be just often according to numerous and diverse program, and normal busy touring operation is between each heat processing unit.
In this form of implementation, all surge chambers (BUF) 671-676 all multilayer laminated 4 is arranged on the below of path unit (PASS) 50,60, all heat treatment system parts (AD) 561,562, (DHP) 521,522, (COL) 621,622 all multilayer laminated tops that are arranged on path unit (PASS) 50,60.For this reason, when the normal operation that does not need in surge chamber (BUF) 671-676 access, arm connecting mechanism 46 can be in minimum moving range, go the rounds to be configured between heat treatment system parts (AD) 561,562 on the path unit (PASS) 50,60, (DHP) 521,522, (COL) 621,622, and efficiently finish every conveyance operation procedure in intensive.
In addition, in this form of implementation, path unit that links to each other with upstream side (PASS) 50 and the path unit that links to each other with the downstream (PASS) 60, it is separate to seize arm connecting mechanism 46 ground on both sides by the arms, upstream side path unit (PASS) 50 and conveyance path and downstream path unit (PASS) 60 and conveyance path can be arranged on the sustained height face, also can very big flexibility be arranged in the design by the differing heights setting.
Yet in the 1st heat treatment portion 26, also can break down or other problem sometimes in some position.For example, be example on adhesive attachment means (AD) 561,562, the hot plate fault to occur and to cause out of use occasion.
At this moment, by switching to the independent of other adhesive attachment means (AD) 562 or a parts operation, though can prolong (delay) intermittent time like this, system's continuously-running., after the 1st heat treatment section 26 is switched intermittently, when breaking down, to move into the substrate G after cleaning from the washing cleaning part (SCR) 42 of upstream side, the substrate G in whole translation conveyances common intermittence.Even in this case, in the 1st heat treatment portion 26, before heat treatment or at interval, storE in surge chamber (BUF) 671-676 by receiving the substrate G that comes from washing cleaning part (SCR) 42 temporarily, carry out compensation or adjustment intermittently.
Also have and the 1st heat treatment portion 26 identical functions and effect in the 2nd and the 3rd heat treatment portion 30,36.Between these heat treatment portions 26,30,36, can unite and can independently deposit above-mentioned substrate.When the said system that is not limited to surge chamber (BUF) breaks down, as required, can apply flexibly in all cases.
In this form of implementation, the front of surge chamber (BUF) can adopt open framework to constitute.Can also adorn switch door or baffle plate.In addition, can be at indoor formation inert gas, as the atmosphere of nitrogen.At that time, for example the back part from the surge chamber framework charges into nitrogen, also can pass through porous plate, and nitrogen is evenly flowed and formation atmosphere indoor.In addition, in above-mentioned form of implementation, a surge chamber (BUF) can only be deposited a substrate G, but also can form the surge chamber structure that can deposit the several piece substrate.
Treatment system of the present invention is highly suitable for above-mentioned coating video picture treatment system.But in system configuration and factor of system, can carry out all distortion, for example, also applicable to comprising film forming apparatus and Etaching device tandem type system.Processed substrate among the present invention is not limited to the LCD substrate, comprises various processed substrates such as colour filter and semiconductor wafer in addition.
As mentioned above, adopt treatment system of the present invention, though in system a technological process sluggishness, also the handling part or the suffered influence of processed substrate of upstream side can be suppressed in the minimum zone, and improve treatment effeciency and product quality.
Claims (11)
1 one kinds of lining treatment systems, along from the case district to hauling operation line reciprocal the outside exposure device, multiple substrates is handled in conveyance successively, it is characterized in that this system comprises:
Have along above-mentioned hauling operation line and be arranged on the 1st handling part of upstream side and be arranged on many processing components groups of the 2nd handling part in downstream; And
Receive along the 1st path unit of the substrate of aforementioned hauling operation line conveyance by above-mentioned the 1st handling part; And
Be arranged on than above-mentioned the 1st path unit downstream also, will send the 2nd path unit of above-mentioned the 2nd handling part to through the substrate of above-mentioned the 1st path unit; And
Be located at the heat treatment portion of at least one path unit top in the above-mentioned the 1st or the 2nd path unit; And
Be located at the above-mentioned the 1st or the below of the 2nd at least one path unit of path unit, between the substrate on the above-mentioned hauling operation line, collide, can stay at least one surge chamber of substrate temporarily for avoiding; And
The arm connecting mechanism of conveyance substrate between the above-mentioned the 1st and the 2nd path unit and above-mentioned surge chamber.
2 lining treatment systems as claimed in claim 1, it is characterized in that having control assembly, when substrate can not be moved into above-mentioned heat treatment portion or substrate can not move into above-mentioned the 2nd handling part the time, control above-mentioned arm exchange mechanism, substrate is taken out of from above-mentioned the 1st path, and substrate is moved into above-mentioned surge chamber.
3 lining treatment systems as claimed in claim 2, it is characterized in that, above-mentioned control assembly after the processing of the preposition operation more than or two that pre-FEFO should be handled, is sent substrate into above-mentioned surge chamber in above-mentioned heat treatment portion that can not move into or above-mentioned the 2nd handling part.
4 lining treatment systems as claimed in claim 1 is characterized in that, above-mentioned arm exchange mechanism is provided with: the lifting conveyance body of lifting vertically; On above-mentioned lifting conveyance body, revolvable rotation conveyance body around vertical axis; On above-mentioned rotation conveyance body, in the time of the above-mentioned substrate of conveyance, can be along the flexible carrying arm of fore-and-aft direction in horizontal plane.
5 lining treatment systems as claimed in claim 1 is characterized in that, respectively below the above-mentioned the 1st and the 2nd path unit, and multilayer laminated up and down a plurality of above-mentioned surge chambers, each deposits a substrate described each chamber.
6 lining treatment systems as claimed in claim 1 is characterized in that, have the parts that form inert gas atmosphere in above-mentioned surge chamber.
7 lining treatment systems as claimed in claim 1, it is characterized in that, above-mentioned the 1st handling part have become an above-mentioned hauling operation line part and with substrate in fact at the carrying channel of flat-hand position lower edge parallel direction conveyance and the substrate of conveyance on to above-mentioned conveyance path implement the processing unit of predetermined processing.
8 lining treatment systems as claimed in claim 1 is characterized in that, above-mentioned heat treatment portion for substrate being implemented the above-mentioned the 1st or the incidental heat treatment of processing of the 2nd handling part, has many multilayer laminated heat processing units up and down.
9 lining treatment systems as claimed in claim 8 is characterized in that above-mentioned heat processing unit comprises the parts of selecting more than 1 or 2 from heater block, cooling-part and adhesive attachment means.
10 lining treatment systems as claimed in claim 1 is characterized in that, this system comprises: many Parts Controllers being responsible for above-mentioned a plurality of processing unit of control and described arm connecting mechanism; And
In parallel with each of above-mentioned Parts Controller, do not collide the master controller of above-mentioned many Parts Controllers of centralized control on described hauling operation line, making successive substrates and front substrate.
11 lining treatment systems as claimed in claim 10 is characterized in that, above-mentioned master controller is grasped all the substrate present positions in changing constantly in the system, and according to the substrate present position of being grasped, controls above-mentioned many Parts Controllers respectively at any time.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP367010/01 | 2001-11-30 | ||
| JP367010/2001 | 2001-11-30 | ||
| JP2001367010A JP3911624B2 (en) | 2001-11-30 | 2001-11-30 | Processing system |
Publications (2)
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| CN1426087A CN1426087A (en) | 2003-06-25 |
| CN1249776C true CN1249776C (en) | 2006-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021518696A Expired - Fee Related CN1249776C (en) | 2001-11-30 | 2002-11-29 | Lining treatment system |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3911624B2 (en) |
| KR (1) | KR100912280B1 (en) |
| CN (1) | CN1249776C (en) |
| TW (1) | TWI248657B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101136349B (en) * | 2006-08-30 | 2010-12-08 | Asm日本子公司 | Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus |
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| KR101074388B1 (en) | 2004-12-22 | 2011-10-17 | 엘지디스플레이 주식회사 | manufacturing device for manufacturing of liquid crystal display device |
| WO2006081519A2 (en) * | 2005-01-28 | 2006-08-03 | Applied Materials, Inc. | Methods and apparatus for operation of substrate carrier handlers |
| JP4745040B2 (en) * | 2005-12-05 | 2011-08-10 | 東京エレクトロン株式会社 | Substrate transport apparatus and substrate processing apparatus |
| JP4560022B2 (en) | 2006-09-12 | 2010-10-13 | 東京エレクトロン株式会社 | Coating, developing device, coating and developing device control method, and storage medium |
| JP6339057B2 (en) * | 2015-09-29 | 2018-06-06 | 株式会社日立国際電気 | Substrate processing apparatus, semiconductor device manufacturing method, and program |
| CN106044229A (en) * | 2016-07-22 | 2016-10-26 | 京东方科技集团股份有限公司 | Mask plate haulage equipment and exposure unit system |
| JP6601360B2 (en) * | 2016-09-30 | 2019-11-06 | 株式会社ダイフク | Goods transport equipment |
| CN110140092B (en) * | 2017-01-13 | 2022-05-13 | 株式会社富士 | Production management device |
| JP6655689B1 (en) * | 2018-09-21 | 2020-02-26 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus and substrate processing method |
| JP7142566B2 (en) * | 2018-12-27 | 2022-09-27 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
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| JPH07297258A (en) * | 1994-04-26 | 1995-11-10 | Tokyo Electron Ltd | Carrying equipment of plate body |
| JP4045008B2 (en) * | 1998-03-26 | 2008-02-13 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JPH11260883A (en) * | 1998-03-09 | 1999-09-24 | Dainippon Screen Mfg Co Ltd | Substrate treating apparatus |
| JP2001117064A (en) * | 1999-10-19 | 2001-04-27 | Tokyo Electron Ltd | Alignment mechanism and alignment method for transporting device as well as substrate treating device |
| JP3645492B2 (en) * | 2000-02-01 | 2005-05-11 | 東京エレクトロン株式会社 | Substrate processing equipment |
| KR100701893B1 (en) * | 2000-02-24 | 2007-03-30 | 엘지.필립스 엘시디 주식회사 | Apparatus of Inspecting Liquid Crystal Display Device in In-line |
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- 2001-11-30 JP JP2001367010A patent/JP3911624B2/en not_active Expired - Fee Related
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2002
- 2002-11-22 TW TW091134095A patent/TWI248657B/en not_active IP Right Cessation
- 2002-11-29 CN CNB021518696A patent/CN1249776C/en not_active Expired - Fee Related
- 2002-11-29 KR KR1020020075426A patent/KR100912280B1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101136349B (en) * | 2006-08-30 | 2010-12-08 | Asm日本子公司 | Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus |
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| KR100912280B1 (en) | 2009-08-17 |
| JP2003168713A (en) | 2003-06-13 |
| KR20030044881A (en) | 2003-06-09 |
| TW200302540A (en) | 2003-08-01 |
| CN1426087A (en) | 2003-06-25 |
| TWI248657B (en) | 2006-02-01 |
| JP3911624B2 (en) | 2007-05-09 |
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