CN1235285C - 用于电子装置的水冷装置 - Google Patents
用于电子装置的水冷装置 Download PDFInfo
- Publication number
- CN1235285C CN1235285C CN02800144.3A CN02800144A CN1235285C CN 1235285 C CN1235285 C CN 1235285C CN 02800144 A CN02800144 A CN 02800144A CN 1235285 C CN1235285 C CN 1235285C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- case
- tank
- water
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims abstract description 52
- 239000007788 liquid Substances 0.000 claims description 58
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 56
- 239000012530 fluid Substances 0.000 claims description 44
- 238000009434 installation Methods 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000000498 cooling water Substances 0.000 abstract description 75
- 238000002347 injection Methods 0.000 abstract description 21
- 239000007924 injection Substances 0.000 abstract description 21
- 239000000110 cooling liquid Substances 0.000 abstract 1
- 230000020169 heat generation Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000004087 circulation Effects 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 239000012809 cooling fluid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000002828 fuel tank Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (2)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP266654/2001 | 2001-09-04 | ||
JP266654/01 | 2001-09-04 | ||
JP2001266654A JP3636118B2 (ja) | 2001-09-04 | 2001-09-04 | 電子装置用の水冷装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200410035360.1A Division CN1545002B (zh) | 2001-09-04 | 2002-07-10 | 电子机器用冷却系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1455952A CN1455952A (zh) | 2003-11-12 |
CN1235285C true CN1235285C (zh) | 2006-01-04 |
Family
ID=19092909
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200410035360.1A Expired - Fee Related CN1545002B (zh) | 2001-09-04 | 2002-07-10 | 电子机器用冷却系统 |
CN02800144.3A Expired - Fee Related CN1235285C (zh) | 2001-09-04 | 2002-07-10 | 用于电子装置的水冷装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200410035360.1A Expired - Fee Related CN1545002B (zh) | 2001-09-04 | 2002-07-10 | 电子机器用冷却系统 |
Country Status (5)
Country | Link |
---|---|
US (3) | US6757169B2 (zh) |
JP (1) | JP3636118B2 (zh) |
CN (2) | CN1545002B (zh) |
TW (2) | TWI310297B (zh) |
WO (1) | WO2003028422A1 (zh) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3636118B2 (ja) * | 2001-09-04 | 2005-04-06 | 株式会社日立製作所 | 電子装置用の水冷装置 |
JP3961844B2 (ja) * | 2002-02-08 | 2007-08-22 | 株式会社日立製作所 | 冷却液タンク |
JP2003324174A (ja) * | 2002-04-30 | 2003-11-14 | Toshiba Corp | 電子機器 |
JP3885679B2 (ja) * | 2002-06-28 | 2007-02-21 | 株式会社日立製作所 | 電子機器 |
JP2004139186A (ja) * | 2002-10-15 | 2004-05-13 | Toshiba Corp | 電子機器 |
US7836597B2 (en) * | 2002-11-01 | 2010-11-23 | Cooligy Inc. | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
DE10393588T5 (de) | 2002-11-01 | 2006-02-23 | Cooligy, Inc., Mountain View | Optimales Ausbreitungssystem, Vorrichtung und Verfahren für flüssigkeitsgekühlten, mikroskalierten Wärmetausch |
US20040182551A1 (en) * | 2003-03-17 | 2004-09-23 | Cooligy, Inc. | Boiling temperature design in pumped microchannel cooling loops |
JP2004348649A (ja) * | 2003-05-26 | 2004-12-09 | Toshiba Corp | 電子機器 |
US7483261B2 (en) | 2003-06-27 | 2009-01-27 | Nec Corporation | Cooling device for an electronic equipment |
US7591302B1 (en) * | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
JP4157451B2 (ja) * | 2003-09-30 | 2008-10-01 | 株式会社東芝 | 気液分離機構、リザーブタンク、及び電子機器 |
JP4533725B2 (ja) * | 2003-11-11 | 2010-09-01 | 昭和電工株式会社 | 膨張タンク装置、膨張タンク装置の製造方法および液冷式放熱装置 |
CN100432589C (zh) * | 2003-11-11 | 2008-11-12 | 昭和电工株式会社 | 膨胀箱装置,制造膨胀箱装置的方法以及液冷式散热器 |
WO2005045333A1 (en) * | 2003-11-11 | 2005-05-19 | Showa Denko K.K. | Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator |
JP4234621B2 (ja) * | 2004-02-16 | 2009-03-04 | 株式会社日立製作所 | 液冷システムおよび電子装置 |
JP2005228237A (ja) * | 2004-02-16 | 2005-08-25 | Hitachi Ltd | 液冷システム及びそれを備えた電子機器 |
US20050241803A1 (en) * | 2004-04-29 | 2005-11-03 | Hewlett-Packard Development Company, L.P. | Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation |
US7616444B2 (en) * | 2004-06-04 | 2009-11-10 | Cooligy Inc. | Gimballed attachment for multiple heat exchangers |
US20050269691A1 (en) * | 2004-06-04 | 2005-12-08 | Cooligy, Inc. | Counter flow micro heat exchanger for optimal performance |
US20050284604A1 (en) * | 2004-06-29 | 2005-12-29 | Mongia Rajiv K | Reducing cooling tube bursts in electronic devices |
JP4056504B2 (ja) | 2004-08-18 | 2008-03-05 | Necディスプレイソリューションズ株式会社 | 冷却装置及びこれを備えた電子機器 |
US7871319B2 (en) * | 2004-11-03 | 2011-01-18 | Hewlett-Packard Development Company, L.P. | Computer thermal dissipation system and method |
US7870751B2 (en) * | 2005-03-11 | 2011-01-18 | Tokyo Electron Limited | Temperature control system and substrate processing apparatus |
DE102005016115B4 (de) * | 2005-04-08 | 2007-12-20 | Rittal Gmbh & Co. Kg | Anordnung zum Kühlen eines elektronischen Gerätes |
JP4725270B2 (ja) * | 2005-09-27 | 2011-07-13 | トヨタ自動車株式会社 | 電力制御ユニットの冷却装置の構造 |
JP2007103633A (ja) * | 2005-10-04 | 2007-04-19 | Matsushita Electric Ind Co Ltd | 冷却装置及びそれを備えた電子機器 |
US7228888B2 (en) * | 2005-10-13 | 2007-06-12 | International Business Machines Corporation | Rotatable liquid reservoir for computer cooling |
US20070114010A1 (en) * | 2005-11-09 | 2007-05-24 | Girish Upadhya | Liquid cooling for backlit displays |
CN101375651B (zh) * | 2006-01-30 | 2011-05-25 | 日本电气株式会社 | 电子设备的冷却装置 |
JP5208769B2 (ja) * | 2006-02-16 | 2013-06-12 | クーリギー インコーポレイテッド | 取付装置 |
US20070227709A1 (en) * | 2006-03-30 | 2007-10-04 | Girish Upadhya | Multi device cooling |
US20070227698A1 (en) * | 2006-03-30 | 2007-10-04 | Conway Bruce R | Integrated fluid pump and radiator reservoir |
WO2007120530A2 (en) | 2006-03-30 | 2007-10-25 | Cooligy, Inc. | Integrated liquid to air conduction module |
US20070256815A1 (en) * | 2006-05-04 | 2007-11-08 | Cooligy, Inc. | Scalable liquid cooling system with modular radiators |
US20080013278A1 (en) * | 2006-06-30 | 2008-01-17 | Fredric Landry | Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles |
JP2008027374A (ja) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
JP4781929B2 (ja) * | 2006-07-25 | 2011-09-28 | 富士通株式会社 | 電子機器 |
JP2008027370A (ja) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 電子機器 |
JP5148079B2 (ja) * | 2006-07-25 | 2013-02-20 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
JP4842040B2 (ja) | 2006-07-25 | 2011-12-21 | 富士通株式会社 | 電子機器 |
JP5283836B2 (ja) | 2006-07-25 | 2013-09-04 | 富士通株式会社 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
JP5133531B2 (ja) * | 2006-07-25 | 2013-01-30 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
CN101715536A (zh) * | 2007-05-02 | 2010-05-26 | 固利吉股份有限公司 | 用于电子冷却应用的微管/多端口逆流散热器设计 |
JP4664943B2 (ja) * | 2007-06-13 | 2011-04-06 | 株式会社日立製作所 | 電子機器 |
WO2009017078A1 (ja) | 2007-07-30 | 2009-02-05 | Nec Corporation | 電子機器の冷却装置 |
TW200924625A (en) | 2007-08-07 | 2009-06-01 | Cooligy Inc | Deformable duct guides that accommodate electronic connection lines |
JP2009088051A (ja) * | 2007-09-28 | 2009-04-23 | Hitachi Ltd | 電子機器用の冷却装置 |
US20090225514A1 (en) * | 2008-03-10 | 2009-09-10 | Adrian Correa | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US9297571B1 (en) * | 2008-03-10 | 2016-03-29 | Liebert Corporation | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
WO2010017327A1 (en) | 2008-08-05 | 2010-02-11 | Cooligy Inc. | A microheat exchanger for laser diode cooling |
CN102033589B (zh) * | 2009-09-29 | 2014-01-22 | 鸿富锦精密工业(深圳)有限公司 | 水冷式散热系统及其储水器 |
US20120298339A1 (en) * | 2010-02-10 | 2012-11-29 | Naoki Masuda | Liquid cooling system and electronic device including the same |
CN105923612A (zh) * | 2016-04-20 | 2016-09-07 | 南方科技大学 | 一种金属-硫属半导体材料、其制备方法和用途 |
CN209460567U (zh) * | 2016-08-25 | 2019-10-01 | Nec显示器解决方案株式会社 | 投影型显示装置 |
CN109426049B (zh) * | 2017-08-21 | 2021-03-05 | 深圳光峰科技股份有限公司 | 液冷循环散热装置、液冷循环散热系统及光学投影系统 |
CN111277045A (zh) * | 2018-12-05 | 2020-06-12 | 中国舰船研究设计中心 | 一种具备瞬态监测能力的水冷型电力监控装置 |
CN114040651B (zh) * | 2021-11-15 | 2023-05-16 | 中国电子科技集团公司第二十九研究所 | 一种可调节冷却区域的主动风冷装置 |
TWI820910B (zh) * | 2022-09-14 | 2023-11-01 | 英業達股份有限公司 | 液冷模組 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3989102A (en) * | 1974-10-18 | 1976-11-02 | General Electric Company | Cooling liquid de-gassing system |
JPH02209685A (ja) | 1989-02-02 | 1990-08-21 | Fujitsu Ltd | 冷却水供給部の構造 |
JPH03208365A (ja) | 1990-01-10 | 1991-09-11 | Hitachi Ltd | 電子装置の冷却機構及びその使用方法 |
JPH05264139A (ja) | 1992-03-18 | 1993-10-12 | Fujitsu Ltd | 冷媒供給システム |
JPH05312143A (ja) | 1992-05-11 | 1993-11-22 | Ebara Corp | 固形物混入水を揚水する高圧水ポンプのブースタポンプ装置 |
JP2801998B2 (ja) | 1992-10-12 | 1998-09-21 | 富士通株式会社 | 電子機器の冷却装置 |
US5394936A (en) * | 1993-03-12 | 1995-03-07 | Intel Corporation | High efficiency heat removal system for electric devices and the like |
JPH06266474A (ja) | 1993-03-17 | 1994-09-22 | Hitachi Ltd | 電子機器装置及びラップトップ型電子機器装置 |
JP3385482B2 (ja) * | 1993-11-15 | 2003-03-10 | 株式会社日立製作所 | 電子機器 |
JPH09268386A (ja) | 1996-04-02 | 1997-10-14 | Hitachi Ltd | 電子計算機の防食方法及びその運転方法 |
US6097597A (en) * | 1998-06-30 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus |
US5999404A (en) * | 1998-10-14 | 1999-12-07 | Sun Microsystems, Inc. | Spray cooled module with removable spray cooled sub-module |
US6234240B1 (en) * | 1999-07-01 | 2001-05-22 | Kioan Cheon | Fanless cooling system for computer |
JP2001024372A (ja) | 1999-07-12 | 2001-01-26 | Matsushita Electric Ind Co Ltd | 冷却装置とこれを用いた電子機器 |
JP2001142573A (ja) | 1999-11-11 | 2001-05-25 | Hitachi Ltd | 電子装置 |
JP3556578B2 (ja) | 2000-06-29 | 2004-08-18 | 株式会社東芝 | 携帯形電子機器およびこの電子機器に用いる冷却装置 |
JP3636118B2 (ja) * | 2001-09-04 | 2005-04-06 | 株式会社日立製作所 | 電子装置用の水冷装置 |
JP3979143B2 (ja) * | 2002-03-27 | 2007-09-19 | 株式会社日立製作所 | 情報処理装置の冷却装置 |
US6953227B2 (en) * | 2002-12-05 | 2005-10-11 | Sun Microsystems, Inc. | High-power multi-device liquid cooling |
-
2001
- 2001-09-04 JP JP2001266654A patent/JP3636118B2/ja not_active Expired - Lifetime
-
2002
- 2002-07-10 US US10/239,155 patent/US6757169B2/en not_active Expired - Lifetime
- 2002-07-10 CN CN200410035360.1A patent/CN1545002B/zh not_active Expired - Fee Related
- 2002-07-10 WO PCT/JP2002/007008 patent/WO2003028422A1/ja active Application Filing
- 2002-07-10 CN CN02800144.3A patent/CN1235285C/zh not_active Expired - Fee Related
- 2002-07-19 TW TW091116174A patent/TWI310297B/zh not_active IP Right Cessation
- 2002-07-19 TW TW094116558A patent/TWI254608B/zh not_active IP Right Cessation
-
2004
- 2004-06-24 US US10/874,232 patent/US6885556B2/en not_active Expired - Lifetime
-
2005
- 2005-04-19 US US11/108,707 patent/US20050180108A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN1455952A (zh) | 2003-11-12 |
JP2003078271A (ja) | 2003-03-14 |
TW200534777A (en) | 2005-10-16 |
TWI310297B (zh) | 2009-05-21 |
JP3636118B2 (ja) | 2005-04-06 |
US6885556B2 (en) | 2005-04-26 |
US20050180108A1 (en) | 2005-08-18 |
WO2003028422A1 (en) | 2003-04-03 |
CN1545002A (zh) | 2004-11-10 |
TWI254608B (en) | 2006-05-01 |
US20040228092A1 (en) | 2004-11-18 |
CN1545002B (zh) | 2010-05-05 |
US20030161100A1 (en) | 2003-08-28 |
US6757169B2 (en) | 2004-06-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI LTD. Free format text: FORMER OWNER: HITACHI,LTD. Effective date: 20130718 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130718 Address after: Tokyo, Japan Patentee after: Hitachi Consumer Electronics Co.,Ltd. Address before: Tokyo, Japan Patentee before: Hitachi Manufacturing Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: HITACHI MAXELL LTD. Free format text: FORMER OWNER: HITACHI LTD. Effective date: 20150327 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150327 Address after: Osaka, Japan Patentee after: Hitachi Maxell, Ltd. Address before: Tokyo, Japan Patentee before: Hitachi Consumer Electronics Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171218 Address after: Kyoto Japan Patentee after: Mike seer Address before: Osaka, Japan Patentee before: Hitachi Maxell, Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060104 Termination date: 20180710 |
|
CF01 | Termination of patent right due to non-payment of annual fee |