CN100343782C - 液冷系统及具有该液冷系统的电子设备 - Google Patents
液冷系统及具有该液冷系统的电子设备 Download PDFInfo
- Publication number
- CN100343782C CN100343782C CNB2004100077724A CN200410007772A CN100343782C CN 100343782 C CN100343782 C CN 100343782C CN B2004100077724 A CNB2004100077724 A CN B2004100077724A CN 200410007772 A CN200410007772 A CN 200410007772A CN 100343782 C CN100343782 C CN 100343782C
- Authority
- CN
- China
- Prior art keywords
- ebullator
- cooling system
- liquid refrigerant
- mentioned
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 133
- 239000007788 liquid Substances 0.000 title claims description 108
- 239000003507 refrigerant Substances 0.000 claims description 66
- 238000010438 heat treatment Methods 0.000 claims description 40
- 239000004065 semiconductor Substances 0.000 claims description 17
- 230000000630 rising effect Effects 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 2
- 239000002826 coolant Substances 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 18
- 238000010521 absorption reaction Methods 0.000 description 12
- 230000009471 action Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000007599 discharging Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000007710 freezing Methods 0.000 description 3
- 230000008014 freezing Effects 0.000 description 3
- 230000008676 import Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- KNMAVSAGTYIFJF-UHFFFAOYSA-N 1-[2-[(2-hydroxy-3-phenoxypropyl)amino]ethylamino]-3-phenoxypropan-2-ol;dihydrochloride Chemical compound Cl.Cl.C=1C=CC=CC=1OCC(O)CNCCNCC(O)COC1=CC=CC=C1 KNMAVSAGTYIFJF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 235000012771 pancakes Nutrition 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/34—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables
- B65H75/38—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables involving the use of a core or former internal to, and supporting, a stored package of material
- B65H75/44—Constructional details
- B65H75/48—Automatic re-storing devices
- B65H75/486—Arrangements or adaptations of the spring motor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2402/00—Constructional details of the handling apparatus
- B65H2402/50—Machine elements
- B65H2402/54—Springs, e.g. helical or leaf springs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2403/00—Power transmission; Driving means
- B65H2403/90—Machine drive
- B65H2403/94—Other features of machine drive
- B65H2403/946—Means for restitution of accumulated energy, e.g. flywheel, spring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP038358/2004 | 2004-02-16 | ||
JP2004038358A JP2005228237A (ja) | 2004-02-16 | 2004-02-16 | 液冷システム及びそれを備えた電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1658120A CN1658120A (zh) | 2005-08-24 |
CN100343782C true CN100343782C (zh) | 2007-10-17 |
Family
ID=34747405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100077724A Expired - Fee Related CN100343782C (zh) | 2004-02-16 | 2004-03-05 | 液冷系统及具有该液冷系统的电子设备 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7149084B2 (zh) |
EP (1) | EP1571532A3 (zh) |
JP (1) | JP2005228237A (zh) |
KR (1) | KR100607004B1 (zh) |
CN (1) | CN100343782C (zh) |
TW (1) | TWI239442B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101789413A (zh) * | 2010-04-19 | 2010-07-28 | 山东大学 | 混合式细通道冷却器 |
Families Citing this family (98)
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US7483261B2 (en) * | 2003-06-27 | 2009-01-27 | Nec Corporation | Cooling device for an electronic equipment |
US7508672B2 (en) * | 2003-09-10 | 2009-03-24 | Qnx Cooling Systems Inc. | Cooling system |
JP2005129812A (ja) * | 2003-10-27 | 2005-05-19 | Hitachi Ltd | 液冷システム |
JP4272503B2 (ja) * | 2003-12-17 | 2009-06-03 | 株式会社日立製作所 | 液冷システム |
US20050138944A1 (en) * | 2003-12-30 | 2005-06-30 | Gwin Paul J. | Liquid cooling system |
US7280358B2 (en) * | 2004-04-19 | 2007-10-09 | Hewlett-Packard Development Company, L.P. | Liquid loop with multiple heat exchangers for efficient space utilization |
JP2005315158A (ja) * | 2004-04-28 | 2005-11-10 | Toshiba Corp | ポンプ、冷却装置、および電子機器 |
JP4234635B2 (ja) * | 2004-04-28 | 2009-03-04 | 株式会社東芝 | 電子機器 |
JP2005317796A (ja) * | 2004-04-28 | 2005-11-10 | Toshiba Corp | ポンプ、冷却装置および電子機器 |
JP2005317798A (ja) * | 2004-04-28 | 2005-11-10 | Toshiba Corp | 電子機器 |
US8430156B2 (en) * | 2004-04-29 | 2013-04-30 | Hewlett-Packard Development Company, L.P. | Liquid loop with multiple pump assembly |
US7203063B2 (en) * | 2004-05-21 | 2007-04-10 | Hewlett-Packard Development Company, L.P. | Small form factor liquid loop cooling system |
JP4343032B2 (ja) * | 2004-05-31 | 2009-10-14 | 株式会社東芝 | 冷却構造および投射型画像表示装置 |
JP2005344562A (ja) * | 2004-06-01 | 2005-12-15 | Toshiba Corp | ポンプ、冷却装置および冷却装置を有する電子機器 |
US7259961B2 (en) * | 2004-06-24 | 2007-08-21 | Intel Corporation | Reconfigurable airflow director for modular blade chassis |
US7420804B2 (en) * | 2004-06-30 | 2008-09-02 | Intel Corporation | Liquid cooling system including hot-swappable components |
US20060144566A1 (en) * | 2004-12-30 | 2006-07-06 | Jensen Kip B | System and method for cooling an integrated circuit device by electromagnetically pumping a fluid |
US7599761B2 (en) * | 2005-01-19 | 2009-10-06 | Hewlett-Packard Development Company, L.P. | Cooling assist module |
TWI257285B (en) * | 2005-04-11 | 2006-06-21 | Delta Electronics Inc | Heat-dissipating module of electronic device |
US20070047203A1 (en) * | 2005-08-31 | 2007-03-01 | Wen-Han Chen | Integral liquid cooling computer housing |
TWM284951U (en) * | 2005-09-21 | 2006-01-01 | Yen Sun Technology Corp | Heat dissipating device for an electronic device |
US7353862B2 (en) * | 2005-10-03 | 2008-04-08 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Liquid cooling device |
US7548421B2 (en) * | 2005-10-25 | 2009-06-16 | Hewlett-Packard Development Company, L.P. | Impingement cooling of components in an electronic system |
US8051897B2 (en) * | 2005-11-30 | 2011-11-08 | International Business Machines Corporation | Redundant assembly for a liquid and air cooled module |
US20070125523A1 (en) * | 2005-12-01 | 2007-06-07 | Bhatti Mohinder S | Low profile liquid cooled server heat sink |
DE102006022464B4 (de) * | 2006-05-13 | 2008-09-25 | Khs Ag | Verfahren sowie Vorrichtung zum gesteuerten Aufschäumen eines in Flaschen oder dergleichen Behälter eingebrachten Füllgutes |
JP2008027370A (ja) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 電子機器 |
JP5148079B2 (ja) * | 2006-07-25 | 2013-02-20 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
JP5133531B2 (ja) * | 2006-07-25 | 2013-01-30 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
JP4781929B2 (ja) * | 2006-07-25 | 2011-09-28 | 富士通株式会社 | 電子機器 |
JP2008027374A (ja) | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
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- 2004-03-05 US US10/792,718 patent/US7149084B2/en not_active Expired - Lifetime
- 2004-03-05 CN CNB2004100077724A patent/CN100343782C/zh not_active Expired - Fee Related
- 2004-03-06 KR KR1020040015244A patent/KR100607004B1/ko not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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EP1571532A3 (en) | 2006-10-25 |
JP2005228237A (ja) | 2005-08-25 |
EP1571532A2 (en) | 2005-09-07 |
KR100607004B1 (ko) | 2006-08-01 |
KR20050081816A (ko) | 2005-08-19 |
TWI239442B (en) | 2005-09-11 |
US20050180105A1 (en) | 2005-08-18 |
TW200528964A (en) | 2005-09-01 |
US7149084B2 (en) | 2006-12-12 |
CN1658120A (zh) | 2005-08-24 |
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