• M284951 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種散熱裝置，特別是指一種用於電 子元件散熱的散熱裝置。 【先前技術】 一般電子元件，特別是例如桌上型電腦、筆記型電腦 的核心一中央運算處理單元（CPU)運作時，會因電子快速 、大量的移動而產生高熱；然而，過高的工作溫度會使電 子元件失效而導致例如當機、資料毁損等問題，因此，如 何處理電子元件運作時的散熱問題，是業者不斷努力研究 的方向。 參閱圖1，目前用於電子元件100散熱的散熱裝置i， 是可熱交換地與電子元件100連接，將電子元件100運作 時產生的熱排離電子元件100本身，以維持電子元件100 本身正常的運作。 散熱裝置1包含一吸熱單元u、一冷媒12、一抽送單 元13，及一冷凝單元14。 吸熱單元11具有一中空的吸熱體111，及一界定出一 流道113的導管112，吸熱體lu與電子元件1〇〇可熱交換 地連結，流道113包括一與吸熱體lu相通的流出端114、 一相反於流出端114且與吸熱體1U相通的流入端115、一 相鄰近流出端114的抽送部116，及一介於抽送部116與流 入端115之間的冷卻部117。 冷媒12容置於吸熱體1U内，可在吸熱體ui與電子 M284951 元件100熱交換後，再與吸熱體⑴#交換，而自流出端 114流離吸熱體111時將熱攜離電子元件丨〇〇。 抽送單元13設置於抽送部116，可抽吸自流出端ιΐ4 流離吸熱體111的冷媒12，以加速冷媒12自流出端丨14沪 流道112往冷卻部117方向流動。在此，抽送單元13為泵 浦。 … 冷凝單元14設置於冷卻部117，具有一呈連續彎折狀 並與流道112連通之冷凝管141，以及多數片間隔設置於冷 凝管141上的散熱片142，沿流道113往冷卻部117方向流 動的冷媒12流入冷凝單元14的冷凝管141中時，與冷凝 管141及多數散熱片142進行熱交換而排出所攜帶的熱量 ，藉由冷凝管141的管壁與散熱片142而將熱排離至外界 〇 當電子70件100作動產生熱時，散熱裝置丨以吸熱單 元11之吸熱體111與電子元件100進行熱交換，同時，冷 媒12與吸熱體m進行熱交換，將電子元件100作動所產 生的熱排離電子元件100，吸熱後的冷媒12藉由抽送單元 13的抽吸，而加速自流出端114流離吸熱體lu並沿流道 112往冷卻部117方向流動，而當冷媒12流入冷凝單元μ 的冷凝管141中時，冷凝管141與散熱片142同時對冷媒 12進行熱交換，而使冷媒12原本所攜帶的熱經由冷凝管 141的官壁與散熱片142的熱交換後排離散熱裝置而至外界 ，排出熱量後的冷媒12通過冷卻部117後再自流入端115 級/主入吸熱體111中，並再次進行上述的熱交換過程；藉由 • M284951 循環的熱交換過程，將電子元件100作動時產生的熱排離 電子元件100，而達成使電子元件100穩定正常運作的目的 0 上述的散熱裝置1，確實能藉由抽送單元13的抽吸以 導引冷媒12的流動，使冷媒12在流道113、冷凝管ι41、 吸熱體111中穩定的流動以進行熱交換，進而達到辅助電子 元件100散熱的目的。 但是，由於一般冷媒是屬流體，當抽送單元13自流出 端114抽吸冷媒的效率過大，冷媒快速、大量地流離散熱體 111而流通入流道113、冷凝管141中時，往往造成流道 113、冷凝管141的壓力過大，進而導致流道1Π、冷凝管 141的爆裂，造成散熱裝置丨的毀損，嚴重時甚至會因冷媒 12的外洩，而導致電子元件1〇〇，甚或整體電子設備的損 害。 所以，目前的散熱裝置1仍需要加以改善，以達到更 佳地辅助電子元件1 00散熱的功效。 【新型内容】 因此，本新型之目的，即在提供一種用於電子元件的 散熱裝置，可穩定地將電子元件作動時產生的熱排離電子 元件，使電子元件維持正常運作。 於是，本新型一種用於電子元件的散熱裝置，包含一 儲容槽、一冷卻液、一導管、一抽取單元、一穩壓單元， 及一降溫單元。 該儲容槽界定出一儲容空間。 • M284951 該冷卻液容置於該儲容空間中。 該導管界定出—可供該冷卻液流動之流道，該流道包 括-與該儲容空間相通的流入端、一自該流入端向相反於 該儲容槽方向延伸的抽送部、一自該抽送部更加遠離該流 入端延伸的穩壓部、-自該穩壓部更加遠離該抽送部延伸 的設置部、-自該設置部更加遠離該穩壓部延伸的散熱部 及自》亥政熱更力口运離該言免置部延伸並與該儲容空間 相通的流出端，該電子元件可熱交換地設置於該設置部。 該抽取單兀設置於該抽送部，可抽送該儲容空間中容 置的該冷卻液，使該冷卻液經由該儲容空間自該流入端向 該流出端流動。 該穩壓單元設置於該穩壓部，可使通過該穩壓部的該 冷卻液以穩定壓力向該流出端流動。 該降溫單元對應於該散熱部裝設，使該冷卻液通過該 散熱部後溫度降低。 本新型的功效在於藉由穩壓單元使冷卻液以穩壓在導 管中流動，進而穩定地輔助電子元件達成散熱的目的，避 免冷卻液流動壓力過大而導致導管破裂、散熱裝置損壞。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。 在本新型被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 8 • M284951 參閱圖2,本新型用於電子元件1〇〇的散熱裝置2的一 較佳實施例，是可熱交換地與作動時產生大量的熱的電子 兀件100相連結，而將電子元件1〇()運作時產生的熱穩定 地排離電子元件1〇〇本身，以維持電子元件1〇〇本身正常 的運作。散熱裝置2包含一儲容槽21、一冷卻液22、一導 管23、一散熱件24、一抽取單元25、一穩壓單元27，及 一降溫單元26。 儲容槽21與導管23均由比熱小之金屬為材料製成， 以便於散熱，儲容槽21界定出一供冷卻液22容置的儲容 空間211 ;導管23界定出一與儲容空間211相連通以供冷 卻液22流動的流道231，流道231包括一與儲容空間211 相通的流入端232、一自流入端232向相反於儲容槽21方 向延伸的抽送部234、一自抽送部234向更加遠離流入端 232方向延伸的穩壓部237、一自穩壓部236向更加遠離抽 送部234方向延伸的設置部236、一自設置部236向更加遠 離穩壓部237方向延伸的散熱部235，及一自散熱部235向 更加遠離設置部236方向延伸並與儲容空間211相通的流出 端 233 〇 冷卻液22是比熱低、吸熱快的流體，例如水、冷媒等 ，儲容於儲容空間211中。 抽取早兀2 5 δ又置於抽送部2 3 4中，可抽送儲容*間 211中容置的冷卻液22，使冷卻液22經由儲容空間211自 流入端232流入流道231並向流出端233流動；在此，抽 取單元25是泵浦，由於此等機具的結構已為業界所周知， 9 M284951 在此不再多加說明。 穩壓單元設置於穩壓部237並緊鄰靠近抽取單元25, 用以穩定通過穩壓部237的冷卻液22的流動壓力，使冷卻 液22穩定的在流道23 1中向流出端233流動。穩壓單元27 包括一穩壓閥271，及一穩壓管272，在本例中，穩壓管 272的相反兩端分別連通流道231與儲容空間2丨i。 如圖2所示，當冷卻液22流經過穩壓閥271的壓力值 不大於穩壓閥271的預設值時，穩壓閥271成封閉狀態而 鲁 使穩壓管272與流道231不相連通，冷卻液22穩定地在流 道231中向流出端233流動；參閱圖3，當冷卻液22流經 過穩壓閥271的壓力值大於穩壓閥271的預設值時，穩壓 閥271被冷卻液22的流動壓力推動而成一開啟狀態，使得 穩壓管272與流道231相連通，此時，部分的冷卻液22流 注入穩壓管272後再流回儲容空間211，藉此舒緩冷卻液22 在流道231中的流動壓力，以控制流經過穩壓單元27後的 冷卻液2 2以穩定壓力向流出端2 3 3流動。 散熱件24以比熱低的金屬，例如銅製成，具有複數彼 此相間隔地設置於設置部236中的散熱鰭片241，當冷卻液 22流經過設置部236時可通過複數散熱鰭片241的表面， 以進行熱交換。 降溫單元26對應於散熱部235裝設，而可使冷卻液22 流過散熱部235後的溫度降低；在此，降溫單元26包括多 數與導管23散熱部235熱連結的散熱片261，以及一對應 該等散熱片261設置的風扇262，風扇262可吹動散熱部 10 M284951 235與散熱片261周圍的氣體流動，進而使熱量可經由導管 23管壁與散熱片261而由氣體流動排散至外界，使得冷卻 液22通過散熱部235後溫度降低，由於此等結構已為業界 所周知，在此不再多加說明。 作動時會產生熱的電子元件⑽是可熱交換地與散熱 件24相連結’而可將電子元件i⑽所產生的熱排離電子元 件 100 〇 如圖2所示，當抽取單元25以穩定的速率抽取冷卻液 ，使冷卻液22以不大於穩壓單元27所預設之流動壓力在 流道231中流動時，穩壓單元27呈封閉狀態，冷卻液22 以穩定的流動壓力經過設置部236的散熱鰭片241，藉由冷 卻液22與散熱鰭片241的熱交換，而將電子元件1〇〇作動 時所產生的熱帶走；帶走電子元件1 〇〇所產生的熱的冷卻 液22再穩定流通過散熱部235時，降溫單元26辅助將冷 卻液22所攜帶的熱量經由導管23管壁與散熱片261而排 散至外界，而使冷卻液22流過散熱部235後的溫度降低； 降溫後的冷卻液22繼續流注入儲容空間211中，再次循環 上述的散熱流動過程，穩定地辅助電子元件100散熱。 如圖3所示，當抽取單元25以較大的速率抽取冷卻液 22，而使得冷卻液22以大於穩壓單元27所預設的流動壓 力在流道231中流經過穩壓部237時，穩壓單元27呈開啟 狀態，使得部分的冷卻液22再經由穩壓管272回流注入儲 容空間211，藉此舒緩冷卻液22在流道231中的流動壓力 ，而控制流經過穩壓單元27後的冷卻液22以穩定壓力向 11 • M284951 流出端233流動’進而使得冷卻液22同樣地以穩定的流動 壓力經過設置部236的散熱鰭# 241，藉由冷卻液22與散 熱鰭片241的熱交換，而將電子元件1〇〇作動時所產= 熱帶走；而，帶走電子元件_所產生的熱的冷卻液Μ可 再穩定流通過散熱部235，藉由降溫單元26辅助將冷卻液 22所攜帶的熱量經由導管23管壁與散熱片261而排散至外 界，而使冷卻液22流過散熱部235後的溫度降低；• M284951 VIII. New description: [New technical field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat of an electronic component. [Prior Art] In general, electronic components, especially the central processing unit (CPU) of a desktop computer or a notebook computer, generate high heat due to rapid and large movement of electrons; however, excessive work Temperature can cause electronic components to fail, causing problems such as crashes and data corruption. Therefore, how to deal with heat dissipation during operation of electronic components is the direction that the industry is constantly striving to study. Referring to FIG. 1, the heat dissipating device i for heat dissipation of the electronic component 100 is connected to the electronic component 100 in a heat exchange manner, and the heat generated when the electronic component 100 operates is discharged from the electronic component 100 itself to maintain the electronic component 100 itself. Operation. The heat sink 1 includes a heat absorbing unit u, a refrigerant 12, a pumping unit 13, and a condensing unit 14. The heat absorbing unit 11 has a hollow heat absorbing body 111, and a duct 112 defining a first-stage channel 113. The heat absorbing body lu is thermally exchangeably connected with the electronic component 1 ,. The flow path 113 includes an outflow end communicating with the heat absorbing body lu. 114. An inflow end 115 opposite to the outflow end 114 and communicating with the heat absorbing body 1U, a pumping portion 116 adjacent to the outflow end 114, and a cooling portion 117 interposed between the pumping portion 116 and the inflow end 115. The refrigerant 12 is housed in the heat absorbing body 1U, and can be exchanged with the heat absorbing body (1)# after the heat absorbing body ui and the electronic M284951 element 100 are heat exchanged, and the heat is carried away from the electronic component when the effluent end 114 flows away from the heat absorbing body 111. Hey. The pumping unit 13 is disposed in the pumping unit 116, and can suck the refrigerant 12 flowing from the heat-dissipating body 111 from the outflow port ι4 to accelerate the flow of the refrigerant 12 from the outflow port 14 to the cooling channel 117. Here, the pumping unit 13 is pumped. The condensing unit 14 is disposed in the cooling unit 117, has a condensing tube 141 which is continuously bent and communicates with the flow path 112, and a plurality of fins 142 spaced apart from each other on the condensing tube 141, and flows along the flow path 113 to the cooling unit When the refrigerant 12 flowing in the 117 direction flows into the condensing pipe 141 of the condensing unit 14, heat is exchanged with the condensing pipe 141 and the plurality of fins 142 to discharge the heat carried by the pipe wall of the condensing pipe 141 and the fins 142. When the heat is discharged to the outside, when the 70 pieces of the electronic device 100 generate heat, the heat dissipating device heat exchanges with the electronic component 100 by the heat absorbing body 111 of the heat absorbing unit 11, and at the same time, the refrigerant 12 exchanges heat with the heat absorbing body m, and the electronic component The heat generated by the operation of the 100 is discharged from the electronic component 100, and the heat-absorbing refrigerant 12 is accelerated by the suction of the pumping unit 13, and is accelerated from the outflow end 114 to the heat absorbing body lu and flows along the flow path 112 toward the cooling portion 117. When the refrigerant 12 flows into the condensing pipe 141 of the condensing unit μ, the condensing pipe 141 and the fins 142 simultaneously exchange heat with the refrigerant 12, and the heat originally carried by the refrigerant 12 passes through the wall of the condensing pipe 141 and the fins 142. After the heat exchange, the discrete heat device is discharged to the outside, and the refrigerant 12 after the heat is discharged passes through the cooling portion 117 and then flows into the end stage 115/main heat absorbing body 111, and performs the above heat exchange process again; by • M284951 circulation The heat exchange process removes the heat generated when the electronic component 100 is activated from the electronic component 100, and achieves the purpose of stabilizing the normal operation of the electronic component 100. The heat dissipating device 1 described above can be guided by the suction of the pumping unit 13. The flow of the refrigerant 12 causes the refrigerant 12 to flow stably in the flow path 113, the condenser tube ι41, and the heat absorbing body 111 to perform heat exchange, thereby achieving the purpose of dissipating heat of the auxiliary electronic component 100. However, since the general refrigerant is a fluid, when the efficiency of the pumping unit 13 sucking the refrigerant from the outflow end 114 is too large, the refrigerant flows rapidly into the flow passage 113 and the condensing duct 141 in a rapid and large amount, and the flow passage 113 is often caused. The pressure of the condensing pipe 141 is too large, which causes the flow path 1 Π and the condensing pipe 141 to burst, causing damage to the heat sink ,, and even when the refrigerant 12 is leaked, the electronic component 1 〇〇 or even the entire electronic device is caused. Damage. Therefore, the current heat sink 1 still needs to be improved to better assist the heat dissipation of the electronic component 100. [New content] Therefore, the object of the present invention is to provide a heat sink for an electronic component that stably discharges heat generated when an electronic component is actuated from the electronic component to maintain normal operation of the electronic component. Therefore, the heat dissipation device for an electronic component comprises a storage tank, a coolant, a conduit, an extraction unit, a voltage stabilization unit, and a temperature reduction unit. The storage tank defines a storage space. • M284951 This coolant is placed in this storage space. The duct defines a flow passage through which the coolant flows, the flow passage including: an inflow end communicating with the storage space, a pumping portion extending from the inflow end in a direction opposite to the storage tank, and a self The pumping portion is further away from the voltage stabilizing portion extending from the inflow end, an installation portion extending further away from the pumping portion from the voltage stabilizing portion, and a heat dissipating portion extending further away from the voltage stabilizing portion from the mounting portion and The heat is further ported to the outflow end extending from the free portion and communicating with the storage space, and the electronic component is heat-exchangeably disposed at the setting portion. The extraction unit is disposed in the pumping unit, and the coolant contained in the storage space can be pumped, and the coolant flows from the inflow end to the outflow end through the storage space. The voltage stabilizing unit is disposed in the voltage stabilizing portion, and the coolant passing through the voltage stabilizing portion can flow to the outflow end at a steady pressure. The cooling unit is provided corresponding to the heat dissipating portion, and the temperature of the cooling liquid is lowered after passing through the heat dissipating portion. The effect of the novel is that the cooling liquid flows through the conduit by the voltage stabilizing unit, thereby stably assisting the electronic component to achieve heat dissipation, and avoiding excessive flow pressure of the coolant, causing the conduit to rupture and the heat sink to be damaged. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. 8 • M284951 Referring to FIG. 2, a preferred embodiment of the heat sink 2 for an electronic component 1 is heat exchangeably coupled to an electronic component 100 that generates a large amount of heat when actuated, and electronically The heat generated during the operation of the component 1 () is stably discharged from the electronic component 1 itself to maintain the normal operation of the electronic component 1 itself. The heat sink 2 includes a storage tank 21, a coolant 22, a conduit 23, a heat sink 24, a pumping unit 25, a voltage stabilizing unit 27, and a temperature reducing unit 26. The storage tank 21 and the conduit 23 are made of a metal having a smaller specific heat to facilitate heat dissipation, and the storage tank 21 defines a storage space 211 for the coolant 22 to be accommodated; the conduit 23 defines a storage space. 211 is connected to a flow path 231 for the cooling liquid 22 to flow. The flow path 231 includes an inflow end 232 communicating with the storage space 211, and a pumping portion 234 extending from the inflow end 232 in a direction opposite to the storage tank 21 The self-sending unit 234 extends toward the regulator unit 237 that extends further away from the inflow end 232, the self-regulating unit 236, the installation unit 236 that extends further away from the pumping unit 234, and the self-installation unit 236 toward the regulator unit 237. The extended heat radiating portion 235 and an outflow end 233 extending from the heat dissipating portion 235 in a direction away from the setting portion 236 and communicating with the storage space 211, the cooling liquid 22 is a fluid having a lower heat and a faster heat absorption, such as water or a refrigerant. It is stored in the storage space 211. The extraction enthalpy 2 5 δ is placed in the pumping portion 2 3 4 to pump the coolant 22 contained in the storage chamber 211, so that the coolant 22 flows into the flow channel 231 from the inflow end 232 through the storage space 211 and The outflow end 233 flows; here, the extraction unit 25 is pumped, and since the structure of such implements is well known in the art, 9 M284951 will not be further described here. The voltage stabilizing unit is disposed in the voltage stabilizing portion 237 and in close proximity to the extracting unit 25 for stabilizing the flow pressure of the cooling liquid 22 passing through the voltage stabilizing portion 237, so that the cooling liquid 22 is stably flowing in the flow path 23 1 toward the outflow end 233. The voltage stabilizing unit 27 includes a voltage stabilizing valve 271 and a voltage stabilizing tube 272. In this example, the opposite ends of the voltage stabilizing tube 272 respectively communicate with the flow path 231 and the storage space 2丨i. As shown in FIG. 2, when the pressure value of the coolant 22 flowing through the regulator valve 271 is not greater than the preset value of the regulator valve 271, the regulator valve 271 is closed and the regulator tube 272 and the runner 231 are not closed. In connection, the coolant 22 stably flows in the flow passage 231 toward the outflow end 233; referring to FIG. 3, when the pressure value of the coolant 22 flowing through the regulator valve 271 is greater than a preset value of the regulator valve 271, the regulator valve 271 is driven by the flow pressure of the cooling liquid 22 to open the state, so that the voltage regulator tube 272 is in communication with the flow channel 231. At this time, part of the coolant 22 flows into the voltage regulator tube 272 and then flows back to the storage space 211. This relieves the flow pressure of the coolant 22 in the flow path 231 to control the flow of the coolant 2 2 flowing through the regulator unit 27 to the outflow end 233 at a steady pressure. The heat sink 24 is made of a metal lower than heat, such as copper, and has a plurality of heat radiating fins 241 disposed in the setting portion 236 at intervals, and passes through the surface of the plurality of heat radiating fins 241 when the coolant 22 flows through the setting portion 236. For heat exchange. The temperature reducing unit 26 is disposed corresponding to the heat dissipating portion 235, and the temperature of the cooling liquid 22 after flowing through the heat dissipating portion 235 is lowered. Here, the temperature reducing unit 26 includes a plurality of fins 261 thermally coupled to the heat radiating portion 235 of the duct 23, and a heat sink 261. In response to the fan 262 disposed on the heat sink 261, the fan 262 can blow the gas around the heat dissipating portion 10 M284951 235 and the fin 261, so that heat can be dissipated by the gas flow through the tube wall and the fin 261. Externally, the temperature of the coolant 22 is lowered after passing through the heat dissipating portion 235. Since these structures are well known in the art, they will not be described here. The electronic component (10) that generates heat when actuated is heat-exchangeably coupled to the heat sink 24', and the heat generated by the electronic component i(10) can be discharged from the electronic component 100, as shown in FIG. 2, when the extracting unit 25 is stable. When the coolant is drawn at a rate such that the coolant 22 flows in the flow passage 231 at a flow pressure not greater than a preset pressure of the regulator unit 27, the regulator unit 27 is in a closed state, and the coolant 22 passes through the setting portion 236 at a steady flow pressure. The heat dissipation fins 241, by the heat exchange between the cooling liquid 22 and the heat dissipation fins 241, move the tropical elements generated when the electronic component 1 is activated; take away the hot coolant 22 generated by the electronic components 1 When the re-stationary flow passes through the heat dissipating portion 235, the cooling unit 26 assists in dissipating the heat carried by the cooling liquid 22 to the outside through the tube wall and the fin 261, and lowers the temperature of the cooling liquid 22 after flowing through the heat dissipating portion 235. The cooled coolant 22 continues to flow into the storage space 211, and the above-described heat dissipation flow process is again circulated to stably assist the electronic component 100 to dissipate heat. As shown in FIG. 3, when the extracting unit 25 draws the cooling liquid 22 at a large rate, so that the cooling liquid 22 flows through the stabilizing portion 237 in the flow path 231 at a flow pressure greater than that preset by the stabilizing unit 27, The pressure unit 27 is in an open state, so that part of the coolant 22 is recirculated into the storage space 211 via the Zener diode 272, thereby relieving the flow pressure of the coolant 22 in the flow channel 231, and the control flow passes through the voltage stabilization unit 27. The coolant 22 flows toward the 11 • M284951 outflow port 233 at a steady pressure, so that the coolant 22 passes through the heat sink fins 241 of the setting portion 236 at a steady flow pressure, and the heat of the coolant 22 and the heat radiating fins 241 Exchanging, when the electronic component 1 is activated, the tropical coolant is generated; and the hot coolant 带 generated by taking away the electronic component _ can be stably flowed through the heat dissipation portion 235, and the cooling liquid is assisted by the cooling unit 26 The heat carried by 22 is dissipated to the outside through the wall of the duct 23 and the fins 261, and the temperature after the coolant 22 flows through the heat dissipating portion 235 is lowered;
的冷卻液22繼續流注人儲容空間211中，再次循環上:的 散熱流動過程，穩定地辅助電子元件散熱。 由上述說明可知，本新型用於電子元件1〇〇的散熱裝 置2與習知的散熱裝置丨相較，更藉由穩壓單元27的調控 ，使得冷卻液22被抽取單元25抽送入流道231、並流經過 穩壓部237後，即可以穩定的流動壓力在流道231中流動 ，進而達到辅助電子元件1〇〇散熱的功效，確實可以改進 習知的散熱裝置1，會因為有時抽送單元13抽吸冷媒12的 效率過大，冷媒12快速、大量地流入流道113、冷凝管141 中，造成流道113、冷凝管141的壓力過大，進而導致流道 113、冷凝管141的爆裂，造成散熱裝置丨的毀損的缺點， 達到本新型的創作目的。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及說明書内容所作之簡單的等效變化與修飾，皆仍屬 本新型專利涵蓋之範圍内。 【圖式簡單說明】 12 M284951 圖1是-示意圖，說明習知用於電子元件散熱的散熱 裝置； 圖2疋一示意圖’說明本新型用於電子元件散熱的散 熱裝置的一較佳實施例，並說明散熱裝置之一穩壓裝置呈 封閉狀態；及 圖3是一示意圖，說明圖2之散熱裝置的穩壓單元呈 開啟狀態’調控冷卻液在流道中穩定的流動。 13 M284951The coolant 22 continues to flow into the human storage space 211, and again circulates: the heat dissipation flow process stably assists the heat dissipation of the electronic components. It can be seen from the above description that the heat dissipating device 2 for the electronic component 1 is compared with the conventional heat dissipating device ,, and the cooling liquid 22 is pumped into the flow channel 231 by the extracting unit 25 by the regulation of the voltage stabilizing unit 27. After flowing through the voltage stabilizing portion 237, a stable flow pressure can flow in the flow channel 231, thereby achieving the effect of dissipating heat from the auxiliary electronic component 1. It is possible to improve the conventional heat dissipating device 1 because it is sometimes pumped. The efficiency of the unit 13 for sucking the refrigerant 12 is too large, and the refrigerant 12 flows into the flow passage 113 and the condensing pipe 141 rapidly and in a large amount, causing the pressure of the flow passage 113 and the condensing pipe 141 to be excessively large, thereby causing the flow passage 113 and the condensing pipe 141 to burst. The disadvantage of causing the damage of the heat sink is achieved, and the creative purpose of the novel is achieved. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent changes and modifications made by the present invention and the contents of the specification are all It is still within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a heat dissipating device for heat dissipation of electronic components. FIG. 2 is a schematic view showing a preferred embodiment of the heat dissipating device for dissipating heat of electronic components. And a cooling device is shown in a closed state; and FIG. 3 is a schematic view showing that the voltage stabilizing unit of the heat sink of FIG. 2 is in an open state to regulate the steady flow of the coolant in the flow channel. 13 M284951
【主要元件符號說明】 100 · * 電子元件 22· · · 冷卻液 1 *… 散熱裝置 23· · · 導管 11 · · · 吸熱單元 231 · * 流道 111 · · 吸熱體 232 * * 流入端 112 ♦ · 導管 233 · · 流出端 113 · · 流道 234 * · 抽送部 114 · · 流出端 235 · * 散熱部 115 . · 流入端 236 * * 設置部 116 ·, 抽送部 237 · · 穩壓部 117 · · 冷卻部 24·… 散熱件 12…* 冷媒 241 * * 散熱鰭片 13 抽送單元 25· · _ 抽取單元 14*… 冷凝單元 26· · · 降溫單元 141 ·. 冷凝管 261 · · 散熱片 142 * · 散熱片 262 · · 風扇 2 散熱裝置 27· · · 穩壓單元 21 ·… 儲容槽 271 · · 穩壓閥 211 · · 儲容空間 272 * * 穩壓管 14[Main component symbol description] 100 · * Electronic component 22 · · · Coolant 1 *... Heat sink 23 · · · Conduit 11 · · · Heat absorbing unit 231 · * Flow path 111 · · Heat absorbing body 232 * * Inflow end 112 ♦ · Conduit 233 · · Outflow end 113 · · Flow path 234 * · Pumping part 114 · · Outflow end 235 · * Heat sink part 115 · Inflow end 236 * * Setting part 116 · Pumping part 237 · · Regulator part 117 · · Cooling unit 24... Heat sink 12...* Refrigerant 241 * * Heat sink fin 13 Pumping unit 25 · · _ Extracting unit 14*... Condensing unit 26 · · · Cooling unit 141 ·. Condensing tube 261 · · Heat sink 142 * · Heat sink 262 · · Fan 2 Heat sink 27 · · · Voltage regulator unit 21 ·... Storage tank 271 · · Regulator valve 211 · · Storage space 272 * * Regulator tube 14