CN1213174A - 一种芯片封装型半导体器件及其生产方法 - Google Patents

一种芯片封装型半导体器件及其生产方法 Download PDF

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Publication number
CN1213174A
CN1213174A CN98119391A CN98119391A CN1213174A CN 1213174 A CN1213174 A CN 1213174A CN 98119391 A CN98119391 A CN 98119391A CN 98119391 A CN98119391 A CN 98119391A CN 1213174 A CN1213174 A CN 1213174A
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lead
wire
semiconductor chip
connecting rod
end portion
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CN98119391A
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Chinese (zh)
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木村直人
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NEC Corp
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NEC Corp
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CN98119391A 1997-09-26 1998-09-25 一种芯片封装型半导体器件及其生产方法 Pending CN1213174A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP262106/97 1997-09-26
JP9262106A JP2954110B2 (ja) 1997-09-26 1997-09-26 Ｃｓｐ型半導体装置及びその製造方法

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CN1213174A true CN1213174A (zh) 1999-04-07

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US (1) US6268652B1 (ja)
JP (1) JP2954110B2 (ja)
CN (1) CN1213174A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1320619C (zh) * 2002-06-10 2007-06-06 日东电工株式会社 制作半导体器件和其中所用耐热压敏粘结带的方法
CN101170071B (zh) * 2006-10-27 2011-08-03 三星Techwin株式会社 半导体封装和形成半导体封装的导线环的方法
CN101202254B (zh) * 2006-12-13 2012-03-28 雅马哈株式会社 半导体装置及其制造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3501281B2 (ja) * 1999-11-15 2004-03-02 沖電気工業株式会社 半導体装置
US7148561B2 (en) * 2001-03-29 2006-12-12 Siliconware Precision Industries Co., Ltd. Ball grid array substrate strip with warpage-preventive linkage structure
JP3920629B2 (ja) * 2001-11-15 2007-05-30 三洋電機株式会社 半導体装置
US7132314B2 (en) * 2004-05-28 2006-11-07 Texas Instruments Incorporated System and method for forming one or more integrated circuit packages using a flexible leadframe structure
DE102004057485B4 (de) * 2004-11-29 2007-10-18 Infineon Technologies Ag Leistungshalbleiterbauelement und Verfahren zu dessen Herstellung
US8269324B2 (en) * 2008-07-11 2012-09-18 Stats Chippac Ltd. Integrated circuit package system with chip on lead
USD934452S1 (en) 2017-12-04 2021-10-26 Signature Systems Group Llc Modular flooring tile with cable channels
CN116441752B (zh) * 2023-04-27 2023-11-21 广州丰江微电子有限公司 高精度定位引线框架切割系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5949416A (en) * 1991-05-28 1999-09-07 Borland International, Inc. Method for providing help information for nested functions
KR930014916A (ko) * 1991-12-24 1993-07-23 김광호 반도체 패키지
JPH0637136A (ja) * 1992-05-22 1994-02-10 Nec Ic Microcomput Syst Ltd 半導体装置
EP0595021A1 (en) * 1992-10-28 1994-05-04 International Business Machines Corporation Improved lead frame package for electronic devices
KR100292036B1 (ko) * 1993-08-27 2001-09-17 윤종용 반도체패키지의제조방법및그에 따른반도체패키지
US5976912A (en) * 1994-03-18 1999-11-02 Hitachi Chemical Company, Ltd. Fabrication process of semiconductor package and semiconductor package
KR0179803B1 (ko) * 1995-12-29 1999-03-20 문정환 리드노출형 반도체 패키지
JP2859194B2 (ja) * 1996-01-30 1999-02-17 九州日本電気株式会社 プラスチックパッケージ型半導体集積回路及びその製造 方法
KR980006174A (ko) * 1996-06-18 1998-03-30 문정환 버틈 리드 패키지
JP3679199B2 (ja) * 1996-07-30 2005-08-03 日本テキサス・インスツルメンツ株式会社 半導体パッケージ装置
JP3012816B2 (ja) * 1996-10-22 2000-02-28 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
KR100237051B1 (ko) * 1996-12-28 2000-01-15 김영환 버텀리드 반도체 패키지 및 그 제조 방법
JP3793628B2 (ja) * 1997-01-20 2006-07-05 沖電気工業株式会社 樹脂封止型半導体装置
KR100214561B1 (ko) * 1997-03-14 1999-08-02 구본준 버틈 리드 패키지
US6271582B1 (en) * 1997-04-07 2001-08-07 Micron Technology, Inc. Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
US6054754A (en) * 1997-06-06 2000-04-25 Micron Technology, Inc. Multi-capacitance lead frame decoupling device
KR100246587B1 (ko) * 1997-09-19 2000-03-15 유무성 볼 그리드 어레이 반도체 팩키지

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1320619C (zh) * 2002-06-10 2007-06-06 日东电工株式会社 制作半导体器件和其中所用耐热压敏粘结带的方法
CN101170071B (zh) * 2006-10-27 2011-08-03 三星Techwin株式会社 半导体封装和形成半导体封装的导线环的方法
CN101202254B (zh) * 2006-12-13 2012-03-28 雅马哈株式会社 半导体装置及其制造方法

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