CN1200822C - 非接触式识别信息卡类及其制造方法 - Google Patents
非接触式识别信息卡类及其制造方法 Download PDFInfo
- Publication number
- CN1200822C CN1200822C CNB018054811A CN01805481A CN1200822C CN 1200822 C CN1200822 C CN 1200822C CN B018054811 A CNB018054811 A CN B018054811A CN 01805481 A CN01805481 A CN 01805481A CN 1200822 C CN1200822 C CN 1200822C
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Images
Classifications
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
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- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/0502—Disposition
- H01L2224/05026—Disposition the internal layer being disposed in a recess of the surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP44006/2000 | 2000-02-22 | ||
JP2000044006 | 2000-02-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1404445A CN1404445A (zh) | 2003-03-19 |
CN1200822C true CN1200822C (zh) | 2005-05-11 |
Family
ID=18566838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018054811A Expired - Lifetime CN1200822C (zh) | 2000-02-22 | 2001-02-21 | 非接触式识别信息卡类及其制造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6779733B2 (zh) |
EP (2) | EP1258370B1 (zh) |
JP (1) | JP3729491B2 (zh) |
KR (1) | KR100732648B1 (zh) |
CN (1) | CN1200822C (zh) |
DE (2) | DE60144452D1 (zh) |
TW (1) | TW550515B (zh) |
WO (1) | WO2001062517A1 (zh) |
Families Citing this family (52)
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US6468638B2 (en) * | 1999-03-16 | 2002-10-22 | Alien Technology Corporation | Web process interconnect in electronic assemblies |
US6951596B2 (en) | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
FI112550B (fi) * | 2001-05-31 | 2003-12-15 | Rafsec Oy | Älytarra ja älytarraraina |
US6606247B2 (en) * | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
US7218527B1 (en) * | 2001-08-17 | 2007-05-15 | Alien Technology Corporation | Apparatuses and methods for forming smart labels |
US6863219B1 (en) * | 2001-08-17 | 2005-03-08 | Alien Technology Corporation | Apparatuses and methods for forming electronic assemblies |
US7214569B2 (en) | 2002-01-23 | 2007-05-08 | Alien Technology Corporation | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
KR20030076274A (ko) | 2002-03-18 | 2003-09-26 | 도레 엔지니아린구 가부시키가이샤 | 비접촉 아이디 카드류 및 그 제조방법 |
US6867983B2 (en) * | 2002-08-07 | 2005-03-15 | Avery Dennison Corporation | Radio frequency identification device and method |
US7275696B2 (en) * | 2002-10-24 | 2007-10-02 | Toray Engineering Company, Limited | Non-contact ID card and the like and method for manufacturing same |
JP3739752B2 (ja) * | 2003-02-07 | 2006-01-25 | 株式会社 ハリーズ | ランダム周期変速可能な小片移載装置 |
US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
US7930815B2 (en) | 2003-04-11 | 2011-04-26 | Avery Dennison Corporation | Conductive pattern and method of making |
US20040200061A1 (en) * | 2003-04-11 | 2004-10-14 | Coleman James P. | Conductive pattern and method of making |
TWI284842B (en) * | 2003-07-14 | 2007-08-01 | Nec Tokin Corp | Communication medium capable of carrying out contactless communication and method of producing the same |
DE10334578A1 (de) * | 2003-07-28 | 2005-03-10 | Infineon Technologies Ag | Chipkarte, Chipkartenmodul sowie Verfahren zur Herstellung eines Chipkartenmoduls |
ATE424009T1 (de) | 2003-08-05 | 2009-03-15 | Nxp Bv | Modul mit mindestens zwei paaren von modulverbindungsplatten |
JPWO2005045919A1 (ja) * | 2003-11-11 | 2007-05-24 | 東レエンジニアリング株式会社 | 非接触idカード及びその製造方法 |
DE102004008840A1 (de) * | 2004-02-20 | 2005-09-01 | Bundesdruckerei Gmbh | Verfahren zur Herstellung eines buchartigen Wertdokuments sowie ein buchartiges Wertdokument |
JP4637499B2 (ja) * | 2004-04-23 | 2011-02-23 | 大日本印刷株式会社 | インターポーザ付シートの巻体およびicタグ |
DE102004025684A1 (de) | 2004-04-29 | 2005-11-17 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zum Ausbilden einer Kontaktstruktur zur elektrischen Kontaktierung eines optoelektronischen Halbleiterchips |
KR100602621B1 (ko) * | 2004-06-16 | 2006-07-19 | 한국조폐공사 | 조립식 콤비카드 및 이의 제조방법 |
JP4526878B2 (ja) * | 2004-06-16 | 2010-08-18 | 大日本印刷株式会社 | 非接触データキャリア部材取付方法及び装置 |
US7274297B2 (en) * | 2004-07-01 | 2007-09-25 | Intermec Ip Corp. | RFID tag and method of manufacture |
KR101176027B1 (ko) * | 2004-10-19 | 2012-08-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 안테나를 구비한 반도체장치 및 그 제조 방법 |
US7452748B1 (en) * | 2004-11-08 | 2008-11-18 | Alien Technology Corporation | Strap assembly comprising functional block deposited therein and method of making same |
US20060109130A1 (en) * | 2004-11-22 | 2006-05-25 | Hattick John B | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
US7385284B2 (en) * | 2004-11-22 | 2008-06-10 | Alien Technology Corporation | Transponder incorporated into an electronic device |
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JP4091096B2 (ja) * | 2004-12-03 | 2008-05-28 | 株式会社 ハリーズ | インターポーザ接合装置 |
CN101073297A (zh) * | 2004-12-03 | 2007-11-14 | 哈里斯股份有限公司 | 电子部件的制造方法及电子部件的制造装置 |
KR100674926B1 (ko) * | 2004-12-08 | 2007-01-26 | 삼성전자주식회사 | 메모리 카드 및 그 제조 방법 |
US7912499B2 (en) * | 2005-03-31 | 2011-03-22 | Black Sand Technologies, Inc. | Techniques for partitioning radios in wireless communication systems |
EP1876877B1 (en) | 2005-04-06 | 2010-08-25 | Hallys Corporation | Electronic component manufacturing apparatus |
JP5036541B2 (ja) * | 2005-04-18 | 2012-09-26 | 株式会社 ハリーズ | 電子部品及び、この電子部品の製造方法 |
JP4171008B2 (ja) | 2005-07-11 | 2008-10-22 | 株式会社東芝 | アンテナ装置および携帯無線機 |
US20070031992A1 (en) * | 2005-08-05 | 2007-02-08 | Schatz Kenneth D | Apparatuses and methods facilitating functional block deposition |
EP1952312B1 (en) * | 2005-10-14 | 2012-02-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and communication system using the semiconductor device |
US20070240304A1 (en) * | 2006-04-12 | 2007-10-18 | Eisenhardt Randolph W | RFID article with interleaf |
JP4992465B2 (ja) * | 2007-02-22 | 2012-08-08 | 富士通株式会社 | Rfidタグおよびrfidタグの製造方法 |
CN101281992B (zh) * | 2007-04-03 | 2015-08-26 | 联想(北京)有限公司 | 无线芯片及无线设备 |
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-
2001
- 2001-02-21 JP JP2001561547A patent/JP3729491B2/ja not_active Expired - Lifetime
- 2001-02-21 DE DE60144452T patent/DE60144452D1/de not_active Expired - Lifetime
- 2001-02-21 EP EP01906168A patent/EP1258370B1/en not_active Expired - Lifetime
- 2001-02-21 KR KR1020027010730A patent/KR100732648B1/ko active IP Right Grant
- 2001-02-21 WO PCT/JP2001/001253 patent/WO2001062517A1/ja active Application Filing
- 2001-02-21 EP EP07075543A patent/EP1843280B1/en not_active Expired - Lifetime
- 2001-02-21 DE DE60137117T patent/DE60137117D1/de not_active Expired - Lifetime
- 2001-02-21 CN CNB018054811A patent/CN1200822C/zh not_active Expired - Lifetime
- 2001-02-21 US US10/204,090 patent/US6779733B2/en not_active Expired - Lifetime
- 2001-02-22 TW TW090104055A patent/TW550515B/zh not_active IP Right Cessation
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EP1258370B1 (en) | 2008-12-24 |
KR20020081333A (ko) | 2002-10-26 |
EP1258370A1 (en) | 2002-11-20 |
US20030029921A1 (en) | 2003-02-13 |
US6779733B2 (en) | 2004-08-24 |
JP3729491B2 (ja) | 2005-12-21 |
EP1843280B1 (en) | 2011-04-13 |
EP1843280A1 (en) | 2007-10-10 |
KR100732648B1 (ko) | 2007-06-28 |
CN1404445A (zh) | 2003-03-19 |
EP1258370A4 (en) | 2004-06-16 |
TW550515B (en) | 2003-09-01 |
DE60137117D1 (de) | 2009-02-05 |
WO2001062517A1 (fr) | 2001-08-30 |
DE60144452D1 (de) | 2011-05-26 |
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