CN1193651C - 印刷线路板 - Google Patents
印刷线路板 Download PDFInfo
- Publication number
- CN1193651C CN1193651C CNB981027350A CN98102735A CN1193651C CN 1193651 C CN1193651 C CN 1193651C CN B981027350 A CNB981027350 A CN B981027350A CN 98102735 A CN98102735 A CN 98102735A CN 1193651 C CN1193651 C CN 1193651C
- Authority
- CN
- China
- Prior art keywords
- outboard flanges
- flange
- printed substrate
- size
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP173489/1997 | 1997-06-30 | ||
JP173489/97 | 1997-06-30 | ||
JP9173489A JPH1126919A (ja) | 1997-06-30 | 1997-06-30 | プリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1206325A CN1206325A (zh) | 1999-01-27 |
CN1193651C true CN1193651C (zh) | 2005-03-16 |
Family
ID=15961463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB981027350A Expired - Fee Related CN1193651C (zh) | 1997-06-30 | 1998-06-25 | 印刷线路板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6218630B1 (zh) |
JP (1) | JPH1126919A (zh) |
CN (1) | CN1193651C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111885815A (zh) * | 2020-08-20 | 2020-11-03 | 苏州浪潮智能科技有限公司 | 一种pcb板及其适用于窄中心距bga芯片的焊盘结构 |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000315843A (ja) * | 1999-04-30 | 2000-11-14 | Fujitsu Ltd | プリント基板及び半導体装置 |
JP2001068836A (ja) * | 1999-08-27 | 2001-03-16 | Mitsubishi Electric Corp | プリント配線基板及び半導体モジュール並びに半導体モジュールの製造方法 |
WO2001022488A1 (fr) * | 1999-09-22 | 2001-03-29 | Suzuka Fuji Xerox Co., Ltd. | Composant electronique a reseau en grille, procede de renfort de ses conducteurs et son procede de fabrication |
EP1098555B1 (en) * | 1999-11-02 | 2008-07-23 | Canon Kabushiki Kaisha | Printed-wiring board |
KR100817646B1 (ko) | 2000-03-10 | 2008-03-27 | 스태츠 칩팩, 엘티디. | 플립칩 상호연결 구조물 |
US10388626B2 (en) * | 2000-03-10 | 2019-08-20 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming flipchip interconnect structure |
US6527162B2 (en) * | 2000-08-04 | 2003-03-04 | Denso Corporation | Connecting method and connecting structure of printed circuit boards |
US6815621B2 (en) | 2000-10-02 | 2004-11-09 | Samsung Electronics Co., Ltd. | Chip scale package, printed circuit board, and method of designing a printed circuit board |
WO2002076329A1 (en) * | 2001-03-26 | 2002-10-03 | Glidewell James R | Back casting prefabricated incisal veneers |
JP4790157B2 (ja) * | 2001-06-07 | 2011-10-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
KR100416000B1 (ko) * | 2001-07-11 | 2004-01-24 | 삼성전자주식회사 | 다수의 핀을 갖는 부품이 실장되는 인쇄회로기판 |
TW533555B (en) * | 2001-11-21 | 2003-05-21 | Siliconware Precision Industries Co Ltd | Substrate for passive device |
GB2384119B (en) * | 2002-01-10 | 2006-03-01 | Nec Technologies | A printed circuit board |
JP2004040056A (ja) * | 2002-07-08 | 2004-02-05 | Shinko Electric Ind Co Ltd | 配線パターンの構造及びバンプの形成方法 |
US7098408B1 (en) * | 2003-10-14 | 2006-08-29 | Cisco Technology, Inc. | Techniques for mounting an area array package to a circuit board using an improved pad layout |
US7023075B2 (en) * | 2003-11-06 | 2006-04-04 | Crydom Technologies | Teardrop shaped lead frames |
US8853001B2 (en) | 2003-11-08 | 2014-10-07 | Stats Chippac, Ltd. | Semiconductor device and method of forming pad layout for flipchip semiconductor die |
US7034391B2 (en) * | 2003-11-08 | 2006-04-25 | Chippac, Inc. | Flip chip interconnection pad layout |
US20070105277A1 (en) | 2004-11-10 | 2007-05-10 | Stats Chippac Ltd. | Solder joint flip chip interconnection |
US8350384B2 (en) * | 2009-11-24 | 2013-01-08 | Stats Chippac, Ltd. | Semiconductor device and method of forming electrical interconnect with stress relief void |
US7659633B2 (en) | 2004-11-10 | 2010-02-09 | Stats Chippac, Ltd. | Solder joint flip chip interconnection having relief structure |
TWI534915B (zh) | 2003-11-10 | 2016-05-21 | 恰巴克有限公司 | 引線上凸塊之倒裝晶片互連 |
USRE47600E1 (en) | 2003-11-10 | 2019-09-10 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming electrical interconnect with stress relief void |
US8216930B2 (en) | 2006-12-14 | 2012-07-10 | Stats Chippac, Ltd. | Solder joint flip chip interconnection having relief structure |
US9029196B2 (en) | 2003-11-10 | 2015-05-12 | Stats Chippac, Ltd. | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask |
US8026128B2 (en) | 2004-11-10 | 2011-09-27 | Stats Chippac, Ltd. | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask |
US8076232B2 (en) | 2008-04-03 | 2011-12-13 | Stats Chippac, Ltd. | Semiconductor device and method of forming composite bump-on-lead interconnection |
US8574959B2 (en) * | 2003-11-10 | 2013-11-05 | Stats Chippac, Ltd. | Semiconductor device and method of forming bump-on-lead interconnection |
US8129841B2 (en) * | 2006-12-14 | 2012-03-06 | Stats Chippac, Ltd. | Solder joint flip chip interconnection |
USRE44500E1 (en) | 2003-11-10 | 2013-09-17 | Stats Chippac, Ltd. | Semiconductor device and method of forming composite bump-on-lead interconnection |
US8841779B2 (en) | 2005-03-25 | 2014-09-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate |
KR20070107154A (ko) | 2005-03-25 | 2007-11-06 | 스태츠 칩팩, 엘티디. | 기판상에 좁은 상호접속 사이트를 갖는 플립 칩 상호접속체 |
US9258904B2 (en) * | 2005-05-16 | 2016-02-09 | Stats Chippac, Ltd. | Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings |
US20060255473A1 (en) * | 2005-05-16 | 2006-11-16 | Stats Chippac Ltd. | Flip chip interconnect solder mask |
JP2007067019A (ja) * | 2005-08-29 | 2007-03-15 | Kyocera Corp | 回路基板、電子機器、及び回路基板の製造方法 |
JP4211828B2 (ja) * | 2006-09-12 | 2009-01-21 | 株式会社日立製作所 | 実装構造体 |
US9847309B2 (en) | 2006-09-22 | 2017-12-19 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate |
US7713782B2 (en) * | 2006-09-22 | 2010-05-11 | Stats Chippac, Inc. | Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps |
US20080182398A1 (en) * | 2007-01-30 | 2008-07-31 | Carpenter Burton J | Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate |
JP2008187074A (ja) * | 2007-01-31 | 2008-08-14 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
US7906835B2 (en) * | 2007-08-13 | 2011-03-15 | Broadcom Corporation | Oblong peripheral solder ball pads on a printed circuit board for mounting a ball grid array package |
US8349721B2 (en) | 2008-03-19 | 2013-01-08 | Stats Chippac, Ltd. | Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding |
US9345148B2 (en) | 2008-03-25 | 2016-05-17 | Stats Chippac, Ltd. | Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad |
US7759137B2 (en) * | 2008-03-25 | 2010-07-20 | Stats Chippac, Ltd. | Flip chip interconnection structure with bump on partial pad and method thereof |
US20090250814A1 (en) * | 2008-04-03 | 2009-10-08 | Stats Chippac, Ltd. | Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof |
JP4770884B2 (ja) * | 2008-06-26 | 2011-09-14 | 住友金属鉱山株式会社 | Cof基板及びその製造方法 |
US7897502B2 (en) * | 2008-09-10 | 2011-03-01 | Stats Chippac, Ltd. | Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers |
US8659172B2 (en) * | 2008-12-31 | 2014-02-25 | Stats Chippac, Ltd. | Semiconductor device and method of confining conductive bump material with solder mask patch |
US8198186B2 (en) | 2008-12-31 | 2012-06-12 | Stats Chippac, Ltd. | Semiconductor device and method of confining conductive bump material during reflow with solder mask patch |
US20100237500A1 (en) * | 2009-03-20 | 2010-09-23 | Stats Chippac, Ltd. | Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site |
US8039384B2 (en) | 2010-03-09 | 2011-10-18 | Stats Chippac, Ltd. | Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces |
US8409978B2 (en) | 2010-06-24 | 2013-04-02 | Stats Chippac, Ltd. | Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe |
US8492197B2 (en) | 2010-08-17 | 2013-07-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate |
US8435834B2 (en) | 2010-09-13 | 2013-05-07 | Stats Chippac, Ltd. | Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP |
JP2015056228A (ja) * | 2013-09-10 | 2015-03-23 | 株式会社小糸製作所 | プリント基板および車両用灯具 |
JP6916453B2 (ja) * | 2017-04-21 | 2021-08-11 | 日亜化学工業株式会社 | 光源装置 |
JP2020061406A (ja) * | 2018-10-05 | 2020-04-16 | 株式会社村田製作所 | 半導体装置 |
CN112752398A (zh) * | 2020-11-24 | 2021-05-04 | 广州朗国电子科技有限公司 | 一种pcb板的芯片焊盘结构 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4600970A (en) * | 1984-05-29 | 1986-07-15 | Rca Corporation | Leadless chip carriers having self-aligning mounting pads |
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
DE69523010T2 (de) * | 1994-10-04 | 2002-07-04 | Nec Corp | Mittels automatischer Bandmontage hergestelltes Halbleitergehäuse |
US5547740A (en) * | 1995-03-23 | 1996-08-20 | Delco Electronics Corporation | Solderable contacts for flip chip integrated circuit devices |
US5585162A (en) * | 1995-06-16 | 1996-12-17 | Minnesota Mining And Manufacturing Company | Ground plane routing |
KR100192766B1 (ko) * | 1995-07-05 | 1999-06-15 | 황인길 | 솔더볼을 입출력 단자로 사용하는 볼그리드 어레이 반도체 패키지의 솔더볼 평탄화 방법 및 그 기판구조 |
JP2894254B2 (ja) * | 1995-09-20 | 1999-05-24 | ソニー株式会社 | 半導体パッケージの製造方法 |
US5982186A (en) * | 1995-09-28 | 1999-11-09 | Texas Instruments Incorporated | Contactor for test applications including membrane carrier having contacts for an integrated circuit and pins connecting contacts to test board |
US5906042A (en) * | 1995-10-04 | 1999-05-25 | Prolinx Labs Corporation | Method and structure to interconnect traces of two conductive layers in a printed circuit board |
JP3458036B2 (ja) * | 1996-03-05 | 2003-10-20 | メック株式会社 | 銅および銅合金のマイクロエッチング剤 |
JP3351706B2 (ja) * | 1997-05-14 | 2002-12-03 | 株式会社東芝 | 半導体装置およびその製造方法 |
-
1997
- 1997-06-30 JP JP9173489A patent/JPH1126919A/ja not_active Withdrawn
-
1998
- 1998-06-25 CN CNB981027350A patent/CN1193651C/zh not_active Expired - Fee Related
- 1998-06-30 US US09/107,478 patent/US6218630B1/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111885815A (zh) * | 2020-08-20 | 2020-11-03 | 苏州浪潮智能科技有限公司 | 一种pcb板及其适用于窄中心距bga芯片的焊盘结构 |
Also Published As
Publication number | Publication date |
---|---|
CN1206325A (zh) | 1999-01-27 |
US6218630B1 (en) | 2001-04-17 |
JPH1126919A (ja) | 1999-01-29 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: FUJI PHOTO FILM CO., LTD. Free format text: FORMER OWNER: FUJIFILM HOLDINGS CORP. Effective date: 20070420 |
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C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: FUJIFILM HOLDINGS CORP. Free format text: FORMER NAME OR ADDRESS: FUJI PHOTO FILM CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Fujifilm Corp. Address before: Saitama Prefecture, Japan Patentee before: Fuji Photo Film Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20070420 Address after: Tokyo, Japan Patentee after: FUJIFILM Corp. Address before: Tokyo, Japan Patentee before: Fujifilm Corp. |
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C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050316 Termination date: 20100625 |