CN1183485C - 芯片卡或类似电子装置的制造方法 - Google Patents

芯片卡或类似电子装置的制造方法 Download PDF

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Publication number
CN1183485C
CN1183485C CNB988054477A CN98805447A CN1183485C CN 1183485 C CN1183485 C CN 1183485C CN B988054477 A CNB988054477 A CN B988054477A CN 98805447 A CN98805447 A CN 98805447A CN 1183485 C CN1183485 C CN 1183485C
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microcircuit
make
chip card
conductive material
card
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CN1257598A (zh
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R-P��������
R－P·布朗
�Ƴ�
J－C·菲达莱戈
P·帕特里斯
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Gemplus SA
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Gemplus SA
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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Abstract

本发明涉及电子组件的制造方法，该电子组件、例如芯片卡、至少包括一个埋设在卡载体(40)中的微电路(44)，该微电路包括与由端子(50，52)和/或天线构成的接口单元相连接的输出接点(46，48)，其特征在于：借助喷射器或类似装置沉积一种在其施加后仍保持柔性的低粘度导电材料来作成输出接点(46，48)及接口单元之间的连接部分(54)。有利地，使用一种填充了导电或本征导电粒子的聚合树脂。

Description

芯片卡或类似电子装置的制造方法
本发明涉及一种电子装置的制造，这种电子装置至少包括一个埋设在卡载体中并与由接线端子和/或天线构成的接口单元相连接的微电路，例如有触点或无触点的集成电路卡、亦称为芯片卡。
尤其是，本发明还可应用于电子标签，它们用于识别产品并可与无触点芯片卡相比较。
本发明更具体地涉及微电路及接口元件、如接线端子和/或天线之间连接的实现。
现在具有包括接口端子的有触点芯片卡，包括位于卡载体中的天线的无触点芯片卡以及包括接口端子和天线的混合卡或组合卡。
也已具有多种制造有触点芯片卡的方法。这些方法中的大多数是基于芯片在所谓微组件的子组件中的组装，后者是用传统方法组装的。
表示在图1中的第一种方法首先包括粘接芯片或微电路20(“模片固定”(“die attach”))，它包括：
将由板上锯得的芯片20其带有输出接点22的有源面朝上放置，并将其反面用铰粘在电支承板28上，胶可能是导电的，粘接在印刷电路或膜上实现。
然后，进行微接线或焊接连接(“线焊”(“wire bonding”))它在于：通过焊接来实现芯片20的输出接点22与印刷电路板上的触点端子24的连接。
最后，在外壳上进行涂层(“封装”(“potting”))，它在于使用树脂30保护芯片20及焊接线26，该树脂例如是基于硅或聚氨基甲酸酯的树脂。
在表示在图2中的该方法的一个变型中，使用了金属外围环32在树脂30的周围稳固微组件。
在该方法的另一变型(“倒装”(“flip-chip”))中，将设有凸块或突出部分(“bump”)的芯片以其有源面朝下，通过金属或聚合物凸块或者通过各向异性胶保证电连接。
在另外变型中，使用了带焊接技术(“带自动焊或“TAB”)，它表示在图3中，根据它芯片34被用各向异性胶36粘接，及通过热压使膜38的各个触点焊在包括凸块39的芯片34上。
还具有不使用微组件制造有触点芯片卡的方法，第一种方法是基于使用网板印刷以形成触点并保证与芯片的互连。
另一方面称为卡体三维金属化，然后使用传统的技术(胶加微接线)或通过上述“倒装”法移装芯片。
在使用微组件的方法中，相关的成本受到膜的价格的限制。此外，在封装制作后，常需要铣削树脂以减小装置厚度。这种方法实施困难，因为树脂被聚化并由此很硬。铣削是产品报废的主要原因。
在上述无微组件的另一方法中，芯片位于表面上，因此受到外部应力，并大大增加了相关成本。而无微组件的第二种方法中步骤数目多，这也增加了成本。
因此，不能考虑使用这种方法来制造大尺寸的芯片卡。
具有两大系列的无触点芯片卡的制造方法。第一系列使用线圈作的天线，天线或是焊在包括芯片的微组件上或是直接焊在包括凸块(“bump”)的芯片上。这种技术仅可使用在简单功能的芯片上。
第二系列借助一个“扁平”天线，它可具有矩形外围螺旋线形状或其它合适形状。这种天线可用照相制板法，机械刻制，压印(tampographie)，网板印刷或导电油墨胶板印刷。然后使用“倒装”技术或传统技术使芯片移置到天线上。
在这些制造无触点芯片卡的方法中，如上所述地，使用了微组件的制造，它包括多个芯片组装步骤并意味着成本高，或使用“倒装”法，其中制造速度受到限制及其组装成本特别高。
对于混合式芯片卡，其制造方法组合了上述有触点及无触点芯片卡的制造方法的缺点。
本发明的基本目的是，提供在一种电子装置(如芯片卡)中实现微电路及接口元件之间连接的方法，该电子装置至少包括一个埋设在卡载体中的微电路及微电路包括与由接线端子和/或天线构成的接口元件相连接的输出接点，该方法没有上述缺点并尤其可以降低成本及产品报废率及不用制作微组件。
根据本发明的方法其特征在于：借助喷射器或类似装置在每个输出接点及相应的接口元件之间沉积低粘度导电材料的滴块，所述导电材料受聚合作用，在其聚合后包括导电电荷及剩余柔性。
该方法允许去除微组件的制作及减少了多个制造步骤。
此外，本发明可获得柔性的连接，而公知类型的连接是刚性或半刚性的，这极大地减少了产品报废率。
有利地，接线端子也是通过低粘度导电材料的沉积实现的。
这就可以进一步简化该方法，即将端子及其连接在单个操作中完成。
有利地，天线也可以通过低粘度导电材料的沉积来实现。
这既可以简化制造又可改善天线性能。
最好，该材料是填充了导电或本征导电粒子的聚合树脂。
在阅读了以下的详细说明时本发明的另外特征及优点将会显现，而为了理解它们需参照附图，其附图为：
-图1是表示制造有触点芯片卡的公知方法的横截面图；
-图2表示图1中方法的一种变型；
-图3表示图1中方法的另一种变型；
-图4表示根据本发明的用于制造有触点芯片卡的方法的第一实施方式；
-图5表示图4中方法的一种变型；
-图6表示用于制造无触点芯片卡的实施方式；
-图7至10表示图6中方法的一个变型；
-图11表示用于制造混合式芯片卡的一个实施方式；
-图12及13表示用于制造电子标签的一个实施方式。
图4表示根据本发明的方法制造的一个有触点芯片卡。
在第一步骤中，制作一个包括凹腔42的卡体40，它可通过注射模制或通过热塑材料片的层压及随后机加工凹腔来实现。
在第二步骤中，将芯片44的有源面、具体地其输出接点46及48朝上地放置在凹腔中，及譬如用胶固定。也可以对凹腔加热，然后将芯片放置在由此熔化的热塑材料中。芯片的有源侧不需要与凹腔底部处于同一水平面上。
在第三步骤中，通过沉积一种低粘度导体材料实现触点端子与输出接点46及48之间的连接，该导电材料例如是一种填充了导电或本征导电粒子的聚合树脂，并使用所谓“散布”(“dispense”)技术沉积，其中使用可控流量及孔径的喷射器或类似装置施加液体或低粘度材料。
该沉积操作，以下称为“散布”，是譬如使用由美国公司“CamelotSystem Inc.”制造的并用于电子电路批量生产的、名称为CAM/ALOT的商业化设备来实现的。喷射器的移动及孔径参数受到计算机程序的控制。
导电树脂被这样地沉积，即它构成了作为芯片卡接口端子的触点50及52和这些触点50及52与芯片的输出接点47及48之间的连接部分54及56。这些沉积部分的厚度可比网报印刷方法的厚度大得多，这就可以获得较大的横截面及由此获得低接触电阻。
有利地，输出接点46及48包括不可氧化的金属化部分，例如镍、钛或钨。
也可在这些接点上设置凸块，以便改善电接触。
为了校正芯片放置误差，可使用由计算机辅助视觉系统(VAO)提供的芯片图象进行调节。
最好选择这样的树脂，它的活化温度低于卡体热塑材料的软化温度。
图5表示上述方法的一个变型，其中制出具有两个水平面的凹腔，这就是说凹腔58在其底部具有一个凹槽60，该凹槽的尺寸足以接收芯片44及其深度基本与芯片的厚度相同，以使得芯片的有源面处于凹腔58的底部62的水平面上。由于这种布置，可以避免在凹腔中树脂束带坡度的第二次改变，这就有利于导电树脂与输出接点46及48的接触。
在第四即最后步骤中，进行封装(potting)，它在于使用一种树脂如基于硅或聚氨基甲酸脂的树脂来保护芯片。
图6表示根据本发明的方法制造的一个无触点芯片卡，它包括由金属轨迹构成的扁平天线，该天线例如具有布置在卡外周上的矩形螺旋线的形状，如图9中所示。
在第一步骤中，使用传统的“模片固定”方法及设备及使用能粘在印刷电络或膜上的胶66使芯片64的源面朝上地粘在选择的连接位置上。选择一种能与天线载体的最高使用温度兼容的胶，例如为曝露在紫外线中时呈网状结构的胶。这种胶接操作的速度可以特别快，例如，每单个粘头每小时5至7千件。重要的是在朝着天线连接区68及70的芯片四周上胶的边缘应得到很好的控制。
在第二步骤中，用导电树脂实现芯片80的输出接点76及78与天线的连接区域68及70之间的电连接部分72及74。
该第二步骤也可用与芯片粘接步骤同样快的速度实现。这两个步骤也可用同样设备实现。
根据其一个变型，扁平天线可用“散布”技术及芯片粘接可用上述“倒装”法实施。
根据另一个表示在图7至10中的变型，首先固定芯片并通过芯片的有源面用“散布”技术制作天线。
在第一步骤(图7)中，将一种绝缘胶82、例如环氧树脂类型的胶散布到一个载体84上随后要粘接带有触点凸块的芯片的地方，该载体例如是由乙烯多氯化物或聚乙烯作成的。
可使用适合载体的用于“模片固定”技术的胶。
在第二步骤(图8)中，将芯片86的有源面朝上地设置在胶82上以实现“模片固定”类型的粘接。触点凸块的好处是改善了芯片输出接点88及90与天线之间的电接触。在不使用的输出接点上可以通过沉积一层介电漆产生一层绝缘。
在第三步骤(图9)中，借助使用譬如上述设备CAM/ALOT的喷射器的移动来散布导电材料的技术制造天线92，该导电材料例如为油墨或胶。
在图10中可以看到，构成天线92的矩形螺旋线圈的端子94及96分别覆盖了芯片86的触点88及90。
在最后即第四步骤中，作出共压层(colamination)操作以完成卡。
图11表示根据本发明方法制造的一个混合式芯片卡。在此情况下，将上述两种方法相结合。
在第一步骤中，制作一个包括具有两个触点101及103的内设天线99的卡体98。在第二步骤中，在卡体中制作一个凹腔100。在第三步骤中，将设有其有源面及其输出接点104的芯片102例如用胶固定在凹腔中，输出接点最好包括不能氧化的金属化部分。
在第四步骤中，使用“散布”技术通过沉积一种导电树脂105制作触点端子106及它们与芯片的输出接点104的连接部分108，以及天线触点101及103与输出接点104的连接部分105。接点104可包括触点凸块。
芯片102的角度放置误差可以如上所述地使用计算机辅助视觉装置来校正。
在第五即最后步骤中，实现芯片的封装。
本发明可应用来制造具有至少一个这样的微电路的所有电子装置，该微电路埋设在载体中并包括与设有端子和/或天线的接口单元相连接的输出接点。尤其是，本发明能够用于制造如图12及13中所示的电子标签。
载体110包括一个凹腔112，在凹腔的底部安装天线114。然后在这里将微电路116的输出接点118朝上地固定。借助散布技术施加树脂120，以实现天线114及芯片输出接点118之间的连接。然后使用绝缘树脂122进行封装。
可以看到，本发明可以取消微组件的制作，尤其是铣削加工。其结果是使产品报废率大为下降。
此外，减少了多个步骤，这就使制造大大地简化并引起成本费用的极大下降。由于某些芯片粘接及实现连接的操作可用相同设备完成，这些有利效果进一步增强。
本发明不使用昂贵的设备，由此也降低了生产成本。
通过散布技术制造天线能够获得最大面积，因此，与传统的内装线圈天线相比增强了天线性能。
本发明也允许以简单及廉价的方式制造复杂及大尺寸的卡。
借助在其活化后仍保留柔性的材料的“散布”技术来实现连接，可以减小卡的刚性并显著增加芯片卡的抗弯扭强度。并且，根据本发明的方法制造的芯片卡具有比目前标准卡所需的应力强度高得多。
如上所指出的，本发明能够实现高的制造速度，例如每小时4000个芯片卡的数量级，而报废率非常低。

Claims (19)

1.电子装置，如芯片卡的制造方法，该电子装置至少包括一个埋设在卡载体(24；40；84；98)中的微电路(20；44；80；86；102)，该微电路包括与内接线端子(28；50；52；106)和/或天线(70；92；99；103)构成的接口单元相连接的输出接点(22；36；46，48；76，78；88，90；104)，其特征在于：借助喷射器沉积一种在其施加后仍保持柔性的低粘度导电材料来作成输出接点(46，48；76，78；88，90；104)及接口单元之间的连接部分(54，56；72，74；105；108)。
2.根据权利要求1的方法，其特征在于：触点端子(106)也是通过沉积低粘度导电材料来实现的。
3.根据权利要求1的方法，其特征在于：天线(92)也是通过沉积低粘度导电材料来实现的。
4.根据权利要求1至3中任一项的方法，其特征在于：该材料是填充了导电粒子的聚合树脂。
5.根据权利要求1至3中任一项的方法，其特征在于：该材料是填充了本征导电粒子的聚合树脂。
6.根据权利要求1至3中任一项的方法，其特征在于：低粘度导电材料的沉积是通过电子装置和喷射器的相对移动来实现的。
7.根据权利要求6的方法，其特征在于：该移动受计算机程序的控制。
8.根据权利要求7的方法，其特征在于：利用计算机辅助视觉系统进行图象捕获来实现位置校正。
9.根据权利要求4的方法，其特征在于：该材料的活化温度低于构成卡体的热塑材料的软化温度。
10.根据权利要求1至3中任一项的方法，其特征在于：输出端子包括不会氧化的金属化部分。
11.根据权利要求2的方法，其特征在于：该装置是一种有触点芯片卡；包括凹胶(42)的卡体(40)；将微电路(44)以其有源面朝上地固定在该凹腔(42)中；通过沉积导电材料制作端子(50，52)及连接部分(54，56)及进行微电路的封装。
12.根据权利要求11的有触点芯片卡制造方法，其特征在于：微电路包括触点凸块。
13.根据权利要求11的有触点芯片卡制造方法，其特征在于：凹腔(58)在其底部(62)具有一个凹槽(60)，用于接收一个微电路(44)。
14.根据权利要求1的方法，其特征在于：该装置是一种无触点芯片卡或电子标签；制作一个扁平天线；将微电路(64)以其有源面朝上地固定在卡上；及通过沉积低粘度导电材料作成微电路的输出接点(76，78)及天线接点(68，70)之间的连接部分(72，74)。
15.根据权利要求3的方法，其特征在于：该装置是一种无触点芯片卡或电子标签；通过沉积低粘度导电材料作成一个扁平天线(92)；在微电路上作成触点凸块及将微电路以其有源面朝下地固定。
16.根据权利要求3的方法，其特征在于：该装置是一种无触点芯片卡或电子标签；借助喷射器或类似装置在载体(84)上沉积一层绝缘胶(182)；将微电路(86)以其有源面朝上地粘接；通过沉积一种低粘度导电材料直接地在微电路(86)上作成一个扁平天线(92)；及完成共压层的最后操作。
17.根据权利要求2的方法，其特征在于：该装置是一种混合式芯片卡；制作一个包括内设天线(99)的卡体(98)；在卡体(98)中制作一个凹腔(100)；将微电路(102)以其有源面朝上地固定在该凹腔中；通过沉积一种低粘度导电材料制成端子(106)及其连接部分(108)及进行封装。
18.根据权利要求17的混合式芯片卡的制造方法，其特征在于：该微电路包括触点凸块。
19.根据权利要求17的混合式芯片卡的制造方法，其特征在于：沉积一种低粘度导电材料，及借助一个计算机辅助视觉系统作出对微电路的角度位置误差的校正。
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