ATE385001T1 - Verfahren zur herstellung einer rfid-antenne - Google Patents

Verfahren zur herstellung einer rfid-antenne

Info

Publication number
ATE385001T1
ATE385001T1 AT05774628T AT05774628T ATE385001T1 AT E385001 T1 ATE385001 T1 AT E385001T1 AT 05774628 T AT05774628 T AT 05774628T AT 05774628 T AT05774628 T AT 05774628T AT E385001 T1 ATE385001 T1 AT E385001T1
Authority
AT
Austria
Prior art keywords
antenna
process support
antenna structure
negative
support coating
Prior art date
Application number
AT05774628T
Other languages
English (en)
Inventor
Gerald Schaffler
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE385001T1 publication Critical patent/ATE385001T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
AT05774628T 2004-08-31 2005-08-17 Verfahren zur herstellung einer rfid-antenne ATE385001T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04104159 2004-08-31

Publications (1)

Publication Number Publication Date
ATE385001T1 true ATE385001T1 (de) 2008-02-15

Family

ID=35079461

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05774628T ATE385001T1 (de) 2004-08-31 2005-08-17 Verfahren zur herstellung einer rfid-antenne

Country Status (7)

Country Link
US (1) US20100026442A1 (de)
EP (1) EP1789912B1 (de)
JP (1) JP2008512019A (de)
CN (1) CN100504917C (de)
AT (1) ATE385001T1 (de)
DE (1) DE602005004562T2 (de)
WO (1) WO2006024980A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7605056B2 (en) * 2005-05-31 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device including separation by physical force
DE102006054449A1 (de) * 2006-11-16 2008-05-21 Smartrac Ip B.V. Transpondereinheit
KR100999798B1 (ko) * 2010-02-11 2010-12-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
FR2962579A1 (fr) * 2010-07-12 2012-01-13 Ask Sa Dispositif d'identification radio frequence en polycarbonate et son procede de fabrication

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2963748A (en) * 1957-05-27 1960-12-13 Young Lawrence John Printed circuits
JPH02141233A (ja) * 1988-11-22 1990-05-30 Toyo Metaraijingu Kk プリント配線板用積層転写フィルム
JPH05309963A (ja) * 1992-05-14 1993-11-22 Matsushita Electric Ind Co Ltd 印刷用凹版および印刷方法
JPH06181380A (ja) * 1992-06-02 1994-06-28 Ibiden Co Ltd 表面実装用基板およびその製造方法
JPH06183165A (ja) * 1992-12-18 1994-07-05 Fujitsu Ltd メタルマスク及びその製造方法
JPH09139564A (ja) * 1995-11-15 1997-05-27 Dainippon Printing Co Ltd 厚膜配線及びその形成方法
DE19637018A1 (de) * 1996-09-12 1998-03-19 Bayer Ag Verfahren zur Herstellung von starren und flexiblen Schaltungen
JP3697859B2 (ja) * 1997-10-06 2005-09-21 松下電器産業株式会社 微細パターンの製造方法
FR2761497B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Procede de fabrication d'une carte a puce ou analogue
JPH11135919A (ja) * 1997-10-27 1999-05-21 Dainippon Printing Co Ltd 回路パターン形成方法、回路パターン形成シートおよび回路パターン
US6618939B2 (en) * 1998-02-27 2003-09-16 Kabushiki Kaisha Miyake Process for producing resonant tag
US6320556B1 (en) * 2000-01-19 2001-11-20 Moore North America, Inc. RFID foil or film antennas
US6476775B1 (en) * 2000-03-13 2002-11-05 Rcd Technology Corporation Method for forming radio frequency antenna
DE10016037B4 (de) * 2000-03-31 2005-01-05 Interlock Ag Verfahren zur Herstellung eines Etiketts oder einer Chipkarte
EP1191127B1 (de) * 2000-09-26 2004-10-13 Enthone-OMI (Deutschland) GmbH Verfahren zur selektiven Metallisierung dielektrischer Materialien
KR20040028635A (ko) * 2001-07-31 2004-04-03 코닌클리케 필립스 일렉트로닉스 엔.브이. 접점 어레이를 포함하는 데이터 캐리어
US6805940B2 (en) * 2001-09-10 2004-10-19 3M Innovative Properties Company Method for making conductive circuits using powdered metals
JP4106237B2 (ja) * 2002-05-22 2008-06-25 株式会社アルバック 基板上の堆積膜の剥離方法
KR100581221B1 (ko) * 2004-06-30 2006-05-22 삼성전자주식회사 테이프 배선 기판 제조 방법
DE102005016511B4 (de) * 2005-04-11 2008-09-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen einer Leiterstruktur auf einem Substrat

Also Published As

Publication number Publication date
EP1789912B1 (de) 2008-01-23
JP2008512019A (ja) 2008-04-17
DE602005004562D1 (de) 2008-03-13
WO2006024980A1 (en) 2006-03-09
CN100504917C (zh) 2009-06-24
CN101048787A (zh) 2007-10-03
DE602005004562T2 (de) 2009-01-22
US20100026442A1 (en) 2010-02-04
EP1789912A1 (de) 2007-05-30

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