BRPI9808425A8 - método de fabricação de cartão de microplaqueta ou dispositivo eletrônico análogo - Google Patents

método de fabricação de cartão de microplaqueta ou dispositivo eletrônico análogo

Info

Publication number
BRPI9808425A8
BRPI9808425A8 BRPI9808425A BRPI9808425A BRPI9808425A8 BR PI9808425 A8 BRPI9808425 A8 BR PI9808425A8 BR PI9808425 A BRPI9808425 A BR PI9808425A BR PI9808425 A BRPI9808425 A BR PI9808425A BR PI9808425 A8 BRPI9808425 A8 BR PI9808425A8
Authority
BR
Brazil
Prior art keywords
electronic device
chip card
analog electronic
card manufacturing
manufacturing
Prior art date
Application number
BRPI9808425A
Other languages
English (en)
Inventor
Fidalgo Jean-Christophe
Patrice Philippe
Blanc Rene-Paul
Original Assignee
Axalto Sa
Gemalto Sa
Gemplus Card Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axalto Sa, Gemalto Sa, Gemplus Card Int filed Critical Axalto Sa
Publication of BRPI9808425A8 publication Critical patent/BRPI9808425A8/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
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    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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    • H01L2924/01059—Praseodymium [Pr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

resumo da patente de invenção <b>"método de fabricação de cartão de microplaqueta ou dispositivo eletrônico análogo"<d> a invenção tem como objeto um método de fabricação de um dispositivo eletrônico, tal como um cartão de microplaqueta, que compreende pelo menos um microcircuito (44) imerso em um cartão suporte (40) e que comporta pinos de saída (46, 48) ligados a elementos de interface constituídos por um conjunto de terminais (50, 52) e/ou uma antena, caracterizado pelo fato de que são realizadas conexões (54) entre os pinos de saída (46, 48) e os elementos de interface por depósito, por meio de uma seringa ou similar, de uma substância condutora de baixa viscosidade, que permanece flexível após a aplicação. vantajosamente, utiliza-se uma resina polimérica carregada de partículas condutoras ou intrinsecamente condutoras.
BRPI9808425A 1997-03-27 1998-03-25 método de fabricação de cartão de microplaqueta ou dispositivo eletrônico análogo BRPI9808425A8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9704093A FR2761497B1 (fr) 1997-03-27 1997-03-27 Procede de fabrication d'une carte a puce ou analogue
PCT/FR1998/000592 WO1998044452A1 (fr) 1997-03-27 1998-03-25 Procede de fabrication de carte a puce ou dispositif electronique analogue

Publications (1)

Publication Number Publication Date
BRPI9808425A8 true BRPI9808425A8 (pt) 2018-06-19

Family

ID=9505497

Family Applications (2)

Application Number Title Priority Date Filing Date
BRPI9808425A BRPI9808425A8 (pt) 1997-03-27 1998-03-25 método de fabricação de cartão de microplaqueta ou dispositivo eletrônico análogo
BR9808425-9A BR9808425A (pt) 1997-03-27 1998-03-25 entre os pinos de saída (46, 48) e os elementos de interface por depósito, por meio de uma seringa ou similar, de uma substância condutora de baixa viscosidade, que permanece flexível após a aplicação. vantajosamente, utiliza-se uma resina polimérica carregada de partículas condutoras ou intrinsecamente condutoras.

Family Applications After (1)

Application Number Title Priority Date Filing Date
BR9808425-9A BR9808425A (pt) 1997-03-27 1998-03-25 entre os pinos de saída (46, 48) e os elementos de interface por depósito, por meio de uma seringa ou similar, de uma substância condutora de baixa viscosidade, que permanece flexível após a aplicação. vantajosamente, utiliza-se uma resina polimérica carregada de partículas condutoras ou intrinsecamente condutoras.

Country Status (14)

Country Link
US (2) US6468835B1 (pt)
EP (2) EP1260938B1 (pt)
JP (1) JP3430339B2 (pt)
KR (1) KR100568042B1 (pt)
CN (1) CN1183485C (pt)
AU (1) AU735162B2 (pt)
BR (2) BRPI9808425A8 (pt)
CA (1) CA2283696C (pt)
DE (2) DE69820684T2 (pt)
ES (2) ES2185161T3 (pt)
FR (1) FR2761497B1 (pt)
HK (1) HK1028834A1 (pt)
RU (1) RU2196356C2 (pt)
WO (1) WO1998044452A1 (pt)

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DE69820684D1 (de) 2004-01-29
DE69820684T2 (de) 2004-09-30
US6468835B1 (en) 2002-10-22
US20030020182A1 (en) 2003-01-30
EP1260938B1 (fr) 2003-12-17
DE69808605T2 (de) 2003-06-26
JP3430339B2 (ja) 2003-07-28
BR9808425A (pt) 2000-05-23
FR2761497A1 (fr) 1998-10-02
KR20010005637A (ko) 2001-01-15
KR100568042B1 (ko) 2006-04-07
JP2000513125A (ja) 2000-10-03
CN1257598A (zh) 2000-06-21
CA2283696A1 (fr) 1998-10-08
US6943437B2 (en) 2005-09-13
RU2196356C2 (ru) 2003-01-10
FR2761497B1 (fr) 1999-06-18
ES2185161T3 (es) 2003-04-16
DE69808605D1 (de) 2002-11-14
EP0970438A1 (fr) 2000-01-12
EP1260938A1 (fr) 2002-11-27
CA2283696C (fr) 2004-01-27
ES2213726T3 (es) 2004-09-01
HK1028834A1 (en) 2001-03-02
AU7050498A (en) 1998-10-22
WO1998044452A1 (fr) 1998-10-08
CN1183485C (zh) 2005-01-05
AU735162B2 (en) 2001-07-05
EP0970438B1 (fr) 2002-10-09

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