JP4839668B2 - 非接触icタグの製造方法 - Google Patents
非接触icタグの製造方法 Download PDFInfo
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- JP4839668B2 JP4839668B2 JP2005131157A JP2005131157A JP4839668B2 JP 4839668 B2 JP4839668 B2 JP 4839668B2 JP 2005131157 A JP2005131157 A JP 2005131157A JP 2005131157 A JP2005131157 A JP 2005131157A JP 4839668 B2 JP4839668 B2 JP 4839668B2
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- inlet
- chip
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Description
3‥‥非接触ICタグ
5‥‥非接触ICカード
6‥‥非接触IC付冊子
10‥‥アンテナコイル
10A‥‥アンテナコイルの一方の端子部
10B‥‥アンテナコイルの他方の端子部
14‥‥接着性発泡樹脂層
14A‥‥表面基材
14B‥‥裏面基材
15A‥‥上部外装基材
15B‥‥下部外装基材
16‥‥接着剤層
17‥‥アンテム
19‥‥バンプ
20‥‥ICチップ
30‥‥有機基板
60‥‥裏表紙
62‥‥裏貼紙
Claims (1)
- 有機基板上に固有の識別情報を格納したICチップを、該識別情報を送受信するアンテナに実装する非接触ICタグの製造方法であって、前記有機基板上の所定の領域にバンプが上になるようにしてICチップを配設し、導電ペーストを用いて前記アンテナの形成と同時に前記ICチップのバンプを覆うように該アンテナの一対の端子部を形成し、該導電ペーストに対して加熱等による後硬化を行いICチップを固定化させて非接触ICインレットとし、該非接触ICインレットを接着性発泡樹脂層を介して上部外装基材と下部外装基材とで挟み込んで貼着することを特徴とする非接触ICタグの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005131157A JP4839668B2 (ja) | 2005-04-28 | 2005-04-28 | 非接触icタグの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005131157A JP4839668B2 (ja) | 2005-04-28 | 2005-04-28 | 非接触icタグの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006309498A JP2006309498A (ja) | 2006-11-09 |
JP4839668B2 true JP4839668B2 (ja) | 2011-12-21 |
Family
ID=37476312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005131157A Expired - Fee Related JP4839668B2 (ja) | 2005-04-28 | 2005-04-28 | 非接触icタグの製造方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4839668B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018173875A (ja) * | 2017-03-31 | 2018-11-08 | サトーホールディングス株式会社 | Rfidインレット及びrfid媒体 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19642378C2 (de) * | 1996-10-14 | 2000-06-08 | Fraunhofer Ges Forschung | Kontaktlose Chipkarte |
FR2761497B1 (fr) * | 1997-03-27 | 1999-06-18 | Gemplus Card Int | Procede de fabrication d'une carte a puce ou analogue |
JP3661482B2 (ja) * | 1999-04-06 | 2005-06-15 | ソニーケミカル株式会社 | 半導体装置 |
JP2002341767A (ja) * | 2001-05-14 | 2002-11-29 | Sekisui Chem Co Ltd | Icカード、icタグの製造方法 |
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2005
- 2005-04-28 JP JP2005131157A patent/JP4839668B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2006309498A (ja) | 2006-11-09 |
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