CN113597452B - 非固化型导热性有机硅组合物 - Google Patents

非固化型导热性有机硅组合物 Download PDF

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Publication number
CN113597452B
CN113597452B CN202080017922.7A CN202080017922A CN113597452B CN 113597452 B CN113597452 B CN 113597452B CN 202080017922 A CN202080017922 A CN 202080017922A CN 113597452 B CN113597452 B CN 113597452B
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component
thermally conductive
silicone composition
conductive silicone
mass
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Chinese (zh)
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CN113597452A (zh
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北泽启太
户谷亘
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202080017922.7A 2019-03-04 2020-02-04 非固化型导热性有机硅组合物 Active CN113597452B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-038421 2019-03-04
JP2019038421A JP6959950B2 (ja) 2019-03-04 2019-03-04 非硬化型熱伝導性シリコーン組成物
PCT/JP2020/004191 WO2020179325A1 (ja) 2019-03-04 2020-02-04 非硬化型熱伝導性シリコーン組成物

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CN113597452A CN113597452A (zh) 2021-11-02
CN113597452B true CN113597452B (zh) 2023-03-31

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US (1) US11912869B2 (enExample)
EP (1) EP3936573B1 (enExample)
JP (1) JP6959950B2 (enExample)
KR (1) KR20210135235A (enExample)
CN (1) CN113597452B (enExample)
TW (1) TWI818154B (enExample)
WO (1) WO2020179325A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7325324B2 (ja) * 2019-12-23 2023-08-14 信越化学工業株式会社 熱伝導性シリコーン組成物
JP7632143B2 (ja) * 2021-07-14 2025-02-19 Jnc株式会社 シリコーン樹脂組成物

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4117028A (en) * 1977-04-21 1978-09-26 Dow Corning Corporation Non-curing silicone pressure sensitive adhesives
JPH08208993A (ja) * 1995-11-27 1996-08-13 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
JP2005015462A (ja) * 2003-05-30 2005-01-20 Lion Corp 毛髪化粧料
KR20090094761A (ko) * 2008-03-03 2009-09-08 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 그리스 조성물
CN101624514A (zh) * 2008-07-08 2010-01-13 信越化学工业株式会社 导热有机硅组合物
JP2010150399A (ja) * 2008-12-25 2010-07-08 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2010280806A (ja) * 2009-06-04 2010-12-16 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2015140395A (ja) * 2014-01-29 2015-08-03 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP2016079204A (ja) * 2014-10-10 2016-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN106414613A (zh) * 2014-04-09 2017-02-15 道康宁东丽株式会社 导热有机硅组合物和电气电子设备
CN107001802A (zh) * 2014-11-25 2017-08-01 信越化学工业株式会社 单液加成固化型有机硅组合物、其保存方法和固化方法
JP2018076423A (ja) * 2016-11-09 2018-05-17 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物、ならびに電子装置及びその製造方法
WO2019039468A1 (ja) * 2017-08-22 2019-02-28 大阪ガスケミカル株式会社 硬化性組成物およびその用途

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933094B1 (enExample) 1968-12-31 1974-09-04
JPS4913874B1 (enExample) 1969-08-29 1974-04-03
JPS4917380B1 (enExample) 1970-07-06 1974-04-30
JPS58366B2 (ja) 1973-10-06 1983-01-06 ソニー株式会社 表面材貼付方法
US4268452A (en) * 1980-03-10 1981-05-19 Toray Silicone Company, Ltd. Noncurable sealing materials
JP2623385B2 (ja) * 1991-08-07 1997-06-25 信越化学工業株式会社 シリコーンゴム粘土組成物
US5902854A (en) * 1996-09-27 1999-05-11 The Dow Chemical Company Polydimethylsiloxane containing polymer blends
JP2938429B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2938428B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性グリース組成物
US6136758A (en) * 1998-08-17 2000-10-24 Shin-Etsu Chemical Co., Ltd. Aluminum nitride powder and thermally conductive grease composition using the same
US6433055B1 (en) * 2000-09-13 2002-08-13 Dow Corning Corporation Electrically conductive hot-melt silicone adhesive composition
US6569914B2 (en) * 2001-04-27 2003-05-27 Wacker Silicones Corporation Additive for modifying the coefficient of friction of silicone release coatings and having low extractable silicone
JP3580366B2 (ja) 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP3952184B2 (ja) 2002-10-10 2007-08-01 信越化学工業株式会社 熱伝導性シート
JP4933094B2 (ja) * 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4917380B2 (ja) 2006-07-31 2012-04-18 信越化学工業株式会社 放熱用シリコーングリース組成物及びその製造方法
JP5283346B2 (ja) 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5233325B2 (ja) 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP4572243B2 (ja) 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
US8098418B2 (en) * 2009-03-03 2012-01-17 E. Ink Corporation Electro-optic displays, and color filters for use therein
JP4913874B2 (ja) 2010-01-18 2012-04-11 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5365572B2 (ja) * 2010-04-13 2013-12-11 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2013001670A (ja) 2011-06-15 2013-01-07 Shin-Etsu Chemical Co Ltd 有機ケイ素化合物及び室温硬化性オルガノポリシロキサン組成物
DE202011110267U1 (de) 2011-11-22 2013-03-26 Evonik Degussa Gmbh Zusammensetzung olefinisch funktionalisierter Siloxanoligomere basierend auf Alkoxysilanen
JP2014077278A (ja) * 2012-10-10 2014-05-01 Shin Etsu Chem Co Ltd コンクリート目地用非硬化性シーリング材、高架橋のコンクリート目地部の施工方法、及び高架橋のコンクリート目地
JP5832983B2 (ja) 2012-10-18 2015-12-16 信越化学工業株式会社 シリコーン組成物
JP6866877B2 (ja) * 2018-05-31 2021-04-28 信越化学工業株式会社 低熱抵抗シリコーン組成物

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4117028A (en) * 1977-04-21 1978-09-26 Dow Corning Corporation Non-curing silicone pressure sensitive adhesives
JPH08208993A (ja) * 1995-11-27 1996-08-13 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
JP2005015462A (ja) * 2003-05-30 2005-01-20 Lion Corp 毛髪化粧料
KR20090094761A (ko) * 2008-03-03 2009-09-08 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 그리스 조성물
JP2009209230A (ja) * 2008-03-03 2009-09-17 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
CN101624514A (zh) * 2008-07-08 2010-01-13 信越化学工业株式会社 导热有机硅组合物
JP2010150399A (ja) * 2008-12-25 2010-07-08 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2010280806A (ja) * 2009-06-04 2010-12-16 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2015140395A (ja) * 2014-01-29 2015-08-03 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN106414613A (zh) * 2014-04-09 2017-02-15 道康宁东丽株式会社 导热有机硅组合物和电气电子设备
JP2016079204A (ja) * 2014-10-10 2016-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN107001802A (zh) * 2014-11-25 2017-08-01 信越化学工业株式会社 单液加成固化型有机硅组合物、其保存方法和固化方法
JP2018076423A (ja) * 2016-11-09 2018-05-17 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物、ならびに電子装置及びその製造方法
WO2019039468A1 (ja) * 2017-08-22 2019-02-28 大阪ガスケミカル株式会社 硬化性組成物およびその用途

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JP6959950B2 (ja) 2021-11-05
JP2020143178A (ja) 2020-09-10
US11912869B2 (en) 2024-02-27
TWI818154B (zh) 2023-10-11
EP3936573B1 (en) 2024-04-03
TW202043369A (zh) 2020-12-01
KR20210135235A (ko) 2021-11-12
WO2020179325A1 (ja) 2020-09-10
US20220135799A1 (en) 2022-05-05
EP3936573A1 (en) 2022-01-12
EP3936573A4 (en) 2022-11-30
CN113597452A (zh) 2021-11-02

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