CN113302720A - 晶圆剥离清洗装置 - Google Patents

晶圆剥离清洗装置 Download PDF

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Publication number
CN113302720A
CN113302720A CN202080009605.0A CN202080009605A CN113302720A CN 113302720 A CN113302720 A CN 113302720A CN 202080009605 A CN202080009605 A CN 202080009605A CN 113302720 A CN113302720 A CN 113302720A
Authority
CN
China
Prior art keywords
wafer
peeling
chuck
wafers
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080009605.0A
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English (en)
Chinese (zh)
Inventor
宫成代三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of CN113302720A publication Critical patent/CN113302720A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202080009605.0A 2019-01-21 2020-01-20 晶圆剥离清洗装置 Pending CN113302720A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2019007570 2019-01-21
JP2019-007570 2019-01-21
JP2019-007568 2019-01-21
JP2019-007569 2019-01-21
JP2019007568 2019-01-21
JP2019007569 2019-01-21
PCT/JP2020/001753 WO2020153307A1 (ja) 2019-01-21 2020-01-20 ウェーハ剥離洗浄装置

Publications (1)

Publication Number Publication Date
CN113302720A true CN113302720A (zh) 2021-08-24

Family

ID=71735589

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080009605.0A Pending CN113302720A (zh) 2019-01-21 2020-01-20 晶圆剥离清洗装置

Country Status (4)

Country Link
JP (1) JP7504596B2 (ko)
KR (2) KR102654129B1 (ko)
CN (1) CN113302720A (ko)
WO (1) WO2020153307A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102507055B1 (ko) * 2022-10-28 2023-03-07 손귀욱 변위센서를 기반으로 한 웨이퍼 낱장 분리장치
KR102519871B1 (ko) * 2022-10-28 2023-04-11 손귀욱 반도체 웨이퍼 낱장 분리시스템
KR102507049B1 (ko) * 2022-10-28 2023-03-07 손귀욱 듀얼 박리 시스템을 기반으로 한 웨이퍼 낱장 분리장치

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022238A (ja) * 1996-06-29 1998-01-23 Komatsu Electron Metals Co Ltd 半導体ウェハのエアーブロー装置
JPH11288902A (ja) * 1998-04-01 1999-10-19 Tokyo Seimitsu Co Ltd ウェーハ剥離洗浄装置
JP2002016032A (ja) * 2000-06-30 2002-01-18 Yasunaga Corp ウェハー洗浄装置
JP2007119216A (ja) * 2005-10-31 2007-05-17 Toyama Kikai Kk 太陽電池セルの吸着装置
KR20110115881A (ko) * 2010-04-16 2011-10-24 금오공과대학교 산학협력단 워터젯을 이용한 태양전지용 실리콘 웨이퍼 박판 분리장치 및 이를 이용한 분리 방법
JP2011246211A (ja) * 2010-05-24 2011-12-08 Toyama Kikai Kk 太陽電池セルの移送装置およびその移送方法
JP2013082017A (ja) * 2011-10-06 2013-05-09 Kazuo Tanabe 固形接着剤を用いたウエーハの貼付方法及び貼付装置
CN104701215A (zh) * 2013-12-06 2015-06-10 松下知识产权经营株式会社 晶片剥离装置
JP2016027671A (ja) * 2015-10-14 2016-02-18 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208449A (ja) 1999-01-12 2000-07-28 Mitsubishi Materials Corp ウェ―ハの剥離方法および剥離装置
JP2001189293A (ja) 2000-01-05 2001-07-10 Enya Systems Ltd ウエ−ハ貼付方法及び装置
JP2002103262A (ja) 2000-09-27 2002-04-09 Nippei Toyama Corp 半導体ウェーハの吸着装置
JP3149712U (ja) * 2009-01-27 2009-04-09 株式会社チャレンジ ウエハ剥離装置
JP5909453B2 (ja) 2013-03-07 2016-04-26 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法
JP5849201B2 (ja) * 2013-05-28 2016-01-27 パナソニックＩｐマネジメント株式会社 切り残し部除去装置
JP6233570B2 (ja) 2013-10-03 2017-11-22 パナソニックＩｐマネジメント株式会社 ウエハ洗浄装置
JP6978840B2 (ja) 2017-02-28 2021-12-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板保持装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022238A (ja) * 1996-06-29 1998-01-23 Komatsu Electron Metals Co Ltd 半導体ウェハのエアーブロー装置
JPH11288902A (ja) * 1998-04-01 1999-10-19 Tokyo Seimitsu Co Ltd ウェーハ剥離洗浄装置
JP2002016032A (ja) * 2000-06-30 2002-01-18 Yasunaga Corp ウェハー洗浄装置
JP2007119216A (ja) * 2005-10-31 2007-05-17 Toyama Kikai Kk 太陽電池セルの吸着装置
KR20110115881A (ko) * 2010-04-16 2011-10-24 금오공과대학교 산학협력단 워터젯을 이용한 태양전지용 실리콘 웨이퍼 박판 분리장치 및 이를 이용한 분리 방법
JP2011246211A (ja) * 2010-05-24 2011-12-08 Toyama Kikai Kk 太陽電池セルの移送装置およびその移送方法
JP2013082017A (ja) * 2011-10-06 2013-05-09 Kazuo Tanabe 固形接着剤を用いたウエーハの貼付方法及び貼付装置
CN104701215A (zh) * 2013-12-06 2015-06-10 松下知识产权经营株式会社 晶片剥离装置
JP2016027671A (ja) * 2015-10-14 2016-02-18 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法

Also Published As

Publication number Publication date
KR102654129B1 (ko) 2024-04-04
KR20240007692A (ko) 2024-01-16
KR20210100185A (ko) 2021-08-13
JP2020120115A (ja) 2020-08-06
WO2020153307A1 (ja) 2020-07-30
JP7504596B2 (ja) 2024-06-24

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