CN1126614C - 轧制铜箔及其制造方法 - Google Patents
轧制铜箔及其制造方法 Download PDFInfo
- Publication number
- CN1126614C CN1126614C CN99106094A CN99106094A CN1126614C CN 1126614 C CN1126614 C CN 1126614C CN 99106094 A CN99106094 A CN 99106094A CN 99106094 A CN99106094 A CN 99106094A CN 1126614 C CN1126614 C CN 1126614C
- Authority
- CN
- China
- Prior art keywords
- copper foil
- annealing
- cold rolling
- rolled
- tough
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 239000011889 copper foil Substances 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000137 annealing Methods 0.000 claims abstract description 36
- 239000010949 copper Substances 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 238000005097 cold rolling Methods 0.000 claims abstract description 24
- 238000002441 X-ray diffraction Methods 0.000 claims abstract description 13
- 238000005452 bending Methods 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000005098 hot rolling Methods 0.000 claims description 6
- 238000002425 crystallisation Methods 0.000 claims description 4
- 230000008025 crystallization Effects 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 abstract description 21
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 abstract description 3
- 239000001301 oxygen Substances 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract description 3
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000000523 sample Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000001953 recrystallisation Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000006101 laboratory sample Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Metal Rolling (AREA)
- Conductive Materials (AREA)
Abstract
Description
序号 | 铜材料 | 最后退火条件 | 最后轧制压下率(%) | 加热200℃30分钟后 | |||||
炉温(℃) | 加热时间(秒) | 晶粒尺寸(μm) | I/Io | 弯曲寿命(弯曲循环数) | 延伸率(%) | ||||
发明例子 | 1 | 韧火精铜 | 800 | 20 | 8 | 95 | 50.7 | 64500 | 13.3 |
2 | 韧火精铜 | 800 | 30 | 15 | 95 | 37.2 | 51100 | 15.6 | |
3 | 韧火精铜 | 800 | 40 | 18 | 95 | 31.4 | 42800 | 16.4 | |
4 | 韧火精铜 | 700 | 40 | 10 | 93 | 39.1 | 40700 | 15.2 | |
5 | 韧火精铜 | 700 | 50 | 13 | 93 | 33.4 | 48700 | 16.2 | |
6 | 韧火精铜 | 700 | 60 | 17 | 93 | 25.7 | 39200 | 17.6 | |
7 | 韧火精铜 | 600 | 90 | 7 | 98 | 64.2 | 82800 | 12.0 | |
8 | 韧火精铜 | 600 | 150 | 15 | 98 | 48.8 | 72300 | 13.6 | |
9 | 韧火精铜 | 500 | 300 | 8 | 92 | 39.1 | 49300 | 15.2 | |
10 | 无氧铜 | 500 | 600 | 11 | 92 | 33.4 | 32800 | 16.3 | |
11 | 无氧铜 | 800 | 30 | 15 | 95 | 37.2 | 68000 | 15.3 | |
12 | 无氧铜 | 700 | 60 | 17 | 93 | 25.7 | 45300 | 17.6 | |
13 | 无氧铜 | 600 | 90 | 7 | 98 | 64.2 | 93200 | 11.6 | |
14 | 无氧铜 | 500 | 600 | 11 | 92 | 33.4 | 59200 | 16.1 | |
比较例子 | 1 | 韧火精铜 | 800 | 10 | 3 | 95 | 60.3 | 85400 | 6.2 |
2 | 无氧铜 | 800 | 60 | 27 | 95 | 14.1 | 19700 | 19.4 | |
3 | 无氧铜 | 700 | 20 | 3 | 94 | 56.5 | 91600 | 7.7 | |
4 | 韧火精铜 | 350 | 1200 | 4 | 93 | 50.7 | 72700 | 8.4 | |
5 | 无氧铜 | 800 | 30 | 15 | 88 | 10.3 | 17600 | 20.1 | |
6 | 韧火精铜 | 700 | 60 | 17 | 85 | 6.2 | 7300 | 23.9 | |
7 | 韧火精铜 | 800 | 10 | 3 | 98 | 73.7 | 92500 | 7.1 |
Claims (2)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP101858/98 | 1998-03-31 | ||
JP101858/1998 | 1998-03-31 | ||
JP10101858A JP3009383B2 (ja) | 1998-03-31 | 1998-03-31 | 圧延銅箔およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1237489A CN1237489A (zh) | 1999-12-08 |
CN1126614C true CN1126614C (zh) | 2003-11-05 |
Family
ID=14311725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN99106094A Expired - Fee Related CN1126614C (zh) | 1998-03-31 | 1999-03-31 | 轧制铜箔及其制造方法 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP3009383B2 (zh) |
KR (1) | KR19990078447A (zh) |
CN (1) | CN1126614C (zh) |
DE (1) | DE19914520C2 (zh) |
MY (1) | MY119946A (zh) |
TW (1) | TW541347B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102574364A (zh) * | 2009-10-30 | 2012-07-11 | Jx日矿日石金属株式会社 | 两面覆铜叠层板的制造方法、和在该制造方法中使用的一组铜或铜合金箔 |
CN102573287A (zh) * | 2010-10-28 | 2012-07-11 | Jx日矿日石金属株式会社 | 轧制铜箔 |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4524471B2 (ja) | 2004-08-30 | 2010-08-18 | Dowaメタルテック株式会社 | 銅合金箔およびその製造法 |
JP4756194B2 (ja) * | 2005-02-22 | 2011-08-24 | 新日鐵化学株式会社 | 銅張積層板の製造方法 |
JP4522972B2 (ja) * | 2005-04-28 | 2010-08-11 | 日鉱金属株式会社 | 銅張積層基板用高光沢圧延銅箔 |
WO2008050584A1 (fr) * | 2006-10-24 | 2008-05-02 | Nippon Mining & Metals Co., Ltd. | Feuille de cuivre enroulee presentant une excellente resistance a la flexion |
US7789977B2 (en) | 2006-10-26 | 2010-09-07 | Hitachi Cable, Ltd. | Rolled copper foil and manufacturing method thereof |
JP4466688B2 (ja) | 2007-07-11 | 2010-05-26 | 日立電線株式会社 | 圧延銅箔 |
JP4656100B2 (ja) * | 2007-07-23 | 2011-03-23 | 日立電線株式会社 | 太陽電池用はんだめっき線及びその製造方法 |
JP2009113475A (ja) * | 2007-10-18 | 2009-05-28 | Shin Etsu Chem Co Ltd | フレキシブル片面ポリイミド銅張積層板の製造方法 |
JP5055088B2 (ja) * | 2007-10-31 | 2012-10-24 | Jx日鉱日石金属株式会社 | 銅箔及びそれを用いたフレキシブルプリント基板 |
JP2009158382A (ja) * | 2007-12-27 | 2009-07-16 | Hitachi Cable Ltd | 銅箔 |
JP5320638B2 (ja) * | 2008-01-08 | 2013-10-23 | 株式会社Shカッパープロダクツ | 圧延銅箔およびその製造方法 |
EP2747527A1 (en) | 2008-06-30 | 2014-06-25 | Nippon Steel & Sumikin Chemical Co., Ltd. | Flexible circuit board and bend structure and device comprising the flexible circuit board |
JP2010121154A (ja) * | 2008-11-18 | 2010-06-03 | Hitachi Cable Ltd | 圧延銅箔の製造方法および圧延銅箔 |
US9079378B2 (en) | 2009-03-31 | 2015-07-14 | Jx Nippon Mining & Metals Corporation | Electromagnetic shielding material and method of producing electromagnetic shielding material |
JP2010280191A (ja) * | 2009-06-08 | 2010-12-16 | Hitachi Cable Ltd | 熱処理用銅箔、熱処理用銅箔の製造方法およびフレキシブルプリント配線板 |
JP2011094200A (ja) * | 2009-10-30 | 2011-05-12 | Jx Nippon Mining & Metals Corp | 銅又は銅合金箔、及びそれを用いた両面銅張積層板の製造方法 |
JP5094834B2 (ja) * | 2009-12-28 | 2012-12-12 | Jx日鉱日石金属株式会社 | 銅箔の製造方法、銅箔及び銅張積層板 |
JP4932974B2 (ja) * | 2010-03-17 | 2012-05-16 | 新日本製鐵株式会社 | 金属テープ材料、及び太陽電池集電用インターコネクター |
JP5325175B2 (ja) | 2010-07-15 | 2013-10-23 | Jx日鉱日石金属株式会社 | 銅箔複合体、及び成形体の製造方法 |
JP5411357B2 (ja) * | 2010-09-28 | 2014-02-12 | Jx日鉱日石金属株式会社 | 圧延銅箔 |
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CN102319733B (zh) * | 2011-01-18 | 2014-04-16 | 菏泽广源铜带股份有限公司 | 一种无压延针孔的紫铜压延铜箔的生产工艺 |
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EP2679384B1 (en) | 2011-03-31 | 2015-05-13 | JX Nippon Mining & Metals Corporation | Metallic foil composite, flexible printed circuit board using same, molded body, and manufacturing method for molded body |
KR101529417B1 (ko) | 2011-05-13 | 2015-06-16 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 구리박 복합체 및 그에 사용되는 구리박, 그리고 성형체 및 그 제조 방법 |
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JP5753115B2 (ja) * | 2012-03-12 | 2015-07-22 | Jx日鉱日石金属株式会社 | プリント配線板用圧延銅箔 |
JP5826160B2 (ja) * | 2012-04-10 | 2015-12-02 | Jx日鉱日石金属株式会社 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
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JP5201432B1 (ja) | 2012-05-17 | 2013-06-05 | 日立電線株式会社 | 圧延銅箔 |
CN102688885B (zh) * | 2012-06-13 | 2014-07-30 | 中南大学 | 一种叠层法同步冷轧铁箔的制备方法 |
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US9883588B2 (en) | 2014-12-12 | 2018-01-30 | Nippon Steel & Sumitomo Metal Corporation | Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device |
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CN107960140B (zh) | 2016-08-16 | 2020-12-25 | 古河电气工业株式会社 | 旋转连接器装置 |
JP6712561B2 (ja) * | 2017-03-21 | 2020-06-24 | Jx金属株式会社 | フレキシブルプリント基板用圧延銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
CN107723524A (zh) * | 2017-11-10 | 2018-02-23 | 安徽华中天力铝业有限公司 | 一种8150电解铝液合金箔及其生产工艺 |
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TWI777760B (zh) * | 2021-08-09 | 2022-09-11 | 頎邦科技股份有限公司 | 具散熱片之軟性電路板及其散熱片 |
-
1998
- 1998-03-31 JP JP10101858A patent/JP3009383B2/ja not_active Expired - Fee Related
-
1999
- 1999-03-29 TW TW088104909A patent/TW541347B/zh not_active IP Right Cessation
- 1999-03-30 DE DE19914520A patent/DE19914520C2/de not_active Expired - Fee Related
- 1999-03-30 MY MYPI99001200A patent/MY119946A/en unknown
- 1999-03-31 KR KR1019990011347A patent/KR19990078447A/ko not_active Application Discontinuation
- 1999-03-31 CN CN99106094A patent/CN1126614C/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102574364A (zh) * | 2009-10-30 | 2012-07-11 | Jx日矿日石金属株式会社 | 两面覆铜叠层板的制造方法、和在该制造方法中使用的一组铜或铜合金箔 |
CN102574364B (zh) * | 2009-10-30 | 2014-09-10 | Jx日矿日石金属株式会社 | 两面覆铜叠层板的制造方法、和在该制造方法中使用的一组铜或铜合金箔 |
CN102573287A (zh) * | 2010-10-28 | 2012-07-11 | Jx日矿日石金属株式会社 | 轧制铜箔 |
CN102573287B (zh) * | 2010-10-28 | 2014-09-17 | Jx日矿日石金属株式会社 | 轧制铜箔 |
Also Published As
Publication number | Publication date |
---|---|
DE19914520A1 (de) | 1999-10-07 |
MY119946A (en) | 2005-08-30 |
CN1237489A (zh) | 1999-12-08 |
DE19914520C2 (de) | 2002-11-21 |
JPH11286760A (ja) | 1999-10-19 |
TW541347B (en) | 2003-07-11 |
JP3009383B2 (ja) | 2000-02-14 |
KR19990078447A (ko) | 1999-10-25 |
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