MY119946A - Rolled copper foil and method of manufacturing the same - Google Patents

Rolled copper foil and method of manufacturing the same

Info

Publication number
MY119946A
MY119946A MYPI99001200A MYPI9901200A MY119946A MY 119946 A MY119946 A MY 119946A MY PI99001200 A MYPI99001200 A MY PI99001200A MY PI9901200 A MYPI9901200 A MY PI9901200A MY 119946 A MY119946 A MY 119946A
Authority
MY
Malaysia
Prior art keywords
cold rolling
rolled copper
copper foil
rolled
manufacturing
Prior art date
Application number
MYPI99001200A
Inventor
Takaaki Hatano
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14311725&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY119946(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of MY119946A publication Critical patent/MY119946A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005—Copper or its alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Metal Rolling (AREA)
  • Conductive Materials (AREA)

Abstract

IMPROVEMENT OF THE FLEX RESISTANCE OF THE EXISTING ROLLED COPPER FOILS WITHOUT SACRIFICING THEIR OTHER PROPERTIES. A ROLLED COPPER FOIL OF EXCELLENT FLEX RESISTANCE HAVING A CUBE TEXTURE SUCH THAT, IN A STATE THERMALLY CONDITIONED AT 200°C FOR 30 MINUTES TO A RECRYSTALLIZED STRUCTURE, THE INTENSITY (I) OF 200 PLANE DETERMINED BY X-RAY DIFFRACTION OF THE ROLLED SURFACE IS I/IO>20 WITH RESPECT TO THE X-RAY DIFFRACTION INTENSITY (IO) OF 200 PLANE OF FINE COPPER POWDER. A METHOD OF MANUFACTURING THE ROLLED COPPER FOIL BY HOT ROLLING A COPPER INGOT, REPEATING COLD ROLLING AND ANNEALING ALTERNATELY, AND FINALLY COLD ROLLING THE WORK TO NOT MORE THAN 50 M IN THICKNESS, THE ANNEALING IMMEDIATELY BEFORE THE FINAL COLD ROLLING BEING PERFORMED UNDER CONDITIONS THAT ENABLE THE ANNEALED RECRYSTALLIZED GRAINS TO HAVE A MEAN GRAIN SIZE OF 5-20 M AND THE REDUCTION RATIO OF THE ENSUING FINAL COLD ROLLING IS SET TO NOT LESS THAN 90%.
MYPI99001200A 1998-03-31 1999-03-30 Rolled copper foil and method of manufacturing the same MY119946A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10101858A JP3009383B2 (en) 1998-03-31 1998-03-31 Rolled copper foil and method for producing the same

Publications (1)

Publication Number Publication Date
MY119946A true MY119946A (en) 2005-08-30

Family

ID=14311725

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI99001200A MY119946A (en) 1998-03-31 1999-03-30 Rolled copper foil and method of manufacturing the same

Country Status (6)

Country Link
JP (1) JP3009383B2 (en)
KR (1) KR19990078447A (en)
CN (1) CN1126614C (en)
DE (1) DE19914520C2 (en)
MY (1) MY119946A (en)
TW (1) TW541347B (en)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4524471B2 (en) 2004-08-30 2010-08-18 Ｄｏｗａメタルテック株式会社 Copper alloy foil and manufacturing method thereof
JP4756194B2 (en) * 2005-02-22 2011-08-24 新日鐵化学株式会社 Method for producing copper clad laminate
JP4522972B2 (en) * 2005-04-28 2010-08-11 日鉱金属株式会社 High gloss rolled copper foil for copper-clad laminates
WO2008050584A1 (en) * 2006-10-24 2008-05-02 Nippon Mining & Metals Co., Ltd. Rolled copper foil excellent in bending resistance
US7789977B2 (en) 2006-10-26 2010-09-07 Hitachi Cable, Ltd. Rolled copper foil and manufacturing method thereof
JP4466688B2 (en) 2007-07-11 2010-05-26 日立電線株式会社 Rolled copper foil
JP4656100B2 (en) * 2007-07-23 2011-03-23 日立電線株式会社 Solder-plated wire for solar cell and manufacturing method thereof
JP2009113475A (en) * 2007-10-18 2009-05-28 Shin Etsu Chem Co Ltd Method of producing flexible single-sided polyimide copper-clad laminate
JP5055088B2 (en) * 2007-10-31 2012-10-24 Ｊｘ日鉱日石金属株式会社 Copper foil and flexible printed circuit board using the same
JP2009158382A (en) * 2007-12-27 2009-07-16 Hitachi Cable Ltd Copper foil
JP5320638B2 (en) * 2008-01-08 2013-10-23 株式会社Ｓｈカッパープロダクツ Rolled copper foil and method for producing the same
US9060432B2 (en) 2008-06-30 2015-06-16 Nippon Steel & Sumikin Chemical Co., Ltd. Flexible circuit board and method for producing same and bend structure of flexible circuit board
JP2010121154A (en) * 2008-11-18 2010-06-03 Hitachi Cable Ltd Method for producing rolled copper foil and rolled copper foil
EP2416639B1 (en) 2009-03-31 2018-11-28 JX Nippon Mining & Metals Corporation Electromagnetic shielding material and process for producing electromagnetic shielding material
JP2010280191A (en) * 2009-06-08 2010-12-16 Hitachi Cable Ltd Copper foil for heat treatment, manufacturing method thereof and flexible printed wiring board
JP2011094200A (en) * 2009-10-30 2011-05-12 Jx Nippon Mining & Metals Corp Copper or copper alloy foil, and method for manufacturing double-sided copper-clad laminate using the same
JP2011093229A (en) * 2009-10-30 2011-05-12 Jx Nippon Mining & Metals Corp Method for manufacturing double-sided copper-clad laminated plate, and one set of copper or copper alloy foil used for the same
JP5094834B2 (en) * 2009-12-28 2012-12-12 Ｊｘ日鉱日石金属株式会社 Copper foil manufacturing method, copper foil and copper clad laminate
US9382603B2 (en) 2010-03-17 2016-07-05 Nippon Steel & Sumitomo Metal Corporation Metal tape material and interconnector for solar module current collection
JP5325175B2 (en) 2010-07-15 2013-10-23 Ｊｘ日鉱日石金属株式会社 Copper foil composite and method for producing molded body
WO2012043462A1 (en) * 2010-09-28 2012-04-05 Jx日鉱日石金属株式会社 Rolled copper foil
KR101376037B1 (en) * 2010-10-28 2014-03-19 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Rolled copper foil
AU2010364692A1 (en) * 2010-11-30 2013-05-30 Luvata Espoo Oy A new electrical conductor for attaching silicon wafers in photovoltaic modules
CN102319733B (en) * 2011-01-18 2014-04-16 菏泽广源铜带股份有限公司 Production process for red copper rolled copper foil without rolling needle hole
JP5411192B2 (en) * 2011-03-25 2014-02-12 Ｊｘ日鉱日石金属株式会社 Rolled copper foil and method for producing the same
CN103415635B (en) 2011-03-31 2016-07-06 新日铁住金化学株式会社 The manufacture method of Copper Foil, copper-clad laminated board, flexible circuit board and copper-clad laminated board
CN103429424B (en) 2011-03-31 2015-12-02 Jx日矿日石金属株式会社 Metal forming complex and use its flexible printing substrate and formed body and manufacture method thereof
EP2695733B1 (en) 2011-05-13 2020-09-16 JX Nippon Mining & Metals Corporation Copper foil composite, copper foil used for the same, formed product and method of producing the same
JP5752536B2 (en) * 2011-08-23 2015-07-22 Jx日鉱日石金属株式会社 Rolled copper foil
KR101635692B1 (en) 2012-01-13 2016-07-01 제이엑스금속주식회사 Copper foil composite, molded body, and method for producing same
BR112014017075A2 (en) 2012-01-13 2017-06-13 Jx Nippon Mining & Metals Corp copper foil, product formed and method of production thereof
JP5246526B1 (en) 2012-02-17 2013-07-24 日立電線株式会社 Rolled copper foil
JP5126436B1 (en) 2012-02-17 2013-01-23 日立電線株式会社 Rolled copper foil
JP5126435B1 (en) 2012-02-17 2013-01-23 日立電線株式会社 Rolled copper foil
JP5126434B1 (en) 2012-02-17 2013-01-23 日立電線株式会社 Rolled copper foil
JP5753115B2 (en) * 2012-03-12 2015-07-22 Jx日鉱日石金属株式会社 Rolled copper foil for printed wiring boards
JP5826160B2 (en) * 2012-04-10 2015-12-02 Jx日鉱日石金属株式会社 Rolled copper foil, copper-clad laminate, flexible printed wiring board and manufacturing method thereof
JP5201431B1 (en) 2012-05-17 2013-06-05 日立電線株式会社 Rolled copper foil
JP5201432B1 (en) 2012-05-17 2013-06-05 日立電線株式会社 Rolled copper foil
CN102688885B (en) * 2012-06-13 2014-07-30 中南大学 Preparation method for synchronously cold-rolling iron foil by using laminated method
CN102716908B (en) * 2012-07-04 2014-02-26 北京科技大学 Forming method of high-flexibility ultrathin rolled copper foil
JP5373941B1 (en) 2012-07-17 2013-12-18 株式会社Ｓｈカッパープロダクツ Rolled copper foil
JP5373940B1 (en) 2012-07-17 2013-12-18 株式会社Ｓｈカッパープロダクツ Rolled copper foil
JP6358340B2 (en) 2014-12-12 2018-07-18 新日鐵住金株式会社 Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device
JP6851963B2 (en) 2015-04-01 2021-03-31 古河電気工業株式会社 Manufacturing method of flat rolled copper foil, flexible flat cable, rotary connector and flat rolled copper foil
KR101721314B1 (en) 2015-05-21 2017-03-29 제이엑스금속주식회사 Rolled copper foil, copper clad laminate, and flexible printed board and electronic device
KR101792153B1 (en) * 2016-05-16 2017-10-31 엘에스전선 주식회사 Heating cable with excellent elasticity and flexibility
CN107960140B (en) * 2016-08-16 2020-12-25 古河电气工业株式会社 Rotary connector device
JP6712561B2 (en) * 2017-03-21 2020-06-24 Ｊｘ金属株式会社 Rolled copper foil for flexible printed circuit board, copper clad laminate using the same, flexible printed circuit board, and electronic device
CN107723524A (en) * 2017-11-10 2018-02-23 安徽华中天力铝业有限公司 A kind of 8150 electrolytic aluminium liquid Alloy Foils and its production technology
KR102106781B1 (en) * 2017-11-30 2020-05-06 성균관대학교산학협력단 Single-crystal metal thin film and preparing method thereof
TWI777760B (en) * 2021-08-09 2022-09-11 頎邦科技股份有限公司 Flexible printed circuit board with heat-dissipation plate and heat-dissipation plate thereof

Also Published As

Publication number Publication date
DE19914520A1 (en) 1999-10-07
TW541347B (en) 2003-07-11
CN1237489A (en) 1999-12-08
KR19990078447A (en) 1999-10-25
CN1126614C (en) 2003-11-05
JPH11286760A (en) 1999-10-19
DE19914520C2 (en) 2002-11-21
JP3009383B2 (en) 2000-02-14

Similar Documents

Publication Publication Date Title
MY119946A (en) Rolled copper foil and method of manufacturing the same
MY121846A (en) Rolled copper foil for flexible printed circuit and method of manufacturing the same
EP0716151A1 (en) High magnetic flux denscity, low iron loss, grainoriented electromagnetic steel sheet and a method for making
CA2271639A1 (en) Hot rolled steel sheet having ultra fine grains with improved formability, and production of hot rolled or cold rolled steel sheet
CA2288426A1 (en) Hot rolled steel sheet having an ultrafine grain structure and process for producing steel sheet
AU2002231713A1 (en) Process for the production of grain oriented electrical steel strips
RU96119243A (en) METHOD FOR PRODUCING ELECTRICAL SHEET STEEL WITH GLASS COATING
Mishin et al. Grain boundary ensembles due to grain growth in copper with strong recrystallization texture
JPS5677357A (en) High strength aluminum alloy conductor with superior wire drawability and its manufacture
JPS57120648A (en) Baking hardenable al alloy
EP1469088A3 (en) Method for manufacturing non-oriented electrical steel sheet having high magnetic flux density
CA2241824A1 (en) Bidirectional electromagnetic steel plate and method of manufacturing the same
JP5705107B2 (en) Rolled copper foil for superconducting film formation
CA2099697A1 (en) High Strength Aluminum Alloy for Forming Fin and Method of Manufacturing the Same
CA2204315A1 (en) Methods for making magnetic strips
JPS5616603A (en) Material for sliding bearing and its manufacture
JPS5713141A (en) Finely grained material for stringer of airplane with superior corrosion resistance and its manufacture
JPS5662944A (en) Aluminum alloy conductor and its manufacture
JPS5751249A (en) Manufacture of aluminum alloy plate with property of bright alumite and superior strength
JPS5698461A (en) Manufacture of al alloy plate for magnetic disk
JP5904869B2 (en) Method for producing rolled copper foil for superconducting film formation
Utsunomiya et al. Critical current density of rolled silver-sheathed Bi (2223) tapes
JPS575835A (en) High strength copper alloy having excellent heat resistance for use as conductive material
CA2048014A1 (en) Method of manufacturing an oriented silicon steel sheet having improved magnetic flux density
Catorceno et al. Annealing of cold and warm rolled az31b magnesium alloy sheets