CN102574364A - 两面覆铜叠层板的制造方法、和在该制造方法中使用的一组铜或铜合金箔 - Google Patents
两面覆铜叠层板的制造方法、和在该制造方法中使用的一组铜或铜合金箔 Download PDFInfo
- Publication number
- CN102574364A CN102574364A CN2010800495254A CN201080049525A CN102574364A CN 102574364 A CN102574364 A CN 102574364A CN 2010800495254 A CN2010800495254 A CN 2010800495254A CN 201080049525 A CN201080049525 A CN 201080049525A CN 102574364 A CN102574364 A CN 102574364A
- Authority
- CN
- China
- Prior art keywords
- copper
- alloy foil
- copper alloy
- bronze medal
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 154
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 61
- 239000010949 copper Substances 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 128
- 239000011888 foil Substances 0.000 title claims description 126
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 39
- 229910000906 Bronze Inorganic materials 0.000 claims description 110
- 239000010974 bronze Substances 0.000 claims description 110
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 110
- 238000003475 lamination Methods 0.000 claims description 20
- 238000013459 approach Methods 0.000 claims description 16
- 230000008602 contraction Effects 0.000 claims description 16
- 238000012360 testing method Methods 0.000 claims description 14
- 238000010792 warming Methods 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 abstract description 91
- 238000010438 heat treatment Methods 0.000 abstract description 23
- 238000000034 method Methods 0.000 abstract description 13
- 238000010030 laminating Methods 0.000 abstract 1
- 238000009864 tensile test Methods 0.000 abstract 1
- 238000005096 rolling process Methods 0.000 description 17
- 230000006835 compression Effects 0.000 description 11
- 238000007906 compression Methods 0.000 description 11
- 229920001721 polyimide Polymers 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920006259 thermoplastic polyimide Polymers 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 241001572350 Lycaena mariposa Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000005417 food ingredient Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000013324 preserved food Nutrition 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009250210A JP2011093229A (ja) | 2009-10-30 | 2009-10-30 | 両面銅張積層板の製造方法、及びそれに用いる1組の銅又は銅合金箔 |
JP2009-250210 | 2009-10-30 | ||
PCT/JP2010/068900 WO2011052557A1 (ja) | 2009-10-30 | 2010-10-26 | 両面銅張積層板の製造方法、及びそれに用いる1組の銅又は銅合金箔 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102574364A true CN102574364A (zh) | 2012-07-11 |
CN102574364B CN102574364B (zh) | 2014-09-10 |
Family
ID=43921981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080049525.4A Active CN102574364B (zh) | 2009-10-30 | 2010-10-26 | 两面覆铜叠层板的制造方法、和在该制造方法中使用的一组铜或铜合金箔 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2011093229A (zh) |
KR (1) | KR101375991B1 (zh) |
CN (1) | CN102574364B (zh) |
TW (1) | TWI473709B (zh) |
WO (1) | WO2011052557A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104754864A (zh) * | 2013-12-27 | 2015-07-01 | 新日铁住金化学株式会社 | 挠性覆铜积层板及挠性电路基板 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113386416B (zh) * | 2021-07-08 | 2022-12-16 | 江西柔顺科技有限公司 | 一种导热双面覆铜板及其制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000212661A (ja) * | 1998-11-17 | 2000-08-02 | Nippon Mining & Metals Co Ltd | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
CN1126614C (zh) * | 1998-03-31 | 2003-11-05 | 日矿金属株式会社 | 轧制铜箔及其制造方法 |
JP2005138310A (ja) * | 2003-11-04 | 2005-06-02 | Hitachi Cable Ltd | 電子部品用銅箔 |
JP2006117977A (ja) * | 2004-10-20 | 2006-05-11 | Sumitomo Kinzoku Kozan Shindo Kk | 圧延銅箔 |
JP2006237048A (ja) * | 2005-02-22 | 2006-09-07 | Nippon Steel Chem Co Ltd | 高屈曲特性を有する銅張積層板及びその製造方法 |
CN1905781A (zh) * | 2005-07-27 | 2007-01-31 | 新日铁化学株式会社 | 高弯曲性挠性覆铜积层板的制造方法 |
CN201307967Y (zh) * | 2008-12-02 | 2009-09-09 | 广东生益科技股份有限公司 | 双面挠性覆铜板 |
-
2009
- 2009-10-30 JP JP2009250210A patent/JP2011093229A/ja not_active Withdrawn
-
2010
- 2010-10-26 WO PCT/JP2010/068900 patent/WO2011052557A1/ja active Application Filing
- 2010-10-26 CN CN201080049525.4A patent/CN102574364B/zh active Active
- 2010-10-26 KR KR1020127011242A patent/KR101375991B1/ko active IP Right Grant
- 2010-10-28 TW TW99136888A patent/TWI473709B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1126614C (zh) * | 1998-03-31 | 2003-11-05 | 日矿金属株式会社 | 轧制铜箔及其制造方法 |
JP2000212661A (ja) * | 1998-11-17 | 2000-08-02 | Nippon Mining & Metals Co Ltd | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
JP2005138310A (ja) * | 2003-11-04 | 2005-06-02 | Hitachi Cable Ltd | 電子部品用銅箔 |
JP2006117977A (ja) * | 2004-10-20 | 2006-05-11 | Sumitomo Kinzoku Kozan Shindo Kk | 圧延銅箔 |
JP2006237048A (ja) * | 2005-02-22 | 2006-09-07 | Nippon Steel Chem Co Ltd | 高屈曲特性を有する銅張積層板及びその製造方法 |
CN1905781A (zh) * | 2005-07-27 | 2007-01-31 | 新日铁化学株式会社 | 高弯曲性挠性覆铜积层板的制造方法 |
CN201307967Y (zh) * | 2008-12-02 | 2009-09-09 | 广东生益科技股份有限公司 | 双面挠性覆铜板 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104754864A (zh) * | 2013-12-27 | 2015-07-01 | 新日铁住金化学株式会社 | 挠性覆铜积层板及挠性电路基板 |
CN104754864B (zh) * | 2013-12-27 | 2018-07-24 | 新日铁住金化学株式会社 | 挠性覆铜积层板及挠性电路基板 |
Also Published As
Publication number | Publication date |
---|---|
WO2011052557A1 (ja) | 2011-05-05 |
JP2011093229A (ja) | 2011-05-12 |
TWI473709B (zh) | 2015-02-21 |
CN102574364B (zh) | 2014-09-10 |
KR101375991B1 (ko) | 2014-03-18 |
TW201132494A (en) | 2011-10-01 |
KR20120079131A (ko) | 2012-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX NIPPON MINING & METALS CORPORATION |
|
CP01 | Change in the name or title of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |
|
CP02 | Change in the address of a patent holder |