CN102574364B - 两面覆铜叠层板的制造方法、和在该制造方法中使用的一组铜或铜合金箔 - Google Patents
两面覆铜叠层板的制造方法、和在该制造方法中使用的一组铜或铜合金箔 Download PDFInfo
- Publication number
- CN102574364B CN102574364B CN201080049525.4A CN201080049525A CN102574364B CN 102574364 B CN102574364 B CN 102574364B CN 201080049525 A CN201080049525 A CN 201080049525A CN 102574364 B CN102574364 B CN 102574364B
- Authority
- CN
- China
- Prior art keywords
- copper
- alloy foil
- copper alloy
- bronze medal
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-250210 | 2009-10-30 | ||
JP2009250210A JP2011093229A (ja) | 2009-10-30 | 2009-10-30 | 両面銅張積層板の製造方法、及びそれに用いる1組の銅又は銅合金箔 |
PCT/JP2010/068900 WO2011052557A1 (ja) | 2009-10-30 | 2010-10-26 | 両面銅張積層板の製造方法、及びそれに用いる1組の銅又は銅合金箔 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102574364A CN102574364A (zh) | 2012-07-11 |
CN102574364B true CN102574364B (zh) | 2014-09-10 |
Family
ID=43921981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080049525.4A Active CN102574364B (zh) | 2009-10-30 | 2010-10-26 | 两面覆铜叠层板的制造方法、和在该制造方法中使用的一组铜或铜合金箔 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2011093229A (zh) |
KR (1) | KR101375991B1 (zh) |
CN (1) | CN102574364B (zh) |
TW (1) | TWI473709B (zh) |
WO (1) | WO2011052557A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6344914B2 (ja) * | 2013-12-27 | 2018-06-20 | 新日鉄住金化学株式会社 | フレキシブル銅張積層板及びフレキシブル回路基板 |
CN113386416B (zh) * | 2021-07-08 | 2022-12-16 | 江西柔顺科技有限公司 | 一种导热双面覆铜板及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1126614C (zh) * | 1998-03-31 | 2003-11-05 | 日矿金属株式会社 | 轧制铜箔及其制造方法 |
CN1905781A (zh) * | 2005-07-27 | 2007-01-31 | 新日铁化学株式会社 | 高弯曲性挠性覆铜积层板的制造方法 |
CN201307967Y (zh) * | 2008-12-02 | 2009-09-09 | 广东生益科技股份有限公司 | 双面挠性覆铜板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3856582B2 (ja) * | 1998-11-17 | 2006-12-13 | 日鉱金属株式会社 | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
JP4254488B2 (ja) * | 2003-11-04 | 2009-04-15 | 日立電線株式会社 | 電子部品用銅箔及びその製造方法 |
JP4430509B2 (ja) * | 2004-10-20 | 2010-03-10 | 住友金属鉱山伸銅株式会社 | 圧延銅箔 |
JP4756194B2 (ja) | 2005-02-22 | 2011-08-24 | 新日鐵化学株式会社 | 銅張積層板の製造方法 |
-
2009
- 2009-10-30 JP JP2009250210A patent/JP2011093229A/ja not_active Withdrawn
-
2010
- 2010-10-26 WO PCT/JP2010/068900 patent/WO2011052557A1/ja active Application Filing
- 2010-10-26 CN CN201080049525.4A patent/CN102574364B/zh active Active
- 2010-10-26 KR KR1020127011242A patent/KR101375991B1/ko active IP Right Grant
- 2010-10-28 TW TW99136888A patent/TWI473709B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1126614C (zh) * | 1998-03-31 | 2003-11-05 | 日矿金属株式会社 | 轧制铜箔及其制造方法 |
CN1905781A (zh) * | 2005-07-27 | 2007-01-31 | 新日铁化学株式会社 | 高弯曲性挠性覆铜积层板的制造方法 |
CN201307967Y (zh) * | 2008-12-02 | 2009-09-09 | 广东生益科技股份有限公司 | 双面挠性覆铜板 |
Non-Patent Citations (4)
Title |
---|
JP特开2000-212661A 2000.08.02 |
JP特开2005-138310A 2005.06.02 |
JP特开2006-117977A 2006.05.11 |
JP特开2006-237048A 2006.09.07 |
Also Published As
Publication number | Publication date |
---|---|
TWI473709B (zh) | 2015-02-21 |
TW201132494A (en) | 2011-10-01 |
KR101375991B1 (ko) | 2014-03-18 |
WO2011052557A1 (ja) | 2011-05-05 |
JP2011093229A (ja) | 2011-05-12 |
KR20120079131A (ko) | 2012-07-11 |
CN102574364A (zh) | 2012-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX NIPPON MINING & METALS CORPORATION |
|
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |