KR101375991B1 - 양면 동장 적층판의 제조 방법, 및 그것에 사용하는 1 세트의 구리 또는 구리 합금박 - Google Patents
양면 동장 적층판의 제조 방법, 및 그것에 사용하는 1 세트의 구리 또는 구리 합금박 Download PDFInfo
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- KR101375991B1 KR101375991B1 KR1020127011242A KR20127011242A KR101375991B1 KR 101375991 B1 KR101375991 B1 KR 101375991B1 KR 1020127011242 A KR1020127011242 A KR 1020127011242A KR 20127011242 A KR20127011242 A KR 20127011242A KR 101375991 B1 KR101375991 B1 KR 101375991B1
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- Prior art keywords
- copper
- alloy foil
- foil
- copper alloy
- sided
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 265
- 239000010949 copper Substances 0.000 title claims abstract description 168
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 167
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000011888 foil Substances 0.000 title claims description 147
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 124
- 239000011347 resin Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000009864 tensile test Methods 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000010030 laminating Methods 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 abstract description 97
- 238000005452 bending Methods 0.000 abstract description 32
- 230000037303 wrinkles Effects 0.000 abstract description 25
- 238000001816 cooling Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 26
- 238000005096 rolling process Methods 0.000 description 13
- 229920001721 polyimide Polymers 0.000 description 9
- 239000011342 resin composition Substances 0.000 description 7
- 238000003475 lamination Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229920006259 thermoplastic polyimide Polymers 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 241001424392 Lucia limbaria Species 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000010731 rolling oil Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
도 2 는 양면 동장 적층판의 구성예를 나타낸 단면도이다.
도 3 은 양면 동장 적층판의 제조시에 가해지는 열에 의해, 제 1 구리 또는 구리 합금박에 주름 (절곡) 이 발생하는 상태를 나타낸 도면이다.
2a : 수지 조성물
4 : 제 1 구리 또는 구리 합금박
6 : 제 2 구리 또는 구리 합금박
8 : 양면 동장 적층판
Claims (3)
- 제 1 구리 또는 구리 합금박의 편면에 수지층을 형성하고, 편면 동장 적층판을 얻는 제 1 공정과, 상기 편면 동장 적층판의 상기 수지층측에 제 2 구리 또는 구리 합금박을 적층하여 가열해서 양면 동장 적층판을 얻는 제 2 공정을 갖는 양면 동장 적층판의 제조 방법으로서,
상기 제 1 구리 또는 구리 합금박의 응력 σA = EA × EB / (EA + EB) × (ΔLA - ΔLB) × 1000 으로 하고, 상기 제 2 구리 또는 구리 합금박의 응력 σB = EA × EB / (EA + EB) × (ΔLB - ΔLA) × 1000 으로 하고, σA 와 σB 중 부의 쪽을 σY 로 했을 때,|10 × σY| ≤ YSY 가 되는,
(단, EA : 상기 제 1 구리 또는 구리 합금박을 350 ℃ 에서 30 분간 유지하여 실온으로 냉각 후, 다시 350 ℃ 에서 30 분간 유지하여 실온으로 냉각시켰을 때의 폭 방향의 영률 (단위는 ㎬),
EB : 상기 제 2 구리 또는 구리 합금박을 350 ℃ 에서 30 분간 유지하여 실온으로 냉각시켰을 때의 폭방향의 영률 (단위는 ㎬),
ΔLA : 실온에서 350 ℃ 로 승온하고, 30 분간 유지하여 실온으로 냉각시켰을 때의 치수를 기준으로 하여, 다시 350 ℃ 에서 30 분간 유지하여 실온으로 냉각 후의 상기 제 1 구리 또는 구리 합금박의 폭방향의 치수 변화율 (단위는 ppm, 수축을 정의 값으로 함),
ΔLB : 실온에서 350 ℃ 로 승온하고, 30 분간 유지하여 실온으로 냉각 후의 상기 제 2 구리 또는 구리 합금박의 폭방향의 치수 변화율 (단위는 ppm, 수축을 정의 값으로 함),
YSY : 인장 시험에서의 0.2 % 내력으로, σA 와 σB 중 부의 쪽이 A 이면 YSA (단위는 ㎫) 를 선택하고, 반대의 경우에는 YSB (단위는 ㎫) 를 선택,
YSA : 인장 시험에서의 상기 제 1 구리 또는 구리 합금박의 0.2 % 내력,
YSB : 인장 시험에서의 상기 제 2 구리 또는 구리 합금박의 0.2 % 내력)
상기 제 1 구리 또는 구리 합금박 및 상기 제 2 구리 또는 구리 합금박을 사용하는 양면 동장 적층판의 제조 방법. - 제 1 항에 기재된 양면 동장 적층판의 제조 방법에 사용되며, 상기 제 1 구리 또는 구리 합금박 및 상기 제 2 구리 또는 구리 합금박의 조합으로 이루어지는 1 세트의 구리 또는 구리 합금박.
- 제 2 항에 있어서,
상기 제 2 구리 또는 구리 합금박의 ΔLB 가 145 ppm 이하인 1 세트의 구리 또는 구리 합금박.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2009-250210 | 2009-10-30 | ||
JP2009250210A JP2011093229A (ja) | 2009-10-30 | 2009-10-30 | 両面銅張積層板の製造方法、及びそれに用いる1組の銅又は銅合金箔 |
PCT/JP2010/068900 WO2011052557A1 (ja) | 2009-10-30 | 2010-10-26 | 両面銅張積層板の製造方法、及びそれに用いる1組の銅又は銅合金箔 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120079131A KR20120079131A (ko) | 2012-07-11 |
KR101375991B1 true KR101375991B1 (ko) | 2014-03-18 |
Family
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Application Number | Title | Priority Date | Filing Date |
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KR1020127011242A Active KR101375991B1 (ko) | 2009-10-30 | 2010-10-26 | 양면 동장 적층판의 제조 방법, 및 그것에 사용하는 1 세트의 구리 또는 구리 합금박 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2011093229A (ko) |
KR (1) | KR101375991B1 (ko) |
CN (1) | CN102574364B (ko) |
TW (1) | TWI473709B (ko) |
WO (1) | WO2011052557A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6344914B2 (ja) * | 2013-12-27 | 2018-06-20 | 新日鉄住金化学株式会社 | フレキシブル銅張積層板及びフレキシブル回路基板 |
CN113386416B (zh) * | 2021-07-08 | 2022-12-16 | 江西柔顺科技有限公司 | 一种导热双面覆铜板及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000212661A (ja) | 1998-11-17 | 2000-08-02 | Nippon Mining & Metals Co Ltd | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
JP2006117977A (ja) | 2004-10-20 | 2006-05-11 | Sumitomo Kinzoku Kozan Shindo Kk | 圧延銅箔 |
JP2006237048A (ja) | 2005-02-22 | 2006-09-07 | Nippon Steel Chem Co Ltd | 高屈曲特性を有する銅張積層板及びその製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3009383B2 (ja) * | 1998-03-31 | 2000-02-14 | 日鉱金属株式会社 | 圧延銅箔およびその製造方法 |
JP4254488B2 (ja) * | 2003-11-04 | 2009-04-15 | 日立電線株式会社 | 電子部品用銅箔及びその製造方法 |
TWI394659B (zh) * | 2005-07-27 | 2013-05-01 | Nippon Steel Chemical Co | 高屈曲性可撓性覆銅積層板之製造方法 |
CN201307967Y (zh) * | 2008-12-02 | 2009-09-09 | 广东生益科技股份有限公司 | 双面挠性覆铜板 |
-
2009
- 2009-10-30 JP JP2009250210A patent/JP2011093229A/ja not_active Withdrawn
-
2010
- 2010-10-26 KR KR1020127011242A patent/KR101375991B1/ko active Active
- 2010-10-26 CN CN201080049525.4A patent/CN102574364B/zh active Active
- 2010-10-26 WO PCT/JP2010/068900 patent/WO2011052557A1/ja active Application Filing
- 2010-10-28 TW TW99136888A patent/TWI473709B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000212661A (ja) | 1998-11-17 | 2000-08-02 | Nippon Mining & Metals Co Ltd | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
JP2006117977A (ja) | 2004-10-20 | 2006-05-11 | Sumitomo Kinzoku Kozan Shindo Kk | 圧延銅箔 |
JP2006237048A (ja) | 2005-02-22 | 2006-09-07 | Nippon Steel Chem Co Ltd | 高屈曲特性を有する銅張積層板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102574364A (zh) | 2012-07-11 |
CN102574364B (zh) | 2014-09-10 |
KR20120079131A (ko) | 2012-07-11 |
JP2011093229A (ja) | 2011-05-12 |
WO2011052557A1 (ja) | 2011-05-05 |
TWI473709B (zh) | 2015-02-21 |
TW201132494A (en) | 2011-10-01 |
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