TWI777760B - 具散熱片之軟性電路板及其散熱片 - Google Patents

具散熱片之軟性電路板及其散熱片 Download PDF

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TWI777760B
TWI777760B TW110133110A TW110133110A TWI777760B TW I777760 B TWI777760 B TW I777760B TW 110133110 A TW110133110 A TW 110133110A TW 110133110 A TW110133110 A TW 110133110A TW I777760 B TWI777760 B TW I777760B
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heat sink
circuit board
heat
flexible circuit
copper layer
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TW202308473A (zh
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謝依凌
李佩螢
李東昇
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頎邦科技股份有限公司
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Priority to US17/494,002 priority patent/US11503698B1/en
Priority to CN202111405025.6A priority patent/CN115707175A/zh
Priority to KR1020210163074A priority patent/KR20230022776A/ko
Priority to JP2021191367A priority patent/JP2023024926A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

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Abstract

一種具散熱片之軟性電路板包含一軟性基板、一電子元件及一散熱片，該軟性基板具有一上表面及一下表面，該電子元件設置於該軟性基板之該上表面，該散熱片設置於該軟性基板之該下表面，其中該散熱片具有一銅層，該銅層具有容積率不小於50%之結晶方向為米勒座標(1,0,0)的銅晶粒。

Description

具散熱片之軟性電路板及其散熱片
本發明是關於一種軟性電路板，特別是關於一種具散熱片之軟性電路板。
軟性電路板有著體積小、具可撓性、厚度薄之特性，而被廣泛地應用於手機、筆記型電腦、智慧手錶…等有著輕薄需求的行動裝置上，但也因為體積小，使得軟性電路板不易散熱，因此，目前軟性電路板會在背面貼上散熱片輔助散熱。請參閱第1圖，為習知一種軟性電路板400與一面板基板200及一控制電路板300連接的示意圖，在實際使用中，該軟性電路板400兩端分別電性連接該面板基板200及該控制電路板300，以將控制電路板300輸入之訊號經過處理後傳送至該面板基板200進行控制，其中，該軟性電路板400會因為安裝的需求而彎折，這也使得貼附於軟性電路板400背面上的散熱片410亦隨著彎折，由於目前行動裝置整體趨向仍走向輕薄，導致軟性電路板400彎折的角度越來越大，這將使得耐彎折度較低之散熱片410容易由軟性電路板400剝離，而失去散熱之效果。
本發明的主要目的在於讓該散熱片中結晶方向為米勒座標(1,0,0)的銅晶粒的容積率大於50%，而可有效地提升散熱片的耐彎折度，以避免散熱片由軟性電路板上剝離。
本發明之一種具散熱片之軟性電路板包含一軟性基板、一電子元件及一散熱片，該軟性基板具有一上表面及一下表面，該電子元件設置於該軟性基板之該上表面，該散熱片設置於該軟性基板之該下表面，其中該散熱片具有一銅層，且該銅層具有容積率不小於50%之結晶方向為米勒座標(1,0,0)的銅晶粒。
本發明之一種軟性電路板之散熱片，其用以對一軟性電路板散熱，其中該散熱片具有一銅層，且該銅層具有容積率不小於50%之結晶方向為米勒座標(1,0,0)的銅晶粒。
本發明藉由該散熱片之該銅層具有容積率不小於50%之結晶方向為米勒座標(1,0,0)的銅晶粒，使該散熱片具有良好的耐彎折度，可避免該散熱片在彎折時由該軟性電路板上剝離。
請參閱第2圖，其為本發明之一實施例，一種具散熱片之軟性電路板100的剖視圖，該具散熱片之軟性電路板100包含一軟性基板110、一電子元件120及一散熱片130，該具散熱片之軟性電路板100還另具有防焊層及晶片底部填充膠，但由於與本案之技術特徵無關，因此並未繪出。
請參閱第2圖，該軟性基板110是由聚醯亞胺(polyimide)或其他具有良好電絕緣性、穩定性、耐化學腐蝕性之聚合物製成，該軟性基板110具有一上表面111及一下表面112，該上表面111具有一圖案化線路層111a，該圖案化線路層111a是藉由對電鍍於該上表面111的銅層經由一圖案化蝕刻製程而形成的細微線路。該電子元件120設置於該軟性基板110之該上表面111並電性連接該圖案化線路層111a，在本實施例中，該電子元件120為一覆晶單元，其具有一晶片121及複數個凸塊122，各該凸塊122之兩端分別電性連接該晶片121及該圖案化線路層111a，以提供該晶片121及該圖案化線路層111a之間進行訊號傳輸。
該散熱片130設置於該軟性基板110之該下表面112，在本實施例中，該散熱片130具有一銅層131及一黏貼層(圖未繪出)，該黏貼層位在該銅層131及該軟性基板110之間，該黏貼層用以將該銅層131黏貼於該軟性基板110之該下表面112，較佳的，該散熱片130位於該電子元件120下方，以對該電子元件120產生的熱進行散熱。
在本實施例中，該銅層131具有容積率不小於50%之結晶方向為米勒座標(1,0,0)的銅晶粒，而由於結晶方向為米勒座標(1,0,0)的銅晶粒所構成的銅具有良好的耐彎折能力，因此，本實施例之該散熱片130之該銅層131亦具有良好的耐彎折度，而可避免彎折時由該具散熱片之軟性電路板100上剝離。較佳的，由於該散熱片130與該電子元件120之間並無電性連接，該散熱片130並無電流訊號流過，而可不需考慮該散熱片130的導電性，讓該散熱片130之該銅層131能夠以容積率不小於50%之結晶方向為米勒座標(1,0,0)的銅晶粒構成。
較佳的，考量到該散熱片130的散熱效能，該散熱片130之該銅層131中之結晶方向為米勒座標(1,0,0)之銅晶粒的一粒徑大於5um，且該散熱片130之該銅層131的厚度介於5-50um之間，能夠讓該散熱片130在具有良好彎折能力的同時具有符合需求的散熱能力。
本發明藉由該散熱片130之該銅層131具有容積率不小於50%之結晶方向為米勒座標(1,0,0)的銅晶粒，而具有良好的耐彎折度，可避免該散熱片130在彎折時由該具散熱片之軟性電路板100上剝離。
本發明之保護範圍當視後附之申請專利範圍所界定者為準，任何熟知此項技藝者，在不脫離本發明之精神和範圍內所作之任何變化與修改，均屬於本發明之保護範圍。
100:具散熱片之軟性電路板
110:軟性基板
111:上表面
111a:圖案化線路層
112:下表面
120:電子元件
121:晶片
122:凸塊
130:散熱片
131:銅層
200:面板基板
300:控制電路板
400:軟性電路板
410:散熱片
第1圖：習知一種具散熱片之軟性電路板與面板基板及控制電路板連接之示意圖。 第2圖：依據本發明之一實施例，一種具散熱片之軟性電路板的剖視圖。
100:具散熱片之軟性電路板
110:軟性基板
111:上表面
111a:圖案化線路層
112:下表面
120:電子元件
121:晶片
122:凸塊
130:散熱片
131:銅層

Claims (8)

  1. 一種具散熱片之軟性電路板，其包含： 一軟性基板，具有一上表面及一下表面； 一電子元件，設置於該上表面；以及 一散熱片，設置於該軟性基板之該下表面，其中該散熱片具有一銅層，且該銅層具有容積率不小於50%之結晶方向為米勒座標(1,0,0)的銅晶粒。
  2. 如請求項1之具散熱片之軟性電路板，其中該銅層中之結晶方向為米勒座標(1,0,0)之銅晶粒的一粒徑大於5 um。
  3. 如請求項1之具散熱片之軟性電路板，其中該電子元件為一覆晶單元。
  4. 如請求項1或3之具散熱片之軟性電路板，其中該散熱片位於該電子元件下方，且該散熱片與該電子元件之間並無電性連接。
  5. 如請求項1之具散熱片之軟性電路板，其中該散熱片之該銅層的厚度介於5-50 um之間。
  6. 一種軟性電路板之散熱片，用以對一軟性電路板散熱，其中該散熱片具有一銅層，且該銅層具有容積率不小於50%之結晶方向為米勒座標(1,0,0)的銅晶粒。
  7. 如請求項6之軟性電路板之散熱片，其中該銅層中之結晶方向為米勒座標(1,0,0)之銅晶粒的一粒徑大於5 um。
  8. 如請求項6或7之軟性電路板之散熱片，其中該散熱片之該銅層的厚度介於5-50 um之間。
TW110133110A 2021-08-09 2021-08-09 具散熱片之軟性電路板及其散熱片 TWI777760B (zh)

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TW110133110A TWI777760B (zh) 2021-08-09 2021-08-09 具散熱片之軟性電路板及其散熱片
US17/494,002 US11503698B1 (en) 2021-08-09 2021-10-05 Flexible circuit board and heat spreader thereof
CN202111405025.6A CN115707175A (zh) 2021-08-09 2021-11-24 具有散热片的软性电路板及其散热片
KR1020210163074A KR20230022776A (ko) 2021-08-09 2021-11-24 방열판이 구비된 연성 회로 기판 및 이의 방열판
JP2021191367A JP2023024926A (ja) 2021-08-09 2021-11-25 フレキシブル回路基板及びそのヒートシンク

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